ASMT-QxBC-Nxxxx
Super 0.5W Power PLCC-4
Surface Mount LED Indicator
Data Sheet
Description
The Super 0.5W Power PLCC-4 SMT LED is Blue mid-Power
PLCC-4 SMT LEDs using InGaN chip technology. The
package can be driven at high current due to its superior
package design. The product is able to dissipate the heat
more efficiently compared to the Power PLCC-4 SMT LEDs.
These LEDs produce higher light output with better flux
performance compared to the Power PLCC-4 SMT LED.
The Super 0.5W Power PLCC-4 SMT LEDs are designed for
higher reliability, better performance, and operate under
a wide range of environmental conditions. The perfor-
mance characteristics of these new mid-power LEDs make
them uniquely suitable for use in harsh conditions such as
in automotive applications, and in electronics signs and
signals.
To facilitate easy pick and place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel is
shipped in single intensity and color bin, to provide close
uniformity.
Features
x Industry Standard PLCC 4 platform (3.2x2.8x1.9mm)
x High reliability package with enhanced silicone resin
encapsulation
x High brightness with optimum flux performance using
InGaN chip technologies
x Available in Blue color
x Available in 8mm carrier tape & 7 inch reel
x Low Thermal Resistance 40°C/W
x Wide viewing angle at 120 degree
x JEDEC MSL 2
Applications
1. Electronic signs and signals
a. Decorative/Advertising Lighting
b. Channel Lettering
c. Signs Luminaire
d. RGB Backlighting
CAUTION: ASMT-QxBC-Nxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions
during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
2
Package Drawing
Notes:
1. All Dimensions in millimeters.
2. Lead Polarity as shown in Figure 13.
3. Terminal Finish: Ag plating
4. Encapsulation material: Silicone resin
Table 1. Device Selection Guide (TJ = 25°C)
Color Part Number
Luminous Flux, )V[1] (lm)
Dice Technology
Min. Flux
(lm)
Typ. Flux
(lm)
Max. Flux
(lm)
Test Current
(mA)
Blue ASMT-QBBC-NACxE 4.3 7.0 9.0 150 InGaN
Notes:
1. )V is the total luminous flux output as measured with an integrating sphere at mono pulse conditions.
2. Tolerance = ±12%
3.6 ± 0.2
0.7
3.2 ± 0.2
2.8 ± 0.2
2.2 ± 0.2 1.9 ± 0.2 0.6 ± 0.3
CC
AA
0.79 ± 0.3
CATHODE
MARKING
I 2.4
1.15 ± 0.2
0.41 (TYP.)
0.56 (TYP.)
0.97
Part Numbering System
ASMT- Q X1 B C – N X2 X3 X4 X5
Packaging Option
Color Bin Selection
Max. Flux Bin Selection
Min. Flux Bin Selection
Color
B – Blue
Figure 1. Package Drawing
3
Table 2. Absolute Maximum Ratings (TA = 25°C)
Parameters ASMT-QxBC-Nxxxx
DC Forward Current [1] 150 mA
Peak Forward Current [2] 300 mA
Power Dissipation 570 mW
Reverse Voltage, VR @ 10 μA 4
Junction Temperature 125°C
Operating Temperature -40°C to +120°C
Storage Temperature -40°C to +120°C
Notes:
1. Derate Linearly as shown in Figure 6.
2. Duty Factor = 10%, Frequency = 1kHz
Table 3. Optical Characteristics (TJ = 25°C)
Color Part Number
Dice
Technology
Peak
Wavelength
OPEAK (nm)
Dominant
Wavelength
OD (nm)
Viewing
Angle 2T½ [1]
(Degrees)
Luminous
Efficiency
Ke (lm/W)
Total Flux / Lumi-
nous Intensity
)V (lm) / IV (cd)
Typ. Typ. Typ. Typ. Typ.
Blue ASMT-QBBC-Nxxxx InGaN 458.0 464.0 120 10 2.70
Notes:
1. T½ is the off-axis angle where the luminous intensity is ½ the peak intensity.
Table 4. Electrical Characteristics (TJ = 25°C)
Part Number
Forward Voltage
VF (Volts) @ IF = 150 mA Thermal
Resistance
RTJ-P (°C/W)Typ. Max.
ASMT-QBBC-NxxxE 3.4 3.8 40
4
Figure 2. Relative Intensity Vs. Wavelength Figure 3. Forward Current Vs. Forward Voltage.
Figure 4. Relative Flux vs. Forward Current Figure 5. Relative Flux Vs. Temperature
Figure 6a. Maximum Forward Current Vs. Ambient Temperature. Derated
Based on TJMAX = 125°C, RTJ-A = 110°C/W & 90°C/W.
Figure 6b. Maximum Forward Current Vs. Solder Point Temperature. Derated
Based on TJMAX = 125°C, RTJ-P = 40°C/W.
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
RELATIVE INTENSITY
0
50
100
150
200
250
300
01234
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
050100 150 200 250 300
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS FLUX
(NORMALIZED AT 150 mA)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-50 -25 0255075100
TJ - JUNCTION TEMPERATURE - °C
NORMALIZED LUMINOUS INTENSITY
(NORMALIZED AT 25°C)
0
20
40
60
80
100
120
140
160
020406080100 140120
CURRENT - mA
RθJA = 110°C/W
0
20
40
60
80
100
120
140
160
020406080100 120 140
TEMPERATURE (°C)
CURRENT - mA
RθJP = 40°C/W
RθJA = 90°C/W
5
Figure 7a. Maximum Pulse Current Vs. Ambient Temperature. Derated Based
on TA = 25°C, RTJ-A = 110°C/W.
Figure 7b. Maximum Pulse Current Vs. Ambient Temperature. Derated Based
on TA = 85°C, RTJ-A = 110°C/W.
Figure 8. Chromaticity Shift Vs. Forward Current Figure 9. Forward Voltage Shift Vs. Temperature.
Figure 10. Radiation Pattern
-0.20
-0.15
-0.10
-0.05
0.00
0.05
0.10
0.15
0.20
0.25
-50 -25 0 25 50 75 100
TJ - JUNCTION TEMPERATURE - °C
FORWARD VOLTAGE SHIFT - V
440
450
460
470
480
490
500
510
050100 150 200 250 300
FORWARD CURRENT - mA
DOMINANT WAVELENGTH - nm
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-90 -60 -300 306090
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
0.00
0.10
0.20
0.30
0.40
1.00E-05 1.00E-04 1.00E-03 1.00E-02 1.00E-011.00E+00 1.00E+011.00E+02
t - Time - (S)
CURRENT - A
0.00
0.10
0.20
0.30
0.40
1.00E-05 1.00E-04 1.00E-03 1.00E-02 1.00E-011.00E+00 1.00E+011.00E+02
tp - Time - (S)
CURRENT - A
D = tp
T
tp
IF
T
D = tp
T
tp
IF
T
D =
0.05
0.10
0.25
0.50
1D =
0.05
0.10
0.25
0.50
1
6
(Acc. to J-STD-020C)
217°C
200°C
60 - 120 SEC.
6°C/SEC. MAX.
3°C/SEC. MAX.
3°C/SEC. MAX.
150°C
255 - 260°C
100 SEC. MAX.
10 - 30 SEC.
TIME
TEMPERATURE
Figure 12. Recommended Pb-free Reflow Soldering Profile
Note: For detail information on reflow soldering of Avago surface mount
LEDs, do refer to Avago Application Note AN 1060 Surface Mounting
SMT LED Indicator Components.
Figure 13. Recommended Soldering Pad Pattern
Note: Diameter "D" should be smaller than 2.2mm
D
Figure 11. Recommended Pick and Place Nozzle Size
CATHODE
MARKING
CATHODE
MARKING
A
C
A A
C C
C C
SOLDER MASK
ANODE
CATHODE
0.4
0.3
MINIMUM 55 mm2 OF CATHODE PAD
FOR IMPROVED HEAT DISSIPATION
2.4
0.6
0.9 X 6
4.6
1.1
1.3 x 6
AA
CC
7
Figure 14. Tape Leader and Trailer Dimensions
200 mm MIN. FOR Ø180 REEL.
200 mm MIN. FOR Ø330 REEL.
TRAILER COMPONENT LEADER
480 mm MIN. FOR Ø180 REEL.
960 mm MIN. FOR Ø330 REEL.
C
A
USER FEED DIRECTION
Figure 15. Tape Dimensions
CATHODE SIDE
USER FEED DIRECTION
PRINTED LABEL
Figure 16. Reeling Orientation
3.8 ± 0.1
2.29 ± 0.1
0.229 ± 0.01
ALL DIMENSIONS IN mm.
2 ± 0.054 ± 0.14 ± 0.1
3.05 ± 0.1
3.5 ± 0.05
8+0.3
–0.1
1.75 ± 0.1
Ø1.5 +0.1
–0
8°
Ø1+0.1
–0
AA
CC
8
Device Color (X1)
B Blue
Flux Bin Select (X2X3)
Individual reel will contain parts from one bin only
X2Min Flux Bin
X3Max Flux Bin
Flux Bin Limits
Bin ID Min. (lm) Max. (lm)
0 3.40 4.30
A 4.30 5.50
B 5.50 7.00
C 7.00 9.00
D 9.00 11.50
E 11.50 15.00
F 15.00 19.50
G 19.50 25.50
H 25.50 33.00
J 33.00 43.00
K 43.00 56.00
L 56.00 73.00
Tolerance of each bin limit = ± 12%
Color Bin Select (X4)
Individual reel will contain parts from one full bin only.
X4
0 Full Distribution
A 1 and 2 only
B 2 and 3 only
C 3 and 4 only
G 1, 2 and 3 only
H 2, 3 and 4 only
Z Special binning
Color Bin Limits
Blue Min. (nm) Max. (nm)
1 460.0 465.0
2 465.0 470.0
3 470.0 475.0
4 475.0 480.0
Tolerance of each bin limit = ±1 nm
VF Bin Limits
Bin ID Min. Max.
S4 2.90 3.20
S5 3.20 3.50
S6 3.50 3.80
Tolerance of each bin limit = ±0.1V
Packaging Option (X5)
Option Test Current Package Type Reel Size
E 150mA Top Mount 7 Inch
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-1885EN - April 8, 2010
Handling Precaution
The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft
material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product
and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to
Avago Application Note AN 5288 for detail information.
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level 2 per Jedec J-STD-020. Precautions when handling this moisture
sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305
Handling of Moisture Sensitive Surface Mount Devices for details.
A. Storage before use
– Unopen moisture barrier bag (MBB) can be stored at <40°C/90%RH for 12 months. If the actual shelf life has
exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the
original MSL rating.
– It is not recommended to open the MBB prior to assembly (e.g. for IQC).
B. Control after opening the MBB
– The humidity indicator card (HIC) shall be read immediately upon opening of MBB.
– The LEDs must be kept at <30°C / 60%RH at all time and all high temperature related process including soldering,
curing or rework need to be completed within 1 year.
C. Control for unfinished reel
– For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH.
D. Control of assembly boards
– If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be
stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 1
year.
E. Baking is required if
– “60%” HIC indicator is NOT Green.
– The LEDs are exposed to condition of >30°C/60% RH at any time.
– The LEDs floor life exceeded 1 year.
Recommended baking condition: 60±5°C for 20 hours.
