CREAT BY ART
- Glass passivated junction chip
- Ideal for automated placement
- Low profile package
- Low power loss, high efficiency
- Halogen-free according to IEC 61249-2-21
Molding compound: UL flammability classification rating 94V-0
Moisture sensitivity level: level 1, per J-STD-020
Packing code with suffix "G" means green compound (halogen-free)
Terminal: Matte tin plated leads, solderable per J-STD-002
Meet JESD 201 class 1A whisker test
SYMBOL ES1DF ES1GF ES1JF UNIT
VRRM 200 400 600 V
VRMS 140 280 420 V
VDC 200 400 600 V
IF(AV) A
CJpF
trr ns
TJ°C
TSTG °C
Version: B1604
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)
ES1DF - ES1JF
1A, 200V - 600V Surface Mount Super Fast Rectifiers
FEATURES
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
MECHANICAF DATA
SMAF
μA
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
1.70
1
30
1.00
1.30
Maximum reverse recovery time (Note 3)
9
Maximum reverse current @ rated VR
TJ=25°C
TJ=125°C
Case: SMAF
Maximum repetitive peak reverse voltage
PARAMETER
Polarity: Indicated by cathode band
Weight: 35 mg (approximately)
A
Maximum instantaneous forward voltage (Note 1)
@ 1 A
V
°C/W
100
35
Typical junction capacitance (Note 2)
Typical thermal resistance
Note 3: Test conditions: IF=0.5A, IR=1.0A, IRR=0.25A
Taiwan Semiconductor
35
85
Operating junction temperature range
Storage temperature range
Note 1: Pulse test with PW=300μs, 1% duty cycle
- 55 to +150
- 55 to +150
5
Note 2: Measured at 1 MHz and applied VR=4.0 V
Not Recommended
Note 2: Whole series with green compound
Fig 1
Fig.2
Version: B1604
R3
G
R3
EXAMPLE
EXAMPLE P/N
ES1DF - ES1JF
Taiwan Semiconductor
ORDERING INFORMATION
PACKING CODE
PACKING CODE
SUFFIX
PACKAGE
PACKING
PART NO.
R2
10,000 / 13" Paper reel
Note 1: "x" defines voltage from 200V (ES1DF) to 600V (ES1JF)
SMAF
3,000 / 7" Plastic reel
SMAF
G
Green compound
RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted)
ES1xF
(Note 1, 2)
ES1DF
PART NO.
ES1DF R3G
PACKING CODE
PACKING CODE
SUFFIX
DESCRIPTION
0
0.2
0.4
0.6
0.8
1
1.2
025 50 75 100 125 150
AVERAGE FORWARD CURRENT (A)
LEAD TEMPERATURE (°C)
FIG.1 FORWARD CURRENT DERATING CURVE
RESISTIVE OR
INDUCTIVE LOAD
0
5
10
15
20
25
30
110 100
PEAK FORWARD SURGE CURRENT (A)
NUMBER OF CYCLES AT 60 Hz
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
8.3ms single half sine wave
0.01
0.1
1
10
100
020 40 60 80 100
INSTANTANEOUS REVERSE CURRENT (μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 4 TYPICAL REVERSE CHARACTERISTICS
TJ=125°C
TJ=25°C
0.1
1
10
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
INSTANTANEOUS FORWARD CURRENT (A)
FORWARD VOLTAGE (V)
FIG. 2 TYPICAL FORWARD CHARACTERISTICS
ES1JF
Pulse width=300μs
1% duty cycle
Not Recommended
Min Max Min Max
A 1.25 1.60 0.049 0.063
B 2.40 2.80 0.094 0.110
C 3.30 4.30 0.130 0.169
D 0.90 1.10 0.035 0.043
E 0.10 0.25 0.004 0.010
F 0.70 1.20 0.028 0.047
G 4.40 5.20 0.173 0.205
MARKING DIAGRAM
P/N = Specific Device Code
G = Green compound Code
YW = Date Code
F = Factory Code
Version: B1604
SMAF
DIM.
Unit (mm)
Unit (inch)
ES1DF - ES1JF
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
0
5
10
15
20
25
30
0.1 1 10 100
CAPACITANCE (pF)
REVERSE VOLTAGE (V)
FIG. 5 TYPICAL JUNCTION CAPACITANCE
f=1.0MHz
Vsig=50mVp-p
Not Recommended
CREAT BY ART
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Version: B1604
ES1DF - ES1JF
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
Not Recommended