ES1DF - ES1JF Taiwan Semiconductor CREAT BY ART 1A, 200V - 600V Surface Mount Super Fast Rectifiers FEATURES - Glass passivated junction chip - Ideal for automated placement - Low profile package - Low power loss, high efficiency - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 en de d MECHANICAF DATA SMAF Case: SMAF Molding compound: UL flammability classification rating 94V-0 Moisture sensitivity level: level 1, per J-STD-020 Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per J-STD-002 mm Meet JESD 201 class 1A whisker test Polarity: Indicated by cathode band Weight: 35 mg (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25C unless otherwise noted) PARAMETER Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage SYMBOL ES1DF ES1GF ES1JF UNIT VRRM 200 400 600 V VRMS 140 280 420 V VDC 200 600 V IF(AV) 400 1 Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 30 eco Maximum average forward rectified current tR Maximum instantaneous forward voltage (Note 1) @1A Maximum reverse current @ rated VR TJ=25C TJ=125C VF IR 1.00 1.30 5 100 A A 1.70 V A CJ 9 pF Maximum reverse recovery time (Note 3) trr 35 ns RJL RJA 35 85 C/W TJ - 55 to +150 C TSTG - 55 to +150 C No Typical junction capacitance (Note 2) Typical thermal resistance Operating junction temperature range Storage temperature range Note 1: Pulse test with PW=300s, 1% duty cycle Note 2: Measured at 1 MHz and applied VR=4.0 V Note 3: Test conditions: IF=0.5A, IR=1.0A, IRR=0.25A Version: B1604 ES1DF - ES1JF Taiwan Semiconductor ORDERING INFORMATION PART NO. PACKING CODE ES1xF (Note 1, 2) R3 R2 PACKING CODE SUFFIX G PACKAGE PACKING SMAF SMAF 3,000 / 7" Plastic reel 10,000 / 13" Paper reel Note 1: "x" defines voltage from 200V (ES1DF) to 600V (ES1JF) Note 2: Whole series with green compound EXAMPLE PART NO. PACKING CODE ES1DF R3G ES1DF R3 PACKING CODE FIG. 2 TYPICAL FORWARD CHARACTERISTICS FIG.1 FORWARD CURRENT DERATING CURVE mm 0.4 0 0 25 50 INSTANTANEOUS FORWARD CURRENT (A) 0.6 RESISTIVE OR INDUCTIVE LOAD Pulse width=300s 1% duty cycle 1 e co AVERAGE FORWARD CURRENT (A) 1 75 100 125 150 tR 0 0.2 0.4 15 10 5 8.3ms single half sine wave 0 1 10 NUMBER OF CYCLES AT 60 Hz 100 0.6 0.8 1 1.2 1.4 1.6 1.8 2 FORWARD VOLTAGE (V) 100 INSTANTANEOUS REVERSE CURRENT (A) No PEAK FORWARD SURGE CURRENT (A) 20 ES1JF FIG. 4 TYPICAL REVERSE CHARACTERISTICS FIG. 3 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 25 Fig.2 0.1 LEAD TEMPERATURE (C) 30 Fig 1 en 10 1.2 0.2 Green compound de RATINGS AND CHARACTERISTICS CURVES (TA=25C unless otherwise noted) 0.8 DESCRIPTION SUFFIX G d EXAMPLE P/N 10 TJ=125C 1 0.1 TJ=25C 0.01 0 20 40 60 80 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Version: B1604 ES1DF - ES1JF Taiwan Semiconductor FIG. 5 TYPICAL JUNCTION CAPACITANCE 30 CAPACITANCE (pF) 25 20 15 10 5 f=1.0MHz Vsig=50mVp-p 0 1 10 100 d 0.1 de REVERSE VOLTAGE (V) en PACKAGE OUTLINE DIMENSIONS SMAF Unit (mm) A Unit (inch) Min Max Min Max 1.25 1.60 0.049 0.063 mm DIM. B 2.40 2.80 0.094 0.110 C 3.30 4.30 0.130 0.169 D 0.90 1.10 0.035 0.043 0.10 0.25 0.004 0.010 F 0.70 1.20 0.028 0.047 G 4.40 5.20 0.173 0.205 tR e co E No MARKING DIAGRAM P/N = Specific Device Code G = Green compound Code YW = Date Code F = Factory Code Version: B1604 ES1DF - ES1JF Taiwan Semiconductor No tR e co mm en de d CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Version: B1604