TLP290-4 TOSHIBA PHOTOCOUPLER GaAs IRED & PHOTO-TRANSISTOR TLP290-4 Programmable Controllers Power Supplies Unit in mm The Toshiba TLP290-4 consists of photo transistor, optically coupled to a gallium arsenide infrared emitting diode. TLP290-4 is housed in the SO16 package, very small and thin coupler. Since TLP290-4 are guaranteed wide operating temperature (Ta=-55 to 110 C), it's suitable for high-density surface mounting applications such as programmable controllers and hybrid ICs. Collector-Emitter Voltage : 80 V (min) Current Transfer Ratio Rank GB : 50% (min) : 100% (min) Isolation Voltage : 2500 Vrms (min) Guaranteed performance over -55 to 110 C UL approved cUL approved No.5A : UL1577 , File No. E67349 : CSA Component Acceptance Service TOSHIBA 11-11F1 Weight: 0.19 g (typ.) Option (V4) type VDE approved Pin Configuration : EN60747-5-2 (Note) : When a EN60747-5-2 approved type is needed, Please designate "Option(V4)" Construction mechanical rating Creepage distance Clearance Insulation thickness : 5.0 mm(min) : 5.0 mm(min) : 0.1 mm(min) TLP290-4 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 1,3,5,7 :ANODE, CATHODE 2,4,6,8 :CATHODE, ANODE 9,11,13,15 :EMITTER 10,12,14,16 :COLLECTOR HOC-1457 1 2011-09-08 TLP290-4 Current Transfer Ratio TYPE TLP290-4 Classification (Note1) Current Transfer Ratio (%) (IC / IF) Marking of Classification IF = 5 mA, V CE = 5 V, Ta = 25 Min Max Blank 50 400 Blank Rank GB 100 400 GB Note1: ex. Rank GB: TLP290-4 (GB) Application type name for certification test, please use standard product type name, i.e. TLP290 4 (GB,E: TLP290-4 HOC-1457 2 2011-09-08 TLP290-4 Absolute Maximum Ratings (Ta = 25) SYMBOL RATING UNIT Forward Current IF(RMS) 50 mA Forward Current Derating IF /C -0.67 (Ta50C) mA /C IFP 1 A Tj 125 C Collector-Emitter Voltage VCEO 80 V Emitter-Collector Voltage VECO 7 V IC 50 mA PC 100 mW PC /C -1.0 mW /C Junction Temperature Tj 125 C Operating Temperature Range Topr -55 to 110 C Storage Temperature Range Tstg -55 to 125 C Lead Soldering Temperature Tsol 260 (10s) C PT 170 mW PT /C -1.7 mW /C BVS 2500 Vrms LED CHARACTERISTIC Pulse Forward Current (Note2) DETECTOR Junction Temperature Collector Current Collector Power Dissipation (1 Circuit) Collector Power Dissipation Derating(Ta25C) (1 Circuit) Total Package Power Dissipation (1 Circuit) Total Package Power Dissipation Derating (Ta25C) (1 Circuit) Isolation Voltage (Note3) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note2: Pulse width 100s, frequency 100Hz Note3: AC, 1 minute, R.H.60%, Device considered a two terminal device : LED side pins shorted together and DETECTOR side pins shorted together. Individual Electrical Characteristics (Ta = 25) DETECTOR LED CHARACTERISTIC SYMBOL TEST CONDITION MIN TYP. MAX UNIT Forward Voltage VF IF = 10 mA 1.1 1.20 1.4 V Capacitance CT V = 0, f = 1 MHz -- 30 -- pF Collector-Emitter Breakdown Voltage V(BR) CEO IC = 0.5 mA 80 -- -- V Emitter-Collector Breakdown Voltage V(BR) ECO IE = 0.1 mA 7 -- -- V VCE = 48 V, -- 0.01 0.1 A VCE = 48 V, Ta = 85C -- 2 50 A V = 0, f = 1 MHz -- 10 -- pF Collector Dark Current (Note5) Capacitance (Collector to Emitter) HOC-1457 ICEO CCE 3 2011-09-08 TLP290-4 Coupled Electrical Characteristics (Ta = 25) CHARACTERISTIC SYMBOL Current Transfer Ratio IC / IF Saturated CTR IC / IF (sat) Collector-Emitter Saturation Voltage VCE (sat) TEST CONDITION MIN TYP. MAX 50 -- 400 100 -- 400 -- 60 -- 30 -- -- IC = 2.4 mA, IF = 8 mA -- -- 0.4 IC = 0.2 mA, IF = 1 mA -- 0.2 -- -- -- 0.4 -- -- 10 A 0.33 -- 3 -- MIN TYP. MAX UNIT -- 0.8 -- pF -- IF = 5 mA, VCE = 5 V Rank GB IF = 1 mA, VCE = 0.4 V Rank GB Rank GB Off-State Collector Current IC (off) CTR symmetry IC (ratio) VF = 0.7 V, VCE = 48 V IC (IF = -5 mA) / IC (IF = 5 mA) Note5 UNIT % % V Note5: IC(ratio ) IC2 (IF IC1(IF IF2 , VCE IF1, VCE 5V) 5V) Isolation Characteristics (Ta = 25) CHARACTERISTIC SYMBOL Capacitance (Input to Output) CS Isolation Resistance RS TEST CONDITION VS = 0 V, f = 1 MHz 12 VS = 500 V, R.H.60% 1x10 AC , 1 minute Isolation Voltage BVS 14 10 2500 -- -- AC , 1 second, in OIL -- 5000 -- DC , 1 minute, in OIL -- 5000 -- Vdc MIN TYP. MAX UNIT -- 2 -- -- 3 -- -- 3 -- -- 3 -- -- 2 -- -- 25 -- -- 40 -- Vrms Switching Characteristics (Ta = 25) CHARACTERISTIC SYMBOL Rise Time tr Fall Time tf Turn-On Time ton Turn-Off Time toff Turn-On Time tON Storage Time ts Turn-Off Time tOFF TEST CONDITION VCC = 10 V, IC = 2 mA RL = 100 RL = 1.9 k VCC = 5 V, IF = 16 mA (Fig.1) s s (Fig.1) Switchin Time Test Circuit HOC-1457 4 2011-09-08 TLP290-4 Soldering and Storage 1. Soldering 1.1 Soldering When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as much as possible by observing the following conditions. 1) Using solder reflow Temperature profile example of lead (Pb) solder (C) This profile is based on the device's maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. Package surface temperature 240 210 160 140 less than 30s 60 to 120s Time (s) Temperature profile example of using lead (Pb)-free solder (C) This profile is based on the device's maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. Package surface temperature 260 230 190 180 60 to 120s 30 to 50s Time (s) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. 2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder) Please preheat it at 150C between 60 and 120 seconds. Complete soldering within 10 seconds below 260C. Each pin may be heated at most once. 3) Using a soldering iron Complete soldering within 10 seconds below 260C, or within 3 seconds at 350C. Each pin may be heated at most once. HOC-1457 5 2011-09-08 TLP290-4 2. Storage 1) Avoid storage locations where devices may be exposed to moisture or direct sunlight. 2) Follow the precautions printed on the packing label of the device for transportation and storage. 3) Keep the storage location temperature and humidity within a range of 5C to 35C and 45% to 75%, respectively. 4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. 5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. 6) When restoring devices after removal from their packing, use anti-static containers. 7) Do not allow loads to be applied directly to devices while they are in storage. 8) If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. HOC-1457 6 2011-09-08 TLP290-4 Option:Specification for Embossed-Tape Packing (TP) for Mini-Flat Coupler 1. Applicable Package Package Name Product Type SO16 Mini-Flat Coupler 2. Product Naming System Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. Example E [[G]]/RoHS COMPATIBLE (Note6) Tape type CTR rank Device name 3. Tape Dimensions 3.1 Orientation of Device in Relation to Direction of Tape Movement Device orientation in the recesses is as shown in Figure 1. Tape feed TLP2904 Figure Device Orientation 3.2 Tape Packing Quantity2000 devices per reel 3.3 Empty Device Recesses are as Shown in Table 1. Table Empty Device Recesses Occurrences of 2 or more successive empty device recesses Single empty device recesses Standard Remarks 0 Within any given 40-mm section of tape, not including leader and trailer 6 device (max) per reel Not including leader and trailer 3.4 Start and End of Tape The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty turns only for a cover tape. HOC-1457 7 2011-09-08 TLP290-4 3.5 Tape Specification (1) Tape material: Plastic (protection against electrostatics) (2) Dimensions: The tape dimensions are as shown in Figure 2 and table 2. 2.0 0.05 0.1 1.5 0 F 0.1 G K0 0.3 A 1.5 2.6 16.0 B D E 0.3 0.1 0.2 Figure2 Tape Forms Table2 Tape Dimensions Unit: mm Unless otherwise specified: 0.1 HOC-1457 Symbol Dimension Remark A 7.5 B 10.5 D 7.5 Center line of indented square hole and sprocket hole E 1.75 Distance between tape edge and hole center F 12.0 G 4.0 K0 2.2 Cumulative error +0.1 (max) per 10 feed holes -0.3 Cumulative error +0.1 (max) per 10 feed holes -0.3 Internal space 8 2011-09-08 TLP290-4 3.6 Reel (1) (2) Material: Plastic Dimensions: The reel dimensions are as shown in Figure 3 and Table 3. Table 3 Reel Dimensions Unit: mm Symbol A B C U E Dimension A 330 2 B 80 1 C 13 0.5 E 2.0 0.5 U 4.0 0.5 W1 17.5 0.5 W2 21.5 1.0 W1 W2 Figure 3 Reel Forms 4. Packing Either one reel or five reels of photocouplers are packed in a shipping carton. 5. Label Indication The carton bears a label indicating the product number, the symbol representing classification of standard, the quantity, the lot number and the Toshiba company name. 6. Ordering Method When placing an order, please specify the product number, the CTR rank, the tape type and the quantity as shown in the following example. Example TLP291-4(GB-TP,E 2000 Pcs Quantity (must be a multiple of 2000) [[G]]/RoHS COMPATIBLE (Note6) Tape type CTR rank Device name Note6 : Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronics equipment. HOC-1457 9 2011-09-08 TLP290-4 PC - Ta IF Ta 120 Allowable collector power dissipation PC (mW) Allowance orward current IF (mA) 100 80 60 40 20 100 80 60 40 20 0 0 -20 0 20 40 60 80 100 -20 120 0 20 60 80 100 120 Ambient temperature Ta Ambient temperature Ta IFP DR IF - VF 100 Forward current IF (mA) 10000 Pulse orward current IFP (mA) 40 1000 100 100 75 50 25 0 -25 -50 10 1 0.1 10 0.001 0.01 0.1 0.6 1 0.8 1 1.2 1.4 1.6 1.8 Forward voltage VF (V) Duty cycle ratio DR IFPVFP VF/TaIF 1000 Pulse forward current IFP (mA) Forward voltage temperature cofficient VF/Ta (mV/) -3.2 -2.8 -2.4 -2 -1.6 -1.2 -0.8 10 Pulse width10us Repeative frequency=100Hz Ta=25 1 -0.4 0.1 1 10 100 0.6 1 1.4 1.8 2.2 2.6 3 3.4 Pulse forward voltage VFP (V) Forward current IF (mA) HOC-1457 100 10 2011-09-08 TLP290-4 ICVCE ICVCE 30 50 Ta=25 Collector current IC (mA) Collector current IC (mA) Ta=25 40 50 30 30 20 15 20 10 PC(max) 10 25 20 15 50 40 30 20 10 10 5 5 IF=2mA IF=5mA 0 0 0 2 4 6 8 10 0 0.2 Collector-emitter voltage VCE (V) 0.4 0.8 1 Collector-emitter voltage VCE (V) ICIF ICEOTa 100 10 Collector dark current ICEO (uA) Collector current IC (mA) 0.6 10 1 1 0.1 VCE=48V 24V 10V 5V 0.01 0.001 0.0001 0 20 40 60 80 100 120 Ambient temperature Ta () VCE=10V VCE=5V VCE=0.4V 0.1 0.1 1 10 IC/IF - IF 100 1000 Current transfer ratio IC/IF (%) Forward current IF (mA) VCE=10V VCE=5V VCE=0.4V 100 10 0.1 1 10 100 Forward current IF (mA) HOC-1457 11 2011-09-08 TLP290-4 IC-Ta VCE(sat) - Ta 100 25 0.20 Collector current ICA) Collector-emitter saturation voltage VCE(sat) (V) 0.24 0.16 0.12 0.08 0.04 0.00 10 10 5 1 1 IF=0.5mA VCE=5V 0.1 -40 0 40 80 120 -40 Ambient temperature Ta () -20 0 20 40 80 100 120 Ambient temperature Ta () Switching timeTa Switchingtime RL 1000 10000 Ta=25 IF =16mA tOFF 1000 Switching time (s) Vcc=5V OFF s Switching time 60 100 s 100 t 10 1 tON IF=16mA, VCC =5V, R L=1.9k 0.1 10 -40 -20 0 20 40 60 80 100 120 Ambient temperature Ta () ON 1 1 10 100 Load resistance RL (k) HOC-1457 12 2011-09-08 TLP290-4 RESTRICTIONS ON PRODUCT USE Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact ("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. HOC-1457 13 2011-09-08