8
TWA Series
TWA Wet Electrolytic Tantalum Capacitor
Technical Summary and Applications Guidelines
1.5 A.C. OPERATION, POWER
DISSIPATION AND RIPPLE CURRENT
1.5.1 A.C. Operation.
In an a.c. application heat is generated within the capacitor by
both the a.c. component of the signal (which will depend upon
the signal form, amplitude and frequency), and by the DC
leakage (for practical purposes the second factor is
insignificant). The actual power dissipated in the capacitor is
calculated using the formula:
P = I2 R
and rearranged to: I = SQRT (P⁄R) .....(Eq. 1)
where I = rms ripple current, amperes
R = equivalent series resistance, ohms
U = rms ripple voltage, volts
P = power dissipated, watts
Z = impedance, ohms, at the frequency
under consideration
The maximum a.c. ripple voltage (Umax) is calculated from
Ohms’ law:
Umax = IR .....(Eq. 2)
Where P is the maximum specified permissible power
dissipation.
However care must be taken to ensure that:
1. The DC working voltage of the capacitor must not be
exceeded by the sum of the positive peak of the applied
a.c. voltage and the DC bias voltage.
2. The sum of the applied DC bias voltage and the negative
a.c. voltage peak must not exceed the reverse voltage
specification limit.
1.5.2 Power Dissipation
The power dissipation is a measure of the power required to
heat the capacitor to a certain temperature above ambient.
Power dissipation is a function of case size and this is used in
the above equations to calculate ripple current limits.
1.5.3 Ripple Current.
Ripple current is referenced at 40kHz at 2/3 rated voltage at
85ºC and multipliers for applied voltages of different
percentages of rated voltage, and for different frequencies,
have been calculated over the temperature range from -55ºC
to 125ºC. These are shown in table 1.5.3.
The reference point (40kHz at 2/3 rated voltage at 85ºC) is
highlighted in yellow in the table.
1.6 SOLDERING CONDITIONS AND
BOARD ATTACHMENT
1.6.1 Wave Soldering.
AVX leaded tantalum capacitors are designed for a wave
soldering operation. The soldering temperature and time
should be the minimum for a good connection. After
insertion into the printed circuit board, the exposed leads
can be passed through wave solder, a suitable temperature
/ time combination being 230°C – 250°C for 3-5 seconds.
Figure 1.6.1 illustrates the allowable range of peak
temperature versus time for wave soldering.
Small parametric shifts may be noted immediately after wave
solder, components should be allowed to stabilize at room
temperature prior to electrical testing. After soldering, the
assembly should be allowed to cool naturally. In the event that
assisted cooling is used, the rate of change in temperature
should not exceed that used in reflow. A recommended wave
solder profile is shown in Figure 1.6.2 below:
Frequency of
Applied
120Hz 800Hz 1kHz
Ripple Current
Ambient Still Air
≤55 85 105 125 ≤55 85 105 125 ≤55 85 105 125
Temperature (ºC)
% of 100% 0.60 0.39 – – 0.71 0.43 – – 0.72 0.45 – –
85ºC 90% 0.60 0.46 – – 0.71 0.55 – _ 0.72 0.55 – –
Rated 80% 0.60 0.52 0.35 – 0.71 0.62 0.42 – 0.72 0.62 0.42 –
Peak 70% 0.60 0.58 0.44 – 0.71 0.69 0.52 – 0.72 0.70 0.52 –
Voltage
66-2/3%
0.60 0.60 0.46 0.27 0.71 0.71 0.55 0.32 0.72 0.72 0.55 0.32
Frequency of
Applied
10kHz 40kHz 100kHz
Ripple Current
Ambient Still Air
≤55 85 105 125 ≤55 85 105 125 ≤55 85 105 125
Temperature (ºC)
% of 100% 0.88 0.55 – – 1.00 0.63 – – 1.10 0.69 – –
85ºC 90% 0.88 0.67 – – 1.00 0.77 – _ 1.10 0.85 – –
Rated 80% 0.88 0.76 0.52 – 1.00 0.87 0.59 – 1.10 0.96 0.65 –
Peak 70% 0.88 0.85 0.64 – 1.00 0.97 0.73 – 1.10 1.07 0.80 –
Voltage
66-2/3%
0.88 0.88 0.68 0.40 1.00 1.00 0.77 0.45 1.10 1.10 0.85 0.50
Table 1.5.3: Ripple Current Multipliers vs. Frequency,
Temperature and Applied Voltage
Figure 1.6.1: Allowable Range of Peak Temp./Time
Combinations for Wave Soldering