TLP290-4
HOC-1457 2011-09-08
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TOSHIBA PHOTOCOUPLER GaAs IRED & PHOTO-TRANSISTOR
TLP290-4
Programmable Controllers
Power Supplies
The Toshiba TLP290-4 consists of photo transistor, optically coupled to a
gallium arsenide infrared emitting diode. TLP290-4 is housed in the SO16
package, very small and thin coupler.
Since TLP290-4 are guaranteed wide operating temperature (Ta=-55 to 110
˚C), it’s suitable for high-density surface mounting applications such as
programmable controllers and hybrid ICs.
Collector-Emitter Voltage : 80 V (min)
Current Transfer Ratio : 50% (min)
Rank GB : 100% (min)
Isolation Voltage : 2500 Vrms (min)
Guaranteed performance over -55 to 110 ˚C
UL approved : UL1577 , File No. E67349
cUL approved : CSA Component Acceptance Service
No.5A
Option (V4) type
VDE approved : EN60747-5-2
(Note) : When a EN60747-5-2 approved type is needed,
Please designate “Option(V4)”
Construction mechanical rating
Creepage distance : 5.0 mm(min)
Clearance : 5.0 mm(min)
Insulation thickness : 0.1 mm(min)
TOSHIBA
11-11F1
Weight: 0.19 g (typ.)
Unit in mm
1,3,5,7 :ANODE, CATHODE
2,4,6,8 :CATHODE, ANODE
9,11,13,15 :EMITTER
10,12,14,16 :COLLECTOR
TLP290-4
8
9
1
2
3
4
5
6
7
10
11
12
13
14
15
16
P
in
C
TLP290-4
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Current Transfer Ratio
Note1: ex. Rank GB: TLP290-4 (GB)
Application type name for certification test, please use standard product type name, i.e.
TLP2904 (GB,E: TLP290-4
Current Transfer Ratio (%)
(IC / IF)
IF = 5 mA, VCE = 5 V, Ta = 25℃
TYPE Classification
(Note1)
Min Max
Marking of Classification
Blank 50 400 Blank
TLP290-4
Rank GB 100 400 GB
TLP290-4
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Absolute Maximum Ratings (Ta = 25℃)
CHARACTERISTIC SYMBOL RATING UNIT
Forward Current IF(RMS) ±50 mA
Forward Current Derating ∆IF /°C −0.67 (Ta≥50°C) mA /°C
Pulse Forward Current (Note2)
IFP ±1 A
LED
Junction Temperature Tj 125 °C
Collector-Emitter Voltage VCEO 80 V
Emitter-Collector Voltage VECO 7 V
Collector Current IC 50 mA
Collector Power Dissipation
(1 Circuit) PC 100 mW
Collector Power Dissipation
Derating(Ta≥25°C) (1 Circuit)
∆PC /°C −1.0 mW /°C
DETECTOR
Junction Temperature Tj 125 °C
Operating Temperature Range Topr −55 to 110 °C
Storage Temperature Range Tstg −55 to 125 °C
Lead Soldering Temperature Tsol 260 (10s) °C
Total Package Power Dissipation
(1 Circuit)
PT 170 mW
Total Package Power Dissipation
Derating (Ta≥25°C) (1 Circuit)
∆PT /°C −1.7 mW /°C
Isolation Voltage (Note3)
BVS 2500 Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note2: Pulse width 100μs, frequency 100Hz
Note3: AC, 1 minute, R.H.≤60%, Device considered a two terminal device : LED side pins shorted together and
DETECTOR side pins shorted together.
Individual Electrical Characteristics (Ta = 25℃)
CHARACTERISTIC SYMBOL TEST CONDITION MIN
TYP.
MAX
UNIT
Forward Voltage VF IF = 10 mA 1.1 1.20
1.4 V
LED
Capacitance CT V = 0, f = 1 MHz — 30 — pF
Collector-Emitter Breakdown Voltage
V(BR) CEO IC = 0.5 mA 80 — — V
Emitter-Collector Breakdown Voltage
V(BR) ECO IE = 0.1 mA 7 — — V
VCE = 48 V, — 0.01
0.1 μA
Collector Dark Current
(Note5)
ICEO
VCE = 48 V, Ta = 85°C — 2 50 μA
DETECTOR
Capacitance
(Collector to Emitter) CCE V = 0, f = 1 MHz — 10 — pF
TLP290-4
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Coupled Electrical Characteristics (Ta = 25℃)
CHARACTERISTIC SYMBOL TEST CONDITION MIN
TYP.
MAX
UNIT
50 — 400
Current Transfer Ratio IC / IF
IF = 5 mA, VCE = 5 V
Rank GB
100
— 400
%
— 60 —
Saturated CTR IC / IF (sat)
IF = 1 mA, VCE = 0.4 V
Rank GB
30 — — %
IC = 2.4 mA, IF = 8 mA — — 0.4
— 0.2 —
Collector-Emitter Saturation Voltage VCE (sat) IC = 0.2 mA, IF = 1 mA
Rank GB
— — 0.4
V
Off-State Collector Current IC (off) VF = 0.7 V, VCE = 48 V — — 10 μA
CTR symmetry IC (ratio) IC (IF = −5 mA) / IC (IF = 5 mA)
Note5
0.33
— 3 —
Note5:
)V5
CE
V,
1F
I
F
I(
1C
I
)V5
CE
V,
2F
I
F
I(
2C
I
)ratio(C
I
Isolation Characteristics (Ta = 25℃)
CHARACTERISTIC SYMBOL TEST CONDITION MIN
TYP.
MAX
UNIT
Capacitance
(Input to Output) CS VS = 0 V, f = 1 MHz — 0.8 — pF
Isolation Resistance RS VS = 500 V, R.H.≤60% 1×1012
1014 — Ω
AC , 1 minute 2500
— —
AC , 1 second, in OIL — 5000
— Vrms
Isolation Voltage BVS
DC , 1 minute, in OIL — 5000
— Vdc
Switching Characteristics (Ta = 25℃)
CHARACTERISTIC SYMBOL TEST CONDITION MIN
TYP.
MAX
UNIT
Rise Time tr — 2 —
Fall Time tf — 3 —
Turn-On Time ton — 3 —
Turn-Off Time toff
VCC = 10 V, IC = 2 mA
RL = 100Ω
— 3 —
μs
Turn-On Time tON — 2 —
Storage Time ts — 25 —
Turn-Off Time tOFF
RL = 1.9 kΩ (Fig.1)
VCC = 5 V, IF = 16 mA
— 40 —
μs
(Fig.1) Switchin Time Test Circuit
TLP290-4
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Soldering and Storage
1. Soldering
1.1 Soldering
When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as
much as possible by observing the following conditions.
1) Using solder reflow
∙Temperature profile example of lead (Pb) solder
∙Temperature profile example of using lead (Pb)-free solder
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)
・Please preheat it at 150°C between 60 and 120 seconds.
・Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.
3) Using a soldering iron
Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may
be heated at most once.
Time
(s)
(°C)
240
210
160
60 to 120s
less than 30s
Package surface temperature
140
Time
(s)
(°C)
260
230
190
60 to 120s
30 to 50s
180
Package surface temperature
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste
type used by the customer within the
described profile.
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste
type used by the customer within the
described profile.
TLP290-4
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2. Storage
1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.
2) Follow the precautions printed on the packing label of the device for transportation and storage.
3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%,
respectively.
4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
6) When restoring devices after removal from their packing, use anti-static containers.
7) Do not allow loads to be applied directly to devices while they are in storage.
8) If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
TLP290-4
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Option:Specification for Embossed-Tape Packing
(TP) for Mini-Flat Coupler
1. Applicable Package
Package Name Product Type
SO16 Mini-Flat Coupler
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
（Example）
ＴＬＰ２９０－４（ＧＢ－ＴＰ，E
[[G]]/RoHS COMPATIBLE (Note6)
Tape type
CTR rank
Device name
3. Tape Dimensions
3.1 Orientation of Device in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Figure１ Device Orientation
3.2 Tape Packing Quantity：2000 devices per reel
3.3 Empty Device Recesses are as Shown in Table 1.
Table１ Empty Device Recesses
Standard Remarks
Occurrences of 2 or more
successive empty device
recesses
0 Within any given 40-mm section of
tape, not including leader and trailer
Single empty device
recesses 6 device (max) per reel Not including leader and trailer
3.4 Start and End of Tape
The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two
empty turns only for a cover tape.
Tape feed
TLP290－4
TLP290-4
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3.5 Tape Specification
(1) Tape material: Plastic (protection against electrostatics)
(2) Dimensions: The tape dimensions are as shown in Figure 2 and table 2.
Figure2 Tape Forms
Table2 Tape Dimensions
Unit: mm
Unless otherwise specified: ±0.1
Symbol Dimension Remark
A 7.5 ―
B 10.5 ―
D 7.5 Center line of indented square hole and sprocket hole
E 1.75 Distance between tape edge and hole center
F 12.0 Cumulative error (max) per 10 feed holes
G 4.0 Cumulative error (max) per 10 feed holes
K0 2.2 Internal space
+
0.1
-0.3
+
0.1
-0.3
0.3 0.05
2.6 0.2
K0
F
1.5 0.1
E
D
B
16.0
0.3
1.5
0.1
0
A
G
2.0 0.1
TLP290-4
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3.6 Reel
(1) Material: Plastic
(2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 3.
Figure 3 Reel Forms
4. Packing
Either one reel or five reels of photocouplers are packed in a shipping carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of
standard, the quantity, the lot number and the Toshiba company name.
6. Ordering Method
When placing an order, please specify the product number, the CTR rank, the tape type and the quantity
as shown in the following example.
（Example）
TLP291-4(GB-TP,E 2000 Pcs
Quantity (must be a multiple of 2000)
[[G]]/RoHS COMPATIBLE (Note6)
Tape type
CTR rank
Device name
Note6 : Please contact your TOSHIBA sales representative for details as to environmental matters such as the
RoHS compatibility of Product.
The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003
on the restriction of the use of certain hazardous substances in electrical and electronics equipment.
Symbol Dimension
A 330 2
B 80 1
C 13 0.5
E 2.0 0.5
U 4.0 0.5
W1 17.5 0.5
W2 21.5 1.0
E
W1
W2
A
B
C
U
Table 3 Reel Dimensions
Unit: mm
TLP290-4
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PC - Ta
0
20
40
60
80
100
120
-20 0 20 40 60 80 100 120
Ambient temperature Ta （℃）
Allowable collector
power dissipation PC (mW)
IF － Ta
0
20
40
60
80
100
-20 0 20 40 60 80 100 120
Ambient temperature Ta （℃）
Allowance ｆorward current
IF (mA)
IFP － DR
10
100
1000
10000
0.001 0.01 0.1 1
Duty cycle ratio　DR
Pulse ｆorward current　IFP (mA)
IF - VF
0.1
1
10
100
0.6 0.8 1 1.2 1.4 1.6 1.8
Forward voltage VF (V)
Forward current IF (mA)
100℃
75℃
50℃
25℃
0℃
-25℃
-50℃
⊿VF/⊿Ta－IF
-3.2
-2.8
-2.4
-2
-1.6
-1.2
-0.8
-0.4
0.1 1 10 100
Forward current IF (mA)
Forward voltage temperature
cofficient ΔVF/ΔTa (mV/℃)
IFP－VFP
1
10
100
1000
0.6 1 1.4 1.8 2.2 2.6 3 3.4
Pulse forward voltage VFP (V)
Pulse forward current IFP (mA)
Pulse width≦10us
Repeative frequency=100Hz
Ta=25℃
TLP290-4
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IC－VCE
0
10
20
30
40
50
0 2 4 6 8 10
Collector-emitter voltage VCE (V)
Collector current IC (mA)
Ta=25℃
20
30
15
10
IF=5mA
PC(max)
50
IC－VCE
0
5
10
15
20
25
30
0 0.2 0.4 0.6 0.8 1
Collector-emitter voltage VCE (V)
Collector current IC (mA)
50
40
30
20
10
5
Ta=25℃
IF=2mA
IC－IF
0.1
1
10
100
0.1 1 10 100
Forward current IF (mA)
Collector current IC (mA)
　　　　　　VCE=10V
　　　　　　VCE=5V
　　　　　　VCE=0.4V
ICEO－Ta
0.0001
0.001
0.01
0.1
1
10
0 20 40 60 80 100 120
Ambient temperature Ta (℃)
Collector dark current I
CEO (uA)
24V
10V
5V
VCE=48V
IC/IF - IF
10
100
1000
0.1 1 10 100
Forward current IF (mA)
Current transfer ratio IC/IF (%)
　　　　　　VCE
=10V
　　　　　　VCE
=5V
　　　　　　VCE
=0.4V
TLP290-4
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Switching time－Ta
0.1
1
10
100
1000
-40 -20 0 20 40 60 80 100 120
Ambient temperature　Ta (℃)
Switching time　(μs)
tON
tｓ
tOFF
IF=16mA,
VCC =5V,
RL=1.9kΩ
Switchingtime － RL
1
10
100
1000
10000
1 10 100
Load resistance RL (kΩ)
Switching time 　（μs）
　Ta=25℃
　IF=16mA
　Vcc=5V
ｔOFF
ｔ
s
ｔ
ON
IC-Ta
0.1
1
10
100
-40 -20 0 20 40 60 80 100 120
Ambient temperature Ta (℃)
Collector current IC（ｍA)
VCE=5V
IF=0.5mA
1
5
10
25
VCE(sat) - Ta
0.00
0.04
0.08
0.12
0.16
0.20
0.24
-40 0 40 80 120
Ambient temperature Ta (℃)
Collector-emitter saturation
voltage V
CE(sat) (V)
TLP290-4
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RESTRICTIONS ON PRODUCT USE
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
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Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without
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or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.