1
FEATURES
ZXY PACKAGE
(BOTTOM VIEW)
A
B
C
D
21 3 4 5
19
18
17
16
15
14
12
13
1
2
3
4
5
6
7
9
8
10 11
20 B1
B2
B4
B6
B8
V
B3
B5
B7
A1
A2
A4
A6
A8
VCCA
A3
A5
A7
OE GND
19
18
17
16
15
14
12
13
1
2
3
4
5
6
7
9
8
10 11
20
A1
B1
A2
A4
A6
A8
VCCA
A3
A5
A7
B2
B4
B6
B8
VCCB
B3
B5
B7
OE
GND
Exposed
Center
Pad
TXS0108E
www.ti.com
..................................................................................................................................... SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008
8-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATORFOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS
•No Direction-Control Signal Needed •IEC 61000-4-2 ESD (B Port)•Max Data Rates – ± 8-kV Contact Discharge– 60 Mbps (Push Pull) – ± 6-kV Air-Gap Discharge– 2 Mbps (Open Drain)•1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V onB Port (V
CCA
≤V
CCB
)•No Power-Supply Sequencing Required –Either V
CCA
or V
CCB
Can Be Ramped First•Latch-Up Performance Exceeds 100 mA PerJESD 78, Class II•ESD Protection Exceeds JESD 22 (A Port)– 2000-V Human-Body Model (A114-B)– 150-V Machine Model (A115-A)– 1000-V Charged-Device Model (C101)
TERMINAL ASSIGNMENTS
12345
DV
CCB
B2 B4 B6 B8
CB1 B3 B5 B7 GND
BA1 A3 A5 A7 OE
AV
CCA
A2 A4 A6 A8
PW PACKAGE RGY PACKAGE(TOP VIEW) (TOP VIEW)
The exposed center pad, if used, must beconnected as a secondary ground or leftelectrically open.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007 – 2008, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
DESCRIPTION/ORDERING INFORMATION
TYPICAL OPERATING CIRCUIT
VV
OE
A1
A2
A3
A4
A5
A6
A7
A8
B1
B2
B3
B4
B5
B6
B7
B8
3.3-V
System
1.8-V
System
Data Data
Controller
CCA CCB
TXS0108E
1.8 V 3.3 V
TXS0108E
SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008 .....................................................................................................................................
www.ti.com
This 8-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed totrack V
CCA
. V
CCA
accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track V
CCB
. V
CCBaccepts any supply voltage from 1.65 V to 5.5 V. This allows for low-voltage bidirectional translation between anyof the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through apulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
QFN – RGY Reel of 1000 TXS0108ERGYR YF08E– 40 ° C to 85 ° C TSSOP – PW Reel of 2000 TXS0108EPWR YF08EUFBGA – ZXY Reel of 2500 TXS0108EZXYR YF08E
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIwebsite at www.ti.com .
2Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
ABSOLUTE MAXIMUM RATINGS
(1)
THERMAL IMPEDANCE RATINGS
TXS0108E
www.ti.com
..................................................................................................................................... SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CCA
– 0.5 4.6 VSupply voltage rangeV
CCB
– 0.5 5.5 VA port – 0.5 4.6V
I
Input voltage range
(2)
VB port – 0.5 6.5A port – 0.5 4.6Voltage range applied to any outputV
O
Vin the high-impedance or power-off state
(2)
B port – 0.5 6.5A port – 0.5 V
CCA
+ 0.5V
O
Voltage range applied to any output in the high or low state
(2) (3)
VB port – 0.5 V
CCB
+ 0.5I
IK
Input clamp current V
I
< 0 – 50 mAI
OK
Output clamp current V
O
< 0 – 50 mAI
O
Continuous output current ± 50 mAContinuous current through V
CCA
, V
CCB
, or GND ± 100 mAT
stg
Storage temperature range – 65 150 ° C
(1) Stresses beyond those listed under " absolute maximum ratings " may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under " recommended operatingconditions " is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.(3) The value of V
CCA
and V
CCB
are provided in the recommended operating conditions table.
UNIT
PW package
(1)
70θ
JA
Package thermal impedance RGY package
(2)
80.9 ° C/WZXY package
(1)
47
(1) The package thermal impedance is calculated in accordance with JESD 51-5.(2) The package thermal impedance is calculated in accordance with JESD 51-7.
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TXS0108E
RECOMMENDED OPERATING CONDITIONS
(1) (2)
TXS0108E
SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008 .....................................................................................................................................
www.ti.com
V
CCA
V
CCB
MIN MAX UNIT
V
CCA
1.2 3.6Supply voltage
(3)
VV
CCB
1.65 5.51.2 V to 1.95 V V
CCI
– 0.2 V
CCIA-Port I/Os 1.65 V to 5.5 V1.95 V to 3.6 V V
CCI
– 0.4 V
CCIV
IH
High-level input voltage VB-Port I/Os V
CCI
– 0.4 V
CCI1.2 V to 3.6 V 1.65 V to 5.5 VOE V
CCA
× 0.65 5.51.2 V to 1.95 V 0 0.15A-Port I/Os 1.65 V to 5.5 V1.95 V to 3.6 V 0 0.15V
IL
Low-level input voltage VB-Port I/Os 0 0.151.2 V to 3.6 V 1.65 V to 5.5 VOE 0 V
CCA
× 0.35A-Port I/Ospush-pull drivingInput transition rise or fallΔt/ Δv B-Port I/Os 1.2 V to 3.6 V 1.65 V to 5.5 V 10 ns/Vrate
push-pull drivingControl inputOperating free-airT
A
– 40 85 ° Ctemperature
(1) V
CCI
is the V
CC
associated with the data input port.(2) V
CCO
is the V
CC
associated with the output port.(3) V
CCA
must be less than or equal to V
CCB
, and V
CCA
must not exceed 3.6 V.
4Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
ELECTRICAL CHARACTERISTICS
(1) (2) (3)
TXS0108E
www.ti.com
..................................................................................................................................... SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008
over recommended operating free-air temperature range (unless otherwise noted)
T
A
= 25 ° C – 40 ° C to 85 ° CTESTPARAMETER V
CCA
V
CCB
UNITCONDITIONS
MIN TYP MAX MIN MAX
1.2 V V
CCA
× 0.67I
OH
= – 20 µA,V
OHA
1.65 V to 5.5 V VV
IB
≥V
CCB
– 0.4 V
1.4 V to 3.6 V V
CCA
× 0.67
I
OL
= 135 µA,
1.2 V 0.25V
IB
≤0.15 V
I
OL
= 180 µA,
1.4 V 0.4V
IB
≤0.15 V
I
OL
= 220 µA,V
OLA
1.65 V 1.65 V to 5.5 V 0.4 VV
IB
≤0.15 V
I
OL
= 300 µA,
2.3 V 0.4V
IB
≤0.15 V
I
OL
= 400 µA,
3 V 0.55V
IB
≤0.15 V
1.2 VI
OH
= – 20 µA,V
OHB
1.65 V to 5.5 V VV
IA
≥V
CCA
– 0.2 V
1.4 V to 3.6 V V
CCB
× 0.67
I
OL
= 220 µA,
1.65 V 0.4V
IA
≤0.15 V
I
OL
= 300 µA,
2.3 V 0.4V
IA
≤0.15 VV
OLB
1.2 V to 3.6 V VI
OL
= 400 µA,
3 V 0.55V
IA
≤0.15 V
I
OL
= 620 µA,
4.5 V 0.55V
IA
≤0.15 V
I
I
OE V
I
= V
CCI
or GND 1.2 V 1.65 V to 5.5 V ± 1 2 µA
A orI
OZ
1.2 V 1.65 V to 5.5 V ± 1 ± 2 µAB port
1.2 V 1.65 V to 5.5 V 1.5 ± 2
1.4 V to 3.6 V 2.3 V to 5.5 V 2V
I
= V
O
= Open,I
CCA
µAI
O
= 0
3.6 V 0 V 2
0 V 5.5 V – 1
1.2 V 1.65 V to 5.5 V 1.5
1.4 V to 3.6 V 2.3 V to 5.5 V 6V
I
= V
O
= Open,I
CCB
µAI
O
= 0
3.6 V 0 V – 1
0 V 5.5 V 1
1.2 V 3V
I
= V
CCI
or GND,I
CCA
+ I
CCB
2.3 V to 5.5 V µAI
O
= 0
1.4 V to 3.6 V 8
1.2 V 0.05V
I
= V
O
= Open,I
CCZA
1.65 V to 5.5 V µAI
O
= 0, OE = GND
1.4 V to 3.6 V 2
1.2 V 4V
I
= V
O
= Open,I
CCZB
1.65 V to 5.5 V µAI
O
= 0, OE = GND
1.4 V to 3.6 V 6
C
i
OE 3.3 V 3.3 V 4.5 5.5 pF
A port 6 7C
io
3.3 V 3.3 V pFB port 5.5 6
(1) V
CCO
is the V
CC
associated with the output port.(2) V
CCI
is the V
CC
associated with the input port.(3) V
CCA
must be less than or equal to V
CCB
, and V
CCA
must not exceed 3.6 V.
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): TXS0108E
TIMING REQUIREMENTS
TIMING REQUIREMENTS
TIMING REQUIREMENTS
TIMING REQUIREMENTS
TIMING REQUIREMENTS
TXS0108E
SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008 .....................................................................................................................................
www.ti.com
T
A
=25 ° C, V
CCA
= 1.2 V
V
CCB
= 1.8 V V
CCB
= 2.5 V V
CCB
= 3.3 V V
CCB
= 5 V
UNITTYP TYP TYP TYP
Push-pull driving 20 20 20 20Data rate MbpsOpen-drain driving 2 2 2 2Push-pull driving 50 50 50 50t
w
Pulse duration Data inputs nsOpen-drain driving 500 500 500 500
over recommended operating free-air temperature range, V
CCA
= 1.5 V ± 0.1 V (unless otherwise noted)
V
CCB
= 1.8 V V
CCB
= 2.5 V V
CCB
= 3.3 V V
CCB
= 5 V± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 V
UNITMIN MAX MIN MAX MIN MAX MIN MAX
Data rate Push-pull driving 40 60 60 50
MbpsOpen-drain driving 2 2 2 2t
w
Push-pull driving 25 16.7 16.7 20Pulse duration Data inputs nsOpen-drain driving 500 500 500 500
over recommended operating free-air temperature range, V
CCA
= 1.8 V ± 0.15 V (unless otherwise noted)
V
CCB
= 1.8 V V
CCB
= 2.5 V V
CCB
= 3.3 V V
CCB
= 5 V UNIT± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 V
MIN MAX MIN MAX MIN MAX MIN MAX
Data rate Push-pull driving 40 60 60 60
MbpsOpen-drain driving 2 2 2 2t
w
Push-pull driving 25 16.7 16.7 16.7Pulse duration Data inputs nsOpen-drain driving 500 500 500 500
over recommended operating free-air temperature range, V
CCA
= 2.5 V ± 0.2 V (unless otherwise noted)
V
CCB
= 2.5 V V
CCB
= 3.3 V V
CC
= 5 V± 0.2 V ± 0.3 V ± 0.5 V
UNITMIN MAX MIN MAX MIN MAX
Push-pull driving 60 60 60Data rate MbpsOpen-drain driving 2 2 2Push-pull driving 16.7 16.7 16.7t
w
Pulse duration Data inputs nsOpen-drain driving 500 500 500
over recommended operating free-air temperature range, V
CCA
= 3.3 V ± 0.3 V (unless otherwise noted)
V
CCB
= 3.3 V V
CC
= 5 V± 0.3 V ± 0.5 V
UNITMIN MAX MIN MAX
Push-pull driving 60 60Data rate MbpsOpen-drain driving 2 2Push-pull driving 16.7 16.7t
w
Pulse duration Data inputs nsOpen-drain driving 500 500
6Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
SWITCHING CHARACTERISTICS
TXS0108E
www.ti.com
..................................................................................................................................... SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008
over recommended operating free-air temperature range, V
CCA
= 1.2 V (unless otherwise noted)
V
CCB
= 1.8 V V
CCB
= 2.5 V V
CCB
= 3.3 V V
CCB
= 5 VFROM TO TEST
± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 VPARAMETER UNIT(INPUT) (OUTPUT) CONDITIONS
TYP TYP TYP TYP
Push-pull driving 6.5 5.9 5.7 5.5t
PHL
Open-drain driving 11.9 11.1 11.0 11.1A B nsPush-pull driving 7.1 6.3 6.2 6.6t
PLH
Open-drain driving 293 236 197 152Push-pull driving 6.4 6 5.8 5.6t
PHL
Open-drain driving 8.5 6.8 6.2 5.9B A nsPush-pull driving 5.6 4.1 3.6 3.2t
PLH
Open-drain driving 312 248 192 132t
en
OE A or B 200 200 200 200 nsPush-pull drivingt
dis
OE A or B 16.8 13.9 13.2 13.5 nsPush-pull driving 7.9 6.7 6.5 6.4t
rA
A-port rise time nsOpen-drain driving 296 238 185 127Push-pull driving 6.3 3.3 1.8 1.5t
rB
B-port rise time nsOpen-drain driving 236 164 115 60Push-pull driving 5.8 4.8 4.3 3.8t
fA
A-port fall time
Open-drain driving 5.9 4.7 4.1 3.5
nsPush-pull driving 4.6 2.8 2.2 1.9t
fB
B-port fall time
Open-drain driving 4.5 2.7 2.2 1.9Channel-to-channel 1 1 1 1t
SK(O)
Push-pull driving nsskew
Push-pull driving 20 20 20 20Max data rate A or B MbpsOpen-drain driving 2 2 2 2
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): TXS0108E
SWITCHING CHARACTERISTICS
TXS0108E
SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008 .....................................................................................................................................
www.ti.com
over recommended operating free-air temperature range, V
CCA
= 1.5 V ± 0.1 V (unless otherwise noted)
V
CCB
= 1.8 V V
CCB
= 2.5 V V
CCB
= 3.3 V V
CCB
= 5 VFROM TO TEST
± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 VPARAMETER UNIT(INPUT) (OUTPUT) CONDITIONS
MIN MAX MIN MAX MIN MAX MIN MAX
Push-pull driving 11 9.2 8.6 8.6t
PHL
Open-drain driving 4 14.4 3.6 12.8 3.5 12.2 3.5 12A B nsPush-pull driving 12 10 9.8 9.7t
PLH
Open-drain driving 182 720 143 554 114 473 81 384Push-pull driving 12.7 11.1 11 12t
PHL
Open-drain driving 3.4 13.2 3.1 9.6 2.8 8.5 2.5 7.5B A nsPush-pull driving 9.5 6.2 5.1 1.6t
PLH
Open-drain driving 186 745 147 603 118 519 84 407t
en
OE A or B 200 200 200 200 nsPush-pull drivingt
dis
OE A or B 28.1 22 20.1 19.6 nsPush-pull driving 3.5 13.1 3 9.8 3.1 9 3.2 8.3t
rA
A-port rise time nsOpen-drain driving 147 982 115 716 92 592 66 481Push-pull driving 2.9 11.4 1.9 7.4 0.9 4.7 0.7 2.6t
rB
B-port rise time nsOpen-drain driving 135 1020 91 756 58 653 20 370Push-pull driving 2.3 9.9 1.7 7.7 1.6 6.8 1.7 6t
fA
A-port fall time
Open-drain driving 2.4 10 2.1 7.9 1.7 7 1.5 6.2
nsPush-pull driving 2 8.7 1.3 5.5 0.9 3.8 0.8 3.1t
fB
B-port fall time
Open-drain driving 1.2 11.5 1.3 8.6 1 9.6 0.5 7.7Channel-to-channel 1 1 1 1.1 1t
SK(O)
Push-pull driving nsskew
Push-pull driving 40 60 60 50
MbpMax data rate A or B
sOpen-drain driving 2 2 2 2
8Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
SWITCHING CHARACTERISTICS
TXS0108E
www.ti.com
..................................................................................................................................... SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008
over recommended operating free-air temperature range, V
CCA
= 1.8 V ± 0.15 V(unless otherwise noted)
V
CCB
= 1.8 V V
CCB
= 2.5 V V
CCB
= 3.3 V V
CCB
= 5 V± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 VFROM TO TESTPARAMETER UNIT(INPUT) (OUTPUT) CONDITIONS
MIN MAX MIN MAX MIN MAX MIN MA
X
Push-pull driving 8.2 6.4 5.7 5.6t
PHL
Open-drain driving 3.6 11.4 3.2 9.9 3.1 9.3 3.1 8.9A B nsPush-pull driving 9 2.1 6.5 6.3t
PLH
Open-drain driving 194 729 155 584 126 466 90 346
Push-pull driving 9.8 8 7.4 7t
PHL
Open-drain driving 3.4 12.1 2.8 8.5 2.5 7.3 2.1 6.2B A nsPush-pull driving 10.2 7 5.8 5t
PLH
Open-drain driving 197 733 159 578 129 459 93 323
t
en
OE A or B 200 200 200 200 nsPush-pull drivingt
dis
OE A or B 25.1 18.8 16.5 15.3 ns
Push-pull driving 3.1 11.9 2.6 8.6 2.7 7.8 2.8 7.2t
rA
A-port rise time nsOpen-drain driving 155 996 124 691 100 508 72 350
Push-pull driving 2.8 10.5 1.8 7.2 1.2 5.2 0.7 2.7t
rB
B-port rise time nsOpen-drain driving 132 1001 106 677 73 546 32 323
Push-pull driving 2.1 8.8 1.6 6.6 1.4 5.7 1.4 4.9t
fA
A-port fall time
Open-drain driving 2.2 9 1.7 6.7 1.4 5.8 1.2 5.2
nsPush-pull driving 2 8.3 1.3 5.4 0.9 3.9 0.7 3t
fB
B-port fall time
Open-drain driving 0.8 10.5 0.7 10.7 1 9.6 0.6 7.8
t
SK(O)
Channel-to-channel skew Push-pull driving 1 1 1 1 ns
Push-pull driving 40 60 60 60Max data rate A or B MbpsOpen-drain driving 2 2 2 2
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): TXS0108E
SWITCHING CHARACTERISTICS
TXS0108E
SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008 .....................................................................................................................................
www.ti.com
over recommended operating free-air temperature range, V
CCA
= 2.5 V ± 0.2 V (unless otherwise noted)
V
CCB
= 2.5 V V
CCB
= 3.3 V V
CCB
= 5 VFROM TO TEST
± 0.2 V ± 0.3 V ± 0.5 VPARAMETER UNIT(INPUT) (OUTPUT) CONDITIONS
MIN MAX MIN MAX MIN MAX
Push-pull driving 5 4 3.7t
PHL
Open-drain driving 2.4 6.9 2.3 6.3 2.2 5.8A B nsPush-pull driving 5.2 4.3 3.9t
PLH
Open-drain driving 149 592 125 488 93 368Push-pull driving 5.4 4.7 4.2t
PHL
Open-drain driving 2.5 7.3 2.2 6 1.8 4.9B A nsPush-pull driving 5.9 4.4 3.5t
PLH
Open-drain driving 150 595 126 481 94 345t
en
OE A or B 200 200 200 nsPush-pull drivingt
dis
OE A or B 15.7 12.9 11.2 nsPush-pull driving 2 7.3 2.1 6.4 2.2 5.8t
rA
A-port rise time nsOpen-drain driving 110 692 93 529 68 369Push-pull driving 1.8 6.5 1.3 5.1 0.7 3.4t
rB
B-port rise time nsOpen-drain driving 107 693 79 483 41 304Push-pull driving 1.5 5.7 1.2 4.7 1.3 3.8t
fA
A-port fall time
Open-drain driving 1.5 5.6 1.2 4.7 1.1 4
nsPush-pull driving 1.4 5.4 0.9 4.1 0.7 3t
fB
B-port fall time
Open-drain driving 0.4 14.2 0.5 19.4 0.4 3t
SK(O)
Channel-to-channel skew Push-pull driving 1 1.2 1 nsPush-pull driving 60 60 60Max data rate A or B MbpsOpen-drain driving 2 2 2
10 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
SWITCHING CHARACTERISTICS
OPERATING CHARACTERISTICS
TXS0108E
www.ti.com
..................................................................................................................................... SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008
over recommended operating free-air temperature range, V
CCA
= 3.3 V ± 0.3 V (unless otherwise noted)
V
CCB
= 3.3 V V
CCB
= 5 VFROM TO TEST
± 0.3 V ± 0.5 VPARAMETER UNIT(INPUT) (OUTPUT) CONDITIONS
MIN MAX MIN MAX
Push-pull driving 3.8 3.1t
PHL
Open-drain driving 2 5.3 1.9 4.8A B nsPush-pull driving 3.9 3.5t
PLH
Open-drain driving 111 439 87 352Push-pull driving 4.2 3.8t
PHL
Open-drain driving 2.1 5.5 1.7 4.5B A nsPush-pull driving 3.8 4.3t
PLH
Open-drain driving 112 449 86 339t
en
OE A or B 200 200 nsPush-pull drivingt
dis
OE A or B 11.9 9.8 nsPush-pull driving 1.8 5.7 1.9 5t
rA
A-port rise time nsOpen-drain driving 75 446 57 337Push-pull driving 1.5 5 1 3.6t
rB
B-port rise time nsOpen-drain driving 72 427 40 290Push-pull driving 1.2 4.5 1.1 3.5t
fA
A-port fall time
Open-drain driving 1.1 4.4 1 3.7
nsPush-pull driving 1.1 4.2 0.8 3.1t
fB
B-port fall time
Open-drain driving 1 4.2 0.8 3.1t
SK(O)
Channel-to-channel skew Push-pull driving 1 1 nsPush-pull driving 60 60Max data rate A or B MbpsOpen-drain driving 2 2
T
A
=25 ° C
V
CCA
1.2 V 1.2 V 1.5 V 1.8 V 2.5 V 2.5 V 3.3 V
PARAMETER TEST CONDITIONS V
CCB
UNIT
5 V 1.8 V 1.8 V 1.8 V 2.5 V 5 V 3.3 V to 5 V
TYP TYP TYP TYP TYP TYP TYP
A-port input,
5.9 5.7 5.9 5.9 6.7 6.9 8B-port outputC
pdA
B-port input,
C
L
= 0, f = 10 MHz,
10.2 10.3 9.9 9.7 9.7 9.4 9.8A-port output
t
r
= t
f
= 1ns,
pFOE = V
CCAA-port input,
29.9 22.2 21.5 20.8 21 23.4 23(outputs enabled)B-port outputC
pdB
B-port input,
22.9 16.7 16.7 16.8 17.8 20.8 20.9A-port outputA-port input,
0.01 0.01 0.01 0.01 0.01 0.01 0.01B-port outputC
pdA
B-port input,
C
L
= 0, f = 10 MHz,
0.06 0.01 0.01 0.01 0.01 0.01 0.01A-port output
t
r
= t
f
= 1ns,
pFOE = GNDA-port input,
0.06 0.01 0.01 0.01 0.01 0.03 0.02(outputs disabled)B-port outputC
pdB
B-port input,
0.06 0.01 0.01 0.01 0.01 0.03 0.02A-port output
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Link(s): TXS0108E
PRINCIPLES OF OPERATION
Applications
Architecture
VCCA
A
VCCB
One-Shot
One-Shot
N1
P1
R1 R2
Translator
One-Shot
One-Shot N2
OS1
OS2
OS4
OS3
T2
T1
RpubRpua
Bias
Npass
B
P2
Translator
TXS0108E
SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008 .....................................................................................................................................
www.ti.com
The TXS0108E can be used in level-translation applications for interfacing devices or systems operating atdifferent interface voltages with one another. The TXS0108E is ideal for use in applications where an open-draindriver is connected to the data I/Os. The TXS0108E can also be used in applications where a push-pull driver isconnected to the data I/Os, but the TXB0104 might be a better option for such push-pull applications. TheTXS0108E device is a semi-buffered auto-direction-sensing voltage translator design is optimized for translationapplications (e.g. MMC Card Interfaces) that require the system to start out in a low-speed open-drain mode andthen switch to a higher speed push-pull mode.
To address these application requirements, a semi-buffered architecture design is used and is illustrated below(see Figure 1 ). Edge-rate accelerator circuitry (for both the high-to-low and low-to-high edges), a High-Ronn-channel pass-gate transistor (on the order of 300 Ωto 500 Ω) and pull-up resistors (to provide DC-bias anddrive capabilities) are included to realize this solution. A direction-control signal (to control the direction of dataflow from A to B or from B to A) is not needed. The resulting implementation supports both low-speed open-drainoperation as well as high-speed push-pull operation.
Figure 1. Architecture of a TXS01xx Cell
When transmitting data from A to B ports, during a rising edge the One-Shot (OS3) turns on the PMOS transistor(P2) for a short-duration and this speeds up the low-to-high transition. Similarly, during a falling edge, whentransmitting data from A to B, the One-Shot (OS4) turns on NMOS transistor (N2) for a short-duration and thisspeeds up the high-to-low transition. The B-port edge-rate accelerator consists of one-shots OS3 and OS4,Transistors P2 and N2 and serves to rapidly force the B port high or low when a corresponding transition isdetected on the A port.
When transmitting data from B to A ports, during a rising edge the One-Shot (OS1) turns on the PMOS transistor
12 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
Power Up
Enable and Disable
Pullup or Pulldown Resistors on I/O Lines
TXS0108E
www.ti.com
..................................................................................................................................... SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008
(P1) for a short-duration and this speeds up the low-to-high transition. Similarly, during a falling edge, whentransmitting data from B to A, the One-Shot (OS2) turns on NMOS transistor (N1) for a short-duration and thisspeeds up the high-to-low transition. The A-port edge-rate accelerator consists of one-shots OS1 and OS2,Transistors P1 and N1 components and form the edge-rate accelerator and serves to rapidly force the A porthigh or low when a corresponding transition is detected on the B port.
During operation, ensure that V
CCA
≤V
CCB
at all times. During power-up sequencing, V
CCA
≥V
CCB
does notdamage the device, so any power supply can be ramped up first.
The TXS0108E has an OE input that is used to disable the device by setting OE low, which places all I/Os in theHi-Z state. The disable time (t
dis
) indicates the delay between the time when OE goes low and when the outputsactually get disabled (Hi-Z). The enable time (t
en
) indicates the amount of time the user must allow for theone-shot circuitry to become operational after OE is taken high.
Each A-port I/O has a pull-up resistor (R
pua
) to V
CCA
and each B-port I/O has a pull-up resistor (R
pub
) to V
CCB
.R
pua
and R
pub
have a value of 40 k Ωwhen the output is driving low. R
pua
and R
pub
have a value of 4 k Ωwhen theoutput is driving high. R
pua
and R
pub
are disabled when OE = Low.
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Link(s): TXS0108E
PARAMETER MEASUREMENT INFORMATION
VOH
VOL
From Output
Under Test
LOAD CIRCUIT FOR ENABLE/DISABLE
TIME MEASUREMENT
S1
2 × VCCO
Open
50 kW
tPLH tPHL
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 × VCCO
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
tPZL
tPZH
tPLZ
tPHZ
VCCA/2VCCA/2
VCCI
0 V
VCCO/2VOH
VOL
0 V
0.1 y VCCO
VCCO/2
0.9 y VCCO VCCO/2 0 V
VCCI
0 V
VCCI/2 VCCI/2
tw
Input
VCCA
VCCO
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Output
Input
tPZL/tPLZ
tPHZ/tPZH
2 × VCCO
Open
TEST S1
A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. VCCI is the VCC associated with the input port.
I. VCCO is the VCC associated with the output port.
J. All parameters and waveforms are not applicable to all devices.
50 kW
1 MW
15 pF
15 pF
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
A PUSH-PULL DRIVER
VCCO
VCCI
DUT
IN OUT
1 MW
15 pF
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
AN OPEN-DRAIN DRIVER
VCCO
VCCI
DUT
IN OUT
VCCI/2 VCCI/2
0.9 y VCCO
VCCO/2
tr
0.1 y VCCO tf
TXS0108E
SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008 .....................................................................................................................................
www.ti.com
Figure 2. Load Circuit and Voltage Waveforms
14 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
PACKAGE OPTION ADDENDUM
www.ti.com 30-Jan-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TXS0108EPWR ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TXS0108EPWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TXS0108ERGYR ACTIVE VQFN RGY 20 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TXS0108EZXYR ACTIVE BGA
MICROSTAR
JUNIOR
ZXY 20 2500 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TXS0108EPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
TXS0108ERGYR VQFN RGY 20 3000 330.0 12.4 3.8 4.8 1.6 8.0 12.0 Q1
TXS0108EZXYR BGA MI
CROSTA
R JUNI
OR
ZXY 20 2500 330.0 12.4 2.8 3.3 1.0 4.0 12.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TXS0108EPWR TSSOP PW 20 2000 367.0 367.0 38.0
TXS0108ERGYR VQFN RGY 20 3000 367.0 367.0 35.0
TXS0108EZXYR BGA MICROSTAR
JUNIOR ZXY 20 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
