HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE200207
Issued Date : 1993.04.12
Revised Date : 2003. 07.21
Page No. : 1/4
HMJE13007 HSMC Produc t Specification
HMJE13007
NPN EPITAXIAL PLANAR TRANSISTOR
Description
• High Voltage, High Speed Power Switch
• Switch Regulators
• PWM Inverters and Motor Controls
• Solenoid and Relay Drivers
• Deflection Circuits
Absolute Maximum Ratings (Ta=25°C)
• Maximum Temperatures
Storage Temperatu re........................................................................................................ -50 ~ +150 °C
Junction Temperature.................................................................................................. 150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C)................................................................................................. 80 W
• Maximum Voltages and Currents (Ta=25°C)
VCEX Collector to Emitter Voltage................................................................................................. 700 V
VCEO Collector to Emitter Voltage ................................................................................................ 400 V
VEBO Emitter to Base Voltage.......................................................................................................... 9 V
IC Collector Current ....................................................................................................... Continuous 8 A
IB Base Current.............................................................................................................. Continuous 4 A
Electrical Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCEX 700 - - V IC=1mA, VBE( off)=1.5V
BVCEO 400 - - V IC=10mA
IEBO - - 100 uA VEB=9V
ICEX - - 100 uA VCE=700V, VBE( off)=1.5V
*VCE(sat)1 - - 1 V IC=2A, IB=0.4A
*VCE(sat)2 - - 2 V IC=5A, IB=1A
*VCE(sat)3 - - 3 V IC=8A, IB=2A
*VBE(sat) - - 1.2 V IC=2 A, IB=0.4A
*VBE(sat) - - 1.6 V IC=5 A, IB=1A
*hFE1 10 - - IC=2A, VCE=5V
*hFE2 6 - - IC=5 A, VCE= 5V
*hFE3 9 - 40 IC=0.5A, VCE=5V
*Pulse Test: Pulse Width ≤380us, Duty Cycle≤2%
TO-220
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE200207
Issued Date : 1993.04.12
Revised Date : 2003. 07.21
Page No. : 2/4
HMJE13007 HSMC Produc t Specification
Characteristics Curve
Current Gain & Collector Curren t
1
10
100
1 10 100 1000 10000
Collector Curren t-I
C
(mA)
hFE
hFE @ VCE=5V
25
o
C
75
o
C
125
o
C
Saturation Voltage & Collector Curren t
10
100
1000
10000
1 10 100 1000 10000
Coll e c tor Current - I
C
(mA)
Saturation Voltage (mV)
VCE(sat) @ IB=5IB
25oC
75oC
125oC
Saturation Voltage & Collect or Cu rrent
10
100
1000
10000
1 10 100 1000 10000
Coll e c tor Current - I
C
(mA)
Satur a t ion Voltag e ( mV)
V
CE(sat)
@ I
C
=4I
B
25
o
C
125
o
C
75
o
C
Saturation Voltage & Col lect or Current
100
1000
10000
1 10 100 1000 10000
Coll e c tor Current - I
C
(mA)
Saturation Voltage (mV)
VBE(sat) @ IC=5IB
125oC
75oC
25oC
Switchange Tim e & C ollect or Cu rrent
0.1
1
10
0.1 1 10
Collector Curren t-I
C
(A)
Swit ching Time ( uS)...
Ton
Tstg
Tf
V
CC
=125V, I
C
=5I
B1
, I
C
=2I
B2
Collector Output Capacitance
1
10
100
1000
0.1 1 10 100
Collector Base Voltage (V)
Capacitance (pF)
Cob
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE200207
Issued Date : 1993.04.12
Revised Date : 2003. 07.21
Page No. : 3/4
HMJE13007 HSMC Produc t Specification
Safe Operating Area
1
10
100
1000
10000
1 10 100 1000
Forward Vol tage-V
CE
(V)
Collector Current-I
C
(mA)
1mS
100mS
1S
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE200207
Issued Date : 1993.04.12
Revised Date : 2003. 07.21
Page No. : 4/4
HMJE13007 HSMC Produc t Specification
TO-220AB Dimension
*: Typical
Inches Millimeters Inches Millimeters
DIM Min. Max. Min. Max. DIM Min. Max. Min. Max.
A 0.2197 0.2949 5.58 7.49 I - *0.1508 - *3.83
B 0.3299 0.3504 8.38 8.90 K 0.0295 0.0374 0.75 0.95
C 0.1732 0.185 4.40 4.70 M 0.0449 0.0551 1.14 1.40
D 0.0453 0.0547 1.15 1.39 N - *0.1000 - *2.54
E 0.0138 0.0236 0.35 0.60 O 0.5000 0.5618 12.70 14.27
G 0.3803 0.4047 9.66 10.28 P 0.5701 0.6248 14.48 15.87
H - *0.6398 - *16.25
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controll i ng dimensi on: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any questi on with packi ng specifi cation or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 A l l oy; solder pl ating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its produc ts without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liabilit y for any cons equence of custom er product design, infringement of patents, or applic at i o n assistance.
Head Office And Factory:
• Head Office (Hi-Sincerit y Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Tai wan R.O.C.
Tel : 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax: 886-3-5982931
AB
E
G
IK
M
OP
3
2
1
C
N
H
D
4
Style: Pin 1.Base 2.Collector 3.Emitter
3-Lead TO-220AB Plastic Pac k age
HSMC Package Code: E
Marking:
Date Code Control Code
H
1MJE
3007
