BGU7005,115 - NXP - Pdf.Support

1. Product profile

1.1 General description

The BGU7005 is a Low Noise Amplifier (LNA) for GNSS receiver applications in a plastic

leadless 6-pin, extremely small SOT886 package. The BGU7005 requires only one

external matching inductor and one external decoupling capacitor.

The BGU7005 adapts itself to the changing environment resulting from co-habitation of

different radio systems in moder n ce llula r ha nd se ts. It has been de sig ne d fo r low po we r

consumption and optimal performance when jamming signals from co-existing cellular

transmitters are present. At low jamming power levels it delivers 16.5 dB gain at a noise

figure of 0.85 dB. During high jamming power levels, resulting for example from a cellular

transmit burst, it temporarily increases its bias current to improve sensitivity.

1.2 Features and benefits

Covers full GNSS L1 band, from 1559 MHz to 1610 MHz

Noise figure (NF) = 0.85 dB

Gain 16.5 dB

High input 1 dB compression point Pi(1dB) of 11 dBm

High out of band IP3i of 9 dB m

Supply voltage 1.5 V to 3.1 V

Power-down mode current consumption < 1 A

Optimized performance at low supply current of 4.5 mA

Integrated matching for the output

Requires only one input matching inductor and one supply decoupling capacitor

Input and output DC decoupled

ESD protection on all pins (HBM > 2 kV)

Integrated temperature stabilized bias for easy design

Small 6-pin leadless package 1 mm  1.45 mm  0.5 mm

110 GHz transit frequency - SiGe:C technology

BGU7005

SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo

and Compass

Rev. 5 — 29 March 2012 Product data sheet

CAUTION

This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken

during transport and handling.

Product data sheet Rev. 5 — 29 March 2012 2 of 20

NXP Semiconductors BGU7005

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

1.3 Applications

LNA for GPS, GLONASS, Galileo and Compass (BeiDou) in smart phones, feature

phones, tablet PCs, Personal Navigation Devices, Digital Still Cameras, Digital Video

Cameras, RF Front End m odules, comple te GPS chip set modules and thef t protection

(laptop, ATM).

1.4 Quick reference data

[1] PCB losses are subtracted.

[2] Including PCB losses.

[3] f1 = 1713 MHz; f2 = 1851 MHz; P1 = P2 = 30 dBm.

2. Pinning information

Table 1. Quick reference data

f = 1559 MHz to 1610 MHz; VCC = 1.8 V; Pi <



40 dBm; Tamb =25



C; input matched to 50



using

a 5.6 nH inductor; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VCC supply voltage RF input AC coupled 1.5 - 3.1 V

ICC supply current VENABLE  0.8 V

Pi < 40 dBm 3.2 4.5 5.7 mA

Pi = 20 dBm 8.1 11.6 14.4 mA

Gppower gain Pi < 40 dBm, no jammer 14 16.5 19 dB

Pi = 20 dBm, no jammer 15 17.5 20 dB

NF noise figure Pi < 40 dBm, no jammer [1] -0.851.2dB

Pi < 40 dBm, no jammer [2] -0.91.3dB

Pi = 20 dBm, no jammer - 1.2 1.6 dB

Pi(1dB) input powe r at 1 dB

gain compression f = 1575 MHz

VCC =1.5V 15 12 - dBm

VCC =1.8V 14 11 - dBm

VCC =2.85V 11 8- dBm

IP3iinput third-order intercept point f = 1.575 GHz

VCC =1.5V [3] 58 - dBm

VCC =1.8V [3] 59 - dBm

VCC =2.85V [3] 512- dBm

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

1GND

2GND

3RF_IN

5 ENABLE

6RF_OUT

sym129

4 5

Product data sheet Rev. 5 — 29 March 2012 3 of 20

NXP Semiconductors BGU7005

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

3. Ordering information

4. Marking

5. Limiting values

[1] Tsp is the temperature at the soldering point of the emitter lead.

[2] Warning: due to internal ESD diode proctection, the applied DC voltage should not exceed VCC + 0.6 and

shall not exceed 5.0 V in order to avoid excess current.

[3] The RF input and RF output are AC coupled through internal DC blocking capacitor.

6. Thermal characteristics

Table 3. Ordering information

Type number Package

Name Description Version

BGU7005 XSON6 plastic extremely thin small outline package; no leads;

6 terminals; body 1 1.45  0.5 mm SOT886

Table 4. Marking codes

Type number Marking code

BGU7005 AC

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VCC supply voltage RF input AC coupled 0.5 +5.0 V

VENABLE voltage on pin ENABLE VENABLE <V

CC +0.6 [2] 0.5 +5.0 V

VRF_IN voltage on pin RF_IN DC; VRF_IN <V

CC +0.6 [2][3] 0.5 +5.0 V

VRF_OUT voltage on pin RF_OUT DC; VRF_OUT <V

CC +0.6 [2][3] 0.5 +5.0 V

Piinput power - 0 dBm

Ptot total power dissipation Tsp  130 C[1] 55 mW

Tstg storage temperature 65 +150 C

Tjjunction temperature - 150 C

VESD electrostatic discharge

voltage Human Body Model (HBM);

According JEDEC standard

22-A114E

-4 kV

Charged

Device Model (CDM);

According JEDEC standard

22-C101B

-1 kV

Table 6. Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-sp) thermal resistance from junction to solder point 225 K/W

Product data sheet Rev. 5 — 29 March 2012 4 of 20

NXP Semiconductors BGU7005

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

7. Characteristics

Table 7. Characteristics

f = 1559 MHz to 1610 MHz; VCC = 1.8 V; VENABLE



0.8 V; P i <



40 dBm; Tamb =25



C; input matched to 50



using a 5.6 nH

inductor; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VCC supply voltage RF input AC coupled 1.5 - 3.1 V

ICC supply current VENABLE  0.8 V

Pi < 40 dBm 3.2 4.5 5.7 mA

Pi = 20 dBm 8.1 11.6 14.4 mA

VENABLE  0.35 V - - 1 A

Tamb ambient temperature 40 +25 +85 C

Gppower gain Tamb =25C

Pi < 40 dBm, no jammer 14 16.5 19 dB

Pi = 20 dBm, no jammer 15 17.5 20 dB

Pjam =20 d Bm; fjam = 850 MHz 15 17.5 20 dB

Pjam =20 d Bm; fjam = 1850 MHz 15 17.5 20 dB

40 CTamb +85 C

Pi < 40 dBm, no jammer 13 - 20 dB

Pi = 20 dBm, no jammer 14 - 21 dB

Pjam =20 d Bm; fjam = 850 MHz 14 - 21 dB

Pjam =20 d Bm; fjam =1850MHz 14 - 21 dB

RLin input return loss Pi < 40 dBm 5 8 - dB

Pi = 20 dBm 6 10 - dB

RLout output return loss Pi < 40 dBm 10 20 - dB

Pi = 20 dBm 10 14 - dB

ISL isolation 20 23 - dB

NF noise figure Tamb =25C

Pi < 40 dBm, no jammer [1] - 0.85 1.2 dB

Pi < 40 dBm, no jammer [2] -0.91.3dB

Pi = 20 dBm, no jammer - 1.2 1.6 dB

Pjam =20 d Bm; fjam = 850 MHz - 1.1 1.5 dB

Pjam =20 d Bm; fjam =1850MHz - 1.3 1.7 dB

40 CTamb +85 C

Pi < 40 dBm, no jammer - - 1.7 dB

Pi = 20 dBm, no jammer - - 1.9 dB

Pjam =20 d Bm; fjam =850MHz - - 1.8 dB

Pjam =20 d Bm; fjam =1850MHz - - 2.0 dB

Product data sheet Rev. 5 — 29 March 2012 5 of 20

NXP Semiconductors BGU7005

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

[1] PCB losses are subtracted.

[2] Including PCB losses.

[3] Out of band.

[4] f1 = 1713 MHz; f2 = 1851 MHz; P1 = P2 =30 dBm.

[5] Within 10 % of the final gain.

Pi(1dB) input power at 1 dB gain compression f = 1575 MHz

VCC =1.5V 15 12 - dBm

VCC =1.8V 14 11 - dBm

VCC =2.85V 11 8- dBm

f = 806 MHz to 928 MHz

VCC =1.5V [3] 15 12 - dBm

VCC =1.8V [3] 14 11 - dBm

VCC =2.85V [3] 14 11 - dBm

f = 1612 MHz to 1909 MHz

VCC =1.5V [3] 13 10 - dBm

VCC =1.8V [3] 12 9- dBm

VCC =2.85V [3] 10 7- dBm

IP3iinput third-order intercept point f = 1.575 GHz

VCC =1.5V [4] 58 - dBm

VCC =1.8V [4] 59 - dBm

VCC =2.85V [4] 512- dBm

ton turn-on time [5] -- 2s

toff turn-off time [5] -- 1s

K Rollett stability factor 1 - -

Table 7. Characteristics …continued

f = 1559 MHz to 1610 MHz; VCC = 1.8 V; VENABLE



0.8 V; P i <



40 dBm; Tamb =25



C; input matched to 50



using a 5.6 nH

inductor; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Table 8. ENABLE (pin 5)







Tamb



+85



C; 1.5 V



VCC



3.1 V

VENABLE (V) State

 0.35 OFF

 0.8 ON

Product data sheet Rev. 5 — 29 March 2012 6 of 20

NXP Semiconductors BGU7005

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

8. Application information

8.1 GNSS LNA

For a list of components see Table 9.

Fig 1. Schematics GNSS LNA evaluation board

Table 9. List of components

For schematics see Figure 1.

Component Description Value Supplier Remarks

C1 decoupling capacitor 1 nF various

IC1 BGU7005 - NXP

L1 high quality matching inductor 5.6 nH Murata LQW15A

001aak685

RF input

IC1

RF output

Pi=45 dBm.

(1) Tamb = 40 C

(2) Tamb = +25 C

(3) Tamb = +85 C

Pi=45 dBm.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.85 V

Fig 2. Supply current as a function of supply voltage;

typical valu e s Fig 3. Supply current as a functi on of ambient

temperature; typical value s

VCC (V)

1.0 3.53.02.0 2.51.5

001aak688

ICC

(mA)

(1)

(2)

(3)

Tamb (°C)

−55 10565−15 25

001aak689

ICC

(mA)

(3)

(1)

(2)

Product data sheet Rev. 5 — 29 March 2012 7 of 20

NXP Semiconductors BGU7005

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

VCC = 1.8 V; Pi=45 dBm.

(1) Tamb = 40 C

(2) Tamb = +25 C

(3) Tamb = +85 C

VCC = 1.8 V; Tamb =25C.

(1) Pi = 45 dBm

(2) Pi = 30 dBm

(3) Pi = 20 dBm

(4) Pi = 15 dBm

Fig 4. Power gain as a function of frequency;

typical values Fig 5. Power gain as a function of frequency;

typical values

f (MHz)

500 300025001500 20001000

001aak690

(dB)

(1)

(2)

(3)

f (MHz)

500 300025001500 20001000

001aak691

(dB)

(4)

(3)

(2)

(1)

Pi=45 dBm; Tamb =25C.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.85 V

Tamb =25C; f = 1575 MHz.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.85 V

Fig 6. Power gain as a function of frequency;

typical values Fig 7. Power gain as a function of input power;

typical values

f (MHz)

500 300025001500 20001000

001aak692

(dB)

(3)

(2)

(1)

Pi (dBm)

−50 0−10−30 −20−40

001aak693

(dB)

ICC

(mA)

Gp(3)

(2)

(1)

(3)

(2)

(1)

ICC

Product data sheet Rev. 5 — 29 March 2012 8 of 20

NXP Semiconductors BGU7005

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

f = 1575 MHz; Tamb =25C; no jammer. f = 1575 MHz; Tamb =25C; no jammer.

Fig 8. Noise figure as a function of frequency;

typical values Fig 9. Noise figure as a function of supply voltage;

typical values

f (MHz)

1550 162016061578 15921564

001aao101

0.8

0.4

1.2

1.6

(dB)

VCC (V)

1.2 3.22.82.0 2.41.6

001aak694

0.8

0.4

1.2

1.6

(dB)

f = 1575 MHz; VCC = 1.8 V; no jammer. fjam= 850 MHz; Tamb =25C; f = 1575 MHz.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.85 V

Fig 10. Noise figure as a function of ambient

temperature; typical values Fig 11. Noise figure as a function of jamming power;

typical values

Tamb (°C)

−50 1007010 40−20

001aak695

0.8

0.4

1.2

1.6

(dB)

Pjam (dBm)

-50 0-10-30 -20-40

001aak696

(dB)

(3)

(2)

(1)

Product data sheet Rev. 5 — 29 March 2012 9 of 20

NXP Semiconductors BGU7005

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

fjam= 1850 MHz; Tamb =25C; f = 1575 MHz.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.85 V

VCC = 1.8 V; Pi=45 dBm.

(1) Tamb = 40 C

(2) Tamb = +25 C

(3) Tamb = +85 C

Fig 12. Noise figure as a function of jamming power;

typical values Fig 13. Input return loss as a function of frequency;

typical values

Pjam (dBm)

-50 0-10-30 -20-40

001aak697

(dB)

(3)

(2)

(1)

f (MHz)

500 300025001500 20001000

001aak698

−9

−6

−12

−3

RLin

(dB)

−15

(1)

(2)

(3)

VCC = 1.8 V; Tamb =25C.

(1) Pi = 45 dBm

(2) Pi = 30 dBm

(3) Pi = 20 dBm

(4) Pi = 15 dBm

Pi=45 dBm; Tamb =25C.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.85 V

Fig 14. Input return loss as a function of frequency;

typical valu e s Fig 15. Input return loss as a function of frequency;

typical values

f (MHz)

500 300025001500 20001000

001aak699

-9

-6

-12

-3

RLin

(dB)

-15

(1)

(2)

(3)

(4)

f (MHz)

500 300025001500 20001000

001aak700

-9

-6

-12

-3

RLin

(dB)

-15

(1)

(2)

(3)

Product data sheet Rev. 5 — 29 March 2012 10 of 20

NXP Semiconductors BGU7005

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

Tamb =25C; f = 1575 MHz.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.85 V

VCC = 1.8 V; Pi=45 dBm.

(1) Tamb = 40 C

(2) Tamb = +25 C

(3) Tamb = +85 C

Fig 16. Input return loss as a function of input power;

typical values Fig 17. Output return loss as a function of frequency;

typical values

Pi (dBm)

-50 0-10-30 -20-40

001aak701

-9

-6

-12

-3

RLin

(dB)

-15

(2)

(3)

(1)

f (MHz)

500 300025001500 20001000

001aak702

−12

−8

−16

−4

RLout

(dB)

−20

(1)

(2)

(3)

VCC = 1.8 V; Tamb =25C.

(1) Pi = 45 dBm

(2) Pi = 30 dBm

(3) Pi = 20 dBm

(4) Pi = 15 dBm

Pi=45 dBm; Tamb =25C.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.85 V

Fig 18. Output return loss as a function of frequency;

typical valu e s Fig 19. Output return loss as a function of frequency;

typical values

f (MHz)

500 300025001500 20001000

001aak703

-12

-8

-16

-4

RLout

(dB)

-20

(4)

(3)

(2)

(1)

f (MHz)

500 300025001500 20001000

001aak704

-12

-8

-16

-4

RLout

(dB)

-20

(1)

(2)

(3)

Product data sheet Rev. 5 — 29 March 2012 11 of 20

NXP Semiconductors BGU7005

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

Tamb =25C; f = 1575 MHz.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.85 V

VCC = 1.8 V; Pi=45 dBm.

(1) Tamb = 40 C

(2) Tamb = +25 C

(3) Tamb = +85 C

Fig 20. Output return loss as a function of input

power; typical values Fig 21. Isolation as a function of frequency; typical

values

Pi (dBm)

-50 0-10-30 -20-40

001aak705

-12

-8

-16

-4

RLout

(dB)

-20

(1)

(2)

(3)

f (MHz)

500 300025001500 20001000

001aak706

−20

−30

−10

ISL

(dB)

−40

(1)

(2)

(3)

VCC = 1.8 V; Tamb =25C.

(1) Pi = 45 dBm

(2) Pi = 30 dBm

(3) Pi = 20 dBm

(4) Pi = 15 dBm

Pi=45 dBm; Tamb =25C.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.85 V

Fig 22. Isolation as a function of frequ ency; typical

values Fig 23. Isolation as a function of frequency; typical

values

f (MHz)

500 300025001500 20001000

001aak707

-20

-30

-10

ISL

(dB)

-40

(4)

(3)

(2)

(1)

f (MHz)

500 300025001500 20001000

001aak708

-20

-30

-10

ISL

(dB)

-40

(1)

(2)

(3)

Product data sheet Rev. 5 — 29 March 2012 12 of 20

NXP Semiconductors BGU7005

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

Tamb =25C; f = 1575 MHz.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.85 V

f = 850 MHz.

(1) Tamb = 40 C

(2) Tamb = +25 C

(3) Tamb = +85 C

Fig 24. Isolation as a function of input power;

typical values Fig 25. Input power at 1 dB gain compression as a

function of supply voltage; typical values

Pi (dBm)

-50 0-10-30 -20-40

001aak709

-20

-30

-10

ISL

(dB)

-40

(1)

(2)

(3)

VCC (V)

1.2 3.22.82.0 2.41.6

001aak710

−12

−8

−16

−4

Pi(1dB)

(dBm)

−20

(2)

(1)

(3)

f = 1850 MHz.

(1) Tamb = 40 C

(2) Tamb = +25 C

(3) Tamb = +85 C

f = 1575 MHz.

(1) Tamb = 40 C

(2) Tamb = +25 C

(3) Tamb = +85 C

Fig 26. Input power at 1 dB gain compre ss ion as a

function of supply voltage; typical values Fig 27. Input power at 1 dB gain compression as a

function of supply voltage; typical values

VCC (V)

1.2 3.22.82.0 2.41.6

001aak711

−12

−8

−16

−4

Pi(1dB)

(dBm)

−20

(2)

(1)

(3)

VCC (V)

1.2 3.22.82.0 2.41.6

001aak716

−12

−8

−16

−4

Pi(1dB)

(dBm)

−20

(2)

(1)

(3)

Product data sheet Rev. 5 — 29 March 2012 13 of 20

NXP Semiconductors BGU7005

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

f = 1575 MHz; f1 = 1713 MHz; f2= 1851 MHz;

Tamb =25C.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.85 V

f = 1575 MHz; f1 = 1713 MHz; f2= 1851 MHz;

VCC =1.8V.

(1) Tamb = 40 C

(2) Tamb = +25 C

(3) Tamb = +85 C

Fig 28. Third order intermodulation distortion and

output power as function of input power;

typical valu e s

Fig 29. Third order intermodulation distortion and

output power as function of input power;

typical values

Pi (dBm)

-40 -15-20-30 -25-35

001aak717

IMD3,

(dBm)

-20

-60

-100

-120

-80

-40

(1)

(2)

(3)

(1)

IMD3 of 1575 MHz signal

PL of 1713 MHz signal

(2)

(3)

Pi (dBm)

−40 −15−20−30 −25−35

001aak718

IMD3,

(dBm)

−20

−60

−100

−120

−80

−40

(1)

IMD3 of 1575 MHz signal

PL of 1713 MHz signal

(2)

(3)

(1)

(2)

(3)

Tamb = 25 C; Pi=45 dBm.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.85 V

VCC = 1.8 V; Pi=45 dBm.

(1) Tamb = 40 C

(2) Tamb = +25 C

(3) Tamb = +85 C

Fig 30. Rollett sta bility factor as a function of

frequency; typical values Fig 31. Rollett stability factor as a function of

frequency; typical values

001aak719

102

10−1

f (MHz)

0 1000080004000 60002000

(3)

(2)

(1)

001aak720

102

10-1

f (MHz)

0 1000080004000 60002000

(3)

(2)

(1)

Product data sheet Rev. 5 — 29 March 2012 14 of 20

NXP Semiconductors BGU7005

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

8.2 GPS front-end

The GPS LNA is typically used in a GPS front-end. A GPS front-end application circuit

and its characteristics is provided here.

8.3 Characteristics GPS front-end

For a list of components see Table 10.

Fig 32. Schematics GPS front-end evaluation board

001aak721

Ven

RFin BPF1 BPF2

IC1

16RFout

Vcc

Table 10. List of comp onents

For schematics see Figure 32.

Component Description Value Supplier Remarks

BPF1, BPF2 GPS SAW filter - Murata SAFEA1G57KE0F00 Alternatives from Epcos:

•B9444

Alternatives from Murata:

•SAFEA1G57KH0F00

•SAFEA1G57KB0F00

Alternatives from Fujitsu:

•FAR-F6KA-1G5754-L4AA

•FAR-F6KA-1G5754-L4AJ

C1 decoupling capacitor 1 nF Various

IC1 BGU7005 - NXP

L1 high quality matching inductor 5.6 nH Murata LQW15A

Table 11. Characteristics GPS front-end

f = 1575 MHz; VCC = 1.8 V; VENABLE



0.8 V; power at LNA input Pi <



40 dBm; Tamb =25



C; input and output matched to



; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VCC supply voltage RF input AC coupled 1.5 - 2.85 V

ICC supply current -4.5- mA

Tamb ambient temperature 40 +25 +85 C

Gppower gain power at LNA input Pi < 40 dBm [1] - 14.5 - dB

power at LNA input Pi = 20 dBm [1] - 15.5 - dB

RLin input return loss power at LNA input Pi < 40 dBm [1] -8.5- dB

power at LNA input Pi = 20 dBm [1] - 10.5 - dB

RLout output return loss power at LNA input Pi < 40 dBm [1] - 14.5 - dB

power at LNA input Pi = 20 dBm [1] - 12.5 - dB

Product data sheet Rev. 5 — 29 March 2012 15 of 20

NXP Semiconductors BGU7005

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

[1] Power at GPS front-end input = power at LNA input + attenuation BPF1.

[2] Out of band.

[3] f1 = 1713 MHz; f2 = 1851 MHz; P1 = P2 = +10 dBm.

[4] Relative to f = 1575 MHz.

[5] Within 10 % of the final gain.

NF noise figure power at LNA input Pi < 40 dBm [1] -1.8- dB

power at LNA input Pi = 20 dBm [1] -1.9- dB

Pi(1dB) input pow er at 1 dB gain comp r ession f = 1575 MHz 8.2 dBm

f = 806 MHz to 928 MHz [2] 31 dBm

f = 1612 MHz to 1909 MHz [2] 40 dBm

IP3iinput third-order intercept point [3] 64 dBm

attenuation f = 850 MHz [4] 95 - - dBc

f = 1850 MHz [4] 90 - - dBc

ton turn-on time [5] -- 2 s

toff turn-off time [5] -- 1 s

Table 11. Characteristics GPS front-end …continued

f = 1575 MHz; VCC = 1.8 V; VENABLE



0.8 V; power at LNA input Pi <



40 dBm; Tamb =25



C; input and output matched to



; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Product data sheet Rev. 5 — 29 March 2012 16 of 20

NXP Semiconductors BGU7005

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

9. Package outline

Fig 33. Package outline SOT886 (XSON6)

References

Outline

version European

projection Issue date

IEC JEDEC JEITA

SOT886 MO-252

sot886_po

04-07-22

12-01-05

Unit

mm max

nom

min

0.5 0.04 1.50

1.45

1.40

1.05

1.00

0.95

0.35

0.30

0.27

0.40

0.35

0.32

0.6

A(1)

Dimensions (mm are the original dimensions)

Notes

1. Including plating thickness.

2. Can be visible in some manufacturing processes.

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886

A1b

0.25

0.20

0.17

DEee

0.5

terminal 1

index area

0 1 2 mm

scale

(2)

Product data sheet Rev. 5 — 29 March 2012 17 of 20

NXP Semiconductors BGU7005

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

10. Abbreviations

11. Revision history

Table 12. Abbreviations

Acronym Description

AC Alternating Current

ATM Automated Teller Machine (cash dispenser)

DC Direct Current

GLONASS GLObal NAvigation Satellite System

GNSS Global Navigation Satellite System

GPS Global Positioning System

HBM Human Body Model

MMIC Monolithic Microwave Integrate d Circuit

PC Personal Computer

PCB Print ed Circuit Board

RF Radio Frequency

SAW Surface Acoustic Wave

SiGe:C Silicon Germanium Carbon

Table 13. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BGU7005 v.5 20120329 Product data sheet - BGU7005 v.4

Modifications: •Added ‘Compass’ to descriptive title

•Section 1.2 on page 1: row 6, changed 2.85 V to 3.1 V

•Section 1.3 on page 2: updated

•Table 1 on page 2: changed max.va lue V CC from 2.85 V to 3.1 V

•Table 7 on page 4: changed max.va lue V CC from 2.85 V to 3.1 V

•Table 8 on page 5: changed max.va lue V CC from 2.85 V to 3.1 V

•Table 5 on page 3: several additions and changes

•Figure 8 on page 8: corrected figure titles

•Figure 9 on page 8: corrected figure titles

BGU7005 v.4 20110506 Product data sheet - BGU7005 v.3

BGU7005 v.3 20100623 Product data sheet - BGU7005_2

BGU7005_2 20100304 Product data sheet - BGU7005_1

BGU7005_1 20091028 Preliminary data sheet - -

Product data sheet Rev. 5 — 29 March 2012 18 of 20

NXP Semiconductors BGU7005

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

12. Legal information

12.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

12.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond tho se described in the

Product data sheet.

12.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability t owards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, lif e-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environme ntal

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applicati ons or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Te rms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly ob jects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by cust omer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product develop ment.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the prod uct specification.

Product data sheet Rev. 5 — 29 March 2012 19 of 20

NXP Semiconductors BGU7005

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for aut omotive use. It i s neither qua lif ied nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in au tomotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting f rom customer design an d

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Translations — A non-English (translated) version of a docume nt is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

12.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

13. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors BGU7005

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 29 March 2012

Document identifier : BGU7005

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

14. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 3

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Application information. . . . . . . . . . . . . . . . . . . 6

8.1 GNSS LNA . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8.2 GPS front-end. . . . . . . . . . . . . . . . . . . . . . . . . 14

8.3 Characteristics GPS front-end . . . . . . . . . . . . 14

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16

10 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 17

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17

12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18

12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 18

12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19

13 Contact information. . . . . . . . . . . . . . . . . . . . . 19

14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20