DE150-101N09A
RF Power MOSFET
Directed En ergy, Inc.
An
IXYS Company
Preliminary Data Sheet
VDSS = 100 V
ID25 = 9.0 A
RDS(on) = 0.16 Ω
ΩΩ
Ω
PDHS = 80W
Symbol Test Conditions Maximum Ratings
VDSS TJ = 25°C to 150°C 100 V
VDGR TJ = 25°C to 150°C; RGS = 1 MΩ 100 V
VGS Continuous ±20 V
VGSM Transient ±30 V
ID25 Tc = 25°C 9.0 A
IDM Tc = 25°C, pulse width limited by TJM 54 A
IAR Tc = 25°C 14 A
EAR Tc = 25°C 7.5 mJ
IS ≤ IDM, di/dt ≤ 100A/µs, VDD ≤ VDSS,
Tj ≤ 150°C, RG = 0.2Ω
5.5 V/ns
IS = 0 >200 V/ns
PDHS Tc = 25°C
Derate 4.4W/°C above 25°C 80 W
PDAMB Tc = 25°C 3.5 W
TJ -55…+150 °C
TJM 150 °C
Tstg -55…+150 °C
TL 1.6mm (0.063 in) from case for 10 s 300 °C
Weight 2 g
dv/dt
Symbol Test Conditions Characteri stic Valu e s
TJ = 25°C unless otherwise specified
min. typ. max.
VDSS VGS = 0 V, ID = 3 ma 100 V
VGS(th) VDS = VGS, ID = 4 ma 2 3 4 V
IGSS VGS = ±20 VDC, VDS = 0 ±100 nA
IDSS VDS = 0.8 VDSS TJ = 25°C
VGS = 0 TJ = 125°C
25
250 µA
µA
RDS(on) 0.16
Ω
gfs VDS = 15 V, ID = 0.5ID25, pulse test 4.6 8.0 S
VGS = 15 V, ID = 0.5ID25
Pulse test, t ≤ 300µS, duty cycle d ≤ 2%
Features
•Isolated Substrate
−high isolation voltage (>2500V)
−excellent thermal transfer
−Increased temperature and power
cycling capability
•IXYS advanced low Qg process
•Low gate charge and capacitances
−easier to drive
−faster switching
•Low RDS(on)
•Very low insertion inductance (<2nH)
•No beryllium oxide (BeO) or other
hazardous materials
A dvantages
•Optimized for RF and high speed
switching at frequencies to >100MHz
•Easy to mount—no insulators needed
•High power density
N-Channel Enhancement Mode
Avalanche Rated
Low Qg and Rg
High dv/dt
Nanosecond Switching
DRAIN
SG1 SG2
GATE
SD1 SD2