Features–––––––––––––––––––––––
• Frame kit
The kit is assembled by ultrasonic welding method which
provides strong and heat resistant assembly with less time.
• Socket
Three types of sockets are available:-
SMT configuration off-set by 0.2mm (.008")
SMT configuration off-set by 0.75mm (.030)
Dual-row straddle type, designed to accommodate PCB
between the two solder tail rows.
The SMT types can be packaged in embossed tape for
automatic mounting.
• Header
Headers are single-row 0.635mm (.025") pitch SMT
configuration. There are two available stand-off heights, 0mm
or 1.64mm (.065").
• Ejector
The assembly of the ejector mechanism to the mounted
header is a simple one-touch operation. The ejector also
makes contact with the solder tabs of the header, thus
preventing static electricity.
• Adapter card
The use of the adapter card allows existing equipment with
PCMCIA slots, the facility to use the newly developed
Compact Flash Technology.
Specifications ––––––––––––––––––
• Pich: 1.27mm (.050")
• Type: Dual-row at mating section
• Current rating: 0.5A AC, DC/line
• Temperature range: -40˚C to +85˚C
(including temperature rise in applying
electrical current)
• Contact resistance: Initial value/40m Ωmax
After environmental testing/max.
20m Ωvariation from initial value
• Insulation resistance: 1,000M Ωmin. (500V DC)
• Withstanding voltage:
500V AC/minute (Except for Adapter cards)
• Mating/unmaking life: 10,000 cycles
• Circuits: 50-circuits
* Contact JST for details.