October 1987
Revised February 1999
MM74HC148 8-3 Line Priority Encoder
© 1999 Fairchild Semicond uctor Corpor ation DS009390.prf www.fairchildsemi .com
MM74HC148
8-3 Line Priority Encoder
General Descript ion
The MM74HC148 priority encoder utilizes advanced sili-
con-gate C MO S techno log y. It has the hig h noise immu ni ty
and low power consumption typical of CMOS circuits, as
wel l as th e speeds and output drive similar to LB -TTL.
This prio ri ty enco de r accepts 8 i n put re que st l ine s 0–7 and
outputs 3 lines A0–A2. The priority encoding ensures that
only the highest order data li ne is e ncoded . Cascad ing c ir-
cuitry (enable input EI and enable output EO) has been
provided to allow octal expansion without the need for
external circuitry. All data inputs and o utputs are active at
the low logic level.
All inputs are protected from damage due to static dis-
charge by internal d iode clamps to VCC and ground.
Features
Typical propagation delay: 13 ns
Wide supply voltage range: 2V–6V
Ordering Code:
Devices also available in Tape and R eel. Speci fy by append ing the suffix let t er “X” to the o rdering code.
Connection Diagram
Pin Assignments for DIP, SOIC and TSSOP
Truth Ta ble
H = HIGH
L = LOW
X = Irrelevant
Order Number Package Number Package Description
MM74HC148M M16A 16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow
MM74HC148MTC MTC16 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
MM74HC148N N16E 16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
Inputs Outputs
EI01234567A2A1A0GSEO
HXXXXXXXXH H H H H
LHHHHHHHH H H H H L
LXXXXXXXL L L L L H
LXXXXXXLH L L H L H
LXXXXXLHH L H L L H
LXXXXLHHH L H H L H
LXXXLHHHHH L L L H
L XXLHHHHH H L H L H
L XLHHHHHH H H L L H
L LHHHHHHH H H H L H
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MM74HC148
Schematic Diagram
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MM74HC148
Logic Diagram
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MM74HC148
Absolute Maximum Ratings(No te 1)
(Note 2) Recommended Operation
Conditions
Note 1: Absolute Maximum Ratings are those values beyond which dam-
age to the device may occur.
Note 2: Unle s s ot herwise specified all voltag es are referenced to ground.
Note 3: Powe r D issipat ion tem perature derating—plastic “N” p ac k age: 12
mW/°C from 65°C to 85°C.
DC Electrical Characteristics (Note 4)
Note 4: For a po wer s upply of 5 V ±10% t he worst case ou tput volt ages ( VOH, and VOL) occur f or HC at 4.5V. Thus t he 4.5V values s hould be used w hen
designing with this supply. Worst case VIH and VIL occu r at VCC = 5. 5V and 4.5V resp ec t iv ely. (The VIH value at 5.5V is 3.85V.) The worst case leakage cur-
rent (IIN, ICC, and IOZ) occur fo r C M OS at the higher volt age and so th e 6. 0V valu es s hould be used.
Supply Voltage (VCC)0.5 to +7.0V
DC Input Voltage (VIN)1.5 to VCC +1.5V
DC Output Voltage (VOUT)0.5 to VCC +0.5V
Clamp Diode Current (IIK, IOK)±20 mA
DC Output Current, per pin (IOUT)±25 mA
DC VCC or GND Current, per pin (ICC)±50 mA
Storage Temperature Range (TSTG)65°C to +150°C
Power Dissipation (PD)
(Note 3) 600 mW
S.O. Package only 500 mW
Lead Temperature (TL)
(Soldering 10 seconds) 26 0°C
Min Max Units
Supply Voltage (VCC)26V
DC Input or Output Voltage
(VIN, VOUT)0V
CC V
Operating Temperature Range (TA)40 +85 °C
Input Rise or Fall Times
(tr, tf) VCC = 2.0V 1000 ns
VCC = 4.5V 500 ns
VCC = 6.0V 400 ns
Symbol Parameter Conditions VCC TA = 25°CT
A = 40 to 85°CT
A = 55 to 125°CUnits
Typ Guaranteed Limits
VIH Minimum HIGH Level 2.0V 1.5 1.5 1.5 V
Input Voltage 4.5V 3.15 3.15 3.15 V
6.0V 4.2 4.2 4.2 V
VIL Maximum LOW Level 2.0 V 0.5 0.5 0.5 V
Input Voltage 4.5V 1.35 1.35 1.35 V
6.0V 1.8 1.8 1.8 V
VOH Minimum HIGH Level VIN = VIH or VIL
Output Vo ltage |IOUT| 20 µA 2.0V 2.0 1.9 1.9 1.9 V
4.5V 4.5 4.4 4.4 4.4 V
6.0V 6.0 5.9 5.9 5.9 V
VIN = VIH or VIL
|IOUT| 4.0 mA 4.5V 4.7 3.96 3.84 3.7 V
|IOUT| 5.2 mA 6.0V 5.2 5.48 5.34 5.2 V
VOL Maximum LOW Level VIN = VIH or VIL
Output Vo ltage |IOUT| 20 µA 2.0V 0 0.1 0.1 0.1 V
4.5V 0 0.1 0.1 0.1 V
6.0V 0 0.1 0.1 0.1 V
VIN = VIH or VIL
|IOUT| 4.0 mA 4.5V 0.2 0.26 0.33 0.4 V
|IOUT| 5.2 mA 6.0V 0.2 0.26 0.33 0.4 V
IIN Maximum Input VIN = VCC or GND 6.0V ±0.1 ±1.0 ±1.0 µA
Current
ICC Maximum Quiescent VIN = VCC or GND 6.0V 8.0 80 160 µA
Supply Current IOUT = 0 µA
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MM74HC148
AC Electrical Characteristics
AC Electrical Characteristics
VCC = 2.0V to 6.0V, CL = 50 pF, tr = tf = 6 ns (unless otherwise specified)
Note 5: Cpd determines the no load dynamic pow er cons um ption, an d t he no load d y namic cu rrent consumptio n.
Symbol Parameter Conditions Typ Guaranteed
Limits Units
tPHL, tPLH Maximum Propagation Delay, 14 ns
Any Input to Any Output
Symbol Parameter Conditions VCC TA = 25°CT
A = 40°C to +85°CT
A = 55°C to +125°CUnits
Typ Guaranteed Limits
tPHL, tPLH Inputs 0–7 2.0V 140 175 210 ns
to Outputs 4.5V 14 28 35 42 ns
A0, A1, A2 6.0V 24 30 36 ns
tPHL, tPLH Inputs 0–7 2.0V 140 175 210 ns
to 4.5V 15 28 35 42 ns
Output EO 6.0V 24 30 36 ns
tPHL, tPLH Inputs 0–7 2.0V 160 200 240 ns
to 4.5V 17 32 40 48 ns
Output GS 6.0V 27 34 41 ns
tPHL, tPLH Input EI 2.0V 160 200 240 ns
to Outputs 4.5V 17 32 40 48 ns
A0, A1, A2 6.0V 27 34 41 ns
tPHL, tPLH Input EI 2.0V 100 125 150 ns
to 4.5V 12 20 25 30 ns
Output GS 6.0V 17 21 26 ns
tPHL, tPLH Input EI 2.0V 100 125 150 ns
to 4.5V 12 20 25 30 ns
Output EO 6.0V 17 21 26 ns
tf, trMaximum 2.0V 75 95 110 ns
Output Rise 4.5V 7 15 19 22 ns
and Fall Time 6.0V 13 16 19 ns
Cpd Power Dissipation 52 pF
Capacitance (Note 5)
Cin Maximum Input 5 10 10 10 pF
Capacitance
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MM74HC148
Physical Dimensions inches (millimeters) unless otherwise noted
16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow
Package Number M16A
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MM74HC148
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Packag e Num be r MTC 16
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
MM74HC148 8-3 Line Priority Encoder
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support de vices o r systems a re devices or syste ms
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical com ponent in any com ponen t of a life supp ort
device or system whose failure to perform can be rea-
sonabl y ex pect ed to ca use the fa i lure of the life su pp ort
device or system, or to affect its safety or effectiveness.
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
Package Number N16E