FEATURES Modulated serial digital output, proportional to temperature 0.5C typical accuracy at 25C 1.0C accuracy from 0C to 70C Two grades available Operation from -40C to +150C Operation from 3 V to 5.5 V Power consumption 70 W maximum at 3.3 V CMOS-/TTL-compatible output on TMP05 Flexible open-drain output on TMP06 Small, low cost, 5-lead SC-70 and SOT-23 packages FUNCTIONAL BLOCK DIAGRAM VDD 5 TMP05/TMP06 TEMPERATURE SENSOR - CORE REFERENCE CONV/IN 2 The TMP05/TMP06 are specified for operation at supply voltages from 3 V to 5.5 V. Operating at 3.3 V, the supply current is typically 370 A. The TMP05/TMP06 are rated for operation over the -40C to +150C temperature range. It is not recommended to operate these devices at temperatures above 125C for more than a total of 5% (5,000 hours) of the lifetime of the devices. They are packaged in low cost, low area SC-70 and SOT-23 packages. The TMP05/TMP06 have three modes of operation: continuously converting mode, daisy-chain mode, and one shot mode. A three-state FUNC input determines the mode in which the TMP05/TMP06 operate. OUT 3 FUNC 4 GND Isolated sensors Environmental control systems Computer thermal monitoring Thermal protection Industrial process control Power-system monitors The TMP05/TMP06 are monolithic temperature sensors that generate a modulated serial digital output (PWM), which varies in direct proportion to the temperature of the devices. The high period (TH) of the PWM remains static over all temperatures, while the low period (TL) varies. The B Grade version offers a high temperature accuracy of 1C from 0C to 70C with excellent transducer linearity. The digital output of the TMP05/ TMP06 is CMOS-/TTL-compatible and is easily interfaced to the serial inputs of most popular microprocessors. The flexible open-drain output of the TMP06 is capable of sinking 5 mA. 1 OUTPUT CONTROL CLK AND TIMING GENERATION APPLICATIONS GENERAL DESCRIPTION AVERAGING BLOCK/ COUNTER 03340-001 Data Sheet 0.5C Accurate PWM Temperature Sensor in 5-Lead SC-70 TMP05/TMP06 Figure 1. The CONV/IN input pin is used to determine the rate at which the TMP05/TMP06 measure temperature in continuously converting mode and one shot mode. In daisy-chain mode, the CONV/IN pin operates as the input to the daisy chain. PRODUCT HIGHLIGHTS 1. The TMP05/TMP06 have an on-chip temperature sensor that allows an accurate measurement of the ambient temperature. The measurable temperature range is -40C to +150C. 2. Supply voltage is 3 V to 5.5 V. 3. Space-saving 5-lead SOT-23 and SC-70 packages. 4. Temperature accuracy is typically 0.5C. Each part needs a decoupling capacitor to achieve this accuracy. 5. Temperature resolution of 0.025C. 6. The TMP05/TMP06 feature a one shot mode that reduces the average power consumption to 102 W at 1 SPS. Rev. C Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 (c)2004-2012 Analog Devices, Inc. All rights reserved. TMP05/TMP06 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Converter Details ....................................................................... 13 Applications ....................................................................................... 1 Functional Description .............................................................. 13 Functional Block Diagram .............................................................. 1 Operating Modes ........................................................................ 13 General Description ......................................................................... 1 TMP05 Output ........................................................................... 16 Product Highlights ........................................................................... 1 TMP06 Output ........................................................................... 16 Revision History ............................................................................... 2 Application Hints ........................................................................... 17 Specifications..................................................................................... 3 Thermal Response Time ........................................................... 17 TMP05A/TMP06A Specifications ............................................. 3 Self-Heating Effects .................................................................... 17 TMP05B/TMP06B Specifications .............................................. 5 Supply Decoupling ..................................................................... 17 Timing Characteristics ................................................................ 7 Layout Considerations ............................................................... 18 Absolute Maximum Ratings ............................................................ 8 Temperature Monitoring ........................................................... 18 ESD Caution .................................................................................. 8 Daisy-Chain Application ........................................................... 18 Pin Configuration and Function Descriptions ............................. 9 Continuously Converting Application .................................... 24 Typical Performance Characteristics ........................................... 10 Outline Dimensions ....................................................................... 26 Theory of Operation ...................................................................... 13 Ordering Guide .......................................................................... 26 Circuit Information .................................................................... 13 REVISION HISTORY 8/12--Rev. B to Rev. C Changes to Table 1 ............................................................................ 3 Changes to Table 2 ............................................................................ 5 Changes to Table 3 ............................................................................ 7 Changes to Figure 6, Figure 7, and Figure 8................................ 10 Changes to Figure 15 ...................................................................... 11 Changes to Functional Description Section ............................... 13 Changes to Table 7 and Table 8 ..................................................... 14 Changes to Table 9 and Daisy-Chain Mode Section.................. 15 Updated Outline Dimensions ....................................................... 26 4/06--Rev. A to Rev. B Changes to Table 1 ............................................................................ 3 Changes to Table 2 ............................................................................ 5 Changes to Table 8 .......................................................................... 14 Changes to Table 9 .......................................................................... 15 10/05--Rev. 0 to Rev. A Changes to Specifications Table ......................................................3 Changes to Absolute Maximum Ratings ........................................8 Changes to Figure 4 ...........................................................................8 Changes to Figure 7 ........................................................................ 10 Changes to Figure 15...................................................................... 11 Deleted Figure 18............................................................................ 12 Changes to One Shot Mode Section ............................................ 14 Changes to Figure 20...................................................................... 14 Changes to Daisy-Chain Mode Section....................................... 15 Changes to Figure 23...................................................................... 15 Changes to Equation 5 and Equation 7 ....................................... 17 Added Layout Considerations Section ........................................ 18 Updated Outline Dimensions ....................................................... 26 Changes to Ordering Guide .......................................................... 26 8/04--Revision 0: Initial Version Rev. C | Page 2 of 28 Data Sheet TMP05/TMP06 SPECIFICATIONS TMP05A/TMP06A SPECIFICATIONS All A grade specifications apply for -40C to +150C, VDD decoupling capacitor is a 0.1 F multilayer ceramic, TA = TMIN to TMAX, VDD = 3.0 V to 5.5 V, unless otherwise noted. Table 1. Parameter TEMPERATURE SENSOR AND ADC Nominal Conversion Rate (One Shot Mode) Accuracy @ VDD = 3.0 V to 5.5 V Temperature Resolution TH Pulse Width TL Pulse Width Quarter Period Conversion Rate (All Operating Modes) Accuracy @ VDD = 3.3 V (3.0 V to 3.6 V) @ VDD = 5 V (4.5 V to 5.5 V) Temperature Resolution TH Pulse Width TL Pulse Width Double High/Quarter Low Conversion Rate (All Operating Modes) Accuracy @ VDD = 3.3 V (3.0 V to 3.6 V) @ VDD = 5 V (4.5 V to 5.5 V) Temperature Resolution TH Pulse Width TL Pulse Width Long-Term Drift Temperature Hysteresis SUPPLIES Supply Voltage Supply Current Normal Mode 2 @ 3.3 V @ 5.0 V Quiescent2 @ 3.3 V @ 5.0 V One Shot Mode @ 1 SPS Power Dissipation 1 SPS Min Typ Max Unit Test Conditions/Comments 2 3 4 5 1 C C C C C/5 s ms ms See Table 7 TA = 0C to 70C, VDD = 3.0 V to 5.5 V TA = -40C to +100C, VDD = 3.0 V to 5.5 V TA = -40C to +125C, VDD = 3.0 V to 5.5 V TA = -40C to +150C, VDD = 3.0 V to 5.5 V Step size for every 5 s on TL TA = 25C, nominal conversion rate TA = 25C, nominal conversion rate 0.025 34 65 See Table 7 1.5 1.5 0.1 8.5 16 C C C/5 s ms ms TA = -40C to +150C TA = -40C to +150C Step size for every 5 s on TL TA = 25C, QI conversion rate TA = 25C, QP conversion rate See Table 7 1.5 1.5 0.1 68 16 0.081 0.0023 3 C C C/5 s ms ms C C TA = -40C to +150C TA = -40C to +150C Step size for every 5 s on TL TA = 25C, DH/QL conversion rate TA = 25C, DH/QL conversion rate Drift over 10 years, if part is operated at 55C Temperature cycle = 25C to 100C to 25C 5.5 V 370 425 600 650 A A Nominal conversion rate Nominal conversion rate 3 5.5 30.9 12 20 A A A Device not converting, output is high Device not converting, output is high Average current @ VDD = 3.3 V, nominal conversion rate @ 25C Average current @ VDD = 5.0 V, nominal conversion rate @ 25C VDD = 3.3 V, continuously converting at nominal conversion rates @ 25C Average power dissipated for VDD = 3.3 V, one shot mode @ 25C Average power dissipated for VDD = 5.0 V, one shot mode @ 25C 37.38 A 803.33 W 101.9 W 186.9 W Rev. C | Page 3 of 28 TMP05/TMP06 Parameter TMP05 OUTPUT (PUSH-PULL) 3 Output High Voltage (VOH) Output Low Voltage (VOL) Output High Current (IOUT) 4 Pin Capacitance Rise Time (tLH) 5 Fall Time (tHL)5 RON Resistance (Low Output) TMP06 OUTPUT (OPEN DRAIN)3 Output Low Voltage (VOL) Output Low Voltage (VOL) Pin Capacitance High Output Leakage Current (IOH) Device Turn-On Time Fall Time (tHL) 6 RON Resistance (Low Output) DIGITAL INPUTS3 Input Current Input Low Voltage (VIL) Input High Voltage (VIH) Pin Capacitance Data Sheet Min Typ Max VDD - 0.3 0.4 2 10 50 50 55 0.4 1.2 10 0.1 20 30 55 5 1 0.3 x VDD 0.7 x VDD 3 10 1 Unit Test Conditions/Comments V V mA pF ns ns IOH = 800 A IOL = 800 A Typ VOH = 3.17 V with VDD = 3.3 V V V pF A ms ns IOL = 1.6 mA IOL = 5.0 mA A V V pF VIN = 0 V to VDD Supply and temperature dependent PWMOUT = 5.5 V Supply and temperature dependent It is not recommended to operate the device at temperatures above 125C for more than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure beyond this limit affects device reliability. Normal mode current relates to current during TL. TMP05/TMP06 are not converting during TH, so quiescent current relates to current during TH. 3 Guaranteed by design and characterization, not production tested. 4 It is advisable to restrict the current being pulled from the TMP05 output because any excess currents going through the die cause self-heating. As a consequence, false temperature readings can occur. 5 Test load circuit is 100 pF to GND. 6 Test load circuit is 100 pF to GND, 10 k to 5.5 V. 2 Rev. C | Page 4 of 28 Data Sheet TMP05/TMP06 TMP05B/TMP06B SPECIFICATIONS All B grade specifications apply for -40C to +150C; VDD decoupling capacitor is a 0.1 F multilayer ceramic; TA = TMIN to TMAX, VDD = 3 V to 5.5 V, unless otherwise noted. Table 2. Parameter TEMPERATURE SENSOR AND ADC Nominal Conversion Rate (One Shot Mode) Accuracy 1 @ VDD = 3.3 V (5%) @ VDD = 5 V (10%) @ VDD = 3.3 V (10%) and 5 V (10%) Temperature Resolution TH Pulse Width TL Pulse Width Quarter Period Conversion Rate (All Operating Modes) Accuracy1 @ VDD = 3.3 V (3.0 V to 3.6 V) @ VDD = 5.0 V (4.5 V to 5.5 V) Temperature Resolution TH Pulse Width TL Pulse Width Double High/Quarter Low Conversion Rate (All Operating Modes) Accuracy1 @ VDD = 3.3 V (3.0 V to 3.6 V) @ VDD = 5 V (4.5 V to 5.5 V) Temperature Resolution TH Pulse Width TL Pulse Width Long-Term Drift Temperature Hysteresis SUPPLIES Supply Voltage Supply Current Normal Mode 3 @ 3.3 V @ 5.0 V Quiescent3 @ 3.3 V @ 5.0 V One Shot Mode @ 1 SPS Min Typ Max Unit Test Conditions/Comments See Table 7 0.2 0.4 1 -1/+1.5 1.5 C C C 2 C 2.5 C 4.5 2 C TA = 0C to 70C, VDD = 3.135 V to 3.465 V TA = 0C to 70C, VDD = 4.5 V to 5.5 V TA = -40C to +70C, VDD = 3.0 V to 3.6 V, VDD = 4.5 V to 5.5 V TA = -40C to +100C, VDD = 3.0 V to 3.6 V, VDD = 4.5 V to 5.5 V TA = -40C to +125C, VDD = 3.0 V to 3.6 V, VDD = 4.5 V to 5.5 V TA = -40C to +150C, VDD = 3.0 V to 3.6 V, VDD = 4.5 V to 5.5 V Step size for every 5 s on TL TA = 25C, nominal conversion rate TA = 25C, nominal conversion rate See Table 7 0.025 34 65 C/5 s ms ms 1.5 1.5 0.1 8.5 16 C C C/5 s ms ms TA = -40C to +150C TA = -40C to +150C Step size for every 5 s on TL TA = 25C, QP conversion rate TA = 25C, QP conversion rate See Table 7 1.5 1.5 0.1 68 16 0.081 0.0023 C C C/5 s ms ms C C TA = -40C to +150C TA = -40C to +150C Step size for every 5 s on TL TA = 25C, DH/QL conversion rate TA = 25C, DH/QL conversion rate Drift over 10 years, if part is operated at 55C Temperature cycle = 25C to 100C to 25C 3 5.5 V 370 425 600 650 A A Nominal conversion rate Nominal conversion rate 3 5.5 30.9 12 20 A A A Device not converting, output is high Device not converting, output is high Average current @ VDD = 3.3 V, nominal conversion rate @ 25C Average current @ VDD = 5.0 V, nominal conversion rate @ 25C 37.38 Rev. C | Page 5 of 28 A TMP05/TMP06 Parameter Power Dissipation Data Sheet Min 1 SPS TMP05 OUTPUT (PUSH-PULL) 4 Output High Voltage (VOH) Output Low Voltage (VOL) Output High Current (IOUT) 5 Pin Capacitance Rise Time (tLH) 6 Fall Time (tHL)6 RON Resistance (Low Output) TMP06 OUTPUT (OPEN DRAIN)4 Output Low Voltage (VOL) Output Low Voltage (VOL) Pin Capacitance High Output Leakage Current (IOH) Device Turn-On Time Fall Time (tHL) 7 RON Resistance (Low Output) DIGITAL INPUTS4 Input Current Input Low Voltage (VIL) Input High Voltage (VIH) Pin Capacitance Typ 803.33 Max 101.9 W 186.9 W VDD - 0.3 0.4 2 10 50 50 55 0.4 1.2 10 0.1 20 30 55 5 1 0.3 x VDD 0.7 x VDD 3 Unit W 10 1 Test Conditions/Comments VDD = 3.3 V, continuously converting at nominal conversion rates @ 25C Average power dissipated for VDD = 3.3 V, one shot mode @ 25C Average power dissipated for VDD = 5.0 V, one shot mode @ 25C V V mA pF ns ns IOH = 800 A IOL = 800 A Typical VOH = 3.17 V with VDD = 3.3 V V V pF A ms ns IOL = 1.6 mA IOL = 5.0 mA A V V pF VIN = 0 V to VDD Supply and temperature dependent PWMOUT = 5.5 V Supply and temperature dependent The accuracy specifications for 3.0 V to 3.6 V and 4.5 V to 5.5 V supply ranges are specified to 3- performance. It is not recommended to operate the device at temperatures above 125C for more than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure beyond this limit affects device reliability. 3 Normal mode current relates to current during TL. TMP05/TMP06 are not converting during TH, so quiescent current relates to current during TH. 4 Guaranteed by design and characterization, not production tested. 5 It is advisable to restrict the current being pulled from the TMP05 output because any excess currents going through the die cause self-heating. As a consequence, false temperature readings can occur. 6 Test load circuit is 100 pF to GND. 7 Test load circuit is 100 pF to GND, 10 k to 5.5 V. 2 Rev. C | Page 6 of 28 Data Sheet TMP05/TMP06 TIMING CHARACTERISTICS TA = TMIN to TMAX, VDD = 3.0 V to 5.5 V, unless otherwise noted. Guaranteed by design and characterization, not production tested. Table 3. Parameter TH TL t3 1 t4 1 t4 2 t5 Comments PWM high time @ 25C under nominal conversion rate PWM low time @ 25C under nominal conversion rate TMP05 output rise time TMP05 output fall time TMP06 output fall time Daisy-chain start pulse width Test load circuit is 100 pF to GND. Test load circuit is 100 pF to GND, 10 k to 5.5 V. TL TH t3 t4 03340-002 2 Unit ms typ ms typ ns typ ns typ ns typ s max 90% 10% 10% 90% Figure 2. PWM Output Nominal Timing Diagram (25C) START PULSE t5 03340-003 1 Limit 34 65 50 50 30 25 Figure 3. Daisy-Chain Start Timing Rev. C | Page 7 of 28 TMP05/TMP06 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 4. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rating -0.3 V to +7 V -0.3 V to VDD + 0.3 V 10 mA -40C to +150C -65C to +160C 150C 0.9 3 0.4 SOT-23 0.3 0.2 150 140 130 120 110 90 40 30 20 0 10 -10 -20 -30 -40 0 03340-0-040 SC-70 0.1 100 220C (0C/5C) 10 sec to 20 sec 2C/s to 3C/s -6C/s 6 minutes max 0.5 80 534.7C/W 172.3C/W 0.6 70 WMAX = (TJ max - TA3)/JA 0.7 60 240C/W 0.8 50 WMAX = (TJ max - TA )/JA MAXIMUM POWER DISSIPATION (W) Parameter VDD to GND Digital Input Voltage to GND Maximum Output Current (OUT) Operating Temperature Range 1 Storage Temperature Range Maximum Junction Temperature, TJ max 5-Lead SOT-23 (RJ-5) Power Dissipation 2 Thermal Impedance 4 JA, Junction-to-Ambient (Still Air) 5-Lead SC-70 (KS-5) Power Dissipation2 Thermal Impedance4 JA, Junction-to-Ambient JC, Junction-to-Case IR Reflow Soldering Peak Temperature Time at Peak Temperature Ramp-Up Rate Ramp-Down Rate Time 25C to Peak Temperature IR Reflow Soldering (Pb-Free Package) Peak Temperature Time at Peak Temperature Ramp-Up Rate Ramp-Down Rate Time 25C to Peak Temperature TEMPERATURE (C) Figure 4. Maximum Power Dissipation vs. Ambient Temperature 260C (0C) 20 sec to 40 sec 3C/sec max -6C/sec max 8 minutes max 1 It is not recommended to operate the device at temperatures above 125C for more than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure beyond this limit affects device reliability. 2 SOT-23 values relate to the package being used on a 2-layer PCB and SC-70 values relate to the package being used on a 4-layer PCB. See Figure 4 for a plot of maximum power dissipation vs. ambient temperature (TA). 3 TA = ambient temperature. 4 Junction-to-case resistance is applicable to components featuring a preferential flow direction, for example, components mounted on a heat sink. Junction-to-ambient resistance is more useful for air-cooled PCB mounted components. ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. C | Page 8 of 28 Data Sheet TMP05/TMP06 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS CONV/IN 2 TMP05/ TMP06 5 VDD TOP VIEW FUNC 3 (Not to Scale) 4 GND 03340-005 OUT 1 Figure 5. Pin Configuration Table 5. Pin Function Descriptions Pin No. 1 Mnemonic OUT 2 CONV/IN 3 FUNC 4 5 GND VDD Description Digital Output. Pulse-width modulated (PWM) output gives a square wave whose ratio of high-to-low period is proportional to temperature. Digital Input. In continuously converting and one shot operating modes, a high, low, or float input determines the temperature measurement rate. In daisy-chain operating mode, this pin is the input pin for the PWM signal from the previous part on the daisy chain. Digital Input. A high, low, or float input on this pin gives three different modes of operation. For details, see the Operating Modes section. Analog and Digital Ground. Positive Supply Voltage, 3.0 V to 5.5 V. Using a decoupling capacitor of 0.1 F as close as possible to this pin is strongly recommended. Rev. C | Page 9 of 28 TMP05/TMP06 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 14 VDD = 3.3V AND 5V CLOAD = 100pF 10 VOLTAGE (V) OUTPUT FREQUENCY (Hz) 12 8 6 0 4 2 100ns/DIV 1V/DIV -40 -20 0 20 40 60 80 100 120 140 TEMPERATURE (C) 03340-023 OUT PIN LOADED WITH 10k RESISTOR 03340-020 0 0 TIME (ns) Figure 9. TMP05 Output Rise Time at 25C Figure 6. PWM Output Frequency vs. Temperature 10.14 10.12 VDD = 3.3V AND 5V CLOAD = 100pF 10.08 10.06 VOLTAGE (V) OUTPUT FREQUENCY (Hz) 10.10 10.04 10.02 10.00 0 9.98 9.96 9.94 5.1 5.4 SUPPLY VOLTAGE (V) 03340-041 OUT PIN LOADED WITH 10k RESISTOR 9.90 3.0 3.3 3.6 3.9 4.2 4.5 4.8 03340-024 100ns/DIV 1V/DIV 9.92 0 TIME (ns) Figure 10. TMP05 Output Fall Time at 25C Figure 7. PWM Output Frequency vs. Supply Voltage 120 100 TL TIME VOLTAGE (V) 60 0 40 TH TIME 20 -40 -20 0 20 30 50 70 90 110 TEMPERATURE (C) 130 150 0 TIME (ns) Figure 11. TMP06 Output Fall Time at 25C Figure 8. TH and TL Times vs. Temperature Rev. C | Page 10 of 28 03340-025 100ns/DIV 1V/DIV OUT PIN LOADED WITH 10k RESISTOR 0 03340-022 TIME (ms) 80 VDD = 3.3V AND 5V RPULLUP = 1k RLOAD = 10k CLOAD = 100pF Data Sheet TMP05/TMP06 2000 1.25 VDD = 3.3V AND 5V 1.00 1600 0.75 TEMPERATURE ERROR (C) 1800 1400 RISE TIME 1000 800 600 FALL TIME 400 0.25 5V 0 -0.25 3.3V -0.50 -0.75 -1.00 0 -1.25 0 1000 2000 3000 4000 5000 6000 7000 8000 9000 10000 CAPACTIVE LOAD (pF) 03340-026 200 CONTINUOUS MODE OPERATION NORMAL CONVERSION RATE -40 0 20 30 50 70 90 110 130 150 TEMPERATURE (C) Figure 12. TMP05 Output Rise and Fall Times vs. Capacitive Load Figure 15. Output Accuracy vs. Temperature 250 350 VDD = 3.3V AND 5V ILOAD = 5mA 300 200 SUPPLY CURRENT (A) OUTPUT LOW VOLTAGE (mV) -20 03340-042 TIME (ns) 1200 0.50 150 100 ILOAD = 0.5mA ILOAD = 1mA VDD = 3.3V AND 5V CONTINUOUS MODE OPERATION NOMINAL CONVERSION RATE NO LOAD ON OUT PIN 250 200 150 100 50 -25 0 25 50 75 100 125 150 TEMPERATURE (C) 0 -50 03340-027 0 -50 0 25 50 75 100 125 150 TEMPERATURE (C) Figure 13. TMP06 Output Low Voltage vs. Temperature Figure 16. Supply Current vs. Temperature 255 35 VDD = 3.3V AND 5V 250 AMBIENT TEMPERATURE = 25C CONTINUOUS MODE OPERATION NOMINAL CONVERSION RATE NO LOAD ON OUT PIN 245 SUPPLY CURRENT (A) 30 25 20 240 235 230 225 15 -50 -25 0 25 50 75 100 125 150 TEMPERATURE (C) 215 2.7 3.0 3.3 3.6 3.9 4.2 4.5 4.8 5.1 SUPPLY VOLTAGE (V) Figure 14. TMP06 Open Drain Sink Current vs. Temperature Figure 17. Supply Current vs. Supply Voltage Rev. C | Page 11 of 28 5.4 5.7 03340-031 220 03340-028 SINK CURRENT (mA) -25 03340-030 50 TMP05/TMP06 Data Sheet 140 1.25 VDD = 3.3V AND 5V AMBIENT TEMPERATURE = 25C 120 TEMPERATURE ERROR (C) 1.00 80 60 TEMPERATURE OF ENVIRONMENT (30C) CHANGED HERE 40 0.75 0.50 0.25 0 0 10 20 30 40 50 TIME (Seconds) 60 70 Figure 18. Response to Thermal Shock 0 0 5 10 15 20 25 LOAD CURRENT (mA) Figure 19. TMP05 Temperature Error vs. Load Current Rev. C | Page 12 of 28 30 03340-034 20 03340-033 TEMPERATURE (C) FINAL TEMPERATURE = 120C 100 Data Sheet TMP05/TMP06 THEORY OF OPERATION The TMP05/TMP06 are monolithic temperature sensors that generate a modulated serial digital output that varies in direct proportion with the temperature of each device. An on-board sensor generates a voltage precisely proportional to absolute temperature, which is compared to an internal voltage reference and is input to a precision digital modulator. The ratiometric encoding format of the serial digital output is independent of the clock drift errors common to most serial modulation techniques such as voltage-to-frequency converters. Overall accuracy for the A grade is 2C from 0C to +70C with excellent transducer linearity. B grade accuracy is 1C from 0C to 70C. The digital output of the TMP05 is CMOS-/TTLcompatible and is easily interfaced to the serial inputs of most popular microprocessors. The open-drain output of the TMP06 is capable of sinking 5 mA. The modulated output of the comparator is encoded using a circuit technique that results in a serial digital signal with a mark-space ratio format. This format is easily decoded by any microprocessor into either C or F values, and is readily transmitted or modulated over a single wire. More importantly, this encoding method neatly avoids major error sources common to other modulation techniques because it is clockindependent. FUNCTIONAL DESCRIPTION The output of the TMP05/TMP06 is a square wave with a typical period of 99 ms at 25C (CONV/IN pin is left floating). The high period, TH, is constant, while the low period, TL, varies with measured temperature. The output format for the nominal conversion rate is readily decoded by the user as follows: Temperature (C) = 421 - (751 x (TH/TL)) The on-board temperature sensor has excellent accuracy and linearity over the entire rated temperature range without correction or calibration by the user. CONVERTER DETAILS The - modulator consists of an input sampler, a summing network, an integrator, a comparator, and a 1-bit DAC. Similar to the voltage-to-frequency converter, this architecture creates, in effect, a negative feedback loop whose intent is to minimize the integrator output by changing the duty cycle of the comparator output in response to input voltage changes. The comparator samples the output of the integrator at a much higher rate than the input sampling frequency, which is called oversampling. Oversampling spreads the quantization noise over a much wider band than that of the input signal, improving overall noise performance and increasing accuracy. - MODULATOR + - - DIGITAL FILTER OPERATING MODES The user can program the TMP05/TMP06 to operate in three different modes by configuring the FUNC pin on power-up as either low, floating, or high. Table 6. Operating Modes FUNC Pin Low Floating High TMP05/TMP06 OUT (SINGLE-BIT) 03340-006 1-BIT DAC CLOCK GENERATOR The time periods TH (high period) and TL (low period) are values easily read by a microprocessor timer/counter port, with the above calculations performed in software. Because both periods are obtained consecutively using the same clock, performing the division indicated in Equation 1 results in a ratiometric value independent of the exact frequency or drift of the TMP05/TMP06 originating clock or the user's counting clock. Operating Mode One shot Continuously converting Daisy-chain In continuously converting mode, the TMP05/TMP06 continuously output a square wave representing temperature. The frequency at which this square wave is output is determined by the state of the CONV/IN pin on power-up. Any change to the state of the CONV/IN pin after power-up is not reflected in the parts until the TMP05/TMP06 are powered down and back up. COMPARATOR + Figure 21. TMP05/TMP06 Output Format Continuously Converting Mode INTEGRATOR VOLTAGE REF AND VPTAT TL TH The sensor output is digitized by a first-order - modulator, also known as the charge balance type analog-to-digital converter. This type of converter utilizes time-domain oversampling and a high accuracy comparator to deliver 12 bits of effective accuracy in an extremely compact circuit. (1) 03340-007 CIRCUIT INFORMATION Figure 20. First-Order - Modulator Rev. C | Page 13 of 28 TMP05/TMP06 Data Sheet One Shot Mode Conversion Rate In one shot mode, the TMP05/TMP06 output one square wave representing temperature when requested by the microcontroller. The microcontroller pulls the OUT pin low and then releases it to indicate to the TMP05/TMP06 that an output is required. The time between the OUT pin going low to the time it is released should be greater than 20 ns. Internal hysteresis in the OUT pin prevents the TMP05/TMP06 from recognizing that the pulse is going low (if it is less than 20 ns). The temperature measurement is output when the OUT line is released by the microcontroller (see Figure 22). In continuously converting and one shot modes, the state of the CONV/IN pin on power-up determines the rate at which the TMP05/TMP06 measure temperature. The available conversion rates are shown in Table 7. CONTROLLER PULLS DOWN OUT LINE HERE CONTROLLER RELEASES OUT LINE HERE TH 03340-019 TL T0 TIME Floating High Conversion Rate Quarter period (TH/4, TL/4) Nominal Double high (TH x 2) Quarter low (TL/4) TH/TL (25C) 8.5/16 (ms) 34/65 (ms) 68/16 (ms) The temperature equation for the low and floating states' conversion rates is Figure 22. TMP05/TMP06 One Shot OUT Pin Signal In the TMP05 one shot mode only, an internal resistor is switched in series with the pull-up MOSFET. The TMP05 OUT pin has a push-pull output configuration (see Figure 23). Therefore, it needs a series resistor to limit the current drawn on this pin when the user pulls it low to start a temperature conversion. This series resistance prevents any short circuit from VDD to GND, and, as a result, protects the TMP05 from short-circuit damage. V+ 5k 03340-016 OUT TMP05 CONV/IN Pin Low The TMP05 (push-pull output) advantage when using the high state conversion rate (double high/quarter low) is lower power consumption. However, the trade-off is loss of resolution on the low time. Depending on the state of the CONV/IN pin, two different temperature equations must be used. TEMP MEASUREMENT >20ns Table 7. Conversion Rates Figure 23. TMP05 One Shot Mode OUT Pin Configuration The advantages of the one shot mode include lower average power consumption, and the microcontroller knowing that the first low-to-high transition occurs after the microcontroller releases the OUT pin. Temperature (C) = 421 - (751 x (TH/TL)) Table 8. Conversion Times Using Equation 2 Temperature (C) -40 -30 -20 -10 0 10 20 25 30 40 50 60 70 80 90 100 110 120 130 140 150 Rev. C | Page 14 of 28 TL (ms) 53.6 54.9 56.4 58.2 60 61.4 63.3 64.3 65.6 67.8 70.1 72.5 74.7 77.4 80.4 84.1 87.5 91.2 95.3 99.6 104.5 Cycle Time (ms) 86.5 87.9 89.5 91.6 93.6 95 97.1 98.2 99.8 102.2 104.7 107.4 109.6 112.6 115.9 120.1 123.8 127.8 132.3 136.9 142.1 (2) Data Sheet TMP05/TMP06 The temperature equation for the high state conversion rate is Temperature (C) = 421 - (93.875 x (TH/TL)) (3) Table 9. Conversion Times Using Equation 3 TL (ms) 13.4 13.7 14.1 14.6 15 15.3 16 16.1 16.4 16.9 17.5 18.1 18.7 19.3 20.1 21 21.9 22.8 23.8 24.9 26.1 Cycle Time (ms) 79.1 79.6 80.3 81.4 82.2 82.5 83.6 83.9 84.7 85.7 86.8 87.8 88.5 89.7 91 93 94.5 96 97.8 99.4 101.4 Figure 25 shows the start pulse on the CONV/IN pin of the first device on the daisy chain. Figure 26 shows the PWM output by this first part. Before the start pulse reaches a TMP05/TMP06 part in the daisy chain, the device acts as a buffer for the previous temperature measurement signals. Each part monitors the PWM signal for the start pulse from the previous part. Once the part detects the start pulse, it initiates a conversion and inserts the result at the end of the daisy-chain PWM signal. It then inserts a start pulse for the next part in the link. The final signal input to the microcontroller should look like Figure 27. The input signal on Pin 2 (IN) of the first daisy-chain device must remain low until the last device has output its start pulse. Daisy-Chain Mode Setting the FUNC pin to a high state allows multiple TMP05/ TMP06s to be connected together and, therefore, allows one input line of the microcontroller to be the sole receiver of all temperature measurements. In this mode, the CONV/IN pin operates as the input of the daisy chain. In addition, conversions take place at the nominal conversion rate of TH/TL = 34 ms/65 ms at 25C. If the input on Pin 2 (IN) goes high and remains high, the TMP05/TMP06 part powers down between 0.3 sec and 1.2 sec later. The part, therefore, requires another start pulse to generate another temperature measurement. Note that to reduce power dissipation through the part, it is recommended to keep Pin 2 (IN) at a high state when the part is not converting. If the IN pin is at 0 V, the OUT pin is at 0 V (because it is acting as a buffer when not converting), and is drawing current through either the pull-up MOSFET (TMP05) or the pull-up resistor (TMP06). MUST GO HIGH ONLY AFTER START PULSE HAS BEEN OUTPUT BY LAST TMP05/TMP06 ON DAISY CHAIN. Therefore, the temperature equation for the daisy-chain mode of operation is Temperature (C) = 421 - (751 x (THTL)) TMP05/ TMP06 #1 IN >20ns CONVERSION STARTS ON THIS EDGE >20ns AND <25s OUT T0 CONV/IN OUT TIME Figure 25. Start Pulse at CONV/IN Pin of First TMP05/TMP06 Device on Daisy Chain TMP05/ TMP06 #2 03340-017 MICRO CONV/IN CONV/IN TMP05/ TMP06 #3 OUT START PULSE #1 TEMP MEASUREMENT CONV/IN TMP05/ TMP06 #N OUT 17s 03340-009 OUT START PULSE (4) T0 TIME Figure 26. Daisy-Chain Temperature Measurement and Start Pulse Output from First TMP05/TMP06 Figure 24. Daisy-Chain Structure Rev. C | Page 15 of 28 03340-010 Temperature (C) -40 -30 -20 -10 0 10 20 25 30 40 50 60 70 80 90 100 110 120 130 140 150 A second microcontroller line is needed to generate the conversion start pulse on the CONV/IN pin. The pulse width of the start pulse should be less than 25 s but greater than 20 ns. The start pulse on the CONV/IN pin lets the first TMP05/TMP06 part know that it should now start a conversion and output its own temperature. Once the part has output its own temperature, it outputs a start pulse for the next part on the daisy-chain link. The pulse width of the start pulse from each TMP05/TMP06 part is typically 17 s. TMP05/TMP06 Data Sheet #2 TEMP MEASUREMENT T0 #N TEMP MEASUREMENT START PULSE 03340-008 #1 TEMP MEASUREMENT TIME Figure 27. Daisy-Chain Signal at Input to the Microcontroller TMP05 OUTPUT TMP06 OUTPUT The TMP05 has a push-pull CMOS output (Figure 28) and provides rail-to-rail output drive for logic interfaces. The rise and fall times of the TMP05 output are closely matched so that errors caused by capacitive loading are minimized. If load capacitance is large (for example, when driving a long cable), an external buffer could improve accuracy. The TMP06 has an open-drain output. Because the output source current is set by the pull-up resistor, output capacitance should be minimized in TMP06 applications. Otherwise, unequal rise and fall times skew the pulse width and introduce measurement errors. V+ TMP06 03340-012 OUT An internal resistor is connected in series with the pull-up MOSFET when the TMP05 is operating in one shot mode. Figure 29. TMP06 Digital Output Structure TMP05 03340-011 OUT Figure 28. TMP05 Digital Output Structure Rev. C | Page 16 of 28 Data Sheet TMP05/TMP06 APPLICATION HINTS THERMAL RESPONSE TIME SUPPLY DECOUPLING The time required for a temperature sensor to settle to a specified accuracy is a function of the sensor's thermal mass and the thermal conductivity between the sensor and the object being sensed. Thermal mass is often considered equivalent to capacitance. Thermal conductivity is commonly specified using the symbol Q and can be thought of as thermal resistance. It is usually specified in units of degrees per watt of power transferred across the thermal joint. Thus, the time required for the TMP05/ TMP06 to settle to the desired accuracy is dependent on the package selected, the thermal contact established in that particular application, and the equivalent power of the heat source. In most applications, the settling time is probably best determined empirically. The TMP05/TMP06 should be decoupled with a 0.1 F ceramic capacitor between VDD and GND. This is particularly important if the TMP05/TMP06 are mounted remotely from the power supply. Precision analog products such as the TMP05/TMP06 require a well filtered power source. Because the parts operate from a single supply, simply tapping into the digital logic power supply could appear to be a convenient option. Unfortunately, the logic supply is often a switch-mode design, which generates noise in the 20 kHz to 1 MHz range. In addition, fast logic gates can generate glitches hundreds of mV in amplitude due to wiring resistance and inductance. The temperature measurement accuracy of the TMP05/TMP06 can be degraded in some applications due to self-heating. Errors are introduced from the quiescent dissipation and power dissipated when converting, that is, during TL. The magnitude of these temperature errors depends on the thermal conductivity of the TMP05/TMP06 package, the mounting technique, and the effects of airflow. Static dissipation in the TMP05/TMP06 is typically 10 W operating at 3.3 V with no load. In the 5-lead SC-70 package mounted in free air, this accounts for a temperature increase due to self-heating of T = PDISS x JA = 10 W x 534.7C/W = 0.0053C (5) In addition, power is dissipated by the digital output, which is capable of sinking 800 A continuously (TMP05). Under an 800 A load, the output can dissipate PDISS = (0.4 V)(0.8 mA)((TL)/TH + TL)) (6) It is important to keep the capacitor package size as small as possible because ESL (equivalent series inductance) increases with increasing package size. Reducing the capacitive value below 100 nF increases the ESR (equivalent series resistance). Using a capacitor with an ESL of 1 nH and an ESR of 80 m is recommended. TTL/CMOS LOGIC CIRCUITS For example, with TL = 80 ms and TH = 40 ms, the power dissipation due to the digital output is approximately 0.21 mW. In a free-standing SC-70 package, this accounts for a temperature increase due to self-heating of T = PDISS x JA = 0.21 mW x 534.7C/W = 0.112C (7) This temperature increase directly adds to that from the quiescent dissipation and affects the accuracy of the TMP05/ TMP06 relative to the true ambient temperature. It is recommended that current dissipated through the device be kept to a minimum because it has a proportional effect on the temperature error. Rev. C | Page 17 of 28 0.1F TMP05/ TMP06 POWER SUPPLY Figure 30. Use Separate Traces to Reduce Power Supply Noise 03340-013 SELF-HEATING EFFECTS If possible, the TMP05/TMP06 should be powered directly from the system power supply. This arrangement, shown in Figure 30, isolates the analog section from the logic switching transients. Even if a separate power supply trace is not available, generous supply bypassing reduces supply-line-induced errors. Local supply bypassing consisting of a 0.1 F ceramic capacitor is critical for the temperature accuracy specifications to be achieved. This decoupling capacitor must be placed as close as possible to the TMP05/TMP06 VDD pin. A recommended decoupling capacitor is Phicomp's 100 nF, 50 V X74. TMP05/TMP06 Data Sheet LAYOUT CONSIDERATIONS Digital boards can be electrically noisy environments and glitches are common on many of the signals in the system. The likelihood of glitches causing problems to the TMP05/ TMP06 OUT pin is very minute. The typical impedance of the TMP05/TMP06 OUT pin when driving low is 55 . When driving high, the TMP05 OUT pin is similar. This low impedance makes it very difficult for a glitch to break the VIL and VIH thresholds. There is a slight risk that a sizeable glitch could cause problems. A glitch can only cause problems when the OUT pin is low during a temperature measurement. If a glitch occurs that is large enough to fool the master into believing that the temperature measurement is over, the temperature read would not be the actual temperature. In most cases, the master spots a temperature value that is erroneous and can request another temperature measurement for confirmation. One area that can cause problems is if this very large glitch occurs near the end of the low period of the mark-space waveform, and the temperature read back is so close to the expectant temperature that the master does not question it. One layout method that helps in reducing the possibility of a glitch is to run ground tracks on either side of the OUT line. Use a wide OUT track to minimize inductance and reduce noise pickup. A 10 mil track minimum width and spacing is recommended. Figure 31 shows how glitch protection traces could be laid out. 10 MIL 10 MIL This section provides an example of how to connect two TMP05s in daisy-chain mode to a standard 8052 microcontroller core. The ADuC812 is the microcontroller used and the core processing engine is the 8052. Figure 31 shows how to interface to the 8052 core device. The TMP05 Program Code Example 1 section shows how to communicate from the ADuC812 to two daisy-chained TMP05s. This code can also be used with the ADuC831 or any microprocessor running on an 8052 core. TIMER T0 STARTS TEMPSEGMENT = 1 TEMPSEGMENT = 2 TEMPSEGMENT = 3 10 MIL 10 MIL GND DAISY-CHAIN APPLICATION 10 MIL 03340-043 OUT One example of using the TMP05/TMP06's unique properties is in monitoring a high power dissipation microprocessor. Each TMP05/TMP06 part, in a surface-mounted package, is mounted directly beneath the microprocessor's pin grid array (PGA) package. In a typical application, the TMP05/TMP06 output is connected to an ASIC, where the pulse width is measured. The TMP05/TMP06 pulse output provides a significant advantage in this application because it produces a linear temperature output while needing only one I/O pin and without requiring an ADC. Figure 31. Use Separate Traces to Reduce Power Supply Noise Another method that helps reduce the possibility of a glitch is to use a 50 ns glitch filter on the OUT line. The glitch filter eliminates any possibility of a glitch getting through to the master or being passed along a daisy chain. TEMPERATURE MONITORING The TMP05/TMP06 are ideal for monitoring the thermal environment within electronic equipment. For example, the surface-mounted package accurately reflects the exact thermal conditions that affect nearby integrated circuits. The TMP05/TMP06 measure and convert the temperature at the surface of their own semiconductor chip. When the TMP05/TMP06 are used to measure the temperature of a TEMP_HIGH0 TEMP_HIGH1 INTO INTO TEMP_LOW0 TEMP_HIGH2 INTO TEMP_LOW1 03340-035 GND nearby heat source, the thermal impedance between the heat source and the TMP05/TMP06 must be considered. Often, a thermocouple or other temperature sensor is used to measure the temperature of the source, while the TMP05/TMP06 temperature is monitored by measuring TH and TL. Once the thermal impedance is determined, the temperature of the heat source can be inferred from the TMP05/TMP06 output. Figure 32. Reference Diagram for Software Variables in the TMP05 Program Code Example 1 Figure 32 is a diagram of the input waveform into the ADuC812 from the TMP05 daisy chain. It illustrates how the code's variables are assigned and it should be referenced when reading the TMP05 Program Code Example 1. Application notes showing the TMP05 working with other types of microcontrollers are available from Analog Devices at www.analog.com. Figure 33 shows how the three devices are hardwired together. Figure 34 to Figure 36 are flow charts for this program. Rev. C | Page 18 of 28 Data Sheet TMP05/TMP06 START PULSE VDD TMP05 (U1) VDD ADuC812 OUT CONV/IN 0.1F P3.7 VDD GND START PULSE TH (U1) FUNC TL (U1) TIME TMP05 (U2) VDD 0.1F P3.2/INTO OUT CONV/IN VDD GND FUNC TH (U1) TL (U1) T0 START PULSE TH (U2) TL (U2) TIME Figure 33. Typical Daisy-Chain Application Circuit Rev. C | Page 19 of 28 03340-014 VDD T0 TMP05/TMP06 Data Sheet DECLARE VARIABLES SET-UP UART INITIALIZE TIMERS CONVERT VARIABLES TO FLOATS ENABLE TIMER INTERRUPTS CALCULATE TEMPERATURE FROM U1 SEND START PULSE TEMP U1 = 421 - (751 x (TEMP_HIGH0/ (TEMP_LOW0 - (TEMP_HIGH1))) START TIMER 0 CALCULATE TEMPERATURE FROM U2 SET-UP EDGE TRIGGERED (H-L) INTO SEND TEMPERATURE RESULTS OUT OF UART ENABLE GLOBAL INTERRUPTS 03340-038 TEMP U2 = 421 - (751 x (TEMP_HIGH1/ (TEMP_LOW1 - (TEMP_HIGH2))) ENABLE INTO INTERRUPT Figure 35. ADuC812 Temperature Calculation Routine Flowchart WAIT FOR INTERRUPT PROCESS INTERRUPTS CALCULATE TEMPERATURE AND SEND FROM UART 03340-036 WAIT FOR END OF MEASUREMENT Figure 34. ADuC812 Main Routine Flowchart Rev. C | Page 20 of 28 Data Sheet TMP05/TMP06 ENTER INTERRUPT ROUTINE NO CHECK IF TIMER 1 IS RUNNING YES START TIMER 1 COPY TIMER 1 VALUES INTO A REGISTER RESET TIMER 1 IS TEMPSEGMENT =1 NO YE S CALCULATE TEMP_HIGH0 RESET TIMER 0 TO ZERO IS TEMPSEGMENT =2 NO YES IS TEMPSEGMENT =3 CALCULATE TEMP_LOW0 USING TIMER 1 VALUES NO RESET TIMER 0 TO ZERO CALCULATE TEMP_LOW1 INCREMENT TEMPSEGMENT CALCULATE TEMP_HIGH2 USING TIMER 0 VALUES EXIT INTERRUPT ROUTINE Figure 36. ADuC812 Interrupt Routine Flowchart TMP05 Program Code Example 1 //============================================================================================= // Description : This program reads the temperature from 2 daisy-chained TMP05 parts. // // This code runs on any standard 8052 part running at 11.0592MHz. // If an alternative core frequency is used, the only change required is an // adjustment of the baud rate timings. // // P3.2 = Daisy-chain output connected to INT0. // P3.7 = Conversion control. // Timer0 is used in gate mode to measure the high time. // Timer1 is triggered on a high-to-low transition of INT0 and is used to measure // the low time. //============================================================================================= Rev. C | Page 21 of 28 03340-037 YE S CALCULATE TEMP_HIGH1 USING TIMER 0 VALUES TMP05/TMP06 Data Sheet #include <stdio.h> #include <ADuC812.h> //ADuC812 SFR definitions void delay(int); sbit Daisy_Start_Pulse = 0xB7; //Daisy_Start_Pulse = P3.7 sbit P3_4 = 0xB4; long temp_high0,temp_low0,temp_high1,temp_low1,temp_high2,th,tl; //Global variables to allow //access during ISR. //See Figure 32. int timer0_count=0,timer1_count=0,tempsegment=0; void int0 () interrupt 0 { if (TR1 == 1) { th = TH1; tl = TL1; th = TH1; TL1 = 0; TH1 = 0; } TR1=1; Already //INT0 Interrupt Service Routine //To avoid misreading timer //Start timer1 running, if not running if (tempsegment == 1) { temp_high0 = (TH0*0x100+TL0)+(timer0_count*65536); //Convert to integer TH0=0x00; //Reset count TL0=0x00; timer0_count=0; } if (tempsegment == 2) { temp_low0 = (th*0x100+tl)+(timer1_count*65536); //Convert to integer temp_high1 = (TH0*0x100+TL0)+(timer0_count*65536); //Convert to integer TH0=0x00; //Reset count TL0=0x00; timer0_count=0; timer1_count=0; } if (tempsegment == 3) { temp_low1 = (th*0x100+tl)+(timer1_count*65536); //Convert to integer temp_high2 = (TH0*0x100+TL0)+(timer0_count*65536); TH0=0x00; //Reset count TL0=0x00; timer0_count=0; timer1_count=0; } tempsegment++; } void timer0 () interrupt 1 { timer0_count++; } void timer1 () interrupt 3 { timer1_count++; //Keep a record of timer0 overflows //Keep a record of timer1 overflows Rev. C | Page 22 of 28 Data Sheet TMP05/TMP06 } void main(void) { double temp1=0,temp2=0; double T1,T2,T3,T4,T5; // Initialization TMOD = 0x19; // Timer1 in 16-bit counter mode // Timer0 in 16-bit counter mode // with gate on INT0. Timer0 only counts when INTO pin // is high. ET0 = 1; // Enable timer0 interrupts ET1 = 1; // Enable timer1 interrupts tempsegment = 1; // Initialize segment Daisy_Start_Pulse = 0; // Start Pulse Daisy_Start_Pulse = 1; Daisy_Start_Pulse = 0; // Set T0 to count the high period TR0 = 1; IT0 = 1; EX0 = 1; EA = 1; for(;;) { if (tempsegment == 4) break; } //CONFIGURE UART SCON = 0x52 ; TMOD = 0x20 ; TH1 = 0xFD ; TR1 = 1; // Pull P3.7 low //Toggle P3.7 to give start pulse // Start timer0 running // Interrupt0 edge triggered // Enable interrupt // Enable global interrupts // // // // 8-bit, no parity, 1 stop bit Configure timer1.. ..for 9600baud.. ..(assuming 11.0592MHz crystal) //Convert variables to floats for calculation T1= temp_high0; T2= temp_low0; T3= temp_high1; T4= temp_low1; T5= temp_high2; temp1=421-(751*(T1/(T2-T3))); temp2=421-(751*(T3/(T4-T5))); printf("Temp1 = %f\nTemp2 = %f\n",temp1,temp2); //Sends temperature result out UART while (1); // END of program } // Delay routine void delay(int length) { while (length >=0) length--; } Rev. C | Page 23 of 28 TMP05/TMP06 Data Sheet CONTINUOUSLY CONVERTING APPLICATION FIRST TEMP MEASUREMENT The TMP05 Program Code Example 2 shows how to communicate from the microchip device to the TMP05. This code can also be used with other PICs by changing the include file for the part. T0 SECOND TEMP MEASUREMENT TIME PIC16F876 PA.0 TMP05 OUT CONV/IN FUNC 3.3V VDD 0.1F GND 03340-039 This section provides an example of how to connect one TMP05 in continuously converting mode to a microchip PIC16F876 microcontroller. Figure 37 shows how to interface to the PIC16F876. Figure 37. Typical Continuously Converting Application Circuit TMP05 Program Code Example 2 //============================================================================================= // // Description : This program reads the temperature from a TMP05 part set up in continuously // converting mode. // This code was written for a PIC16F876, but can be easily configured to function with other // PICs by simply changing the include file for the part. // // Fosc = 4MHz // Compiled under CCS C compiler IDE version 3.4 // PWM output from TMP05 connected to PortA.0 of PIC16F876 // //============================================================================================ #include <16F876.h> // Insert header file for the particular PIC being used #device adc=8 #use delay(clock=4000000) #fuses NOWDT,XT, PUT, NOPROTECT, BROWNOUT, LVP //_______________________________Wait for high function_____________________________________ void wait_for_high() { while(input(PIN_A0)) ; /* while high, wait for low */ while(!input(PIN_A0)); /* wait for high */ } //______________________________Wait for low function_______________________________________ void wait_for_low() { while(input(PIN_A0)); /* wait for high */ } //_______________________________Main begins here____________________________________________ void main(){ long int high_time,low_time,temp; setup_adc_ports(NO_ANALOGS); setup_adc(ADC_OFF); setup_spi(FALSE); setup_timer_1 ( T1_INTERNAL | T1_DIV_BY_2); //Sets up timer to overflow after 131.07ms Rev. C | Page 24 of 28 Data Sheet TMP05/TMP06 do{ wait_for_high(); set_timer1(0); wait_for_low(); high_time = get_timer1(); set_timer1(0); wait_for_high(); low_time = get_timer1(); //Reset timer //Reset timer temp = 421 - ((751 * high_time)/low_time)); //Temperature equation for the high state //conversion rate. //Temperature value stored in temp as a long int }while (TRUE); } Rev. C | Page 25 of 28 TMP05/TMP06 Data Sheet OUTLINE DIMENSIONS 3.00 2.90 2.80 2.20 2.00 1.80 1.35 1.25 1.15 5 4 1 2 3 1.70 1.60 1.50 2.40 2.10 1.80 5 1 4 2 3.00 2.80 2.60 3 0.95 BSC 1.90 BSC 0.10 MAX COPLANARITY 0.10 0.40 0.10 1.10 0.80 0.30 0.15 SEATING PLANE 1.30 1.15 0.90 1.45 MAX 0.95 MIN 0.46 0.36 0.26 0.22 0.08 0.15 MAX 0.05 MIN 072809-A 1.00 0.90 0.70 COMPLIANT TO JEDEC STANDARDS MO-203-AA 0.50 MAX 0.35 MIN 0.20 MAX 0.08 MIN SEATING PLANE 10 5 0 0.60 BSC 0.55 0.45 0.35 COMPLIANT TO JEDEC STANDARDS MO-178-AA Figure 39. 5-Lead Small Outline Transistor Package [SOT-23] (RJ-5) Dimensions shown in millimeters Figure 38. 5-Lead Thin Shrink Small Outline Transistor Package [SC-70] (KS-5) Dimensions shown in millimeters ORDERING GUIDE Model 1 TMP05AKSZ-500RL7 TMP05AKSZ-REEL TMP05AKSZ-REEL7 TMP05ARTZ-500RL7 TMP05ARTZ-REEL7 TMP05BKSZ-500RL7 TMP05BKSZ-REEL TMP05BKSZ-REEL7 TMP05BRTZ-500RL7 TMP05BRTZ-REEL TMP05BRTZ-REEL7 EVAL-TMP05/06EBZ TMP06AKSZ-500RL7 TMP06AKSZ-REEL TMP06ARTZ-500RL7 TMP06BKSZ-500RL7 TMP06BRTZ-500RL7 Minimum Quantities/Reel 500 10,000 3,000 500 3,000 500 10,000 3,000 500 10,000 3,000 500 10,000 500 500 500 Temperature Range 2 -40C to +150C -40C to +150C -40C to +150C -40C to +150C -40C to +150C -40C to +150C -40C to +150C -40C to +150C -40C to +150C -40C to +150C -40C to +150C -40C to +150C -40C to +150C -40C to +150C -40C to +150C -40C to +150C -40C to +150C Temperature Accuracy 3 2C 2C 2C 2C 2C 1C 1C 1C 1C 1C 1C Package Description 5-Lead SC-70 5-Lead SC-70 5-Lead SC-70 5-Lead SOT-23 5-Lead SOT-23 5-Lead SC-70 5-Lead SC-70 5-Lead SC-70 5-Lead SOT-23 5-Lead SOT-23 5-Lead SOT-23 Package Option KS-5 KS-5 KS-5 RJ-5 RJ-5 KS-5 KS-5 KS-5 RJ-5 RJ-5 RJ-5 Branding T8C T8C T8C T8C T8C T8D T8D T8D T8D T8D T8D 2C 2C 2C 1C 1C 5-Lead SC-70 5-Lead SC-70 5-Lead SOT-23 5-Lead SC-70 5-Lead SOT-23 KS-5 KS-5 RJ-5 KS-5 RJ-5 T9C T9C T9C T9D T9D 1 Z = RoHS Compliant Part. It is not recommended to operate the device at temperatures above 125C for more than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure beyond this limit affects device reliability. 3 A-grade and B-grade temperature accuracy is over the 0C to 70C temperature range. 2 Rev. C | Page 26 of 28 11-01-2010-A 0.65 BSC Data Sheet TMP05/TMP06 NOTES Rev. C | Page 27 of 28 TMP05/TMP06 Data Sheet NOTES (c)2004-2012 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D03340-0-8/12(C) Rev. C | Page 28 of 28 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Analog Devices Inc.: TMP05BKSZ-REEL7