Semiconductor Components Industries, LLC, 2012
February, 2012 Rev. 4
1Publication Order Number:
SMF05C/D
SMF05CT1G, SMF12CT1G,
SMF15CT1G, SMF24CT1G,
SZSMF12CT1G
5-Line Transient Voltage
Suppressor Array
This 5line voltage transient suppressor array is designed for
application requiring transient voltage protection capability. It is
intended for use in overtransient voltage and ESD sensitive
equipment such as computers, printers, automotive electronics,
networking communication and other applications. This device
features a monolithic common anode design which protects five
independent lines in a single SC88 package.
Features
Protects up to 5Line in a Single SC88 Package
Peak Power Dissipation 100 W (8 x 20 ms Waveform)
ESD Rating of Class 3B (Exceeding 8 kV) per Human Body Model
and Class C (Exceeding 400 V) per Machine Model.
Compliance with IEC 6100042 (ESD) 15 kV (Air), 8 kV (Contact)
Flammability Rating of UL 94 V0
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AECQ101 Qualified and
PPAP Capable
PbFree Packages are Available*
Applications
HandHeld Portable Applications
Networking and Telecom
Automotive Electronics
Serial and Parallel Ports
Notebooks, Desktops, Servers
MAXIMUM RATINGS (TJ = 25C unless otherwise specified)
Symbol Rating Value Unit
PPK 1 Peak Power Dissipation
8 x 20 ms Double Exponential Waveform
(Note 1)
100
W
TJOperating Junction Temperature Range 40 to 125 C
TSTG Storage Temperature Range 55 to 150 C
TLLead Solder Temperature (10 s) 260 C
ESD Human Body Model (HBM)
Machine Model (MM)
IEC 6100042 Air (ESD)
IEC 6100042 Contact (ESD)
16000
400
15000
15000
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Nonrepetitive current pulse per Figure 3.
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
SC88 FIVE TRANSIENT
VOLTAGE SUPPRESSOR
100 W PEAK POWER
SC88
CASE 419B
STYLE 24
1
2
3
6
5
4
MARKING DIAGRAM
PIN ASSIGNMENT
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
http://onsemi.com
XX = Specific Device Code
6J = SMF05C
6K = SZSMF12C/SMF12C
6L = SMF15C
6M= SMF24C
M = Date Code
G=PbFree Package
XX MG
G
1
6
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
ORDERING INFORMATION
SMF05CT1G, SMF12CT1G, SMF15CT1G, SMF24CT1G, SZSMF12CT1G
http://onsemi.com
2
SMF05CT1G ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise specified)
Parameter Symbol Conditions Min Typ Max Unit
Reverse Working Voltage VRWM (Note 2) 5.0 V
Breakdown Voltage VBR IT = 1 mA, (Note 3) 6.2 7.2 V
Reverse Leakage Current IRVRWM = 5 V 0.07 5.0 mA
Clamping Voltage VCIPP = 5 A (8 x 20 ms Waveform) 9.8 V
Clamping Voltage VCIPP = 8 A (8 x 20 ms Waveform) 12.5 V
Maximum Peak Pulse Current IPP 8 x 20 ms Waveform 8.0 A
Capacitance CJVR = 0 V, f = 1 MHz (Line to GND) 80 130 pF
SMF12CT1G ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise specified)
Parameter Symbol Conditions Min Typ Max Unit
Reverse Working Voltage VRWM (Note 2) 12 V
Breakdown Voltage VBR IT = 1 mA, (Note 3) 13.3 15 V
Reverse Leakage Current IRVRWM = 12 V 0.01 0.1 mA
Clamping Voltage VCIPP = 3 A (8 x 20 ms Waveform) 21 V
Clamping Voltage VCIPP = 6 A (8 x 20 ms Waveform) 23 V
Maximum Peak Pulse Current IPP 8 x 20 ms Waveform 6.0 A
Capacitance CJVR = 0 V, f = 1 MHz (Line to GND) 40 60 pF
SMF15CT1G ELECTRICAL CHARACTERISTICS (TJ = 25C, unless otherwise specified)
Parameter Symbol Conditions Min Typ Max Unit
Reverse Working Voltage VRWM (Note 2) 15 V
Breakdown Voltage VBR IT = 1 mA, (Note 3) 17 19 V
Reverse Leakage Current IRVRWM = 15 V 0.01 1.0 mA
Clamping Voltage VCIPP = 1 A (8 x 20 ms Waveform) 23 V
Clamping Voltage VCIPP = 5 A (8 x 20 ms Waveform) 29 V
Maximum Peak Pulse Current IPP 8 x 20 ms Waveform 5.0 A
Capacitance CJVR = 0 V, f = 1 MHz (Line to GND) 33 45 pF
SMF24CT1G ELECTRICAL CHARACTERISTICS (TJ = 25C, unless otherwise specified)
Parameter Symbol Conditions Min Typ Max Unit
Reverse Working Voltage VRWM (Note 2) 24 V
Breakdown Voltage VBR IT = 1 mA, (Note 3) 26.7 32 V
Reverse Leakage Current IRVRWM = 24 V 0.01 1.0 mA
Clamping Voltage VCIPP = 1 A (8 x 20 ms Waveform) 40 V
Clamping Voltage VCIPP = 2.5 A (8 x 20 ms Waveform) 44 V
Maximum Peak Pulse Current IPP 8 x 20 ms Waveform 2.5 A
Capacitance CJVR = 0 V, f = 1 MHz (Line to GND) 21 25 pF
2. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal or greater than the DC
or continuous peak operating voltage level.
3. VBR is measured at pulse test current IT
.
4. Include SZ-prefix devices where applicable.
SMF05CT1G, SMF12CT1G, SMF15CT1G, SMF24CT1G, SZSMF12CT1G
http://onsemi.com
3
TYPICAL PERFORMANCE CURVES
(TJ = 25C unless otherwise specified)
Figure 1. Pulse Derating Curve
100
90
80
70
60
50
40
30
20
10
00 25 50 75 100 125 150 175 200
TA, AMBIENT TEMPERATURE (C)
Figure 2. 8 20 ms Pulse Waveform
100
90
80
70
60
50
40
30
20
10
00204060
t, TIME (ms)
% OF PEAK PULSE CURRENT
tP
tr
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
PEAK VALUE IRSM @ 8 ms
HALF VALUE IRSM/2 @ 20 ms
80
Figure 3. Clamping Voltage vs Peak Pulse Current
100
10
10510
IPP
, PEAK PULSE CURRENT (A)
VCLAMP
, CLAMPING VOLTAGE (V)
15
Figure 4. Junction Capacitance vs Reverse Voltage
100
10
105
VBR, REVERSE VOLTAGE (V)
JUNCTION CAPACITANCE (pF)
10 15 20 25
SMF05CT1G
SMF12CT1G
SMF15CT1G
SMF24CT1G
SMF05CT1G
SMF12CT1G
SMF15CT1G
SMF24CT1G
PEAK POWER DISSIPATION (%)
ORDERING INFORMATION
Device Package Shipping
SMF05CT1G SC88
(PbFree)
3,000 / Tape & Reel
SMF05CT2G* SC88
(PbFree)
3,000 / Tape & Reel
SMF12CT1G SC88
(PbFree)
3,000 / Tape & Reel
SMF15CT1G SC88
(PbFree)
3,000 / Tape & Reel
SMF24CT1G SC88
(PbFree)
3,000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*The “T2” suffix refers to an alternate tape & reel orientation.
SMF05CT1G, SMF12CT1G, SMF15CT1G, SMF24CT1G, SZSMF12CT1G
http://onsemi.com
4
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B01 OBSOLETE, NEW STANDARD 419B02.
E0.2 (0.008) MM
123
D
e
A1
A
A3
C
L
654
E
b6 PL
SC88/SC706/SOT363
CASE 419B02
ISSUE W
DIM MIN NOM MAX
MILLIMETERS
A0.80 0.95 1.10
A1 0.00 0.05 0.10
A3
b0.10 0.21 0.30
C0.10 0.14 0.25
D1.80 2.00 2.20
0.031 0.037 0.043
0.000 0.002 0.004
0.004 0.008 0.012
0.004 0.005 0.010
0.070 0.078 0.086
MIN NOM MAX
INCHES
0.20 REF 0.008 REF
HE
HE
E1.15 1.25 1.35
e0.65 BSC
L0.10 0.20 0.30
2.00 2.10 2.20
0.045 0.049 0.053
0.026 BSC
0.004 0.008 0.012
0.078 0.082 0.086
STYLE 24:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
ǒmm
inchesǓ
SCALE 20:1
0.65
0.025
0.65
0.025
0.50
0.0197
0.40
0.0157
1.9
0.0748
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
SC88/SC706/SOT363
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 8002829855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81358171050
SMF05C/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 3036752175 or 8003443860 Toll Free USA/Canada
Fax: 3036752176 or 8003443867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative