XCV150-6BG256C - Xilinx

All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.

DS003-1 (v2.5 ) April 2, 2001 www.xilinx.com Module 1 of 4

Product Specification 1-800-255-7778 1

Features

• Fast, high-density Field-Programmable Gate Arrays

- Densities from 50k to 1M system gates

- System performance up to 200 MHz

- 66-MHz PCI Compliant

- Hot-swappable for Compact PCI

• Multi-standard SelectIO™ interfaces

- 16 high-performance interface standards

- Connects directly to ZBTRAM devices

• Built-in clock-management circuitry

- Four dedicated delay-locked loops (DLLs) for

advanced clock control

- Four primary low-skew global clock distribution

nets, plus 24 secondary local clock nets

• Hierarchical memory system

- LUTs configurable as 16-bit RAM, 32-bit RAM,

16-bit dual-ported RAM, or 16-bit Shift Register

- Configurable synchronous dual-ported 4k-bit

RAMs

- Fast interfaces to external high-performance RAMs

• Flexible architecture that balances speed and density

- Dedicated carry logic for high-speed arithmetic

- Dedicated multiplier support

- Cascade chain for wide-input functions

- Abundant registers/latches with clock enable, and

dual synchronous/asynchronous set and reset

- Internal 3-state bussing

- IEEE 1149.1 boundary-scan logic

- Die-temperature sensor diode

• Supported by FPGA Foundation™ and Alliance

Development Systems

- Complete support for Unified Libraries, Relationally

Placed Macros, and Design Manager

- Wide selection of PC and workstation platforms

• SRAM-based in-system configuration

- Unlimited re-programmability

- Four programming modes

•0.22µm 5-layer metal process

• 100% factory tested

Description

The Virtex FPGA family delivers high-performance,

high-capacity programmable logic solutions. Dramatic

increases in silicon efficiency result from optimizing the new

architecture for place-and-route efficiency and exploiting an

aggressive 5-layer-metal 0.22 µm CMOS process. These

advances make Virtex FPGAs powerful and flexible alterna-

tives to mask-programmed gate arrays. The Virtex family

comprises the nine members shown in Tabl e 1.

Building on experience gained from previous generations of

FPGAs, the Virtex family represents a revolutionary step

forward in programmable logic design. Combining a wide

variety of programmable system features, a rich hierarchy of

fast, flexible interconnect resources, and advanced process

technology, the Virtex family delivers a high-speed and

high-capacity programmable logic solution that enhances

design flexibility while reducing time-to-market.

Virtex™ 2.5 V

Field Programmable Gate Arrays

DS003-1 (v2.5 ) April 2, 2001 00Product Specification

Table 1: Virtex Field-Programmable Gate Array Family Members

Device System Gates CLB Array Logic Cells

Maximum

Available I/O

Block RAM

Bits

Maximum

SelectRAM+™ Bits

XCV50 57,906 16x24 1,728 180 32,768 24,576

XCV100 108,904 20x30 2,700 180 40,960 38,400

XCV150 164,674 24x36 3,888 260 49,152 55,296

XCV200 236,666 28x42 5,292 284 57,344 75,264

XCV300 322,970 32x48 6,912 316 65,536 98,304

XCV400 468,252 40x60 10,800 404 81,920 153,600

XCV600 661,111 48x72 15,552 512 98,304 221,184

XCV800 888,439 56x84 21,168 512 114,688 301,056

XCV1000 1,124,022 64x96 27,648 512 131,072 393,216

Virtex™ 2.5 V Field Programmable Gate Arrays R

Module 1 of 4 www.xilinx.com DS003-1 (v2.5 ) April 2, 2001

2 1-800-255-7778 Product Specification

Virtex Architecture

Virtex devices feature a flexible, regular architecture that

comprises an array of configurable logic blocks (CLBs) sur-

rounded by programmable input/output blocks (IOBs), all

interconnected by a rich hierarchy of fast, versatile routing

resources. The abundance of routing resources permits the

Virtex family to accommodate even the largest and most

complex designs.

Virtex FPGAs are SRAM-based, and are customized by

loading configuration data into internal memory cells. In

some modes, the FPGA reads its own configuration data

from an external PROM (master serial mode). Otherwise,

the configuration data is written into the FPGA (Select-

MAP™, slave serial, and JTAG modes).

The standard Xilinx Foundation™ and Alliance Series™

Development systems deliver complete design support for

Virtex, covering every aspect from behavioral and sche-

matic entry, through simulation, automatic design transla-

tion and implementation, to the creation, downloading, and

readback of a configuration bit stream.

Higher Performance

Virtex devices provide better performance than previous

generations of FPGA. Designs can achieve synchronous

system clock rates up to 200 MHz including I/O. Virtex

inputs and outputs comply fully with PCI specifications, and

interfaces can be implemented that operate at 33 MHz or 66

MHz. Additionally, Virtex supports the hot-swapping

requirements of Compact PCI.

Xilinx thoroughly benchmarked the Virtex family. While per-

formance is design-dependent, many designs operated

internally at speeds in excess of 100 MHz and can achieve

200 MHz. Ta bl e 2 shows performance data for representa-

tive circuits, using worst-case timing parameters.

Tab le 2: Performance for Common Circuit Functions

Function Bits Virtex -6

Adder 16

5.0 ns

7.2 ns

Pipelined Multiplier 8 x 8

16 x 16

5.1 ns

6.0 ns

Address Decoder 16

4.4 ns

6.4 ns

16:1 Multiplexer 5.4 ns

Parity Tree 9

4.1 ns

5.0 ns

6.9 ns

Chip-to-Chip

HSTL Class IV 200 MHz

LVTTL,16mA, fast slew 180 MHz

Virtex™ 2.5 V Field Programmable Gate Arrays

DS003-1 (v2.5 ) April 2, 2001 www.xilinx.com Module 1 of 4

Product Specification 1-800-255-7778 3

Virtex Device/Package Combinations and Maximum I/O

Virtex Ordering Information

Table 3: Virtex Family Maximum User I/O by Device/Package (Excluding Dedicated Clock Pins)

Package XCV50 XCV100 XCV150 XCV200 XCV300 XCV400 XCV600 XCV800 XCV1000

CS144 94 94

TQ144 98 98

PQ240 166 166 166 166 166

HQ240 166 166 166

BG256 180 180 180 180

BG352 260 260 260

BG432 316 316 316 316

BG560 404 404 404 404

FG256 176 176 176 176

FG456 260 284 312

FG676 404 444 444

FG680 512 512 512

Figure 1: Virtex Ordering Information

XCV300 -6 PQ 240 C

Example:

Temperature Range

C = Commercial (TJ = 0°C to +85°C)

I = Industrial (TJ = –40°C to +100°C)

Number of Pins

Device Type

Speed Grade

-4

-5

-6 Package Type

BG = Ball Grid Array

FG = Fine-pitch Ball Grid Array

PQ = Plastic Quad Flat Pack

HQ = High Heat Dissipation QFP

TQ = Thin Quad Flat Pack

CS = Chip-scale Package

Virtex™ 2.5 V Field Programmable Gate Arrays R

Module 1 of 4 www.xilinx.com DS003-1 (v2.5 ) April 2, 2001

4 1-800-255-7778 Product Specification

Revision History

Virtex Data Sheet

The Virtex Data Sheet contains the following modules:

•DS003-1, Virtex 2.5V FPGAs:

Introduction and Ordering Information (Module 1)

•DS003-2, Virtex 2.5V FPGAs:

Functional Description (Module 2)

•DS003-3, Virtex 2.5V FPGAs:

DC and Switching Characteristics (Module 3)

•DS003-4, Virtex 2.5V FPGAs:

Pinout Tables (Module 4)

Date Version Revision

11/98 1.0 Initial Xilinx release.

01/99 1.2 Updated package drawings and specs.

02/99 1.3 Update of package drawings, updated specifications.

05/99 1.4 Addition of package drawings and specifications.

05/99 1.5 Replaced FG 676 & FG680 package drawings.

07/99 1.6 Changed Boundary Scan Information and changed Figure 11, Boundary Scan Bit

Sequence. Updated IOB Input & Output delays. Added Capacitance info for different I/O

Standards. Added 5 V tolerant information. Added DLL Parameters and waveforms and

new Pin-to-pin Input and Output Parameter tables for Global Clock Input to Output and

Setup and Hold. Changed Configuration Information including Figures 12, 14, 17 & 19.

Added device-dependent listings for quiescent currents ICCINTQ and ICCOQ. Updated

IOB Input and Output Delays based on default standard of LVTTL, 12 mA, Fast Slew Rate.

Added IOB Input Switching Characteristics Standard Adjustments.

09/99 1.7 Speed grade update to preliminary status, Power-on specification and Clock-to-Out

Minimums additions, “0” hold time listing explanation, quiescent current listing update, and

Figure 6 ADDRA input label correction. Added TIJITCC parameter, changed TOJIT to

TOPHASE.

01/00 1.8 Update to speed.txt file 1.96. Corrections for CRs 111036,111137, 112697, 115479,

117153, 117154, and 117612. Modified notes for Recommended Operating Conditions

(voltage and temperature). Changed Bank information for VCCO in CS144 package on p.43.

01/00 1.9 Updated DLL Jitter Parameter table and waveforms, added Delay Measurement

Methodology table for different I/O standards, changed buffered Hex line info and

Input/Output Timing measurement notes.

03/00 2.0 New TBCKO values; corrected FG680 package connection drawing; new note about status

of CCLK pin after configuration.

05/00 2.1 Modified “Pins not listed ...” statement. Speed grade update to Final status.

05/00 2.2 Modified Table 18.

09/00 2.3 •Added XCV400 values to table under Minimum Clock-to-Out for Virtex Devices.

•Corrected Units column in table under IOB Input Switching Characteristics.

•Added values to table under CLB SelectRAM Switching Characteristics.

10/00 2.4 •Corrected Pinout information for devices in the BG256, BG432, and BG560 packages in

Ta bl e 1 8 .

•Corrected BG256 Pin Function Diagram.

04/01 2.5 •Revised minimums for Global Clock Set-Up and Hold for LVTTL Standard, with DLL.

•Converted file to modularized format. See Virtex Data Sheet section.

All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.

DS003-2 (v2.8.1) December 9, 2002 www.xilinx.com Module 2 of 4

Product Specification 1-800-255-7778 1

Architectural Description

Virtex Array

The Virtex user-programmable gate array, shown in

Figure 1, comprises two major configurable elements: con-

figurable logic blocks (CLBs) and input/output blocks

(IOBs).

•CLBs provide the functional elements for constructing

logic

•IOBs provide the interface between the package pins

and the CLBs

CLBs interconnect through a general routing matrix (GRM).

The GRM comprises an array of routing switches located at

the intersections of horizontal and vertical routing channels.

Each CLB nests into a VersaBlock™ that also provides local

routing resources to connect the CLB to the GRM.

The VersaRing™ I/O interface provides additional routing

resources around the periphery of the device. This routing

improves I/O routability and facilitates pin locking.

The Virtex architecture also includes the following circuits

that connect to the GRM.

•Dedicated block memories of 4096 bits each

•Clock DLLs for clock-distribution delay compensation

and clock domain control

•3-State buffers (BUFTs) associated with each CLB that

drive dedicated segmentable horizontal routing

resources

Values stored in static memory cells control the configurable

logic elements and interconnect resources. These values

load into the memory cells on power-up, and can reload if

necessary to change the function of the device.

Input/Output Block

The Virtex IOB, Figure 2, features SelectIO™ inputs and

outputs that support a wide variety of I/O signalling stan-

dards, see Ta b l e 1 .

The three IOB storage elements function either as edge-trig-

gered D-type flip-flops or as level sensitive latches. Each

IOB has a clock signal (CLK) shared by the three flip-flops

and independent clock enable signals for each flip-flop.

In addition to the CLK and CE control signals, the three

flip-flops share a Set/Reset (SR). For each flip-flop, this sig-

nal can be independently configured as a synchronous Set,

a synchronous Reset, an asynchronous Preset, or an asyn-

chronous Clear.

The output buffer and all of the IOB control signals have

independent polarity controls.

All pads are protected against damage from electrostatic

discharge (ESD) and from over-voltage transients. Two

forms of over-voltage protection are provided, one that per-

mits 5 V compliance, and one that does not. For 5 V compli-

ance, a Zener-like structure connected to ground turns on

when the output rises to approximately 6.5 V. When PCI

3.3 V compliance is required, a conventional clamp diode is

connected to the output supply voltage, VCCO.

Optional pull-up and pull-down resistors and an optional

weak-keeper circuit are attached to each pad. Prior to con-

figuration, all pins not involved in configuration are forced

into their high-impedance state. The pull-down resistors and

the weak-keeper circuits are inactive, but inputs can option-

ally be pulled up.

The activation of pull-up resistors prior to configuration is

controlled on a global basis by the configuration mode pins.

If the pull-up resistors are not activated, all the pins will float.

Consequently, external pull-up or pull-down resistors must

be provided on pins required to be at a well-defined logic

level prior to configuration.

All Virtex IOBs support IEEE 1149.1-compatible boundary

scan testing.

Virtex™ 2.5 V

Field Programmable Gate Arrays

DS003-2 (v2.8.1) December 9, 2002 00Product Specification

Figure 1: Virtex Architecture Overview

vao_b.eps

IOBs

DLL

DLLDLL

DLL

VersaRing

CLBs

BRAMs

Virtex™ 2.5 V Field Programmable Gate Arrays R

Module 2 of 4 www.xilinx.com DS003-2 (v2.8.1) December 9, 2002

2 1-800-255-7778 Product Specification

Figure 2: Virtex Input/Output Block (IOB)

OBUFT

IBUF

Vref

ds022_02_091300

CLK

ICE

OCE

TCE

PAD

Programmable

Delay

Weak

Keeper

Table 1: Supported Select I/O Standards

I/O Standard

Input Reference

Voltage (VREF)

Output Source

Voltage (VCCO)

Board Termination

Voltage (VTT)5V Tolerant

LVTTL 2 – 24 mA N/A 3.3 N/A Yes

LVCMOS2 N/A 2.5 N/A Ye s

PCI, 5 V N/A 3.3 N/A Yes

PCI, 3.3 V N/A 3.3 N/A No

GTL 0.8 N/A 1.2 No

GTL+ 1.0 N/A 1.5 No

HSTL Class I 0.75 1.5 0.75 No

HSTL Class III 0.9 1.5 1.5 No

HSTL Class IV 0.9 1.5 1.5 No

SSTL3 Class I &II 1.5 3.3 1.5 No

SSTL2 Class I & II 1.25 2.5 1.25 No

CTT 1.5 3.3 1.5 No

AGP 1.32 3.3 N/A No

Virtex™ 2.5 V Field Programmable Gate Arrays

DS003-2 (v2.8.1) December 9, 2002 www.xilinx.com Module 2 of 4

Product Specification 1-800-255-7778 3

Input Path

A buffer In the Virtex IOB input path routes the input signal

either directly to internal logic or through an optional input

flip-flop.

An optional delay element at the D-input of this flip-flop elim-

inates pad-to-pad hold time. The delay is matched to the

internal clock-distribution delay of the FPGA, and when

used, assures that the pad-to-pad hold time is zero.

Each input buffer can be configured to conform to any of the

low-voltage signalling standards supported. In some of

these standards the input buffer utilizes a user-supplied

threshold voltage, VREF

. The need to supply VREF imposes

constraints on which standards can used in close proximity

to each other. See I/O Banking, page 3.

There are optional pull-up and pull-down resistors at each

user I/O input for use after configuration. Their value is in

the range 50 kΩ – 100 kΩ.

Output Path

The output path includes a 3-state output buffer that drives

the output signal onto the pad. The output signal can be

routed to the buffer directly from the internal logic or through

an optional IOB output flip-flop.

The 3-state control of the output can also be routed directly

from the internal logic or through a flip-flip that provides syn-

chronous enable and disable.

Each output driver can be individually programmed for a

wide range of low-voltage signalling standards. Each output

buffer can source up to 24 mA and sink up to 48mA. Drive

strength and slew rate controls minimize bus transients.

In most signalling standards, the output High voltage

depends on an externally supplied VCCO voltage. The need

to supply VCCO imposes constraints on which standards

can be used in close proximity to each other. See I/O Bank-

ing, page 3.

An optional weak-keeper circuit is connected to each out-

put. When selected, the circuit monitors the voltage on the

pad and weakly drives the pin High or Low to match the

input signal. If the pin is connected to a multiple-source sig-

nal, the weak keeper holds the signal in its last state if all

drivers are disabled. Maintaining a valid logic level in this

way eliminates bus chatter.

Because the weak-keeper circuit uses the IOB input buffer

to monitor the input level, an appropriate VREF voltage must

be provided if the signalling standard requires one. The pro-

vision of this voltage must comply with the I/O banking

rules.

I/O Banking

Some of the I/O standards described above require VCCO

and/or VREF voltages. These voltages externally and con-

nected to device pins that serve groups of IOBs, called

banks. Consequently, restrictions exist about which I/O

standards can be combined within a given bank.

Eight I/O banks result from separating each edge of the

FPGA into two banks, as shown in Figure 3. Each bank has

multiple VCCO pins, all of which must be connected to the

same voltage. This voltage is determined by the output

standards in use.

Within a bank, output standards can be mixed only if they

use the same VCCO. Compatible standards are shown in

Tab le 2 . GTL and GTL+ appear under all voltages because

their open-drain outputs do not depend on VCCO.

Some input standards require a user-supplied threshold

voltage, VREF

. In this case, certain user-I/O pins are auto-

matically configured as inputs for the VREF voltage. Approx-

imately one in six of the I/O pins in the bank assume this

role.

The VREF pins within a bank are interconnected internally

and consequently only one VREF voltage can be used within

each bank. All VREF pins in the bank, however, must be con-

nected to the external voltage source for correct operation.

Within a bank, inputs that require VREF can be mixed with

those that do not. However, only one VREF voltage can be

used within a bank. Input buffers that use VREF are not 5 V

tolerant. LVTTL, LVCMOS2, and PCI 33 MHz 5 V, are 5 V

tolerant.

The VCCO and VREF pins for each bank appear in the device

Pinout tables and diagrams. The diagrams also show the

bank affiliation of each I/O.

Within a given package, the number of VREF and VCCO pins

can vary depending on the size of device. In larger devices,

Figure 3: Virtex I/O Banks

Tab le 2: Compatible Output Standards

VCCO Compatible Standards

3.3 V PCI, LVTTL, SSTL3 I, SSTL3 II, CTT, AGP, GTL,

GTL+

2.5 V SSTL2 I, SSTL2 II, LVCMOS2, GTL, GTL+

1.5 V HSTL I, HSTL III, HSTL IV, GTL, GTL+

X8778_b

Bank 0

GCLK3 GCLK2

GCLK1 GCLK0

Bank 1

Bank 5 Bank 4

Virtex

Device

Bank 7Bank 6

Bank 2Bank 3

Virtex™ 2.5 V Field Programmable Gate Arrays R

Module 2 of 4 www.xilinx.com DS003-2 (v2.8.1) December 9, 2002

4 1-800-255-7778 Product Specification

more I/O pins convert to VREF pins. Since these are always

a superset of the VREF pins used for smaller devices, it is

possible to design a PCB that permits migration to a larger

device if necessary. All the VREF pins for the largest device

anticipated must be connected to the VREF voltage, and not

used for I/O.

In smaller devices, some VCCO pins used in larger devices

do not connect within the package. These unconnected pins

can be left unconnected externally, or can be connected to

the VCCO voltage to permit migration to a larger device if

necessary.

In TQ144 and PQ/HQ240 packages, all VCCO pins are

bonded together internally, and consequently the same

VCCO voltage must be connected to all of them. In the

CS144 package, bank pairs that share a side are intercon-

nected internally, permitting four choices for VCCO. In both

cases, the VREF pins remain internally connected as eight

banks, and can be used as described previously.

Configurable Logic Block

The basic building block of the Virtex CLB is the logic cell

(LC). An LC includes a 4-input function generator, carry

logic, and a storage element. The output from the function

generator in each LC drives both the CLB output and the D

input of the flip-flop. Each Virtex CLB contains four LCs,

organized in two similar slices, as shown in Figure 4.

Figure 5 shows a more detailed view of a single slice.

In addition to the four basic LCs, the Virtex CLB contains

logic that combines function generators to provide functions

of five or six inputs. Consequently, when estimating the

number of system gates provided by a given device, each

CLB counts as 4.5 LCs.

Look-Up Tables

Virtex function generators are implemented as 4-input

look-up tables (LUTs). In addition to operating as a function

generator, each LUT can provide a 16 x 1-bit synchronous

RAM. Furthermore, the two LUTs within a slice can be com-

bined to create a 16 x 2-bit or 32 x 1-bit synchronous RAM,

or a 16x1-bit dual-port synchronous RAM.

The Virtex LUT can also provide a 16-bit shift register that is

ideal for capturing high-speed or burst-mode data. This

mode can also be used to store data in applications such as

Digital Signal Processing.

Storage Elements

The storage elements in the Virtex slice can be configured

either as edge-triggered D-type flip-flops or as level-sensi-

tive latches. The D inputs can be driven either by the func-

tion generators within the slice or directly from slice inputs,

bypassing the function generators.

In addition to Clock and Clock Enable signals, each Slice

has synchronous set and reset signals (SR and BY). SR

forces a storage element into the initialization state speci-

fied for it in the configuration. BY forces it into the opposite

state. Alternatively, these signals can be configured to oper-

ate asynchronously. All of the control signals are indepen-

dently invertible, and are shared by the two flip-flops within

the slice.

Figure 4: 2-Slice Virtex CLB

Carry &

Control

Carry &

Control

Carry &

Control

Carry &

Control

LUT

CINCIN

COUT COUT

YBYB

slice_b.eps

Slice 1 Slice 0

LUT

LUT D

Virtex™ 2.5 V Field Programmable Gate Arrays

DS003-2 (v2.8.1) December 9, 2002 www.xilinx.com Module 2 of 4

Product Specification 1-800-255-7778 5

Additional Logic

The F5 multiplexer in each slice combines the function gen-

erator outputs. This combination provides either a function

generator that can implement any 5-input function, a 4:1

multiplexer, or selected functions of up to nine inputs.

Similarly, the F6 multiplexer combines the outputs of all four

function generators in the CLB by selecting one of the

F5-multiplexer outputs. This permits the implementation of

any 6-input function, an 8:1 multiplexer, or selected func-

tions of up to 19 inputs.

Each CLB has four direct feedthrough paths, one per LC.

These paths provide extra data input lines or additional local

routing that does not consume logic resources.

Arithmetic Logic

Dedicated carry logic provides fast arithmetic carry capabil-

ity for high-speed arithmetic functions. The Virtex CLB sup-

ports two separate carry chains, one per Slice. The height

of the carry chains is two bits per CLB.

The arithmetic logic includes an XOR gate that allows a

1-bit full adder to be implemented within an LC. In addition,

a dedicated AND gate improves the efficiency of multiplier

implementation.

The dedicated carry path can also be used to cascade func-

tion generators for implementing wide logic functions.

BUFTs

Each Virtex CLB contains two 3-state drivers (BUFTs) that

can drive on-chip busses. See Dedicated Routing, page 7.

Each Virtex BUFT has an independent 3-state control pin

and an independent input pin.

Block SelectRAM

Virtex FPGAs incorporate several large block SelectRAM

memories. These complement the distributed LUT

SelectRAMs that provide shallow RAM structures imple-

mented in CLBs.

Block SelectRAM memory blocks are organized in columns.

All Virtex devices contain two such columns, one along

each vertical edge. These columns extend the full height of

the chip. Each memory block is four CLBs high, and conse-

quently, a Virtex device 64 CLBs high contains 16 memory

blocks per column, and a total of 32 blocks.

Tab le 3 shows the amount of block SelectRAM memory that

is available in each Virtex device.

Figure 5: Detailed View of VIrtex Slice

F5IN

CLK

CIN

F5 F5

viewslc4.eps

COUT

CK WSO

WSH

BY DG

BX DI

LUT

INIT

REV

Tab le 3: Virtex Block SelectRAM Amounts

Device # of Blocks Total Block SelectRAM Bits

XCV50 8 32,768

XCV100 10 40,960

XCV150 12 49,152

XCV200 14 57,344

XCV300 16 65,536

XCV400 20 81,920

XCV600 24 98,304

XCV800 28 114,688

XCV1000 32 131,072

Virtex™ 2.5 V Field Programmable Gate Arrays R

Module 2 of 4 www.xilinx.com DS003-2 (v2.8.1) December 9, 2002

6 1-800-255-7778 Product Specification

Each block SelectRAM cell, as illustrated in Figure 6, is a

fully synchronous dual-ported 4096-bit RAM with indepen-

dent control signals for each port. The data widths of the

two ports can be configured independently, providing

built-in bus-width conversion.

Tab le 4 shows the depth and width aspect ratios for the

block SelectRAM.

The Virtex block SelectRAM also includes dedicated routing

to provide an efficient interface with both CLBs and other

block SelectRAMs. Refer to XAPP130 for block SelectRAM

timing waveforms.

Programmable Routing Matrix

It is the longest delay path that limits the speed of any

worst-case design. Consequently, the Virtex routing archi-

tecture and its place-and-route software were defined in a

single optimization process. This joint optimization mini-

mizes long-path delays, and consequently, yields the best

system performance.

The joint optimization also reduces design compilation

times because the architecture is software-friendly. Design

cycles are correspondingly reduced due to shorter design

iteration times.

Local Routing

The VersaBlock provides local routing resources, as shown

in Figure 7, providing the following three types of connec-

tions.

•Interconnections among the LUTs, flip-flops, and GRM

•Internal CLB feedback paths that provide high-speed

connections to LUTs within the same CLB, chaining

them together with minimal routing delay

•Direct paths that provide high-speed connections

between horizontally adjacent CLBs, eliminating the

delay of the GRM.

Figure 6: Dual-Port Block SelectRAM

WEB

ENB

RSTB

CLKB

ADDRB[#:0]

DIB[#:0]

WEA

ENA

RSTA

CLKA

ADDRA[#:0]

DIA[#:0]

DOA[#:0]

DOB[#:0]

RAMB4_S#_S#

xcv_ds_006

Tab le 4: Block SelectRAM Port Aspect Ratios

Width Depth ADDR Bus Data Bus

1 4096 ADDR<11:0> DATA<0>

2 2048 ADDR<10:0> DATA<1:0>

4 1024 ADDR<9:0> DATA<3:0>

8 512 ADDR<8:0> DATA<7:0>

16 256 ADDR<7:0> DATA<15:0>

Figure 7: Virtex Local Routing

X8794b

CLB

GRM

To Adjacent

GRM

To Adjacent

GRM

Direct Connection

To Adjacent

CLB

To Adjacent

GRM

To Adjacent

GRM

Direct Connection

To Adjacent

CLB

Virtex™ 2.5 V Field Programmable Gate Arrays

DS003-2 (v2.8.1) December 9, 2002 www.xilinx.com Module 2 of 4

Product Specification 1-800-255-7778 7

General Purpose Routing

Most Virtex signals are routed on the general purpose rout-

ing, and consequently, the majority of interconnect

resources are associated with this level of the routing hier-

archy. The general routing resources are located in horizon-

tal and vertical routing channels associated with the rows

and columns CLBs. The general-purpose routing resources

are listed below.

•Adjacent to each CLB is a General Routing Matrix

(GRM). The GRM is the switch matrix through which

horizontal and vertical routing resources connect, and

is also the means by which the CLB gains access to

the general purpose routing.

•24 single-length lines route GRM signals to adjacent

GRMs in each of the four directions.

•12 buffered Hex lines route GRM signals to another

GRMs six-blocks away in each one of the four

directions. Organized in a staggered pattern, Hex lines

can be driven only at their endpoints. Hex-line signals

can be accessed either at the endpoints or at the

midpoint (three blocks from the source). One third of

the Hex lines are bidirectional, while the remaining

ones are uni-directional.

•12 Longlines are buffered, bidirectional wires that

distribute signals across the device quickly and

efficiently. Vertical Longlines span the full height of the

device, and horizontal ones span the full width of the

device.

I/O Routing

Virtex devices have additional routing resources around

their periphery that form an interface between the CLB array

and the IOBs. This additional routing, called the VersaRing,

facilitates pin-swapping and pin-locking, such that logic

redesigns can adapt to existing PCB layouts. Time-to-mar-

ket is reduced, since PCBs and other system components

can be manufactured while the logic design is still in

progress.

Dedicated Routing

Some classes of signal require dedicated routing resources

to maximize performance. In the Virtex architecture, dedi-

cated routing resources are provided for two classes of sig-

nal.

•Horizontal routing resources are provided for on-chip

3-state busses. Four partitionable bus lines are

provided per CLB row, permitting multiple busses

within a row, as shown in Figure 8.

•Two dedicated nets per CLB propagate carry signals

vertically to the adjacent CLB.

Global Routing

Global Routing resources distribute clocks and other sig-

nals with very high fanout throughout the device. Virtex

devices include two tiers of global routing resources

referred to as primary global and secondary local clock rout-

ing resources.

•The primary global routing resources are four

dedicated global nets with dedicated input pins that are

designed to distribute high-fanout clock signals with

minimal skew. Each global clock net can drive all CLB,

IOB, and block RAM clock pins. The primary global

nets can only be driven by global buffers. There are

four global buffers, one for each global net.

•The secondary local clock routing resources consist of

24 backbone lines, 12 across the top of the chip and 12

across bottom. From these lines, up to 12 unique

signals per column can be distributed via the 12

longlines in the column. These secondary resources

are more flexible than the primary resources since they

are not restricted to routing only to clock pins.

Clock Distribution

Virtex provides high-speed, low-skew clock distribution

through the primary global routing resources described

above. A typical clock distribution net is shown in Figure 9.

Four global buffers are provided, two at the top center of the

device and two at the bottom center. These drive the four

primary global nets that in turn drive any clock pin.

Figure 8: BUFT Connections to Dedicated Horizontal Bus Lines

CLB CLB CLB CLB

buft_c.eps

Tri-State

Lines

Virtex™ 2.5 V Field Programmable Gate Arrays R

Module 2 of 4 www.xilinx.com DS003-2 (v2.8.1) December 9, 2002

8 1-800-255-7778 Product Specification

Four dedicated clock pads are provided, one adjacent to

each of the global buffers. The input to the global buffer is

selected either from these pads or from signals in the gen-

eral purpose routing.

Delay-Locked Loop (DLL)

Associated with each global clock input buffer is a fully digi-

tal Delay-Locked Loop (DLL) that can eliminate skew

between the clock input pad and internal clock-input pins

throughout the device. Each DLL can drive two global clock

networks.The DLL monitors the input clock and the distrib-

uted clock, and automatically adjusts a clock delay element.

Clock edges reach internal flip-flops one to four clock peri-

ods after they arrive at the input. This closed-loop system

effectively eliminates clock-distribution delay by ensuring

that clock edges arrive at internal flip-flops in synchronism

with clock edges arriving at the input.

In addition to eliminating clock-distribution delay, the DLL

provides advanced control of multiple clock domains. The

DLL provides four quadrature phases of the source clock,

can double the clock, or divide the clock by 1.5, 2, 2.5, 3, 4,

5, 8, or 16.

The DLL also operates as a clock mirror. By driving the out-

put from a DLL off-chip and then back on again, the DLL can

be used to de-skew a board level clock among multiple Vir-

tex devices.

In order to guarantee that the system clock is operating cor-

rectly prior to the FPGA starting up after configuration, the

DLL can delay the completion of the configuration process

until after it has achieved lock.

See DLL Timing Parameters, page 21 of Module 3, for fre-

quency range information.

Boundary Scan

Virtex devices support all the mandatory boundary-scan

instructions specified in the IEEE standard 1149.1. A Test

Access Port (TAP) and registers are provided that implement

the EXTEST, INTEST, SAMPLE/PRELOAD, BYPASS,

IDCODE, USERCODE, and HIGHZ instructions. The TAP

also supports two internal scan chains and configura-

tion/readback of the device.The TAP uses dedicated package

pins that always operate using LVTTL. For TDO to operate

using LVTTL, the VCCO for Bank 2 should be 3.3 V. Other-

wise, TDO switches rail-to-rail between ground and VCCO.

Boundary-scan operation is independent of individual IOB

configurations, and unaffected by package type. All IOBs,

including un-bonded ones, are treated as independent

3-state bidirectional pins in a single scan chain. Retention of

the bidirectional test capability after configuration facilitates

the testing of external interconnections, provided the user

design or application is turned off.

Tab le 5 lists the boundary-scan instructions supported in

Virtex FPGAs. Internal signals can be captured during

EXTEST by connecting them to un-bonded or unused IOBs.

They can also be connected to the unused outputs of IOBs

defined as unidirectional input pins.

Before the device is configured, all instructions except

USER1 and USER2 are available. After configuration, all

instructions are available. During configuration, it is recom-

mended that those operations using the boundary-scan

performed.

Figure 9: Global Clock Distribution Network

Global Clock Spine

Global Clock Column

GCLKPAD2

GCLKBUF2

GCLKPAD3

GCLKBUF3

GCLKBUF1

GCLKPAD1

GCLKBUF0

GCLKPAD0

Global Clock Rows

gclkbu_2.eps

Virtex™ 2.5 V Field Programmable Gate Arrays

DS003-2 (v2.8.1) December 9, 2002 www.xilinx.com Module 2 of 4

Product Specification 1-800-255-7778 9

In addition to the test instructions outlined above, the

boundary-scan circuitry can be used to configure the

FPGA, and also to read back the configuration data.

Figure 10 is a diagram of the Virtex Series boundary scan

logic. It includes three bits of Data Register per IOB, the

IEEE 1149.1 Test Access Port controller, and the Instruction

Instruction Set

The Virtex Series boundary scan instruction set also

includes instructions to configure the device and read back

configuration data (CFG_IN, CFG_OUT, and JSTART). The

complete instruction set is coded as shown in Ta bl e 5 .

Data Registers

The primary data register is the boundary scan register. For

each IOB pin in the FPGA, bonded or not, it includes three

bits for In, Out, and 3-State Control. Non-IOB pins have

appropriate partial bit population if input-only or output-only.

Each EXTEST CAPTURED-OR state captures all In, Out,

and 3-state pins.

The other standard data register is the single flip-flop

BYPASS register. It synchronizes data being passed

through the FPGA to the next downstream boundary scan

device.

The FPGA supports up to two additional internal scan

chains that can be specified using the BSCAN macro. The

macro provides two user pins (SEL1 and SEL2) which are

decodes of the USER1 and USER2 instructions respec-

tively. For these instructions, two corresponding pins (TDO1

and TDO2) allow user scan data to be shifted out of TDO.

Likewise, there are individual clock pins (DRCK1 and

DRCK2) for each user register. There is a common input pin

(TDI) and shared output pins that represent the state of the

TAP controller (RESET, SHIFT, and UPDATE).

Bit Sequence

The order within each IOB is: In, Out, 3-State. The

input-only pins contribute only the In bit to the boundary

scan I/O data register, while the output-only pins contributes

all three bits.

From a cavity-up view of the chip (as shown in EPIC), start-

ing in the upper right chip corner, the boundary scan

data-register bits are ordered as shown in Figure 11.

BSDL (Boundary Scan Description Language) files for Vir-

tex Series devices are available on the Xilinx web site in the

File Download area.

Figure 10: Virtex Series Boundary Scan Logic

D Q

IOB

BYPASS

IOB IOB

TDO

TDI

IOB IOB IOB

D Q

IOB

D Q

0DQ

IOB.T

DATA IN

IOB.I

IOB.Q

IOB.T

IOB.I

SHIFT/

CAPTURE

CLOCK DATA

DATAOUT UPDATE EXTEST

X9016

INSTRUCTION REGISTER

Virtex™ 2.5 V Field Programmable Gate Arrays R

Module 2 of 4 www.xilinx.com DS003-2 (v2.8.1) December 9, 2002

10 1-800-255-7778 Product Specification

Identification Registers

The IDCODE register is supported. By using the IDCODE,

the device connected to the JTAG port can be determined.

The IDCODE register has the following binary format:

vvvv:ffff:fffa:aaaa:aaaa:cccc:cccc:ccc1

where

v = the die version number

f = the family code (03h for Virtex family)

a = the number of CLB rows (ranges from 010h for XCV50

to 040h for XCV1000)

c = the company code (49h for Xilinx)

The USERCODE register is supported. By using the USER-

CODE, a user-programmable identification code can be

loaded and shifted out for examination. The identification

code is embedded in the bitstream during bitstream gener-

ation and is valid only after configuration.

Including Boundary Scan in a Design

Since the boundary scan pins are dedicated, no special ele-

ment needs to be added to the design unless an internal

data register (USER1 or USER2) is desired.

If an internal data register is used, insert the boundary scan

symbol and connect the necessary pins as appropriate.

Development System

Virtex FPGAs are supported by the Xilinx Foundation and

Alliance CAE tools. The basic methodology for Virtex design

consists of three interrelated steps: design entry, imple-

mentation, and verification. Industry-standard tools are

used for design entry and simulation (for example, Synop-

sys FPGA Express), while Xilinx provides proprietary archi-

tecture-specific tools for implementation.

The Xilinx development system is integrated under the Xil-

inx Design Manager (XDM™) software, providing designers

Figure 11: Boundary Scan Bit Sequence

Table 5: Boundary Scan Instructions

Boundary-Scan

Command

Binary

Code(4:0) Description

EXTEST 00000 Enables boundary-scan

EXTEST operation

SAMPLE/PRELOAD 00001 Enables boundary-scan

SAMPLE/PRELOAD

operation

USER 1 00010 Access user-defined

USER 2 00011 Access user-defined

CFG_OUT 00100 Access the configuration

bus for read operations.

CFG_IN 00101 Access the configuration

bus for write operations.

INTEST 00111 Enables boundary-scan

INTEST operation

USERCODE 01000 Enables shifting out

USER code

IDCODE 01001 Enables shifting out of ID

Code

HIGHZ 01010 3-states output pins while

enabling the Bypass

JSTART 01100 Clock the start-up

sequence when

StartupClk is TCK

BYPASS 11111 Enables BYPASS

RESERVED All other

codes

Xilinx reserved

instructions

Bit 0 ( TDO end)

Bit 1

Bit 2

Right half of Top-edge IOBs (Right-to-Left)

GCLK2

GCLK3

Left half of Top-edge IOBs (Right-to-Left)

Left-edge IOBs (Top-to-Bottom)

Left half of Bottom-edge IOBs (Left-to-Right)

GCLK1

GCLK0

Right half of Bottom-edge IOBs (Left-to-Right)

DONE

PROG

Right-edge IOBs (Bottom -to-Top)

CCLK

(TDI end)

990602001

Tab le 6: IDCODEs Assigned to Virtex FPGAs

FPGA IDCODE

XCV50 v0610093h

XCV100 v0614093h

XCV150 v0618093h

XCV200 v061C093h

XCV300 v0620093h

XCV400 v0628093h

XCV600 v0630093h

XCV800 v0638093h

XCV1000 v0640093h

Virtex™ 2.5 V Field Programmable Gate Arrays

DS003-2 (v2.8.1) December 9, 2002 www.xilinx.com Module 2 of 4

Product Specification 1-800-255-7778 11

with a common user interface regardless of their choice of

entry and verification tools. The XDM software simplifies the

selection of implementation options with pull-down menus

and on-line help.

Application programs ranging from schematic capture to

Placement and Routing (PAR) can be accessed through the

XDM software. The program command sequence is gener-

ated prior to execution, and stored for documentation.

Several advanced software features facilitate Virtex design.

RPMs, for example, are schematic-based macros with rela-

tive location constraints to guide their placement. They help

ensure optimal implementation of common functions.

For HDL design entry, the Xilinx FPGA Foundation develop-

ment system provides interfaces to the following synthesis

design environments.

•Synopsys (FPGA Compiler, FPGA Express)

•Exemplar (Spectrum)

•Synplicity (Synplify)

For schematic design entry, the Xilinx FPGA Foundation

and alliance development system provides interfaces to the

following schematic-capture design environments.

•Mentor Graphics V8 (Design Architect, QuickSim II)

•Viewlogic Systems (Viewdraw)

Third-party vendors support many other environments.

A standard interface-file specification, Electronic Design

Interchange Format (EDIF), simplifies file transfers into and

out of the development system.

Virtex FPGAs supported by a unified library of standard

functions. This library contains over 400 primitives and mac-

ros, ranging from 2-input AND gates to 16-bit accumulators,

and includes arithmetic functions, comparators, counters,

data registers, decoders, encoders, I/O functions, latches,

Boolean functions, multiplexers, shift registers, and barrel

shifters.

The “soft macro” portion of the library contains detailed

descriptions of common logic functions, but does not con-

tain any partitioning or placement information. The perfor-

mance of these macros depends, therefore, on the

partitioning and placement obtained during implementation.

RPMs, on the other hand, do contain predetermined parti-

tioning and placement information that permits optimal

implementation of these functions. Users can create their

own library of soft macros or RPMs based on the macros

and primitives in the standard library.

The design environment supports hierarchical design entry,

with high-level schematics that comprise major functional

blocks, while lower-level schematics define the logic in

these blocks. These hierarchical design elements are auto-

matically combined by the implementation tools. Different

design entry tools can be combined within a hierarchical

design, thus allowing the most convenient entry method to

be used for each portion of the design.

Design Implementation

The place-and-route tools (PAR) automatically provide the

implementation flow described in this section. The parti-

tioner takes the EDIF net list for the design and maps the

logic into the architectural resources of the FPGA (CLBs

and IOBs, for example). The placer then determines the

best locations for these blocks based on their interconnec-

tions and the desired performance. Finally, the router inter-

connects the blocks.

The PAR algorithms support fully automatic implementation

of most designs. For demanding applications, however, the

user can exercise various degrees of control over the pro-

cess. User partitioning, placement, and routing information

is optionally specified during the design-entry process. The

implementation of highly structured designs can benefit

greatly from basic floor planning.

The implementation software incorporates Timing Wizard®

timing-driven placement and routing. Designers specify tim-

ing requirements along entire paths during design entry.

The timing path analysis routines in PAR then recognize

these user-specified requirements and accommodate them.

Timing requirements are entered on a schematic in a form

directly relating to the system requirements, such as the tar-

geted clock frequency, or the maximum allowable delay

between two registers. In this way, the overall performance

of the system along entire signal paths is automatically tai-

lored to user-generated specifications. Specific timing infor-

mation for individual nets is unnecessary.

Design Verification

In addition to conventional software simulation, FPGA users

can use in-circuit debugging techniques. Because Xilinx

devices are infinitely reprogrammable, designs can be veri-

fied in real time without the need for extensive sets of soft-

ware simulation vectors.

The development system supports both software simulation

and in-circuit debugging techniques. For simulation, the

system extracts the post-layout timing information from the

design database, and back-annotates this information into

the net list for use by the simulator. Alternatively, the user

can verify timing-critical portions of the design using the

TRACE® static timing analyzer.

For in-circuit debugging, the development system includes

a download and readback cable. This cable connects the

FPGA in the target system to a PC or workstation. After

downloading the design into the FPGA, the designer can

single-step the logic, readback the contents of the flip-flops,

and so observe the internal logic state. Simple modifica-

tions can be downloaded into the system in a matter of min-

utes.

Virtex™ 2.5 V Field Programmable Gate Arrays R

Module 2 of 4 www.xilinx.com DS003-2 (v2.8.1) December 9, 2002

12 1-800-255-7778 Product Specification

Configuration

Virtex devices are configured by loading configuration data

into the internal configuration memory. Some of the pins

used for this are dedicated configuration pins, while others

can be re-used as general purpose inputs and outputs once

configuration is complete.

The following are dedicated pins:

•Mode pins (M2, M1, M0)

•Configuration clock pin (CCLK)

•PROGRAM pin

•DONE pin

•Boundary-scan pins (TDI, TDO, TMS, TCK)

Depending on the configuration mode chosen, CCLK can

be an output generated by the FPGA, or it can be generated

externally and provided to the FPGA as an input. The

PROGRAM pin must be pulled High prior to reconfiguration.

Note that some configuration pins can act as outputs. For

correct operation, these pins can require a VCCO of 3.3 V to

permit LVTTL operation. All the pins affected are in banks 2

or 3. The configuration pins needed for SelectMap (CS,

Write) are located in bank 1.

After Virtex devices are configured, unused IOBs function

as 3-state OBUFTs with weak pull downs. For a more

detailed description than that given below, see the

XAPP138, Virtex Configuration and Readback.

Configuration Modes

Virtex supports the following four configuration modes.

•Slave-serial mode

•Master-serial mode

•SelectMAP mode

•Boundary-scan mode

The Configuration mode pins (M2, M1, M0) select among

these configuration modes with the option in each case of

having the IOB pins either pulled up or left floating prior to

configuration. The selection codes are listed in Ta bl e 7 .

Configuration through the boundary-scan port is always

available, independent of the mode selection. Selecting the

boundary-scan mode simply turns off the other modes. The

three mode pins have internal pull-up resistors, and default

to a logic High if left unconnected. However, it is recom-

mended to drive the configuration mode pins externally.

Slave-Serial Mode

In slave-serial mode, the FPGA receives configuration data

in bit-serial form from a serial PROM or other source of

serial configuration data. The serial bitstream must be setup

at the DIN input pin a short time before each rising edge of

an externally generated CCLK.

For more information on serial PROMs, see the PROM data

sheet at:

http://www.xilinx.com/bvdocs/publications/ds026.pdf.

Multiple FPGAs can be daisy-chained for configuration from a

single source. After a particular FPGA has been configured,

the data for the next device is routed to the DOUT pin. The

data on the DOUT pin changes on the rising edge of CCLK.

The change of DOUT on the rising edge of CCLK differs

from previous families, but does not cause a problem for

mixed configuration chains. This change was made to

improve serial configuration rates for Virtex-only chains.

Figure 12 shows a full master/slave system. A Virtex device

in slave-serial mode should be connected as shown in the

third device from the left.

Slave-serial mode is selected by applying <111> or <011>

to the mode pins (M2, M1, M0). A weak pull-up on the mode

pins makes slave-serial the default mode if the pins are left

unconnected. However, it is recommended to drive the con-

figuration mode pins externally. Figure 13 shows

slave-serial mode programming switching characteristics.

Tab le 8 provides more detail about the characteristics

shown in Figure 13. Configuration must be delayed until the

INIT pins of all daisy-chained FPGAs are High.

Table 7: Configuration Codes

Configuration Mode M2 M1 M0 CCLK Direction Data Width Serial Dout Configuration Pull-ups

Master-serial mode 0 0 0 Out 1 Yes No

Boundary-scan mode 1 0 1 N/A 1 No No

SelectMAP mode 1 1 0 In 8 No No

Slave-serial mode 1 1 1 In 1 Yes No

Master-serial mode 1 0 0 Out 1 Yes Yes

Boundary-scan mode 0 0 1 N/A 1 No Yes

SelectMAP mode 0 1 0 In 8 No Yes

Slave-serial mode 0 1 1 In 1 Yes Yes

Virtex™ 2.5 V Field Programmable Gate Arrays

DS003-2 (v2.8.1) December 9, 2002 www.xilinx.com Module 2 of 4

Product Specification 1-800-255-7778 13

Table 8: Master/Slave Serial Mode Programming Switching

Description

Figure

References Symbol Values Units

CCLK

DIN setup/hold, slave mode 1/2 TDCC/TCCD 5.0 / 0 ns, min

DIN setup/hold, master mode 1/2 TDSCK/TCKDS 5.0 / 0 ns, min

DOUT 3 TCCO 12.0 ns, max

High time 4 TCCH 5.0 ns, min

Low time 5 TCCL 5.0 ns, min

Maximum Frequency FCC 66 MHz, max

Frequency Tolerance, master mode with

respect to nominal

+45%

–30%

Figure 12: Master/Slave Serial Mode Circuit Diagram

VIRTEX

MASTER

SERIAL

VIRTEX,

XC4000XL,

SLAVE

XC1701L

PROGRAM

M0 M1

DOUT

CCLK CLK

DATA

CE CEO

RESET/OE DONE

DIN

INIT INIT

DONE

PROGRAM PROGRAM

CCLK

DIN DOUT

M0 M1

(Low Reset Option Used)

4.7 K

xcv_12_091499

3.3V V

Optional Pull-up

Resistor on Done

Note 1: If none of the Virtex FPGAs have been selected to drive DONE, an external pull-up resistor of 330 Ω should be added to the common DONE line.

Figure 13: Slave-Serial Mode Programming Switching Characteristics

4TCCH

3TCCO

5TCCL

2TCCD

1TDCC

DIN

CCLK

DOUT

(Output)

X5379_a

Virtex™ 2.5 V Field Programmable Gate Arrays R

Module 2 of 4 www.xilinx.com DS003-2 (v2.8.1) December 9, 2002

14 1-800-255-7778 Product Specification

Master-Serial Mode

In master-serial mode, the CCLK output of the FPGA drives

a Xilinx Serial PROM that feeds bit-serial data to the DIN

input. The FPGA accepts this data on each rising CCLK

edge. After the FPGA has been loaded, the data for the next

device in a daisy-chain is presented on the DOUT pin after

the rising CCLK edge.

The interface is identical to slave-serial except that an inter-

nal oscillator is used to generate the configuration clock

(CCLK). A wide range of frequencies can be selected for

CCLK which always starts at a slow default frequency. Con-

figuration bits then switch CCLK to a higher frequency for

the remainder of the configuration. Switching to a lower fre-

quency is prohibited.

The CCLK frequency is set using the ConfigRate option in

the bitstream generation software. The maximum CCLK fre-

quency that can be selected is 60 MHz. When selecting a

CCLK frequency, ensure that the serial PROM and any

daisy-chained FPGAs are fast enough to support the clock

rate.

On power-up, the CCLK frequency is 2.5 MHz. This fre-

quency is used until the ConfigRate bits have been loaded

when the frequency changes to the selected ConfigRate.

Unless a different frequency is specified in the design, the

default ConfigRate is 4 MHz.

Figure 12 shows a full master/slave system. In this system,

the left-most device operates in master-serial mode. The

remaining devices operate in slave-serial mode. The

SPROM RESET pin is driven by INIT, and the CE input is

driven by DONE. There is the potential for contention on the

DONE pin, depending on the start-up sequence options

chosen.

Figure 14 shows the timing of master-serial configuration.

Master-serial mode is selected by a <000> or <100> on the

mode pins (M2, M1, M0). Ta bl e 8 shows the timing informa-

tion for Figure 14.

At power-up, VCC must rise from 1.0 V to VCC min in less

than 50 ms, otherwise delay configuration by pulling

PROGRAM Low until VCC is valid.

The sequence of operations necessary to configure a Virtex

FPGA serially appears in Figure 15.

SelectMAP Mode

The SelectMAP mode is the fastest configuration option.

Byte-wide data is written into the FPGA with a BUSY flag

controlling the flow of data.

An external data source provides a byte stream, CCLK, a

Chip Select (CS) signal and a Write signal (WRITE). If

BUSY is asserted (High) by the FPGA, the data must be

held until BUSY goes Low.

Data can also be read using the SelectMAP mode. If

WRITE is not asserted, configuration data is read out of the

FPGA as part of a readback operation.

In the SelectMAP mode, multiple Virtex devices can be

chained in parallel. DATA pins (D7:D0), CCLK, WRITE,

BUSY

, PROGRAM, DONE, and INIT can be connected in

parallel between all the FPGAs. Note that the data is orga-

nized with the MSB of each byte on pin DO and the LSB of

each byte on D7. The CS pins are kept separate, insuring

that each FPGA can be selected individually. WRITE should

be Low before loading the first bitstream and returned High

after the last device has been programmed. Use CS to

select the appropriate FPGA for loading the bitstream and

sending the configuration data. at the end of the bitstream,

deselect the loaded device and select the next target FPGA

by setting its CS pin High. A free-running oscillator or other

externally generated signal can be used for CCLK. The

BUSY signal can be ignored for frequencies below 50 MHz.

For details about frequencies above 50 MHz, see

XAPP138, Virtex Configuration and Readback. Once all the

devices have been programmed, the DONE pin goes High.

Figure 14: Master-Serial Mode Programming Switching Characteristics

Serial Data In

CCLK

(Output)

Serial DOUT

(Output)

1TDSCK

TCKDS

DS022_44_071201

Virtex™ 2.5 V Field Programmable Gate Arrays

DS003-2 (v2.8.1) December 9, 2002 www.xilinx.com Module 2 of 4

Product Specification 1-800-255-7778 15

After configuration, the pins of the SelectMAP port can be

used as additional user I/O. Alternatively, the port can be

retained to permit high-speed 8-bit readback.

Retention of the SelectMAP port is selectable on a

design-by-design basis when the bitstream is generated. If

retention is selected, PROHIBIT constraints are required to

prevent the SelectMAP-port pins from being used as user

I/O.

Multiple Virtex FPGAs can be configured using the Select-

MAP mode, and be made to start-up simultaneously. To

configure multiple devices in this way, wire the individual

CCLK, Data, WRITE, and BUSY pins of all the devices in

parallel. The individual devices are loaded separately by

asserting the CS pin of each device in turn and writing the

appropriate data. See Ta bl e 9 for SelectMAP Write Timing

Characteristics.

Write

Write operations send packets of configuration data into the

FPGA. The sequence of operations for a multi-cycle write

operation is shown below. Note that a configuration packet

can be split into many such sequences. The packet does

not have to complete within one assertion of CS, illustrated

in Figure 16.

1. Assert WRITE and CS Low. Note that when CS is

asserted on successive CCLKs, WRITE must remain

either asserted or de-asserted. Otherwise an abort will

be initiated, as described below.

2. Drive data onto D[7:0]. Note that to avoid contention,

the data source should not be enabled while CS is Low

and WRITE is High. Similarly, while WRITE is High, no

more that one CS should be asserted.

Figure 15: Serial Configuration Flowchart

Apply Power

Set PROGRAM = High

Release INIT If used to delay

configuration

Load a Configuration Bit

High

Low

FPGA makes a final

clearing pass and releases

INIT when finished.

FPGA starts to clear

configuration memory.

ds003_154_111799

Configuration Completed

End of

Bitstream?

Yes

Once per bitstream,

FPGA checks data using CRC

and pulls INIT Low on error.

If no CRC errors found,

FPGA enters start-up phase

causing DONE to go High.

INIT?

Table 9: SelectMAP Write Timing Characteristics

Description Symbol Units

CCLK

D0-7 Setup/Hold 1/2 TSMDCC/TSMCCD 5.0 / 1.7 ns, min

CS Setup/Hold 3/4 TSMCSCC/TSMCCCS 7.0 / 1.7 ns, min

WRITE Setup/Hold 5/6 TSMCCW/TSMWCC 7.0 / 1.7 ns, min

BUSY Propagation Delay 7 TSMCKBY 12.0 ns, max

Maximum Frequency FCC 66 MHz, max

Maximum Frequency with no handshake FCCNH 50 MHz, max

Virtex™ 2.5 V Field Programmable Gate Arrays R

Module 2 of 4 www.xilinx.com DS003-2 (v2.8.1) December 9, 2002

16 1-800-255-7778 Product Specification

3. At the rising edge of CCLK: If BUSY is Low, the data is

accepted on this clock. If BUSY is High (from a previous

write), the data is not accepted. Acceptance will instead

occur on the first clock after BUSY goes Low, and the

data must be held until this has happened.

4. Repeat steps 2 and 3 until all the data has been sent.

5. De-assert CS and WRITE.

A flowchart for the write operation appears in Figure 17.

Note that if CCLK is slower than fCCNH, the FPGA never

asserts BUSY. In this case, the above handshake is unnec-

essary, and data can simply be entered into the FPGA every

CCLK cycle.

Figure 16: Write Operations

ds003_16_071902

CCLK

Write Write No Write Write

DATA[0:7]

WRITE

BUSY

Virtex™ 2.5 V Field Programmable Gate Arrays

DS003-2 (v2.8.1) December 9, 2002 www.xilinx.com Module 2 of 4

Product Specification 1-800-255-7778 17

Abort

During a given assertion of CS, the user cannot switch from

a write to a read, or vice-versa. This action causes the cur-

rent packet command to be aborted. The device will remain

BUSY until the aborted operation has completed. Following

an abort, data is assumed to be unaligned to word bound-

aries, and the FPGA requires a new synchronization word

prior to accepting any new packets.

To initiate an abort during a write operation, de-assert

WRITE. At the rising edge of CCLK, an abort is initiated, as

shown in Figure 18.

Figure 17: SelectMAP Flowchart for Write Operation

Apply Power

Release INIT If used to delay

configuration

On first FPGA

PROGRAM

from Low

to High

Set WRITE = Low

Enter Data Source

Set CS = Low

On first FPGA

Set CS = High

Apply Configuration Byte

INIT?

High

Low

Yes

Busy?

Low

High

Disable Data Source

Set WRITE = High

When all DONE pins

are released, DONE goes High

and start-up sequences complete.

If no errors,

later FPGAs enter start-up phase

releasing DONE.

If no errors,

first FPGAs enter start-up phase

releasing DONE.

Once per bitstream,

FPGA checks data using CRC

and pulls INIT Low on error.

FPGA makes a final

clearing pass and releases

INIT when finished.

FPGA starts to clear

configuration memory.

For any other FPGAs

ds003_17_090602

Repeat Sequence A

Configuration Completed

Sequence A

End of Data?

Yes

Virtex™ 2.5 V Field Programmable Gate Arrays R

Module 2 of 4 www.xilinx.com DS003-2 (v2.8.1) December 9, 2002

18 1-800-255-7778 Product Specification

Boundary-Scan Mode

In the boundary-scan mode, configuration is done through

the IEEE 1149.1 Test Access Port. Note that the

PROGRAM pin must be pulled High prior to reconfiguration.

A Low on the PROGRAM pin resets the TAP controller and

no JTAG operations can be performed.

Configuration through the TAP uses the CFG_IN instruc-

tion. This instruction allows data input on TDI to be con-

verted into data packets for the internal configuration bus.

The following steps are required to configure the FPGA

through the boundary-scan port (when using TCK as a

start-up clock).

1. Load the CFG_IN instruction into the boundary-scan

instruction register (IR)

2. Enter the Shift-DR (SDR) state

3. Shift a configuration bitstream into TDI

4. Return to Run-Test-Idle (RTI)

5. Load the JSTART instruction into IR

6. Enter the SDR state

7. Clock TCK through the startup sequence

8. Return to RTI

Configuration and readback via the TAP is always available.

The boundary-scan mode is selected by a <101> or 001>

on the mode pins (M2, M1, M0). For details on TAP charac-

teristics, refer to XAPP139.

Configuration Sequence

The configuration of Virtex devices is a three-phase pro-

cess. First, the configuration memory is cleared. Next, con-

figuration data is loaded into the memory, and finally, the

logic is activated by a start-up process.

Configuration is automatically initiated on power-up unless

it is delayed by the user, as described below. The configura-

tion process can also be initiated by asserting PROGRAM.

The end of the memory-clearing phase is signalled by INIT

going High, and the completion of the entire process is sig-

nalled by DONE going High.

The power-up timing of configuration signals is shown in

Figure 19. The corresponding timing characteristics are

listed in Ta bl e 1 0 .

Delaying Configuration

INIT can be held Low using an open-drain driver. An

open-drain is required since INIT is a bidirectional

open-drain pin that is held Low by the FPGA while the con-

figuration memory is being cleared. Extending the time that

the pin is Low causes the configuration sequencer to wait.

Thus, configuration is delayed by preventing entry into the

phase where data is loaded.

Start-Up Sequence

The default Start-up sequence is that one CCLK cycle after

DONE goes High, the global 3-state signal (GTS) is released.

This permits device outputs to turn on as necessary.

One CCLK cycle later, the Global Set/Reset (GSR) and Glo-

bal Write Enable (GWE) signals are released. This permits

the internal storage elements to begin changing state in

response to the logic and the user clock.

The relative timing of these events can be changed. In addi-

tion, the GTS, GSR, and GWE events can be made depen-

dent on the DONE pins of multiple devices all going High,

forcing the devices to start in synchronism. The sequence

can also be paused at any stage until lock has been

achieved on any or all DLLs.

Figure 18: SelectMAP Write Abort Waveforms

X8797_c

CCLK

WRITE

Abort

DATA[0:7]

BUSY

Figure 19: Power-Up Timing Configuration Signals

Table 10: Power-up Timing Characteristics

Description Symbol Value Units

Power-on Reset TPOR 2.0 ms, max

Program Latency TPL 100.0 µs, max

CCLK (output) Delay TICCK 0.5 µs, min

4.0 µs, max

Program Pulse Width TPROGRAM 300 ns, min

PROGRAM

VCC

CCLK OUTPUT or INPUT

TPI

TICCK

98122302

TPOR

INIT

M0, M1, M2

(Required)

VALID

Virtex™ 2.5 V Field Programmable Gate Arrays

DS003-2 (v2.8.1) December 9, 2002 www.xilinx.com Module 2 of 4

Product Specification 1-800-255-7778 19

Data Stream Format

Virtex devices are configured by sequentially loading

frames of data. Ta b l e 1 1 lists the total number of bits

required to configure each device. For more detailed infor-

mation, see application note XAPP151 “Virtex Configura-

tion Architecture Advanced Users Guide”.

Readback

The configuration data stored in the Virtex configuration

memory can be readback for verification. Along with the

configuration data it is possible to readback the contents all

flip-flops/latches, LUTRAMs, and block RAMs. This capabil-

ity is used for real-time debugging.

For more detailed information, see Application Note

XAPP138: Virtex FPGA Series Configuration and Readback,

available online at www.xilinx.com.

Revision History

Table 11: Virtex Bit-Stream Lengths

Device # of Configuration Bits

XCV50 559,200

XCV100 781,216

XCV150 1,040,096

XCV200 1,335,840

XCV300 1,751,808

XCV400 2,546,048

XCV600 3,607,968

XCV800 4,715,616

XCV1000 6,127,744