Pin 1. Input
2. Ground
3. Output
Tab/Case is Ground
1
1
1
TO
TO-252
TO-220
2
3
3
2
2
3
Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
Reference
Design
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM341
,
LM78M05
SNVS090F –MAY 2004–REVISED DECEMBER 2016
LM341 and LM78M05 Series 3-Terminal 500-mA Positive Voltage Regulators
1
1 Features
1• Output Current in Excess of 0.5 A
• No External Components
• Internal Thermal Overload Protection
• Internal Short Circuit Current-Limiting
• Output Transistor Safe-Area Compensation
• Available in 3-Pin TO-220, TO-252, and TO
packages
• Output Voltages of 5 V and 15 V
2 Applications
• Electronic Point-of-Sale
• Medical and Health Fitness Applications
• Printers
• Appliances and White Goods
• TVs and Set-Top Boxes
3 Description
The LM341 and LM78M05 three-pin positive voltage
regulators employ built-in current limiting, thermal
shutdown, and safe-operating area protection, which
makes them virtually immune to damage from output
overloads.
With adequate heat sinking, they can deliver in
excess of 0.5-A output current. Typical applications
would include local (on-card) regulators which can
eliminate the noise and degraded performance
associated with single-point regulation.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LM341 TO-220 (3) 10.16 mm × 14.986 mm
LM78M05 TO-220 (3) 10.16 mm × 14.986 mm
TO-252 (3) 6.10 mm × 6.58 mm
TO (3) 9.14 mm × 9.14 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Available Pinouts Typical Application
2
LM341
,
LM78M05
SNVS090F –MAY 2004–REVISED DECEMBER 2016
www.ti.com
Product Folder Links: LM341 LM78M05
Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated
Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 3
6.1 Absolute Maximum Ratings ...................................... 3
6.2 Recommended Operating Conditions....................... 3
6.3 Thermal Information.................................................. 4
6.4 Electrical Characteristics: LM341 (5 V) and
LM78M05................................................................... 4
6.5 Electrical Characteristics: LM341 (12 V)................... 4
6.6 Electrical Characteristics: LM341 (15 V)................... 5
6.7 Typical Characteristics.............................................. 6
7 Detailed Description.............................................. 8
7.1 Overview................................................................... 8
7.2 Functional Block Diagram......................................... 9
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 10
8 Application and Implementation ........................ 11
8.1 Application Information............................................ 11
8.2 Typical Application.................................................. 11
9 Power Supply Recommendations...................... 12
10 Layout................................................................... 13
10.1 Layout Guidelines ................................................. 13
10.2 Layout Example .................................................... 13
10.3 Thermal Considerations........................................ 13
11 Device and Documentation Support................. 16
11.1 Documentation Support ........................................ 16
11.2 Related Links ........................................................ 16
11.3 Receiving Notification of Documentation Updates 16
11.4 Community Resources.......................................... 16
11.5 Trademarks........................................................... 16
11.6 Electrostatic Discharge Caution............................ 16
11.7 Glossary................................................................ 16
12 Mechanical, Packaging, and Orderable
Information........................................................... 16
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (August 2005) to Revision F Page
• Added Applications section, Device Information table, Pin Configuration and Functions section, ESD Ratings table,
Recommended Operating Conditions table, Thermal Information table, Detailed Description section, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1
• Deleted parts marked as obsolete: LM78M12 and LM78M15................................................................................................ 1
• Changed package type names throughout............................................................................................................................. 1
• Deleted 12-V output voltage option from Features................................................................................................................. 1
• Changed RθJA values in Thermal Information table From: 60°C/W To: 22.6°C/W (NDE), From: 92°C/W To: 38°C/W
(NDP), and From: 120°C/W To: 162.4°C/W (NDT)................................................................................................................ 4
• Changed RθJC(top) values in Thermal Information table From: 5°C/W To: 17.8°C/W (NDE), From: 10°C/W To:
48.4°C/W (NDP), and From: 18°C/W To: 23.9°C/W (NDT).................................................................................................... 4
• Updated Thermal Considerations section ............................................................................................................................ 13
3
LM341
,
LM78M05
www.ti.com
SNVS090F –MAY 2004–REVISED DECEMBER 2016
Product Folder Links: LM341 LM78M05
Submit Documentation FeedbackCopyright © 2004–2016, Texas Instruments Incorporated
5 Pin Configuration and Functions
NDE Package
3-Pin TO-220
Top View
NDP Package
3-Pin TO-252
Top View
NDT Package
3-Pin TO
Top View
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
TO-220 TO-252 TO
GND 2/TAB 2/TAB 3 — Tab is GND
INPUT 1 1 1 I Input
OUTPUT 2 2 2 O Output
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Input voltage VO= 5 V to 15 V 35 V
Power dissipation Internally limited
Lead temperature (Soldering, 10 s) TO package (NDT) 300 °C
TO-220 package (NDE) 260
Operating junction temperature –40 125 °C
Storage temperature, Tstg –65 150 °C
6.2 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
Input voltage VOUT + 1.8 35 V
Output current 0.5 A
4
LM341
,
LM78M05
SNVS090F –MAY 2004–REVISED DECEMBER 2016
www.ti.com
Product Folder Links: LM341 LM78M05
Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.3 Thermal Information
THERMAL METRIC(1) LM341 LM78M05
UNITNDE (TO-220) NDP (TO-252) NDT (TO)
3 PINS 3 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 22.6 38 162.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 17.8 48.4 23.9 °C/W
RθJB Junction-to-board thermal resistance 6 17.7 — °C/W
ψJT Junction-to-top characterization parameter 3.3 6.7 — °C/W
ψJB Junction-to-board characterization parameter 6 17.9 — °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.3 4.4 — °C/W
6.4 Electrical Characteristics: LM341 (5 V) and LM78M05
VIN = 10 V, CIN = 0.33 µF, CO= 0.1 µF, TJ= 25°C (unless otherwise noted). Limits are specified by production testing or
correlation techniques using standard Statistical Quality Control (SQC) methods.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOOutput voltage IL= 500 mA 4.8 5 5.2 V
IL= 5 mA to 500 mA, PD≤7.5 W,
VIN = 7.5 V to 20 V, TJ= –40°C to 125°C 4.75 5 5.25
VRLINE Line regulation VIN = 7.2 V to 25 V IL= 100 mA 50 mV
IL= 500 mA 100
VRLOAD Load regulation IL= 5 mA to 500 mA 100 mV
IQQuiescent current IL= 500 mA 4 10 mA
ΔIQQuiescent current change IL= 5 mA to 500 mA 0.5 mA
VIN = 7.5 V to 25 V, IL= 500 mA 1
VnOutput noise voltage f = 10 Hz to 100 kHz 40 µV
ΔVIN Ripple rejection f = 120 Hz, IL= 500 mA 78 dB
VIN Input voltage required to maintain
line regulation IL= 500 mA 7.2 V
ΔVOLong-term stability IL= 500 mA, TJ= –40°C to 125°C 20 mV/khrs
6.5 Electrical Characteristics: LM341 (12 V)
VIN = 19 V, CIN = 0.33 µF, CO= 0.1 µF, TJ= 25°C (unless otherwise noted). Limits are specified by production testing or
correlation techniques using standard Statistical Quality Control (SQC) methods.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOOutput voltage IL= 500 mA 11.5 12 12.5 V
IL= 5 mA to 500 mA, PD≤7.5 W, VIN = 14.8 V
to 27 V, TJ= –40°C to 125°C 11.4 12 12.6
VRLINE Line regulation VIN = 14.5 V to 30 V IL= 100 mA 120 mV
IL= 500 mA 240
VRLOAD Load regulation IL= 5 mA to 500 mA 240 mV
IQQuiescent current IL= 500 mA 4 10 mA
ΔIQQuiescent current change IL= 5 mA to 500 mA 0.5 mA
VIN = 14.8 V to 30 V, IL= 500 mA 1
VnOutput noise voltage f = 10 Hz to 100 kHz 75 µV
ΔVIN Ripple rejection f = 120 Hz, IL= 500 mA 71 dB
VIN Input voltage required to maintain
line regulation IL= 500 mA 14.5 V
ΔVOLong-term stability IL= 500 mA, TJ= –40°C to 125°C 48 mV/khrs
5
LM341
,
LM78M05
www.ti.com
SNVS090F –MAY 2004–REVISED DECEMBER 2016
Product Folder Links: LM341 LM78M05
Submit Documentation FeedbackCopyright © 2004–2016, Texas Instruments Incorporated
6.6 Electrical Characteristics: LM341 (15 V)
VIN = 23 V, CIN = 0.33 µF, CO= 0.1 µF, TJ= 25°C (unless otherwise noted). Limits are specified by production testing or
correlation techniques using standard Statistical Quality Control (SQC) methods.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOOutput voltage IL= 500 mA 14.4 15 15.6 V
IL= 5 mA to 500 mA, PD≤7.5 W, VIN = 18 V
to 30 V, TJ= –40°C to 125°C 14.25 15 15.75
VRLINE Line regulation VIN = 17.6 V to 30 V IL= 100 mA 150 mV
IL= 500 mA 300
VRLOAD Load regulation IL= 5 mA to 500 mA 300 mV
IQQuiescent current IL= 500 mA 4 10 mA
ΔIQQuiescent current change IL= 5 mA to 500 mA 0.5 mA
VIN = 18 V to 30 V, IL= 500 mA 1
VnOutput noise voltage f = 10 Hz to 100 kHz 90 µV
ΔVIN Ripple rejection f = 120 Hz, IL= 500 mA 69 dB
VIN Input voltage required to maintain
line regulation IL= 500 mA 17.6 V
ΔVOLong-term stability IL= 500 mA, TJ= –40°C to 125°C 60 mV/khrs
6
LM341
,
LM78M05
SNVS090F –MAY 2004–REVISED DECEMBER 2016
www.ti.com
Product Folder Links: LM341 LM78M05
Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated
6.7 Typical Characteristics
Figure 1. Peak Output Current Figure 2. Ripple Rejection
Figure 3. Ripple Rejection Figure 4. Dropout Voltage
Normalized to 1 V TJ= 25°C
Figure 5. Output Voltage Figure 6. Quiescent Current
7
LM341
,
LM78M05
www.ti.com
SNVS090F –MAY 2004–REVISED DECEMBER 2016
Product Folder Links: LM341 LM78M05
Submit Documentation FeedbackCopyright © 2004–2016, Texas Instruments Incorporated
Typical Characteristics (continued)
Figure 7. Quiescent Current Figure 8. Output Impedance
Figure 9. Line Transient Response Figure 10. Load Transient Response
8
LM341
,
LM78M05
SNVS090F –MAY 2004–REVISED DECEMBER 2016
www.ti.com
Product Folder Links: LM341 LM78M05
Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated
7 Detailed Description
7.1 Overview
The LM341 and LM78M05 devices are a family of fixed positive voltage regulators. They can accept up to 35 V
at the input and regulate it down to outputs of 5 V, 12 V, or 15 V. The devices are capable of supplying up to 500
mA of output current, although it is important to ensure there is adequate heat sinking to avoid exceeding thermal
limits. However, in the case of accidental overload the device has built in current limiting, thermal shutdown and
safe-operating area protection to prevent damage from occurring.
10
LM341
,
LM78M05
SNVS090F –MAY 2004–REVISED DECEMBER 2016
www.ti.com
Product Folder Links: LM341 LM78M05
Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated
7.3 Feature Description
The LM341 and LM78M05 fixed voltage regulators have built-in thermal overload protection which prevents the
device from being damaged due to excessive junction temperature.
The regulators also contain internal short-circuit protection which limits the maximum output current, and safe-
area protection for the pass transistor which reduces the short-circuit current as the voltage across the pass
transistor is increased.
Although the internal power dissipation is automatically limited, the maximum junction temperature of the device
must be kept below 125°C to meet data sheet specifications. An adequate heat sink must be provided to assure
this limit is not exceeded under worst-case operating conditions (maximum input voltage and load current) if
reliable performance is to be obtained.
7.4 Device Functional Modes
7.4.1 Normal Operation
The device OUTPUT pin sources current necessary to make the voltage at the OUTPUT pin equal to the fixed
voltage level of the device.
7.4.2 Operation With Low Input Voltage
The device requires up to 2-V headroom (VI– VO) to operate in regulation. With less headroom, the device may
drop out of regulation in which the OUTPUT voltage would equal INPUT voltage minus dropout voltage.
7.4.3 Operation in Self Protection
When an overload occurs, the device shuts down Darlington NPN output stage or reduce the output current to
prevent device damage. The device automatically resets from the overload. The output may be reduced or
alternate between on and off until the overload is removed.
11
LM341
,
LM78M05
www.ti.com
SNVS090F –MAY 2004–REVISED DECEMBER 2016
Product Folder Links: LM341 LM78M05
Submit Documentation FeedbackCopyright © 2004–2016, Texas Instruments Incorporated
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM341 and LM78Mxx devices are fixed voltage regulators meaning no external feedback resistors are
required to set the output voltage. Input and output capacitors are also not required for the device to be stable.
However input capacitance helps filter noise from the supply and output capacitance improves the transient
response.
8.2 Typical Application
*Required if regulator input is more than 4 inches from input filter capacitor (or if no input filter capacitor is used).
**Optional for improved transient response.
Figure 11. Typical Application
8.2.1 Design Requirements
For this design example, use the parameters listed in Table 1 as the input parameters.
Table 1. Design Parameters
PARAMETER VALUE
CIN 0.33 µF
COUT 0.1 µF
8.2.2 Detailed Design Procedure
8.2.2.1 Input Voltage
Regardless of the output voltage option being used (5 V, 12 V, 15 V), the input voltage must be at least 2 V
greater to ensure proper regulation (7 V, 14 V, 17 V).
12
LM341
,
LM78M05
SNVS090F –MAY 2004–REVISED DECEMBER 2016
www.ti.com
Product Folder Links: LM341 LM78M05
Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated
8.2.2.2 Output Current
Depending on the input-output voltage differential, the output current must be limited to ensure maximum power
dissipation is not exceeded. The graph in Figure 1 shows the appropriate current limit for a variety of conditions.
8.2.2.3 Input Capacitor
If no power supply filter capacitor is used or if the device is placed more than four inches away from the capacitor
of the power supply, an additional capacitor placed at the input pin of the device helps bypass noise.
8.2.2.4 Output Capacitor
These devices are designed to be stable with no output capacitance and can be omitted from the design if
needed. However if large changes in load are expected, an output capacitor is recommended to improve the
transient response.
8.2.3 Application Curves
Figure 12. RθJA vs 2-oz Copper Area for PFM Figure 13. Maximum Allowable Power Dissipation
vs Ambient Temperature for PFM
Figure 14. Maximum Allowable Power Dissipation vs 2-oz Copper Area for PFM
9 Power Supply Recommendations
The LM341 and LM78M05 devices are designed to operate from an input voltage supply range between
VOUT + 2 V to 35 V. If the device is more than four inches from the power supply filter capacitors, an input bypass
capacitor 0.1-µF or greater of any type is recommended.
13
LM341
,
LM78M05
www.ti.com
SNVS090F –MAY 2004–REVISED DECEMBER 2016
Product Folder Links: LM341 LM78M05
Submit Documentation FeedbackCopyright © 2004–2016, Texas Instruments Incorporated
10 Layout
10.1 Layout Guidelines
Some layout guidelines must be followed to ensure proper regulation of the output voltage with minimum noise.
TI recommends that the input terminal be bypassed to ground with a bypass capacitor. The optimum placement
is closest to the input terminal of the device and the system GND. Take care to minimize the loop area formed by
the bypass-capacitor connection, the input terminal, and the system GND. Traces carrying the load current must
be wide to reduce the amount of parasitic trace inductance. In cases when VIN shorts to ground, an external
diode must be placed from VOUT to VIN to divert the surge current from the output capacitor and protect the IC.
This diode must be placed close to the corresponding IC pins to increase their effectiveness.
10.2 Layout Example
Figure 15. Layout Recommendation
10.3 Thermal Considerations
When an integrated circuit operates with appreciable current, its junction temperature is elevated. It is important
to quantify its thermal limits to achieve acceptable performance and reliability. This limit is determined by
summing the individual parts consisting of a series of temperature rises from the semiconductor junction to the
operating environment. A one-dimension steady-state model of conduction heat transfer is demonstrated in
Figure 16. The heat generated at the device junction flows through the die to the die attach pad, through the lead
frame to the surrounding case material, to the printed-circuit board, and eventually to the ambient environment.
There are several variables that may affect the thermal resistance and in turn the need for a heat sink, which
includes the following.
Component variables (RθJC)
• Leadframe size and material
• Number of conduction pins
• Die size
• Die attach material
• Molding compound size and material
Application variables (RθCA)
• Mounting pad size, material, and location
• Placement of mounting pad
• PCB size and material
• Traces length and width
• Adjacent heat sources
• Volume of air
• Ambient temperature
• Shape of mounting pad
14
LM341
,
LM78M05
SNVS090F –MAY 2004–REVISED DECEMBER 2016
www.ti.com
Product Folder Links: LM341 LM78M05
Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated
Thermal Considerations (continued)
The case temperature is measured at the point where the leads contact the mounting pad surface
Figure 16. Cross-Sectional View of Integrated Circuit Mounted on a Printed-Circuit Board
The LM341 and LM78M05 regulators have internal thermal shutdown to protect the device from overheating.
Under all possible operating conditions, the junction temperature of the LM341 and LM78M05 must be within the
range of 0°C to 125°C. A heat sink may be required depending on the maximum power dissipation and maximum
ambient temperature of the application. To determine if a heat sink is needed, the power dissipated by the
regulator (PD) is calculated using Equation 1.
IIN = IL+ IG(1)
PD= (VIN – VOUT)×IL+ (VIN × IG) (2)
Figure 17 shows the voltages and currents which are present in the circuit.
Figure 17. Power Dissipation Diagram
The next parameter which must be calculated is the maximum allowable temperature rise, TR(MAX).
TR(MAX) = TJ(MAX) – TA(MAX)
where
• TJ(MAX) is the maximum allowable junction temperature (125°C)
• TA(MAX) is the maximum ambient temperature encountered in the application
Using the calculated values for TR(MAX) and PD, the maximum allowable value for the junction-to-ambient thermal
resistance (RθJA) can be calculated with Equation 3.
RθJA = TR(MAX) / PD(3)
As a design aid, Table 2 shows the value of the RθJA of TO-252 for different heat sink area. The copper patterns
that we used to measure these RθJA are shown at the end of AN–1028 Maximum Power Enhancement
Techniques for Power Packages (SNVA036). Figure 12 reflects the same test results as what are in the Table 2.
Figure 13 shows the maximum allowable power dissipation versus ambient temperature for the PFM device.
Figure 14 shows the maximum allowable power dissipation versus copper area (in2) for the TO-252 device. For
power enhancement techniques to be used with TO-252 package, see AN–1028 Maximum Power Enhancement
Techniques for Power Packages (SNVA036).
15
LM341
,
LM78M05
www.ti.com
SNVS090F –MAY 2004–REVISED DECEMBER 2016
Product Folder Links: LM341 LM78M05
Submit Documentation FeedbackCopyright © 2004–2016, Texas Instruments Incorporated
Thermal Considerations (continued)
(1) Tab of device is attached to topside copper.
Table 2. RθJA Different Heat Sink Area
LAYOUT COPPER AREA (in2)THERMAL RESISTANCE: RθJA
(°C/W)
TOP SIDE(1) BOTTOM SIDE TO-252
1 0.0123 0 103
2 0.066 0 87
3 0.3 0 60
4 0.53 0 54
5 0.76 0 52
6 1 0 47
7 0 0.2 84
8 0 0.4 70
9 0 0.6 63
10 0 0.8 57
11 0 1 57
12 0.066 0.066 89
13 0.175 0.175 72
14 0.284 0.284 61
15 0.392 0.392 55
16 0.5 0.5 53
16
LM341
,
LM78M05
SNVS090F –MAY 2004–REVISED DECEMBER 2016
www.ti.com
Product Folder Links: LM341 LM78M05
Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated
11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
AN–1028 Maximum Power Enhancement Techniques for Power Packages (SNVA036)
11.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 3. Related Links
PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL
DOCUMENTS TOOLS &
SOFTWARE SUPPORT &
COMMUNITY
LM341 Click here Click here Click here Click here Click here
LM78M05 Click here Click here Click here Click here Click here
11.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.7 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PACKAGE OPTION ADDENDUM
www.ti.com 28-Oct-2016
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM341T-15 NRND TO-220 NDE 3 TBD Call TI Call TI -40 to 125 LM341T-15
LM78M15CT
LM341T-15/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS
& no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM341T-15
LM78M15CT
LM341T-5.0 NRND TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM341T-5.0
LM78M05CT
LM341T-5.0/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS
& no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM341T-5.0
LM78M05CT
LM78M05CDT NRND TO-252 NDP 3 75 TBD Call TI Call TI -40 to 125 LM78M05
CDT
LM78M05CDT/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM78M05
CDT
LM78M05CDTX NRND TO-252 NDP 3 2500 TBD Call TI Call TI -40 to 125 LM78M05
CDT
LM78M05CDTX/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM78M05
CDT
LM78M05CH ACTIVE TO NDT 3 500 Green (RoHS
& no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 125 ( LM78M05CH ~
LM78M05CH)
LM78M05CH/NOPB ACTIVE TO NDT 3 500 Green (RoHS
& no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 125 ( LM78M05CH ~
LM78M05CH)
LM78M05CT NRND TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM341T-5.0
LM78M05CT
LM78M05CT/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS
& no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM341T-5.0
LM78M05CT
LM78M15CT/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS
& no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM341T-15
LM78M15CT
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 28-Oct-2016
Addendum-Page 2
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
MECHANICAL DATA
NDE0003B
www.ti.com
MECHANICAL DATA
NDP0003B
www.ti.com
TD03B (Rev F)
MECHANICAL DATA
NDT0003A
www.ti.com
H03A (Rev D)
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated
