MCP4011/2/3/4 Low-Cost 64-Step Volatile Digital POT Package Types * Volatile Digital Potentiometer in SOT-23, SOIC, MSOP and DFN packages * 64 Taps: 63 Resistors with Taps to terminal A and terminal B * Simple Up/Down (U/D) Protocol * Power-on Recall of Default Wiper Setting - Custom POR wiper settings available (contact factory) * Resistance Values: 2.1 k, 5 k, 10 k or 50 k * Low Tempco: - Absolute (Rheostat): 50 ppm (0C to 70C typ.) - Ratiometric (Potentiometer): 10 ppm (typ.) * Low Wiper Resistance: 75 (typ.) * High-Voltage Tolerant Digital Inputs: Up to 12.5V * Low-Power Operation: 1 A Max Static Current * Wide Operating Voltage Range: - 1.8V to 5.5V - Device Operation - 2.7V to 5.5V - Resistor Characteristics Specified * Extended Temperature Range: -40C to +125C * Wide Bandwidth (-3 dB) Operation: - 4 MHz (typ.) for 2.1 k device Description MCP4011 MCP4012 SOIC, MSOP, DFN Potentiometer SOT-23-6 Rheostat VDD 1 VSS 2 A 3 A W W 4 VDD 1 7 NC VSS 2 6 B U/D 3 A 4 CS B MCP4014 SOT-23-5 Rheostat VSS 2 U/D 3 A W B 5 W 5 CS SOT-23-6 Potentiometer VDD 1 6 A W MCP4013 6 A VDD 1 5 W VSS 2 4 CS U/D 3 5 W W B A 4 CS Block Diagram A VDD VSS CS The MCP4011/2/3/4 devices are volatile, 6-bit Digital Potentiometers that can be configured as either a potentiometer or rheostat. The wiper setting is controlled through a simple Up/Down (U/D) serial interface. B 8 U/D U/D Power-Up and Brown-Out Control Wiper Register (Resistor Array) Features 2-Wire Interface and Control Logic W B Device Wiper Configuration Memory POR Wiper Type Setting Options (k) # of Wiper Steps () VDD Operating Range (2) WiperLockTM Technology Resistance (typical) Control Interface Device Features MCP4011 Potentiometer (1) RAM Mid-Scale 2.1, 5.0, 10.0, 50.0 75 64 1.8V to 5.5V U/D No MCP4012 Rheostat RAM Mid-Scale 2.1, 5.0, 10.0, 50.0 75 64 1.8V to 5.5V U/D No MCP4013 Potentiometer RAM Mid-Scale 2.1, 5.0, 10.0, 50.0 75 64 1.8V to 5.5V U/D No MCP4014 Rheostat RAM Mid-Scale 2.1, 5.0, 10.0, 50.0 75 64 1.8V to 5.5V U/D No Note 1: Floating either terminal (A or B) allows the device to be used in Rheostat mode. 2: Analog characteristics (resistor) tested from 2.7V to 5.5V. . (c) 2006 Microchip Technology Inc. DS21978C-page 1 MCP4011/2/3/4 1.0 ELECTRICAL CHARACTERISTICS Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings VDD ............................................................................................................. 6.5V CS and U/D inputs w.r.t VSS.................................... -0.3V to 12.5V A,B and W terminals w.r.t VSS..................... -0.3V to VDD + 0.3V Current at Input Pins ..................................................10 mA Current at Supply Pins ...............................................10 mA Current at Potentiometer Pins ...................................2.5 mA Storage temperature .....................................-65C to +150C Ambient temp. with power applied ................-55C to +125C ESD protection on all pins ........... 4 kV (HBM), 400V (MM) Maximum Junction Temperature (TJ) . .........................+150C AC/DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all parameters apply across the specified operating ranges. TA = -40C to +125C, 2.1 k, 5 k, 10 k and 50 k devices. Typical specifications represent values for VDD = 2.7V to 5.5V, VSS = 0V, TA = +25C. Parameters Sym Min Operating Voltage Range VDD VDD CS Input Voltage Supply Current Resistance ( 20%) Note 1: 2: 3: 4: 5: 6: 7: 8: 9: Typ Max Units 2.7 -- 5.5 V -- 1.8 -- V VDD = 1.8V, CS:VIHH = 8.5V, VIH = 1.8V, VIL = 0V, U/D:VIH = 1.8V, VIL = 0V VCS VSS -- 12.5 V The CS pin will be at one of three input levels (VIL, VIH or VIHH). (Note 6) IDD -- 45 -- A 5.5V, CS = VSS, fU/D = 1 MHz -- 15 -- A 2.7V, CS = VSS, fU/D = 1 MHz -- 0.3 1 A Serial Interface Inactive (CS = VIH, U/D = VIH) 1.68 2.1 2.52 k -202 devices (Note 1) RAB Conditions 4.0 5 6.0 k -502 devices (Note 1) 8.0 10 12.0 k -103 devices (Note 1) 40.0 50 60.0 k -503 devices (Note 1) Resistance is defined as the resistance between terminal A to terminal B. INL and DNL are measured at VW with VA = VDD and VB = VSS. (-202 devices VA = 4V). MCP4011/13 only, test conditions are: IW = 1.9 mA, code = 00h. MCP4012/14 only, test conditions are: Current at Voltage Device Resistance 5.5V 2.1 k 2.25 mA 1.1 mA 5 k 1.4 mA 450 A 10 k 450 A 210 A 50 k 90 A 40 A 2.7V Comments MCP4012 includes VWZSE MCP4014 includes VWFSE Resistor terminals A, W and B's polarity with respect to each other is not restricted. This specification by design. Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and temperature. See Section 6.0 "Resistor" for additional information. For voltages below 2.7V, refer to Section 2.0 "Typical Performance Curves". The MCP4011 is externally connected to match the configurations of the MCP4012 and MCP4014 and then tested. DS21978C-page 2 (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 AC/DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all parameters apply across the specified operating ranges. TA = -40C to +125C, 2.1 k, 5 k, 10 k and 50 k devices. Typical specifications represent values for VDD = 2.7V to 5.5V, VSS = 0V, TA = +25C. Parameters Sym Resolution Min N Typ Max 64 Units Taps Conditions No Missing Codes Step Resistance RS -- RAB / 63 -- Note 6 Wiper Resistance (Note 3, Note 4) RW -- 70 125 5.5V -- 70 325 -- 50 -- ppm/C TA = -20C to +70C -- 100 -- ppm/C TA = -40C to +85C -- 150 -- ppm/C TA = -40C to +125C 10 -- ppm/C MCP4011 and MCP4013 only, code = 1Fh R/T Nominal Resistance Tempco 2.7V Ratiometeric Tempco VWA/ T -- Full-Scale Error (MCP4011/13 only) VWFSE -0.5 -0.1 +0.5 LSb Code 3Fh, 2.7V VDD 5.5V Zero-Scale Error (MCP4011/13 only) VWZSE -0.5 +0.1 +0.5 LSb Code 00h, 2.7V VDD 5.5V VA,VW, VB Vss -- VDD V Current through A, W or B IW -- -- 2.5 mA Note 6 Leakage current into A, W or B IWL -- 100 -- nA MCP4011 A = W = B = VSS -- 100 -- nA MCP4012/13 A = W = VSS Monotonicity N Resistor Terminal Input Voltage Range (Terminals A, B and W) Yes Bits Note 5, Note 6 -- 100 -- nA MCP4014 W = VSS CAW -- 75 -- pF f =1 MHz, code = 1Fh Capacitance (Pw) CW -- 120 -- pF f =1 MHz, code = 1Fh Capacitance (PB) CBW -- 75 -- pF f =1 MHz, code = 1Fh Bandwidth -3 dB BW -- 4 -- MHz -202 devices -- 2 -- MHz -502 devices -- 1 -- MHz -103 devices -- 200 -- kHz -503 devices Capacitance (PA) Note 1: 2: 3: 4: 5: 6: 7: 8: 9: Code = 1F, output load = 30 pF Resistance is defined as the resistance between terminal A to terminal B. INL and DNL are measured at VW with VA = VDD and VB = VSS. (-202 devices VA = 4V). MCP4011/13 only, test conditions are: IW = 1.9 mA, code = 00h. MCP4012/14 only, test conditions are: Current at Voltage Device Resistance 5.5V 2.7V 2.1 k 2.25 mA 1.1 mA 5 k 1.4 mA 450 A 10 k 450 A 210 A 50 k 90 A 40 A Comments MCP4012 includes VWZSE MCP4014 includes VWFSE Resistor terminals A, W and B's polarity with respect to each other is not restricted. This specification by design. Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and temperature. See Section 6.0 "Resistor" for additional information. For voltages below 2.7V, refer to Section 2.0 "Typical Performance Curves". The MCP4011 is externally connected to match the configurations of the MCP4012 and MCP4014 and then tested. (c) 2006 Microchip Technology Inc. DS21978C-page 3 MCP4011/2/3/4 AC/DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all parameters apply across the specified operating ranges. TA = -40C to +125C, 2.1 k, 5 k, 10 k and 50 k devices. Typical specifications represent values for VDD = 2.7V to 5.5V, VSS = 0V, TA = +25C. Parameters Potentiometer Integral Non-linearity Potentiometer Differential Non-linearity Rheostat Integral Non-linearity MCP4011 (Note 4, Note 9) MCP4012 and MCP4014 (Note 4) Sym Min Typ Max Units INL -0.5 0.25 +0.5 LSb MCP4011/13 only (Note 2) DNL -0.5 0.25 +0.5 LSb MCP4011/13 only (Note 2) R-INL -0.5 0.25 +0.5 LSb +4.5 +8.5 LSb -8.5 See Section 2.0 LSb -0.5 0.25 +0.5 LSb -5.5 +2.5 +5.5 LSb 0.25 +0.5 LSb +1 +3 LSb See Section 2.0 -0.5 -3 LSb See Section 2.0 LSb -0.5 0.25 +0.5 LSb -1 +0.25 +1 LSb 0.25 +0.5 LSb +0.5 +2 LSb See Section 2.0 Rheostat Differential Non-linearity MCP4011 (Note 4, Note 9) MCP4012 and MCP4014 (Note 4) R-DNL -0.5 -1 LSb See Section 2.0 LSb -0.5 0.25 +0.5 LSb -1 +0.25 +1.25 LSb See Section 2.0 -0.5 -1 LSb 0.25 +0.5 LSb 0 +1 LSb See Section 2.0 LSb -0.5 0.25 +0.5 LSb -0.5 0 +0.5 LSb See Section 2.0 Note 1: 2: 3: 4: 5: 6: 7: 8: 9: LSb Conditions -202 devices (2.1 k) 5.5V 2.7V (Note 7) 1.8V (Note 7, Note 8) -502 devices (5 k) 5.5V -103 devices (10 k) 5.5V -503 devices (50 k) 2.7V (Note 7) 1.8V (Note 7, Note 8) 2.7V (Note 7) 1.8V (Note 7, Note 8) 5.5V 2.7V (Note 7) 1.8V (Note 7, Note 8) -202 devices (2.1 k) 5.5V -502 devices (5 k) 5.5V -103 devices (10 k) 5.5V -503 devices (50 k) 2.7V (Note 7) 1.8V (Note 7, Note 8) 2.7V (Note 7) 1.8V (Note 7, Note 8) 2.7V (Note 7) 1.8V (Note 7, Note 8) 5.5V 2.7V (Note 7) 1.8V (Note 7, Note 8) Resistance is defined as the resistance between terminal A to terminal B. INL and DNL are measured at VW with VA = VDD and VB = VSS. (-202 devices VA = 4V). MCP4011/13 only, test conditions are: IW = 1.9 mA, code = 00h. MCP4012/14 only, test conditions are: Current at Voltage Device Resistance 5.5V 2.7V 2.1 k 2.25 mA 1.1 mA 5 k 1.4 mA 450 A 10 k 450 A 210 A 50 k 90 A 40 A Comments MCP4012 includes VWZSE MCP4014 includes VWFSE Resistor terminals A, W and B's polarity with respect to each other is not restricted. This specification by design. Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and temperature. See Section 6.0 "Resistor" for additional information. For voltages below 2.7V, refer to Section 2.0 "Typical Performance Curves". The MCP4011 is externally connected to match the configurations of the MCP4012 and MCP4014 and then tested. DS21978C-page 4 (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 AC/DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all parameters apply across the specified operating ranges. TA = -40C to +125C, 2.1 k, 5 k, 10 k and 50 k devices. Typical specifications represent values for VDD = 2.7V to 5.5V, VSS = 0V, TA = +25C. Parameters Sym Min Typ Max Units VIH 0.7 VDD -- -- V Conditions Digital Inputs/Outputs (CS, U/D) Input High Voltage VIL -- -- 0.3 VDD V High-Voltage Input Entry Voltage VIHH 8.5 -- 12.5 (6) V High-Voltage Input Exit Voltage VIHH -- -- VDD+0.8(6) V CS Pull-up/Pull-down Resistance RCS -- 16 -- k VDD = 5.5V, VCS = 3V CS Weak Pull-up/Pull-down Current IPU -- 170 -- A VDD = 5.5V, VCS = 3V Input Low Voltage Threshold for WiperLockTM Technology IIL -1 -- 1 A VIN = VDD CIN, COUT -- 10 -- pF fC = 1 MHz, VDD 2.7V Value Range N 0h -- 3Fh Default POR Setting N Input Leakage Current CS and U/D Pin Capacitance RAM (Wiper) Value 1Fh hex hex Power Requirements Power Supply Sensitivity (MCP4011 and MCP4013 only) Note 1: 2: 3: 4: 5: 6: 7: 8: 9: PSS -- 0.0015 0.0035 %/% VDD = 4.5V to 5.5V, VA = 4.5V, Code = 1Fh -- 0.0015 0.0035 %/% VDD = 2.7V to 4.5V, VA = 2.7V, Code = 1Fh Resistance is defined as the resistance between terminal A to terminal B. INL and DNL are measured at VW with VA = VDD and VB = VSS. (-202 devices VA = 4V). MCP4011/13 only, test conditions are: IW = 1.9 mA, code = 00h. MCP4012/14 only, test conditions are: Current at Voltage Device Resistance 5.5V 2.7V 2.1 k 2.25 mA 1.1 mA 5 k 1.4 mA 450 A 10 k 450 A 210 A 50 k 90 A 40 A Comments MCP4012 includes VWZSE MCP4014 includes VWFSE Resistor terminals A, W and B's polarity with respect to each other is not restricted. This specification by design. Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and temperature. See Section 6.0 "Resistor" for additional information. For voltages below 2.7V, refer to Section 2.0 "Typical Performance Curves". The MCP4011 is externally connected to match the configurations of the MCP4012 and MCP4014 and then tested. (c) 2006 Microchip Technology Inc. DS21978C-page 5 MCP4011/2/3/4 tCSHI tCSLO CS tLUC 1/fUD tLO tLCUF tLUC tLCUF U/D tHI tLCUR tS tS W FIGURE 1-1: Increment Timing Waveform. SERIAL TIMING CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply across the specified operating ranges. Extended (E): VDD = +1.8V to 5.5V, TA = -40C to +125C. Parameters Sym Min Typ Max Units CS Low Time tCSLO 5 -- -- s CS High Time tCSHI 500 -- -- ns 2.7V VDD 5.5V -- -- -- ns 1.8V VDD < 2.7V 500 -- -- ns 2.7V VDD 5.5V 750 -- -- ns 1.8V VDD < 2.7V U/D to CS Hold Time tLUC Conditions CS to U/D Low Setup Time tLCUF 500 -- -- ns CS to U/D High Setup Time tLCUR 3 -- -- s U/D High Time tHI 500 -- -- ns U/D Low Time tLO 500 -- -- ns Up/Down Toggle Frequency fUD -- -- 1 MHz tS 0.5 -- -- s 2.1 k, CL = 100 pF 1 -- -- s 5 k, CL = 100 pF 2 -- -- s 10 k, CL = 100 pF 10 5 -- s 50 k, CL = 100 pF -- 200 -- ns Wiper Settling Time Wiper Response on Power-up DS21978C-page 6 tPU (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 tCSHI tCSLO CS 1/fUD tLUC tLUC tHI tLCUF U/D tLO tLCUR tS tS W FIGURE 1-2: Decrement Timing Waveform. SERIAL TIMING CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply across the specified operating ranges. Extended (E): VDD = +1.8V to 5.5V, TA = -40C to +125C. Parameters Sym Min Typ Max Units CS Low Time tCSLO 5 -- -- s CS High Time tCSHI 500 -- -- ns 2.7V VDD 5.5V -- -- -- ns 1.8V VDD < 2.7V 500 -- -- ns 2.7V VDD 5.5V 750 -- -- ns 1.8V VDD < 2.7V U/D to CS Hold Time tLUC Conditions CS to U/D Low Setup Time tLCUF 500 -- -- ns CS to U/D High Setup Time tLCUR 3 -- -- s U/D High Time tHI 500 -- -- ns U/D Low Time tLO 500 -- -- ns Up/Down Toggle Frequency fUD -- -- 1 MHz tS 0.5 -- -- s 2.1 k, CL = 100 pF 1 -- -- s 5 k, CL = 100 pF 2 -- -- s 10 k, CL = 100 pF 10 5 -- s 50 k, CL = 100 pF -- 200 -- ns Wiper Settling Time Wiper Response on Power-up (c) 2006 Microchip Technology Inc. tPU DS21978C-page 7 MCP4011/2/3/4 tCSHI tCSLO 12V CS 5V tHUC 1/fUD tLO tHCUF tHUC tHCUF U/D tHI tHCUR tS tS W FIGURE 1-3: High-Voltage Increment Timing Waveform. SERIAL TIMING CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply across the specified operating ranges. Extended (E): VDD = +1.8V to 5.5V, TA = -40C to +125C. Parameters Sym Min Typ Max Units Conditions CS Low Time tCSLO 5 -- -- s CS High Time tCSHI 500 -- -- ns 2.7V VDD 5.5V -- -- -- ns 1.8V VDD < 2.7V U/D High Time tHI 500 -- -- ns U/D Low Time tLO 500 -- -- ns Up/Down Toggle Frequency fUD -- -- 1 MHz HV U/D to CS Hold Time tHUC 1.5 -- -- s HV CS to U/D Low Setup Time tHCUF 8 -- -- s HV CS to U/D High Setup Time tHCUR 4.5 -- -- s tS 0.5 -- -- s 2.1 k, CL = 100 pF 1 -- -- s 5 k, CL = 100 pF 2 -- -- s 10 k, CL = 100 pF 10 5 -- s 50 k, CL = 100 pF -- 200 -- ns Wiper Settling Time Wiper Response on Power-up DS21978C-page 8 tPU (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 tCSHI tCSLO CS 12V 5V 1/fUD tHUC tHUC tHI tHCUF U/D tLO tHCUR tS tS W FIGURE 1-4: High-Voltage Decrement Timing Waveform. SERIAL TIMING CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply across the specified operating ranges. Extended (E): VDD = +1.8V to 5.5V, TA = -40C to +125C. Parameters Sym Min Typ Max Units Conditions CS Low Time tCSLO 5 -- -- s CS High Time tCSHI 500 -- -- ns 2.7V VDD 5.5V -- -- -- ns 1.8V VDD < 2.7V U/D High Time tHI 500 -- -- ns U/D Low Time tLO 500 -- -- ns Up/Down Toggle Frequency fUD -- -- 1 MHz HV U/D to CS Hold Time tHUC 1.5 -- -- s HV CS to U/D Low Setup Time tHCUF 8 -- -- s HV CS to U/D High Setup Time tHCUR 4.5 -- -- s tS 0.5 -- -- s 2.1 k, CL = 100 pF 1 -- -- s 5 k, CL = 100 pF 2 -- -- s 10 k, CL = 100 pF 10 5 -- s 50 k, CL = 100 pF -- 200 -- ns Wiper Settling Time Wiper Response on Power-up (c) 2006 Microchip Technology Inc. tPU DS21978C-page 9 MCP4011/2/3/4 TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = +2.7V to +5.5V, VSS = GND. Parameters Sym Min Typ Max Units Specified Temperature Range TA -40 -- +125 C Operating Temperature Range TA -40 -- +125 C Storage Temperature Range TA -65 -- +150 C Thermal Resistance, 5L-SOT-23 JA -- 70 -- C/W Thermal Resistance, 6L-SOT-23 JA -- 120 -- C/W Thermal Resistance, 8L-DFN (2x3) JA -- 85 -- C/W Thermal Resistance, 8L-MSOP JA -- 206 -- C/W Thermal Resistance, 8L-SOIC JA -- 163 -- C/W Conditions Temperature Ranges Thermal Package Resistances DS21978C-page 10 (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. 250 2.7V -40C 2.7V 25C 2.7V 85C 2.7V 125C 5.5V -40C 5.5V 25C 5.5V 85C 5.5V 125C 60 50 40 800 200 30 20 600 400 150 200 ICS 0 100 -200 -400 50 10 -600 RCS 0 0.20 0.40 0.60 fU/D (MHz) 0.80 -1000 9 8 12 CS VPP Threshold (V) VDD = 5.5V 0.6 0.5 0.4 0.3 0.2 VDD = 2.7V 0.1 0.0 7 6 5 4 VCS (V) 3 2 1 FIGURE 2-3: CS Pull-up/Pull-down Resistance (RCS) and Current (ICS) vs. CS Input Voltage (VCS) (VDD = 5.5V). 0.8 0.7 -800 0 1.00 FIGURE 2-1: Device Current (IDD) vs. U/D Frequency (fU/D) and Ambient Temperature (VDD = 2.7V and 5.5V). Device Current (IDD) (A) 1000 ICS (A) 70 RCS (kOhms) Device Current (IDD) (A) 80 1.8V Entry 2.7V Entry 5.5V Entry 1.8V Exit 2.7V Exit 5.5V Exit 10 8 6 4 2 0 -40 25 85 125 Ambient Temperature (C) FIGURE 2-2: Device Current (ISHDN) and VDD. (CS = VDD) vs. Ambient Temperature. (c) 2006 Microchip Technology Inc. -40 -20 0 20 40 60 80 100 Ambient Temperature (C) 120 FIGURE 2-4: CS High Input Entry/Exit Threshold vs. Ambient Temperature and VDD. DS21978C-page 11 MCP4011/2/3/4 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. 120 0.05 100 0.025 80 0 DNL 60 -0.025 40 -0.05 20 0 8 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 300 0.4 60 0.2 40 0 200 0 DNL RW 100 DNL RW 500 -0.05 16 24 32 40 48 Wiper Setting (decimal) 56 -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL INL 6 4 2 16 24 32 40 48 Wiper Setting (decimal) 0 56 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL INL DNL RW 0 8 2.25 1.75 1.25 0.75 0.25 -0.25 -0.75 -1.25 -1.75 -2.25 -2.75 Error (LSb) Wiper Resistance (Rw)(ohms) -40C Rw -40C INL -40C DNL 16 24 32 40 48 56 Wiper Setting (decimal) FIGURE 2-7: 2.1 k Pot Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 1.8V). DS21978C-page 12 -2 0 FIGURE 2-6: 2.1 k Pot Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 2.7V). 1100 1000 900 800 700 600 500 400 300 200 100 0 0 DNL RW 8 16 24 32 40 48 Wiper Setting (decimal) 56 FIGURE 2-9: 2.1 k Rheo Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 2.7V). 1100 1000 900 800 700 600 500 400 300 200 100 0 -40C Rw -40C INL -40C DNL Wiper Resistance (Rw)(ohms) 8 8 200 -0.1 0 10 300 100 0 -0.2 -0.4 8 400 INL 0.6 FIGURE 2-8: 2.1 k Rheo Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 5.5V). 0.1 0.05 0.8 INL 0 Error (LSb) Wiper Resistance (Rw)(ohms) -40C Rw -40C INL -40C DNL 125C Rw 125C INL 125C DNL 80 16 24 32 40 48 56 Wiper Setting (decimal) FIGURE 2-5: 2.1 k Pot Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 5.5V). 400 85C Rw 85C INL 85C DNL 0 -0.1 0 25C Rw 25C INL 25C DNL 20 -0.075 RW -40C Rw -40C INL -40C DNL Error (LSb) INL 100 0.075 Error (LSb) 125C Rw 125C INL 125C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL INL RW DNL 0 8 16 24 32 40 48 Wiper Setting (decimal) 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 -2 Error (LSb) 85C Rw 85C INL 85C DNL Wiper Resistance (Rw)(ohms) Wiper Resistance (Rw)(ohms) 25C Rw 25C INL 25C DNL Wiper Resistance (Rw)(ohms) -40C Rw -40C INL -40C DNL 120 Error (LSb) 140 56 FIGURE 2-10: 2.1 k Rheo Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 1.8V). (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. 2500 2000 2060 RWB (Ohms) Nominal Resistance (RAB) (Ohms) 2080 VDD = 5.5V 2040 2020 1500 1000 -40C 25C 85C 125C 500 VDD = 2.7V 0 2000 -40 0 40 80 Ambient Temperature (C) 120 FIGURE 2-11: 2.1 k - Nominal Resistance () vs. Ambient Temperature and VDD. (c) 2006 Microchip Technology Inc. 0 8 16 24 32 40 48 Wiper Setting (decimal) 56 64 FIGURE 2-12: 2.1 k - RWB () vs. Wiper Setting and Ambient Temperature. DS21978C-page 13 MCP4011/2/3/4 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. WIPER WIPER WIPER U/D U/D U/D FIGURE 2-13: 2.1 k - Low-Voltage Decrement Wiper Settling Time (VDD = 2.7V). FIGURE 2-16: 2.1 k - Low-Voltage Increment Wiper Settling Time (VDD = 2.7V). WIPER WIPER U/D U/D FIGURE 2-14: 2.1 k - Low-Voltage Decrement Wiper Settling Time (VDD = 5.5V). FIGURE 2-17: 2.1 k - Low-Voltage Increment Wiper Settling Time (VDD = 5.5V). WIPER VDD FIGURE 2-15: Response Time. DS21978C-page 14 2.1 k - Power-Up Wiper (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. 120 0.05 100 0.025 INL 80 0 DNL 60 -0.025 40 -0.05 20 0 -0.1 0 8 -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 350 0.075 300 0.025 250 0 DNL -0.025 150 -0.05 RW 100 50 0 16 24 32 40 48 -0.4 -0.6 8 16 24 32 40 48 Wiper Setting (decimal) -40C Rw -40C INL -40C DNL 400 INL 1500 DNL 1000 RW 500 0 0 8 0 DNL 0 -1 8 16 24 32 40 48 Wiper Setting (decimal) 56 FIGURE 2-22: 5 k Rheo Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 2.7V). -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 2000 16 24 32 40 48 56 Wiper Setting (decimal) FIGURE 2-20: 5 k Pot Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 1.8V). (c) 2006 Microchip Technology Inc. 3 1 0 2.25 1.75 1.25 0.75 0.25 -0.25 -0.75 -1.25 -1.75 -2.25 -2.75 4 200 Wiper Resistance (Rw)(ohms) 125C Rw 125C INL 125C DNL 5 2 56 Error (LSb) Wiper Resistance (Rw)(ohms) 2000 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 300 2500 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL RW FIGURE 2-19: 5 k Pot Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 2.7V). -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL INL Wiper Setting (decimal) 2500 56 FIGURE 2-21: 5 k Rheo Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 5.5V). -0.125 8 -0.2 RW 100 -0.1 0 40 500 -0.075 0.4 0 DNL 600 0.1 0.6 0.2 INL 0 0.05 INL 200 60 125C Rw 125C INL 125C DNL 0 Error (LSb) Wiper Resistance (Rw)(ohms) 400 85C Rw 85C INL 85C DNL 80 16 24 32 40 48 56 Wiper Setting (decimal) FIGURE 2-18: 5 k Pot Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 5.5V). 450 25C Rw 25C INL 25C DNL 20 -0.075 RW -40C Rw -40C INL -40C DNL Error (LSb) 0.075 Error (LSb) 125C Rw 125C INL 125C DNL INL 1500 1000 RW 500 DNL 0 0 8 16 24 32 40 48 Wiper Setting (decimal) 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 -2 Error (LSb) 85C Rw 85C INL 85C DNL Wiper Resistance (Rw)(ohms) Wiper Resistance (Rw)(ohms) 100 25C Rw 25C INL 25C DNL Wiper Resistance (Rw)(ohms) -40C Rw -40C INL -40C DNL 120 Error (LSb) 140 56 FIGURE 2-23: 5 k Rheo Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 1.8V). DS21978C-page 15 MCP4011/2/3/4 4950 6000 4925 5000 4900 4000 RWB (Ohms) Nominal Resistance (RAB) (Ohms) Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. 4875 VDD = 5.5V 4850 4825 3000 2000 -40C 25C 85C 125C 1000 VDD = 2.7V 4800 0 -40 -20 0 20 40 60 80 100 120 Ambient Temperature (C) FIGURE 2-24: 5 k - Nominal Resistance () vs. Ambient Temperature and VDD. DS21978C-page 16 0 8 16 24 32 40 48 Wiper Setting (decimal) 56 64 FIGURE 2-25: 5 k - RWB () vs. Wiper Setting and Ambient Temperature. (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. WIPER WIPER U/D U/D FIGURE 2-26: 5 k - Low-Voltage Decrement Wiper Settling Time (VDD = 2.7V). FIGURE 2-28: 5 k - Low-Voltage Increment Wiper Settling Time (VDD = 2.7V). WIPER WIPER U/D FIGURE 2-27: 5 k - Low-Voltage Decrement Wiper Settling Time (VDD = 5.5V). (c) 2006 Microchip Technology Inc. U/D FIGURE 2-29: 5 k - Low-Voltage Increment Wiper Settling Time (VDD = 5.5V). DS21978C-page 17 MCP4011/2/3/4 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. 0.05 120 0.025 100 DNL 80 0 INL 60 -0.025 40 -0.05 RW 20 -0.075 0 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL DNL 300 INL 250 200 -0.05 150 -0.075 RW 100 -0.1 50 0 -0.125 8 60 0 40 -0.05 RW -0.1 -0.15 8 -40C Rw -40C INL -40C DNL 3000 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 2500 DNL 2000 1500 INL 1000 500 RW 0 0 8 125C Rw 125C INL 125C DNL 1.5 200 DNL -0.5 RW 100 -1.5 -2.5 8 16 24 32 40 48 56 Wiper Setting (decimal) FIGURE 2-34: 10 k Rheo Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 2.7V). -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 2500 16 24 32 40 48 56 Wiper Setting (decimal) 2.5 0.5 3000 FIGURE 2-32: 10 k Pot Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 1.8V). DS21978C-page 18 85C Rw 85C INL 85C DNL 300 0 2.25 1.75 1.25 0.75 0.25 -0.25 -0.75 -1.25 -1.75 -2.25 -2.75 25C Rw 25C INL 25C DNL 0 Error (LSb) -40C Rw -40C INL -40C DNL 56 INL 3500 3500 16 24 32 40 48 Wiper Setting (decimal) 400 16 24 32 40 48 56 Wiper Setting (decimal) FIGURE 2-31: 10 k Pot Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 2.7V). Wiper Resistance (Rw)(ohms) 0.05 500 0.025 -0.025 0.1 FIGURE 2-33: 10 k Rheo Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 5.5V). 0.05 0 0.15 DNL Wiper Resistance (Rw)(ohms) Wiper Resistance (Rw)(ohms) 25C Rw 25C INL 25C DNL 350 0 80 0 Error (LSb) -40C Rw -40C INL -40C DNL 400 125C Rw 125C INL 125C DNL 0 FIGURE 2-30: 10 k Pot Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 5.5V). 450 85C Rw 85C INL 85C DNL INL 16 24 32 40 48 56 Wiper Setting (decimal) Wiper Resistance (Rw)(ohms) 8 25C Rw 25C INL 25C DNL 20 -0.1 0 -40C Rw -40C INL -40C DNL Error (LSb) 125C Rw 125C INL 125C DNL Error (LSb) 85C Rw 85C INL 85C DNL Error (LSb) Wiper Resistance (Rw)(ohms) 100 25C Rw 25C INL 25C DNL RW 2000 1500 INL 1000 500 DNL 0 0 8 16 24 32 40 48 Wiper Setting (decimal) 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 -2 Error (LSb) -40C Rw -40C INL -40C DNL Wiper Resistance (Rw)(ohms) 120 56 FIGURE 2-35: 10 k Rheo Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 1.8V). (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 12000 10250 10230 10210 10190 10170 10150 10130 10110 10090 10070 10050 10000 VDD = 5.5V VDD = 2.7V RWB (Ohms) Nominal Resistance (RAB) (Ohms) Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. 8000 6000 4000 -40C 25C 85C 125C 2000 0 -40 -20 0 20 40 60 80 100 120 Ambient Temperature (C) FIGURE 2-36: 10 k - Nominal Resistance () vs. Ambient Temperature and VDD. (c) 2006 Microchip Technology Inc. 0 8 16 24 32 40 48 Wiper Setting (decimal) 56 64 FIGURE 2-37: 10 k - RWB () vs. Wiper Setting and Ambient Temperature. DS21978C-page 19 MCP4011/2/3/4 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. WIPER WIPER U/D FIGURE 2-38: 10 k - Low-Voltage Decrement Wiper Settling Time (VDD = 2.7V). WIPER U/D FIGURE 2-39: 10 k - Low-Voltage Decrement Wiper Settling Time (VDD = 5.5V). DS21978C-page 20 U/D FIGURE 2-40: 10 k - Low-Voltage Increment Wiper Settling Time (VDD = 2.7V). WIPER U/D FIGURE 2-41: 10 k - Low-Voltage Increment Wiper Settling Time (VDD = 5.5V). (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. 120 0 INL -0.05 RW 40 150 -0.1 0 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 400 300 600 0.025 500 -0.025 INL 200 -0.05 100 -0.075 RW 0 8 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL RW INL DNL 0 8 16 24 32 40 48 56 Wiper Setting (decimal) FIGURE 2-44: 50 k Pot Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 1.8V). (c) 2006 Microchip Technology Inc. 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 1.5 1 RW 0.5 INL 0 DNL 200 -0.5 100 -1 -1.5 0 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 -2 56 0 Error (LSb) 25C Rw 25C INL 25C DNL Wiper Resistance (Rw)(ohms) -40C Rw -40C INL -40C DNL -40C Rw -40C INL -40C DNL 300 16 24 32 40 48 56 Wiper Setting (decimal) FIGURE 2-43: 50 k Pot Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 2.7V). 12000 11000 10000 9000 8000 7000 6000 5000 4000 3000 2000 1000 0 16 24 32 40 48 Wiper Setting (decimal) 400 -0.1 0 8 FIGURE 2-45: 50 k Rheo Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 5.5V). 0.05 0 -0.05 -0.1 0 DNL 0.1 0 RW 50 0 Error (LSb) Wiper Resistance (Rw)(ohms) 500 25C Rw 25C INL 25C DNL 0.15 0.05 16 24 32 40 48 56 Wiper Setting (decimal) -40C Rw -40C INL -40C DNL 125C Rw 125C INL 125C DNL DNL FIGURE 2-42: 50 k Pot Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 5.5V). 600 85C Rw 85C INL 85C DNL INL Wiper Resistance (Rw)(ohms) 8 25C Rw 25C INL 25C DNL 100 -0.15 0 -40C Rw -40C INL -40C DNL Error (LSb) 0.05 DNL 80 200 Error (LSb) 0.1 125C Rw 125C INL 125C DNL 8 16 24 32 40 48 Wiper Setting (decimal) 56 FIGURE 2-46: 50 k Rheo Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 2.7V). 12000 11000 10000 9000 8000 7000 6000 5000 4000 3000 2000 1000 0 -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL RW INL DNL 0 8 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 -2 Error (LSb) 85C Rw 85C INL 85C DNL Wiper Resistance (Rw)(ohms) Wiper Resistance (Rw)(ohms) 160 25C Rw 25C INL 25C DNL Wiper Resistance (Rw)(ohms) -40C Rw -40C INL -40C DNL Error (LSb) 200 16 24 32 40 48 56 Wiper Setting (decimal) FIGURE 2-47: 50 k Rheo Mode - RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 1.8V). DS21978C-page 21 MCP4011/2/3/4 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. 60000 49600 50000 49400 VDD = 5.5V 49200 49000 48800 VDD = 2.7V 48600 48400 RWB (Ohms) Nominal Resistance (RAB) (Ohms) 49800 40000 30000 20000 -40C 25C 85C 125C 10000 48200 48000 0 -40 -20 0 20 40 60 80 100 120 Ambient Temperature (C) FIGURE 2-48: 50 k - Nominal Resistance () vs. Ambient Temperature and VDD. DS21978C-page 22 0 8 16 24 32 40 48 Wiper Setting (decimal) 56 64 FIGURE 2-49: 50 k - RWB () vs. Wiper Setting and Ambient Temperature. (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. U/D U/D WIPER WIPER FIGURE 2-50: 50 k - Low-Voltage Decrement Wiper Settling Time (VDD = 2.7V). FIGURE 2-53: 50 k - Low-Voltage Increment Wiper Settling Time (VDD = 2.7V). U/D U/D WIPER WIPER FIGURE 2-51: 50 k - Low-Voltage Decrement Wiper Settling Time (VDD = 5.5V). FIGURE 2-54: 50 k - Low-Voltage Increment Wiper Settling Time (VDD = 5.5V). WIPER VDD FIGURE 2-52: Response Time. 50 k - Power-Up Wiper (c) 2006 Microchip Technology Inc. DS21978C-page 23 MCP4011/2/3/4 Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V. -3dB Frequency (MHz) 4.5 4 A 2.1 k: 3.5 3 VIN 2.5 5 k: 2 1.5 10 k: 1 0.5 ~ Offset Gnd +5V W DUT + VOUT - B 50 k: 2.5V DC 0 -40 25 125 Temperature (C) FIGURE 2-55: Temperature. DS21978C-page 24 -3 dB Bandwidth vs. FIGURE 2-56: Circuit. -3 dB Bandwidth Test (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number MCP4011 (SOIC-8) MCP4012 MCP4014 Symbol MCP4013 (SOT-23-5) (SOT-23-6) Buffer Type 1 1 VDD P -- Positive Power Supply Input 2 2 2 VSS P -- Ground 3 6 -- A I/O A Potentiometer Terminal A 4 5 5 W I/O A Potentiometer Wiper Terminal 5 4 4 CS I TTL 6 -- -- B I/O A Potentiometer Terminal B 7 -- -- NC -- -- No Connection 8 3 3 U/D I TTL Chip Select Input Increment/Decrement Input A = Analog input O = Output Positive Power Supply Input (VDD) The VDD pin is the device's positive power supply input. The input power supply is relative to VSS and can range from 1.8V to 5.5V. A decoupling capacitor on VDD (to VSS) is recommended to achieve maximum performance. 3.2 Function 1 Legend: TTL = TTL compatible input I = Input P = Power 3.1 Pin Type Ground (VSS) 3.4 Potentiometer Wiper (W) Terminal The terminal W pin is connected to the internal potentiometer's terminal W (the wiper). The wiper terminal is the adjustable terminal of the digital potentiometer. The terminal W pin does not have a polarity relative to terminals A or B pins. The terminal W pin can support both positive and negative current. The voltage on terminal W must be between VSS and VDD. The VSS pin is the device ground reference. 3.5 3.3 The terminal B pin is connected to the internal potentiometer's terminal B (available on some devices). The potentiometer's terminal B is the fixed connection to the 0x00 terminal of the digital potentiometer. Potentiometer Terminal A The terminal A pin is connected to the internal potentiometer's terminal A (available on some devices). The potentiometer's terminal A is the fixed connection to the 0x3F terminal of the digital potentiometer. The terminal A pin is available on the MCP4011, MCP4012 and MCP4013 devices. The terminal A pin does not have a polarity relative to the terminal W or B pins. The terminal A pin can support both positive and negative current. The voltage on terminal A must be between VSS and VDD. The terminal A pin is not available on the MCP4014. The potentiometer's terminal A is internally floating. Potentiometer Terminal B The terminal B pin is available on the MCP4011 device. The terminal B pin does not have a polarity relative to the terminal W or A pins. The terminal B pin can support both positive and negative current. The voltage on terminal B must be between VSS and VDD. The terminal B pin is not available on the MCP4012, MCP4013 and MCP4014 devices. For the MCP4013 and MCP4014, the internal potentiometer's terminal B is internally connected to VSS. Terminal B does not have a polarity relative to terminals W or A. Terminal B can support both positive and negative current. For the MCP4012, terminal B is internally floating. (c) 2006 Microchip Technology Inc. DS21978C-page 25 MCP4011/2/3/4 3.6 Chip Select (CS) The CS pin is the chip select input. Forcing the CS pin to VIL enables the serial commands. These commands can increment and decrement the wiper. Forcing the CS pin to VIHH enables the high-voltage serial commands. These commands can increment and decrement the wiper and are compatibe with the MCP402X devices. The wiper is saved to volatile memory (RAM). 3.7 Increment/Decrement (U/D) The U/D pin input is used to increment or decrement the wiper on the digital potentiometer. An increment moves the wiper one step toward terminal A, while a decrement moves the wiper one step toward terminal B. The CS pin has an internal pull-up resistor. The resistor will become "disabled" when the voltage on the CS pin is below the VIH level. This means that when the CS pin is "floating", the CS pin will be pulled to the VIH level (serial communication (the U/D pin) is ignored). And when the CS pin is driven low (VIL), the resistance becomes very large to reduce the device current consumption when serial commands are occurring. See Figure 2-3 for additional information. DS21978C-page 26 (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 4.0 GENERAL OVERVIEW EQUATION 4-1: The MCP4011/2/3/4 devices are general purpose digital potentiometers intended to be used in applications where a programmable resistance with moderate bandwidth is desired. Applications generally suited for the MCP4011/2/3/4 devices include: * * * * Set point or offset trimming Sensor calibration Selectable gain and offset amplifier designs Cost-sensitive mechanical trim pot replacement There are 63 resistors in a string between terminal A and terminal B. The wiper can be set to tap onto any of these 63 resistors thus providing 64 possible settings (including terminal A and terminal B). Figure 4-1 shows a block diagram for the resistive network of the device. Equation 4-1 shows the calculation for the step resistance, while Equation 4-2 illustrates the calculation used to determine the resistance between the wiper and terminal B. A N = 62 3Eh RW (1) RS 3Dh N = 61 RW RS (1) W 01h N=1 RW (1) RS N=0 B 00h RW EQUATION 4-2: RWB CALCULATION R AB N - + RW R WB = ------------63 1 LSb is the ideal resistance difference between two successive codes. If we use N = 1 and RW = 0 in Equation 4-2, we can calculate the step size for each increment or decrement command. The MCP4011 device offers a voltage divider (potentiometer) with all terminals available on pins. The MCP4012 is a true rheostat, with terminal A and the wiper (W) of the variable resistor available on pins. The MCP4013 device offers a voltage divider (potentiometer) with terminal B connected to ground. The MCP4014 device is a Rheostat device with terminal A of the resistor floating, terminal B connected to ground, and the wiper (W) available on pin. The MCP4011 can be externally configured to implement any of the MCP4012, MCP4013 or MCP4014 configurations. 4.1 3Fh RW (1) RS R AB R S = --------63 N = 0 to 63 (decimal) The digital potentiometer is available in four nominal resistances (RAB), where the nominal resistance is defined as the resistance between terminal A and terminal B. The four nominal resistances are 2.1 k, 5 k, 10 k and 50 k. N = 63 RS CALCULATION Serial Interface A 2-wire synchronous serial protocol is used to increment or decrement the digital potentiometer's wiper terminal. The Increment/Decrement (U/D) protocol utilizes the CS and U/D input pins. Both inputs are tolerant of signals up to 12.5V without damaging the device. The CS pin can differenciate between two high-voltage levels, VIH and VIHH. This enables additional commands without requiring additional input pins. The high-voltage commands (VIHH on the CS pin) are similar to the standard commands and are supported for compatability to the MCP401X family of devices. The simple U/D protocol uses the state of the U/D pin at the falling edge of the CS pin to determine if Increment or Decrement mode is desired. Subsequent rising edges of the U/D pin move the wiper. The wiper value will not underflow or overflow. (1) Analog Mux Note 1: The wiper resistance is tap dependent. That is, each tap selection resistance has a small variation. This variation effects the smaller resistance devices (2.1 k) more. FIGURE 4-1: Resistor Block Diagram. (c) 2006 Microchip Technology Inc. DS21978C-page 27 MCP4011/2/3/4 4.2 Power-up 4.3 When the device powers up (rising VDD crosses the Trip Point Voltage (VTP)), the "default" wiper setting is restored. Table 4-1 shows the default value loaded into the wiper on POR/BOR. TABLE 4-1: DEFAULT POR WIPER SETTING SELECTION Default POR Wiper Setting Wiper Code Typical RAB Value -202 Mid-scale 1Fh 2.1 k -502 Mid-scale 1Fh 5.0 k -103 Mid-scale 1Fh 10.0 k -503 Mid-scale 1Fh 50.0 k Package Code Brown Out If the device VDD is below the specified minimum voltage, care must be taken to ensure that the CS and U/D pins do not "create" any of the serial commands. When the device VDD drops below VMIN (1.8V), the electrical performance may not meet the data sheet specifications (see Figure 4-2). The wiper state may be unknown. Also, the device may be capable of incrementing or decrementing, if a valid command is detected on the CS and U/D pins. When the device voltage rises from below the powerup trip point (VTP) into the valid operation voltage range, the wiper state will be forced to the default POR wiper setting (see Table 4-1). 4.4 Serial Interface Inactive The serial interface is inactive any time the CS pin is at VIH and all write cycles are completed. While VDD < Vmin (1.8V), the electrical performance may not meet the data sheet specifications (see Figure 4-2). The wiper state may be unknown. Also, the device may be capable of incrementing or decrementing, if a valid command is detected on the CS and U/D pins. VDD 1.8V VTP VSS POR Trip Point (on Rising VDD) Outside Device Operation Wiper Forced to Default POR Setting FIGURE 4-2: DS21978C-page 28 Power-up and Brown-out. (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 5.0 SERIAL INTERFACE 5.1 Overview 5.2 The MCP4011/2/3/4 utilizes a simple 2-wire interface to increment or decrement the digital potentiometer's wiper terminal (W). This interface uses the CS and U/D pins. The CS pin is the Chip Select input, while the U/D pin is the Up/Down input. The Increment/Decrement protocol enables the device to move one step at a time through the range of possible resistance values. The wiper value is initialized with the "default" value upon power-up. A wiper value of 00h connects the wiper to terminal B. A wiper value of 3Fh connects the wiper to terminal A. Increment commands move the wiper toward terminal A, but will not increment to a value greater than 3Fh. Decrement commands move the wiper toward terminal B, but will not decrement below 00h. Refer to Section 1.0 "Electrical Characteristics", AC/DC Electrical Characteristics table for detailed input threshold and timing specifications. Serial Commands The MCP401X devices support eight serial commands. Six of these commands are for support and to ease migration with the MCP402X family of devices. The commands can be grouped into the following types: * Serial Commands * High-voltage Serial Commands All the commands are shown in Table 5-1. The command type is determined by the voltage level the CS pin is driven to. The initial state that the CS pin must be driven is VIH. From VIH, the two levels that the CS pin can be driven are: * VIL * VIHH If the CS pin is driven from VIH to VIL, a serial command is selected. If the CS pin is driven from VIH to VIHH, a high-voltage serial command is selected. Support of the high-voltage serial commands is for compatiblity with the MCP402X devices. Communication is unidirectional. Therefore, the value of the current wiper setting cannot be read out of the MCP401X device. TABLE 5-1: COMMANDS Command Name High Voltage on CS pin? Increment -- Increment (for MCP402X Compatibility) -- Decrement -- Decrement (for MCP402X Compatibility) -- High-Voltage Increment 1 (for MCP402X Compatibility) Yes High-Voltage Increment 2 (for MCP402X Compatibility) Yes High-Voltage Decrement 1 (for MCP402X Compatibility) Yes High-Voltage Decrement 2 (for MCP402X Compatibility) Yes (c) 2006 Microchip Technology Inc. DS21978C-page 29 MCP4011/2/3/4 5.2.1 INCREMENT When the device voltage falls below the RAM retention voltage of the device, the wiper state may be corrupted. When the device returns to the operating range, the wiper will be loaded with the default POR wiper setting. This mode is achieved by initializing the U/D pin to a high state (VIH) prior to achieving a low state (VIL) on the CS pin. Subsequent rising edges of the U/D pin increment the wiper setting toward terminal A. This is shown in Figure 5-1. After the CS pin is driven to VIH (from VIL), any other serial command may immediately be entered. After the wiper is incremented to the desired position, the CS pin should be forced to VIH to ensure that "unexpected" transitions on the U/D pin do not cause the wiper setting to increment. Driving the CS pin to VIH should occur as soon as possible (within device specifications) after the last desired increment occurs. Note: The wiper value will not overflow. That is, once the wiper value equals 0x3F, subsequent increment commands are ignored. VIH CS VIL 1 U/D DS21978C-page 30 3 5 4 6 VIH VIL Wiper FIGURE 5-1: 2 X X+1 X+2 X+3 X+4 Increment. (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 5.2.2 Note: INCREMENT (FOR MCP402X COMPATIBILITY) When the device voltage falls below the RAM retention voltage of the device, the wiper state may be corrupted. When the device returns to the operating range, the wiper will be loaded with the Default POR wiper setting. This command allows compatibility with the MCP402X family, which supports updating of the non-volatile wiper setting. After the CS pin is driven to VIH (from VIL), any other serial command may immediately be entered. This mode is achieved by initializing the U/D pin to a high state (VIH) prior to achieving a low state (VIL) on the CS pin. Subsequent rising edges of the U/D pin increments the wiper setting toward terminal A. This is shown in Figure 5-2. Note: The wiper value will not overflow. That is, once the wiper value equals 0x3F, subsequent increment commands are ignored. After the wiper is incremented to the desired position, the U/D pin should be driven low (VIL), and the CS pin should be forced to VIH to ensure that "unexpected" transitions on the U/D pin do not cause the wiper setting to increment. Driving the CS pin to VIH should occur as soon as possible (within device specifications) after the last desired increment occurs. VIH VIH VIL CS VIH 1 2 3 4 5 VIL U/D Wiper FIGURE 5-2: 6 X X+1 X+2 X+3 X+4 Increment (For MCP402X Compatibility). (c) 2006 Microchip Technology Inc. DS21978C-page 31 MCP4011/2/3/4 5.2.3 DECREMENT When the device voltage falls below the RAM retention voltage of the device, the wiper state may be corrupted. When the device returns to the operating range, the wiper will be loaded with the default POR wiper setting. This mode is achieved by initializing the U/D pin to a low state (VIL) prior to achieving a low state (VIL) on the CS pin. Subsequent rising edges of the U/D pin will decrement the wiper setting toward terminal B. This is shown in Figure 5-3. After the CS pin is driven to VIH (from VIL), any other serial command may immediately be entered. After the wiper is decremented to the desired position, the U/D pin should be forced low (VIL) and the CS pin should be forced to VIH. This will ensure that "unexpected" transitions on the U/D pin do not cause the wiper setting to decrement. Driving the CS pin to VIH should occur as soon as possible (within device specifications) after the last desired increment occurs. Note: The wiper value will not underflow. That is, once the wiper value equals 0x00, subsequent decrement commands are ignored. VIH VIL CS 1 U/D DS21978C-page 32 4 VIH 3 5 6 VIL VIL Wiper FIGURE 5-3: 2 X X-1 X-2 X-3 X-4 Decrement. (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 5.2.4 Note: DECREMENT (FOR MCP402X COMPATIBILITY) When the device voltage falls below the RAM retention voltage of the device, the wiper state may be corrupted. When the device returns to the operating range, the wiper will be loaded with the default POR wiper setting. This command allows compatibility with the MCP402X family, which supports updating of the non-volatile wiper setting. After the CS pin is driven to VIH (from VIL), any other serial command may immediately be entered. This mode is achieved by initializing the U/D pin to a low state (VIL) prior to achieving a low state (VIL) on the CS pin. Subsequent rising edges of the U/D pin decrement the wiper setting toward terminal B. This is shown in Figure 5-4. Note: The wiper value will not underflow. That is, once the wiper value equals 0x00, subsequent decrement commands are ignored. After the wiper is decremented to the desired position, the U/D pin should remain high (VIH), and the CS pin should be forced to VIH to ensure that "unexpected" transitions on the U/D pin do not cause the wiper setting to increment. Driving the CS pin to VIH should occur as soon as possible (within device specifications) after the last desired increment occurs. VIH VIL CS 1 U/D Wiper FIGURE 5-4: 2 3 4 5 6 VIH VIL X X-1 X-2 X-3 X-4 Decrement (For MCP402X Compatibility). (c) 2006 Microchip Technology Inc. DS21978C-page 33 MCP4011/2/3/4 5.2.5 Note: HIGH-VOLTAGE INCREMENT 1 (FOR MCP402X COMPATIBILITY) After the CS pin is driven to VIH (from VIL), any other serial command may immediately be entered. Note: This command allows compatibility with the MCP402X family, which supports updating of the non-volatile wiper setting with the WiperLock Technology feature. The wiper value will not overflow. That is, once the wiper value equals 0x3F, subsequent increment commands are ignored. This mode is achieved by initializing the U/D pin to a high state (VIH) prior to the CS pin being driven to VIHH. Subsequent rising edges of the U/D pin increment the wiper setting toward terminal A. Set the U/D pin to the high state (VIH) prior to forcing the CS pin to VIH. This is shown in Figure 5-5. VIHH VIH VIH CS VIH U/D Wiper FIGURE 5-5: DS21978C-page 34 1 2 3 5 4 6 VIH VIL X X+1 X+2 X+3 X+4 High-Voltage Increment 1 (For MCP402X Compatibility). (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 5.2.6 Note: HIGH-VOLTAGE INCREMENT 2 (FOR MCP402X COMPATIBILITY) After the CS pin is driven to VIH (from VIL), any other serial command may immediately be entered. Note: This command allows compatibility with the MCP402X family, which supports updating of the non-volatile wiper setting with the WiperLock Technology feature. The wiper value will not overflow. That is, once the wiper value equals 0x3F, subsequent increment commands are ignored. This mode is achieved by initializing the U/D pin to a high state (VIH) prior to the CS pin being driven to VIHH. Subsequent rising edges of the U/D pin increment the wiper setting toward terminal A. Set the U/D pin to the low state (VIL) prior to forcing the CS pin to VIH. This is shown in Figure 5-6. VIHH VIH VIH CS VIH U/D Wiper FIGURE 5-6: 1 2 3 4 5 6 VIL VIL X X+1 X+2 X+3 X+4 High-Voltage Increment 2 (For MCP402X Compatibility). (c) 2006 Microchip Technology Inc. DS21978C-page 35 MCP4011/2/3/4 5.2.7 Note: HIGH-VOLTAGE DECREMENT 1 (FOR MCP402X COMPATIBILITY) After the CS pin is driven to VIH (from VIL), any other serial command may immediately be entered. Note: This command allows compatibility with the MCP402X family, which supports updating of the non-volatile wiper setting with the WiperLock Technology feature. The wiper value will not underflow. That is, once the wiper value equals 0x00, subsequent decrement commands are ignored. This mode is achieved by initializing the U/D pin to a low state (VIL) prior to the CS pin being driven to VIHH. Subsequent rising edges of the U/D pin decrement the wiper setting toward terminal B. Set the U/D pin to the low state (VIL) prior to forcing the CS pin to VIH. This is shown in Figure 5-7. VIHH VIH VIH CS 1 U/D Wiper FIGURE 5-7: DS21978C-page 36 2 3 4 5 6 VIH VIL VIL X X-1 X-2 X-3 X-4 High-Voltage Decrement 1 (For MCP402X Compatibility). (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 5.2.8 Note: HIGH-VOLTAGE DECREMENT 2 (FOR MCP402X COMPATIBILITY) After the CS pin is driven to VIH (from VIL), any other serial command may immediately be entered. Note: This command allows compatibility with the MCP402X family, which supports updating of the non-volatile wiper setting with the WiperLock Technology feature. The wiper value will not underflow. That is, once the wiper value equals 0x00, subsequent decrement commands are ignored. This mode is achieved by initializing the U/D pin to the low state (VIL) prior to driving the CS pin to VIHH. Subsequent rising edges of the U/D pin decrement the wiper setting toward terminal B. Set the U/D pin to a high state (VIH) prior to forcing the CS pin to VIH. This is shown in Figure 5-8. VIHH VIH VIH CS 1 U/D 3 VDD 5 4 6 VIH VIL Wiper FIGURE 5-8: 2 X X-1 X-2 X-3 X-4 High-Voltage Decrement 2 (For MCP402X Compatibility). (c) 2006 Microchip Technology Inc. DS21978C-page 37 MCP4011/2/3/4 5.3 CS High Voltage The CS pin is High-Voltage (VIHH) tolerant, like the MCP402X. This allows the MCP401X to be used in MCP402X applications without needing to change other portions of the application circuit. 6.0 RESISTOR Digital potentiometer applications can be divided into two categories: Figure 6-1 shows a block diagram for the MCP401X resistors. A RW (1) RW (1) RW (1) N = 62 Typical Resistance () Total (RAB) Step (RS) MCP401X-203E 2100 33.33 MCP401X-503E 5000 79.37 MCP401X-104E 10000 158.73 MCP401X-504E 50000 793.65 Terminal A and B, as well as the wiper W, do not have a polarity. These terminals can support both positive and negative current. 3Eh 3Dh N = 61 RS TABLE 6-1: TYPICAL STEP RESISTANCES 3Fh N = 63 RS The total resistance of the device has minimal variation due to operating voltage (see Figure 2-11, Figure 2-24, Figure 2-36 or Figure 2-48). Part Number * Rheostat configuration * Potentiometer (or voltage divider) configuration RS Step resistance (RS) is the resistance from one tap setting to the next. This value will be dependent on the RAB value that has been selected. Table 6-1 shows the typical step resistances for each device. W N=1 01h RW (1) RS N=0 B 00h RW (1) Analog Mux Note 1: The wiper resistance is tap dependent. That is, each tap selection resistance has a small variation. This variation effects the smaller resistance devices (2.1 k) more. FIGURE 6-1: DS21978C-page 38 Resistor Block Diagram. (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 6.1 Resistor Configurations 6.1.1 6.1.2 RHEOSTAT CONFIGURATION When used as a rheostat, two of the three digital potentiometer's terminals are used as a resistive element in the circuit. With terminal W (wiper) and either terminal A or terminal B, a variable resistor is created. The resistance will depend on the tap setting of the wiper and the wiper's resistance. The resistance is controlled by changing the wiper setting. The unused terminal (B or A) should be left floating. Figure 6-2 shows the two possible resistors that can be used. Reversing the polarity of the A and B terminals will not affect operation. POTENTIOMETER CONFIGURATION When used as a potentiometer, all three terminals are tied to different nodes in the circuit. This allows the potentiometer to output a voltage proportional to the input voltage. This configuration is sometimes called voltage divider mode. The potentiometer is used to provide a variable voltage by adjusting the wiper position between the two endpoints as shown in Figure 6-3. Reversing the polarity of the A and B terminals will not affect operation. V1 A W A V3 B RAW or W RBW B FIGURE 6-3: Resistor FIGURE 6-2: Rheostat Configuration. This allows the control of the total resistance between the two nodes. The total resistance depends on the "starting" terminal to the wiper terminal. At the code 00h, the RBW resistance is minimal (RW), but the RAW resistance in maximized (RAB + RW). Conversely, at the code 3Fh, the RAW resistance is minimal (RW), but the RBW resistance in maximized (RAB + RW). The resistance step size (RS) equates to one LSb of the resistor. Note: V2 To avoid damage to the internal wiper circuitry in this configuration, care should be taken to insure the current flow never exceeds 2.5 mA. Potentiometer Configuration. The temperature coefficient of the RAB resistors is minimal by design. In this configuration, the resistors all change uniformly, so minimal variation should be seen. The wiper resistor temperature coefficient is different from the RAB temperature coefficient. The voltage at node V3 (Figure 6-3) is not dependent on this wiper resistance, just the ratio of the RAB resistors, so this temperature coefficient in most cases can be ignored. Note: To avoid damage to the internal wiper circuitry in this configuration, care should be taken to insure the current flow never exceeds 2.5 mA. The change in wiper-to-end terminal resistance over temperature is shown in Figure 2-11, Figure 2-24, Figure 2-36 and Figure 2-48. The most variation over temperature will occur in the first few codes due to the wiper resistance coefficient affecting the total resistance. The remaining codes are dominated by the total resistance tempco RAB. (c) 2006 Microchip Technology Inc. DS21978C-page 39 MCP4011/2/3/4 6.2 Wiper Resistance The slope of the resistance has a linear area (at the higher voltages) and a non-linear area (at the lower voltages), where resistance increases faster than the voltage drop (at low voltages). Wiper resistance is the series resistance of the wiper. This resistance is typically measured when the wiper is positioned at either zero-scale (00h) or full-scale (3Fh). The wiper resistance in potentiometer-generated voltage divider applications is not a significant source of error. The wiper resistance in rheostat applications can create significant non-linearity as the wiper is moved toward zero-scale (00h). The lower the nominal resistance, the greater the possible error. RW Wiper resistance is significant depending on the devices operating voltage. As the device voltage decreases, the wiper resistance increases (see Figure 6-4 and Table 6-2). VDD Note: In a rheostat configuration, this change in voltage needs to be taken into account, particularly for the lower resistance devices. For the 2.1 k device, the maximum wiper resistance at 5.5V is approximately 6% of the total resistance, while at 2.7V, it is approximately 15.5% of the total resistance. FIGURE 6-4: Relationship of Wiper Resistance (RW) to Voltage. Since there is minimal variation of the total device resistance over voltage, at a constant temperature (see Figure 2-11, Figure 2-24, Figure 2-36 or Figure 2-48), the change in wiper resistance over voltage can have a significant impact on the INL and DNL error. In a potentiometer configuration, the wiper resistance variation does not effect the output voltage seen on the terminal W pin. TABLE 6-2: The slope of the resistance has a linear area (at the higher voltages) and a nonlinear area (at the lower voltages). TYPICAL STEP RESISTANCES AND RELATIONSHIP TO WIPER RESISTANCE RW / RS (%) (1, 2) Resistance () Typical Wiper (RW) Max @ Max @ 5.5V 2.7V RW = Typical RW = Max RW = Max @ 5.5V @ 2.7V RW / RAB (%) (1, 3) RW = Typical RW = Max RW = Max @ 5.5V @ 2.7V Total (RAB) Step (RS) Typical 2100 33.33 75 125 325 225.0% 375.0% 975.0% 3.57% 5.95% 15.48% 5000 79.37 75 125 325 94.5% 157.5% 409.5% 1.5% 2.50% 6.50% 10000 158.73 75 125 325 47.25% 78.75% 204.75% 0.75% 1.25% 3.25% 50000 793.65 75 125 325 9.45% 15.75% 40.95% 0.15% 0.25% 0.65% Note 1: The wiper resistance (RW) is not a significant source of error in potentiometer-generated voltage divider applications. In rheostat applications, the variation of the RW value can create significant non-linearity. 2: RS is the typical value. The variation of this resistance is minimal over voltage. 3: RAB is the typical value. The variation of this resistance is minimal over voltage. DS21978C-page 40 (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 6.3 Operational Characteristics Understanding the operational characteristics of the device's resistor components is important to the system design. 6.3.1 6.3.1.1 6.3.1.2 Differential Non-Linearity (DNL) DNL error is the measure of variations in code widths from the ideal code width. A DNL error of zero would imply that every code is exactly 1 LSb wide. ACCURACY Integral Non-Linearity (INL) INL error for these devices is the maximum deviation between an actual code transition point and its corresponding ideal transition point after offset and gain errors have been removed. These endpoints are from 0x00 to 0x3F. Refer to Figure 6-5. Positive INL means higher resistance than ideal. Negative INL means lower resistance than ideal. 111 110 101 Digital Input Code 100 011 010 Actual Transfer Function Ideal Transfer Function Wide Code, > 1 LSb 001 INL < 0 000 111 110 Narrow Code < 1 LSb Actual Rransfer Function Digital Pot Output 101 Digital Input Code FIGURE 6-6: 100 6.3.1.3 011 Ideal Transfer Function 010 001 000 INL < 0 Digital Pot Output FIGURE 6-5: INL Accuracy. (c) 2006 Microchip Technology Inc. DNL Accuracy. Ratiometric Temperature Coefficient The ratiometric temperature coefficient quantifies the error in the ratio RAW/RWB due to temperature drift. This is typically the critical error when using a potentiometer device (MCP4011 and MCP4013) in a voltage divider configuration. 6.3.1.4 Absolute Temperature Coefficient The absolute temperature coefficient quantifies the error in the end-to-end resistance (nominal resistance RAB) due to temperature drift. This is typically the critical error when using a rheostat device (MCP4012 and MCP4014) in an adjustable resistor configuration. DS21978C-page 41 MCP4011/2/3/4 6.3.2 MONOTONIC OPERATION Monotonic operation means that the device's resistance increases with every step change (from terminal A to terminal B or terminal B to terminal A). The wiper resistance is different at each tap location. When changing from one tap position to the next (either increasing or decreasing), the RW is less than the RS. When this change occurs, the device voltage and temperature are "the same" for the two tap positions. RS63 0x3F RS62 Digital Input Code 0x3E 0x3D RS3 0x03 RS1 0x02 RS0 0x01 0x00 RW n=? (@ tap) R = RSn + RW(@ Tap n) BW n=0 Resistance (RBW) FIGURE 6-7: DS21978C-page 42 Resistance RBW. (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 7.0 DESIGN CONSIDERATIONS In the design of a system with the MCP401X devices, the following considerations should be taken into account: * The Power Supply * The Layout 7.1 Power Supply Considerations The typical application will require a bypass capacitor in order to filter high-frequency noise, which can be induced onto the power supply's traces. The bypass capacitor helps to minimize the effect of these noise sources on signal integrity. Figure 7-1 illustrates an appropriate bypass strategy. 7.2 Layout Considerations Inductively-coupled AC transients and digital switching noise can degrade the input and output signal integrity, potentially masking the MCP4011/2/3/4's performance. Careful board layout will minimize these effects and increase the Signal-to-Noise Ratio (SNR). Bench testing has shown that a multi-layer board utilizing a low-inductance ground plane, isolated inputs, isolated outputs and proper decoupling are critical to achieving the performance that the silicon is capable of providing. Particularly harsh environments may require shielding of critical signals. If low noise is desired, breadboards and wire-wrapped boards are not recommended. In this example, the recommended bypass capacitor value is 0.1 F. This capacitor should be placed as close (within 4 mm) to the device power pin (VDD) as possible. The power source supplying these devices should be as clean as possible. If the application circuit has separate digital and analog power supplies, VDD and VSS should reside on the analog plane. VDD 0.1 F VDD W B VSS FIGURE 7-1: Connections. U/D PIC(R) Microcontroller A MCP4011/2/3/4 0.1 F CS VSS Typical Microcontroller (c) 2006 Microchip Technology Inc. DS21978C-page 43 MCP4011/2/3/4 8.0 APPLICATIONS EXAMPLES VDD Non-volatile digital potentiometers have a multitude of practical uses in modern electronic circuits. The most popular uses include precision calibration of set point thresholds, sensor trimming, LCD bias trimming, audio attenuation, adjustable power supplies, motor control overcurrent trip setting, adjustable gain amplifiers and offset trimming. The MCP4011/2/3/4 devices can be used to replace the common mechanical trim pot in applications where the operating and terminal voltages are within CMOS process limitations (VDD = 2.7V to 5.5V). 8.1 R1 MCP4011 A CS U/D W VOUT B R2 Set Point Threshold Trimming Applications that need accurate detection of an input threshold event often need several sources of error eliminated. Use of comparators and operational amplifiers (op amps) with low offset and gain error can help achieve the desired accuracy, but in many applications, the input source variation is beyond the designer's control. If the entire system can be calibrated after assembly in a controlled environment (like factory test), these sources of error are minimized, if not entirely eliminated. Figure 8-1 illustrates a common digital potentiometer configuration. This configuration is often referred to as a "windowed voltage divider". Note that R1 and R2 are not necessary to create the voltage divider, but their presence is useful when the desired threshold has limited range. It is "windowed" because R1 and R2 can narrow the adjustable range of VTRIP to a value much less than VDD - VSS. If the output range is reduced, the magnitude of each output step is reduced. This effectively increases the trimming resolution for a fixed digital potentiometer resolution. This technique may allow a lower-cost digital potentiometer to be utilized (64 steps instead of 256 steps). The MCP4011's and MCP4013's low DNL performance is critical to meeting calibration accuracy in production without having to use a higher precision digital potentiometer. EQUATION 8-1: V TRIP CALCULATING THE WIPER SETTING FROM THE DESIRED VTRIP R 2 + R WB = V DD ----------------------------------- R 1 + R AB + R 2 FIGURE 8-1: Using the Digital Potentiometer to Set a Precise Output Voltage. 8.1.1 TRIMMING A THRESHOLD FOR AN OPTICAL SENSOR If the application has to calibrate the threshold of a diode, transistor or resistor, a variation range of 0.1V is common. Often, the desired resolution of 2 mV or better is adequate to accurately detect the presence of a precise signal. A "windowed" voltage divider, utilizing the MCP4011 or MCP4013, would be a potential solution as shown in Figure 8-2. VDD VDD Rsense VCC+ R1 MCP4011 A CS U/D VTRIP W B R2 FIGURE 8-2: Calibration. Comparator MCP6021 0.1 F VCC- Set Point or Threshold R AB = R Nominal D R WB = R AB * ------ 63 V TRIP D = -------------- * ( ( R 1 + R AB + R 2 ) - R 2 ) * 63 V DD Where: D = Digital Potentiometer Wiper Setting (0-63) DS21978C-page 44 (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 8.2 Operational Amplifier Applications VDD VIN Figure 8-3, Figure 8-4 and Figure 8-5 illustrate typical amplifier circuits that could replace fixed resistors with the MCP4011/2/3/4 to achieve digitally-adjustable analog solutions. R3 A VIN MCP4011 A R3 MCP4012 FIGURE 8-4: Trimming Offset and Gain in a Non-Inverting Amplifier. MCP4011 R3 A R4 B W Pot2 VDD A B - - Op Amp VIN W Pot1 MCP4011 + VOUT MCP6021 1 fc = ----------------------------- 2 R Eq C R2 Op Amp R1 W B R4 B VOUT - A W R2 W VDD A R1 MCP4011 Op Amp VW R1 MCP4011 Figure 8-4 shows a circuit that allows a non-inverting amplifier to have its' offset and gain to be independently trimmed. The MCP4011 is used along with resistors R1 and R2 to set the offset voltage. The sum of R1 + R2 resistance should be significantly greater (> 100 times) the resistance value of the MCP4011. This allows each increment or decrement in the MCP4011 to be a fine adjustment of the offset voltage. The input voltage of the op amp (VIN) should be centered at the op amps Vw voltage. The gain is adjusted by the MCP4012. If the resistance value of the MCP4012 is small compared to the resistance value of R3, then this is a fine adjustment of the gain. If the resistance value of the MCP4012 is equal (or large) compared to the resistance value of R3, then this is a course adjustment of the gain. In general, trim the course adjustments first and then trim the fine adjustments. VDD MCP6291 + VOUT + MCP6001 W B Thevenin R = ( R 1 + R AB - R WB ) || ( R 2 + R WB ) + R w Equivalent Eq FIGURE 8-5: Programmable Filter. R2 FIGURE 8-3: Trimming Offset and Gain in an Inverting Amplifier. (c) 2006 Microchip Technology Inc. DS21978C-page 45 MCP4011/2/3/4 8.3 Temperature Sensor Applications VDD Thermistors are resistors with very predictable variation with temperature. Thermistors are a popular sensor choice when a low-cost, temperature-sensing solution is desired. Unfortunately, thermistors have non-linear characteristics that are undesirable, typically requiring trimming in an application to achieve greater accuracy. There are several common solutions to trim and linearize thermistors. Figure 8-6 and Figure 8-7 are simple methods for linearizing a 3-terminal NTC thermistor. Both are simple voltage dividers using a Positive Temperature Coefficient (PTC) resistor (R1) with a transfer function capable of compensating for the linearity error in the Negative Temperature Coefficient (NTC) thermistor. The circuit, illustrated by Figure 8-6, utilizes a digital rheostat for trimming the offset error caused by the thermistor's part-to-part variation. This solution puts the digital potentiometer's RW into the voltage divider calculation. The MCP4011/2/3/4's RAB temperature coefficient is 50 ppm (-20C to +70C). RW's error is substantially greater than RAB's error because RW varies with VDD, wiper setting and temperature. For the 50 k devices, the error introduced by RW is, in most cases, insignificant as long as the wiper setting is > 6. For the 2 k devices, the error introduced by RW is significant because it is a higher percentage of RWB. For these reasons, the circuit illustrated in Figure 8-6 is not the most optimum method for "exciting" and linearizing a thermistor. VDD R1 NTC Thermistor MCP4011 VOUT R2 FIGURE 8-7: Thermistor Calibration using a Digital Potentiometer in a Potentiometer Configuration. 8.4 Wheatstone Bridge Trimming Another common configuration to "excite" a sensor (such as a strain gauge, pressure sensor or thermistor) is the wheatstone bridge configuration. The wheatstone bridge provides a differential output instead of a single-ended output. Figure 8-8 illustrates a wheatstone bridge utilizing one to three digital potentiometers. The digital potentiometers in this example are used to trim the offset and gain of the wheatstone bridge. VDD R1 NTC Thermistor VOUT 2.1 k MCP4012 R2 A W MCP4012 FIGURE 8-6: Thermistor Calibration using a Digital Potentiometer in a Rheostat Configuration. The circuit illustrated by Figure 8-7 utilizes a digital potentiometer for trimming the offset error. This solution removes RW from the trimming equation along with the error associated with RW. R2 is not required, but can be utilized to reduce the trimming "window" and reduce variation due to the digital potentiometer's RAB part-to-part variability. DS21978C-page 46 VOUT MCP4012 50 k FIGURE 8-8: Trimming. MCP4012 50 k Wheatstone Bridge (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 9.0 DEVELOPMENT SUPPORT 9.1 Evaluation/Demonstration Boards Currently there are three boards that are available that can be used to evaluate the MCP401X family of devices. 1. The MCP402X Digital Potentiometer Evaluation Board kit (MCP402XEV) contains a simple demonstration board utilizing a PIC10F206, the MCP401X and a blank PCB, which can be populated with any desired MCP4011/2/3/4 device in a SOT-23-5, SOT-23-6 or 150 mil SOIC 8-pin package. This board has two push buttons to control when the PIC(R) microcontroller generates MCP402X serial commands. The example firmware demonstrates the following commands: * Increment * Decrement * High-Voltage Increment and Enable WiperLock Technology * High-Voltage Decrement and Enable WiperLock Technology * High-Voltage Increment and Disable WiperLock Technology * High-Voltage Decrement and Disable WiperLock Technology The populated board (with the MCP4011) can be used to evaluate the other MCP401X devices by appropriately jumpering the PCB pads. 2. 3. 4. The SOT-23-5/6 Evaluation Board (VSUPEV2) can be used to evaluate the characteristics of the MCP4012, MCP4013 and MCP4014 devices. The 8-pin SOIC/MSOP/TSSOP/DIP Evaluation Board (SOIC8EV) can be used to evaluate the characteristics of the MCP4011 device in either the SOIC or MSOP package. The MCP4XXX Digital Potentiometer Daughter Board allows the system designer to quickly evaluate the operation of Microchip Technology's MCP42XXX and MCP402X Digital Potentiometers. The board supports two MCP42XXX devices and an MCP402X device, which can be replaced with an MCP401X device. The board also has a voltage doubler device (TC1240A), which can be used to show the WiperLockTM Technology feature of the MCP4021. These boards may be purchased directly from the Microchip web site at www.microchip.com. (c) 2006 Microchip Technology Inc. DS21978C-page 47 MCP4011/2/3/4 10.0 PACKAGING INFORMATION 10.1 Package Marking Information 5-Lead SOT-23 (MCP4014) XXNN Example: JU25 Part Number Code MCP4014T-202E/OT JUNN MCP4014T-502E/OT JVNN MCP4014T-103E/OT JWNN MCP4014T-503E/OT JXNN Note: Applies to 5-Lead SOT-23 6-Lead SOT-23 (MCP4012 / MCP4013) XXNN Example: BJ25 Code Part Number MCP4012 MCP4013 MCP401xT-202E/CH BJNN BPNN MCP401xT-502E/CH BKNN BQNN MCP401xT-103E/CH BLNN BRNN MCP401xT-503E/CH BMNN BSNN Note: Applies to 6-Lead SOT-23 Legend: XX...X Y YY WW NNN e3 * Note: DS21978C-page 48 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 Package Marking Information 8-Lead DFN (2x3) (MCP4011) Example: ABE 534 256 XXX YWW NNN Part Number Code MCP4011T-202E/MC ABE MCP4011T-502E/MC ABF MCP4011T-103E/MC ABG MCP4011T-503E/MC ABH Note: Applies to 8-Lead DFN Example: 8-Lead MSOP (MCP4011) XXXXXX 401122 YWWNNN 534256 8-Lead SOIC (150 mil) (MCP4011) Example: XXXXXXXX XXXXYYWW NNN 401152E e3 0534 SN^^ 256 Part Numbers 8L-MSOP Legend: XX...X Y YY WW NNN e3 * Note: Code 8L-SOIC MCP4011-202E/MS MCP4011-202E/SN 22 MCP4011-502E/MS MCP4011-502E/SN 52 MCP4011-103E/MS MCP4011-103E/SN 13 MCP4011-503E/MS MCP4011-503E/SN 53 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. (c) 2006 Microchip Technology Inc. DS21978C-page 49 MCP4011/2/3/4 5-Lead Plastic Small Outline Transistor (OT) (SOT-23) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E1 p B p1 n D 1 c A L A1 INCHES* Units Dimension Limits A2 MIN MILLIMETERS NOM MAX MIN NOM Pitch n p .038 0.95 Outside lead pitch (basic) p1 .075 1.90 Number of Pins Overall Height 5 MAX 5 A .035 .046 .057 0.90 1.18 1.45 Molded Package Thickness A2 .035 .043 .051 0.90 1.10 1.30 Standoff A1 .000 .003 .006 0.00 0.08 0.15 Overall Width E .102 .110 .118 2.60 2.80 3.00 Molded Package Width E1 .059 .064 .069 1.50 1.63 1.75 Overall Length D .110 .116 .122 2.80 2.95 3.10 Foot Length .014 .018 .022 0.35 0.45 Foot Angle L f Lead Thickness c .004 Lead Width B a .014 Mold Draft Angle Top Mold Draft Angle Bottom b 0 5 .006 .017 10 0 0.55 5 .008 0.09 0.15 .020 0.35 0.43 10 0.20 0.50 0 5 10 0 5 10 0 5 10 0 5 10 * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. EIAJ Equivalent: SC-74A Revised 09-12-05 Drawing No. C04-091 DS21978C-page 50 (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 6-Lead Plastic Small Outline Transistor (CH) (SOT-23) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E1 B p1 n D 1 c A A1 L INCHES* Units Dimension Limits MIN Pitch .038 BSC Outside lead pitch p1 .075 BSC Overall Height MILLIMETERS NOM n p Number of Pins A2 MAX MIN NOM 6 MAX 6 0.95 BSC 1.90 BSC A .035 .046 .057 0.90 1.18 1.45 Molded Package Thickness A2 .035 .043 .051 0.90 1.10 1.30 Standoff A1 .000 .003 .006 0.00 0.08 0.15 Overall Width E .102 .110 .118 2.60 2.80 3.00 Molded Package Width E1 .059 .064 .069 1.50 1.63 1.75 Overall Length D .110 .116 .122 2.80 2.95 3.10 Foot Length L .014 .022 0.35 Foot Angle Lead Thickness c .004 Lead Width B .014 Mold Draft Angle Top Mold Draft Angle Bottom .018 0 5 .006 .017 10 0.45 0 0.55 5 .008 0.09 0.15 .020 0.35 0.43 10 0.20 0.50 0 5 10 0 5 10 0 5 10 0 5 10 * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. BSC: Basic Dimension. Theoretically exact value shown without tolerances. See ASME Y14.5M JEITA (formerly EIAJ) equivalent: SC-74A Drawing No. C04-120 (c) 2006 Microchip Technology Inc. Revised 09-12-05 DS21978C-page 51 MCP4011/2/3/4 8-Lead Plastic Dual-Flat No-Lead Package (MC) 2x3x0.9 mm Body (DFN) - Saw Singulated Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging e D b N N L K E E2 EXPOSED PAD NOTE 1 1 2 2 1 NOTE 1 D2 TOP VIEW BOTTOM VIEW A A3 A1 NOTE 2 Units Dimension Limits Number of Pins N Pitch e Overall Height A Standoff A1 Contact Thickness A3 Overall Length D Overall Width E Exposed Pad Length D2 Exposed Pad Width E2 Contact Width b Contact Length L Contact-to-Exposed Pad K MIN 0.80 0.00 1.30 1.50 0.18 0.30 0.20 MILLIMETERS NOM 8 0.50 BSC 0.90 0.02 0.20 REF 2.00 BSC 3.00 BSC -- -- 0.25 0.40 -- MAX 1.00 0.05 1.75 1.90 0.30 0.50 -- Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package may have one or more exposed tie bars at ends. 3. Significant Characteristic 4. Package is saw singulated 5. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing No. C04-123, Sept. 8, 2006 DS21978C-page 52 (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N E E1 NOTE 1 1 2 e b A2 A c L1 A1 Number of Pins Pitch Overall Height Molded Package Standoff Overall Width Molded Package Overall Length Foot Length Footprint Foot Angle Lead Thickness Lead Width Units Dimension Limits N e A Thickness A2 A1 E Width E1 D L L1 c b MIN -- 0.75 0.00 0.40 0 0.08 0.22 MILLIMETERS NOM 8 0.65 BSC -- 0.85 -- 4.90 BSC 3.00 BSC 3.00 BSC 0.60 0.95 REF -- -- -- L MAX 1.10 0.95 0.15 0.80 8 0.23 0.40 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing No. C04-111, Sept. 8, 2006 (c) 2006 Microchip Technology Inc. DS21978C-page 53 MCP4011/2/3/4 8-Lead Plastic Small Outline (SN) - Narrow, 150 mil (SOIC) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E1 p D 2 B n 1 h 45 c A2 A L Units Dimension Limits n p INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MAX Number of Pins Pitch Overall Height A .053 .069 1.75 Molded Package Thickness A2 .052 .061 1.55 Standoff A1 .004 .010 0.25 Overall Width E .228 .244 6.20 Molded Package Width E1 .146 .157 3.99 Overall Length D .189 .197 5.00 Chamfer Distance h .010 .020 0.51 Foot Length L .019 .030 0.76 Foot Angle 0 8 8 c Lead Thickness .008 .010 0.25 Lead Width B .013 .020 0.51 Mold Draft Angle Top 0 15 15 Mold Draft Angle Bottom 0 15 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 DS21978C-page 54 MIN A1 MIN (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 APPENDIX A: REVISION HISTORY Revision C (December 2006) * Added device designators in conditions column to associate units (MHz) in Bandwidth -3 dB parameter in AC/DC Characteristics table. * Added device designations in conditions column for R-INL and R-DNL specifications. Revision B (October 2006) * For the 10 k device, the rheostat differential non-linearity specification at 2.7V was changed from 0.5 LSb to 1 LSb. * Figure 2-9 in Section 2.0 "Typical Performance Curves" was updated with the correct data. * Added Figure 2-55 for -3 db Bandwidth information. * Added Figure 2-56 for -3 db Bandwidth test circuit. * Updated available Development Tools * Added disclaimer to package outline drawings and updated changed drawings as needed. Revision A (November 2005) * Original Release of this Document. (c) 2006 Microchip Technology Inc. DS21978C-page 55 MCP4011/2/3/4 NOTES: DS21978C-page 56 (c) 2006 Microchip Technology Inc. MCP4011/2/3/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device XXX X /XX Resistance Temperature Package Version Range Device: MCP4011: MCP4011T: MCP4012: MCP4012T: MCP4013: MCP4013T: MCP4014: MCP4014T: Single Potentiometer with U/D Interface Single Potentiometer with U/D Interface (Tape and Reel) (SOIC, MSOP) Single Rheostat with U/D interface Single Rheostat with U/D interface (Tape and Reel) (SOT-23-6) Single Potentiometer to GND with U/D Interface Single Potentiometer to GND with U/D Interface (Tape and Reel) (SOT-23-6) Single Rheostat to GND with U/D Interface Single Rheostat to GND with U/D Interface (Tape and Reel)(SOT-23-5) Examples: a) b) c) d) e) f) g) h) i) j) k) l) m) n) o) p) q) r) s) t) MCP4011-103E/MS: MCP4011-103E/SN: MCP4011T-103E/MC: MCP4011T-103E/MS: MCP4011T-103E/SN: MCP4011-202E/MS: MCP4011-202E/SN: MCP4011T-202E/MC: MCP4011T-202E/MS: MCP4011T-202E/SN: MCP4011-502E/MS: MCP4011-502E/SN: MCP4011T-502E/MC: MCP4011T-502E/MS: MCP4011T-502E/SN: MCP4011-503E/MS: MCP4011-503E/SN: MCP4011T-503E/MC: MCP4011T-503E/MS: MCP4011T-503E/SN: 10 k, 8-LD MSOP 10 k, 8-LD SOIC T/R, 10 k, 8-LD DFN T/R, 10 k, 8-LD MSOP T/R, 10 k, 8-LD SOIC 2.1 k, 8-LD MSOP 2.1 k, 8-LD SOIC T/R, 2.1 k, 8-LD DFN T/R, 2.1 k, 8-LD MSOP T/R, 2.1 k, 8-LD SOIC 5 k, 8-LD MSOP 5 k, 8-LD SOIC T/R, 5 k, 8-LD DFN T/R, 5 k, 8-LD MSOP T/R, 5 k, 8-LD SOIC 50 k, 8-LD MSOP 50 k, 8-LD SOIC T/R, 50 k, 8-LD DFN T/R, 50 k, 8-LD MSOP T/R, 50 k, 8-LD SOIC a) b) c) d) MCP4012T-202E/CH MCP4012T-502E/CH MCP4012T-103E/CH MCP4012T-503E/CH 2.1 k, 6-LD SOT-23 5 k, 6-LD SOT-23 10 k, 6-LD SOT-23 50 k, 6-LD SOT-23 Resistance Version: 202 = 2.1 k 502 = 5 k 103 = 10 k 503 = 50 k Temperature Range: E = -40C to +125C a) b) c) d) MCP4013T-202E/CH MCP4013T-502E/CH MCP4013T-103E/CH MCP4013T-503E/CH 2.1 k, 6-LD SOT-23 5 k, 6-LD SOT-23 10 k, 6-LD SOT-23 50 k, 6-LD SOT-23 Package: CH MC MS SN OT = = = = = a) b) c) d) MCP4014T-202E/OT MCP4014T-502E/OT MCP4014T-103E/OT MCP4014T-503E/OT 2.1 k, 5-LD SOT-23 5 k, 5-LD SOT-23 10 k, 5-LD SOT-23 50 k, 5-LD SOT-23 Plastic Small Outline Transistor, 6-lead Plastic Dual Flat No Lead (2x3x0.9 mm), 8-lead Plastic MSOP, 8-lead Plastic SOIC, (150 mil Body), 8-lead Plastic Small Outline Transistor, 5-lead (c) 2006 Microchip Technology Inc. DS21978C-page 57 MCP4011/2/3/4 NOTES: DS21978C-page 58 (c) 2006 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company's quality system processes and procedures are for its PIC(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. (c) 2006 Microchip Technology Inc. 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