Z0103MN0,135 - NXP Semiconductors

1. Product profile

1.1 General description

Planar passivated very sensitive gate four quadrant triac in a SOT223 (SC- 73 )

surface-mount able plastic package intended for applications requiring enhan ced immunity

to noise and direct interfacing to logic level ICs and low power gate drivers.

1.2 Features and benefits

Direct interfacing to logic level ICs

Enhanced current surge capability

Enhanced noise immunity

High blocking voltage capability

Planar passivated for voltage

ruggedness and reliability

Surface-mountable package

Triggering in all four quadrants

Very sensitive gate in four quadrants

1.3 Applications

General purpose low power motor

control

Home appliances

Industrial pro cess control

Low power AC Fan controllers

1.4 Quick reference data

Z0103MN0

4Q Triac

Rev. 02 — 17 March 2011 Product data sheet

SOT223

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VDRM repetitive peak

off-state voltage --600V

ITSM non-repetitive

peak on-state

current

full sine wave; Tj(init) =25°C;

tp= 20 ms; see Figure 4;

see Figure 5

--12.5A

IT(RMS) RMS on-state

current full sine wave; Tsp ≤105 °C;

see Figure 3; see Figure 1;

see Figure 2

--1A

Product data sheet Rev. 02 — 17 March 2011 2 of 15

NXP Semiconductors Z0103MN0

4Q Triac

2. Pinning information

3. Ordering information

4. Marking

[1] % = placeholder for manufacturing site code

Static characteristics

IGT gate trigger

current VD=12V; I

T= 0.1 A; T2+ G+;

Tj=25°C; see Figure 9 0.2 - 3 mA

VD=12V; I

T= 0.1 A; T2+ G-;

Tj=25°C; see Figure 9 0.2 - 3 mA

VD=12V; I

T= 0.1 A; T2- G-;

Tj=25°C; see Figure 9 0.2 - 3 mA

VD=12V; I

T= 0.1 A; T2- G+;

Tj=25°C; see Figure 9 0.2 - 5 mA

Table 1. Quick reference data …continued

Symbol Parameter Conditions Min Typ Max Unit

Tabl e 2. Pinning information

Pin Symbol Description Simplified outline Graphi c sy mbol

1 T1 main terminal 1

SOT223 (SOT223)

2 T2 main terminal 2

3 G gate

4 T2 main terminal 2

132

sym051

Table 3. Ordering informatio n

Type number Package

Name Description Version

Z0103MN0 SOT223 plastic surface-mo unted package with increased heatsink; 4 leads SOT223

Table 4. Marking codes

Type number Marking code[1]

Z0103MN0 103MN0

Product data sheet Rev. 02 — 17 March 2011 3 of 15

NXP Semiconductors Z0103MN0

4Q Triac

5. Limiting values

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VDRM repetitive peak off-state voltage - 600 V

IT(RMS) RMS on-state current full sine wave; Tsp ≤105 °C;

see Figure 3; see Figure 1; see Figure 2 -1A

ITSM non-repetitive peak on-state

current full sine wave; Tj(init) =25°C;

tp= 20 ms; see Figure 4; see Figure 5 - 12.5 A

full sine wave; Tj(init) =25°C;

tp=16.7ms - 13.8 A

I2tI

2t for fusing tp= 10 ms; sine-wave pulse - 0.78 A2s

dIT/dt rate of rise of on-state current IT=1A; I

G=20mA;

dIG/dt = 100 mA/µs; T2+ G+ -50A/µs

IT=1A; I

G=20mA;

dIG/dt = 100 mA/µs; T2+ G- -50A/µs

IT=1A; I

G=20mA;

dIG/dt = 100 mA/µs; T2- G- -50A/µs

IT=1A; I

G=20mA;

dIG/dt = 100 mA/µs; T2- G+ -20A/µs

IGM peak gate current - 1 A

PGM peak gate power - 2 W

PG(AV) a verage gate power over any 20 ms period - 0.1 W

Tstg storage temperature -40 150 °C

Tjjunction temperature - 125 °C

Fig 1. RMS on-state current as a function of surge

duration; maximum values Fig 2. RMS on-state current as a function of solder

point temperature; maximum values

003aac269

10-2 10-1 1 10

surge duration (s)

IT(RMS)

(A)

003aac270

0.4

0.8

1.2

-50 0 50 100 150

(°C)

T(RMS)

(A)

Product data sheet Rev. 02 — 17 March 2011 4 of 15

NXP Semiconductors Z0103MN0

4Q Triac

Fig 3. Total power dissipation as a function of RMS on-state current; maximum values

Fig 4. No n-repetitive peak on-state curre nt as a function of the number of sinusoidal current cycles; maximum

values

003aac259

0.0

0.4

0.8

1.2

1.6

2.0

0 0.2 0.4 0.6 0.8 1 1.2

T(RMS )

(A)

tot

(W)

a = 180

120

conduction

angle

(degrees)

form

factor

120

180

2.8

2.2

1.9

1.57

003aaf449

ITSM

(A)

number of cycles

1 103

102

ITSM

Tj(init) = 25 °C max

1/f

Product data sheet Rev. 02 — 17 March 2011 5 of 15

NXP Semiconductors Z0103MN0

4Q Triac

Fig 5. No n-repetitive peak on-state curre nt as a function of puls e wi dth ; maxi mum value s

003aaf490

102

103

10−510−410−310−210−1

tp (s)

ITSM

(A)

(2)

(1)

TSM

j(init)

= 25 °C max

Product data sheet Rev. 02 — 17 March 2011 6 of 15

NXP Semiconductors Z0103MN0

4Q Triac

6. Thermal characteristics

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-sp) thermal resistance from

junction to solder point full cycle; see Figure 8 --15K/W

Rth(j-a) thermal resistance from

junction to ambient in free air; printed-circuit board mounted:

minimum footprint; full cycle; see Figure 6 - 156 - K/W

in free air; printed-circuit board mounted:

pad area; full cycle; see Figure 7 -70-K/W

All dimensions are in mm

Printed circuit board:

FR4 epoxy glass (1.6 mm thick), copper laminate

(35 um thick)

Fig 6. Minimum footprint SOT223 Fig 7. Printed circuit board pad area: SOT223

001aab508

3.8 min

1.5

min

1.5

min

(3×)

2.3

4.6

6.3

1.5

min

001aab509

4.6

4.5

Product data sheet Rev. 02 — 17 March 2011 7 of 15

NXP Semiconductors Z0103MN0

4Q Triac

Fig 8. Transient thermal impedance from junction to solder point as a junction of pulse width

003aac210

-2

-1

-5

-4

-3

-2

(s)

th(j-sp)

(K/W)

-1

Product data sheet Rev. 02 — 17 March 2011 8 of 15

NXP Semiconductors Z0103MN0

4Q Triac

7. Characteristics

Table 7. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

Static characteristics

IGT gate trigger current VD=12V; I

T= 0.1 A; T2+ G+;

Tj=25°C; see Figure 9 0.2 - 3 mA

VD=12V; I

T= 0.1 A; T2+ G-;

Tj=25°C; see Figure 9 0.2 - 3 mA

VD=12V; I

T= 0.1 A; T2- G-;

Tj=25°C; see Figure 9 0.2 - 3 mA

VD=12V; I

T= 0.1 A; T2- G+;

Tj=25°C; see Figure 9 0.2 - 5 mA

ILlatching current VD=12V; I

G= 0.1 A; T2+ G+;

Tj=25°C; see Figure 10 --7mA

VD=12V; I

G= 0.1 A; T2+ G-;

Tj=25°C; see Figure 10 --20mA

VD=12V; I

G= 0.1 A; T2- G-;

Tj=25°C; see Figure 10 --7mA

VD=12V; I

G= 0.1 A; T2- G+;

Tj=25°C; see Figure 10 --7mA

IHholding current VD=12V; T

j=25°C; see Figure 11 --7mA

VTon-stat e vo ltage IT= 1.4 A; Tj=25°C; see Figure 12 -1.31.6V

VGT gate trigger voltage VD=12V; I

T= 0.1 A; Tj=25°C;

see Figure 13 --1.3V

VD=600V; I

T= 0.1 A; Tj=125°C;

see Figure 13 0.2--V

IDoff-state current VD=600V; T

j= 125 °C - - 0.5 mA

Dynamic characteristics

dVD/dt rate of rise of off-state

voltage VDM =402V; T

j= 110 °C; gate open

circuit; exponential waveform;

see Figure 14

80--V/µs

dVcom/dt rate of change of

commutating voltage VD=400V; T

j=110°C;

dIcom/dt = 0.44 A/ms; gate open circuit 0.5--V/µs

Product data sheet Rev. 02 — 17 March 2011 9 of 15

NXP Semiconductors Z0103MN0

4Q Triac

(1) T2- G+

(2) T2- G-

(3) T2+ G-

(4) T2+ G+

Fig 9. Normalized gate trigger cu rrent as a function of

junction temperature Fig 10. Normalized latching current as a function of

junction temperature

Vo = 1.13 V

Rs = 0.31 Ω

(1) Tj = 125 °C; typical values

(2) Tj = 125 °C; maximum values

(3) Tj = 25 °C; maximum values

Fig 11. Normalized holding current as a function of

junction temperature Fig 12. On-state current as a function of on-state

voltage

Tj (°C)

-50 150100050

003aaa205

IGT(25°C)

IGT

(1)

(2)

(3)

(4)

Tj (°C)

-50 150100050

003aaa203

IL(25°C)

Tj (°C)

-50 150100050

003aaa204

IH(25°C)

003aac258

0.4

0.8

1.2

1.6

0 0.4 0.8 1.2 1.6 2

(V)

(A)

(1) (2) (3)

Product data sheet Rev. 02 — 17 March 2011 10 of 15

NXP Semiconductors Z0103MN0

4Q Triac

Fig 13. Normalized gate trigger voltage as a function of

junction temperature Fig 14. Normalized critical rate of rise of off-state

voltage as a function of junction temperature;

typical values

Tj (°C)

-50 150100050

003aaa209

0.8

0.4

1.2

1.6

VGT(25°C)

VGT

1.6

1.2

0.8

0.4

0 50 100 150

Tj (°C)

003aaa208

Product data sheet Rev. 02 — 17 March 2011 11 of 15

NXP Semiconductors Z0103MN0

4Q Triac

8. Package outline

Fig 15. Package outline SOT223 (SOT223)

UNIT A1bpcDEe1HELpQywv

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.10

0.01

1.8

1.5 0.80

0.60

3.1

2.9 0.32

0.22 6.7

6.3 3.7

3.3 2.3

4.6 7.3

6.7 1.1

0.7 0.95

0.85 0.1 0.10.2

DIMENSIONS (mm are the original dimensions)

SOT223 SC-73 04-11-10

06-03-16

detail X

vMA

0 2 4 mm

scale

132

Plastic surface-mounted package with increased heatsink; 4 leads SOT223

Product data sheet Rev. 02 — 17 March 2011 12 of 15

NXP Semiconductors Z0103MN0

4Q Triac

9. Revision history

Table 8. Revision history

Document ID Release date Data sheet status Change notice Supersedes

Z0103MN0 v.2 20110317 Product data sheet - Z0103MN0 v.1

Modifications: •Various changes to conte nt.

Z0103MN0 v.1 20110103 Product data sheet - -

Product data sheet Rev. 02 — 17 March 2011 13 of 15

NXP Semiconductors Z0103MN0

4Q Triac

10. Legal information

10.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The p r oduct status of device(s) described in this document may have changed since this doc ument was published and may differ in case of multiple devices. The latest product

status information is available on the Internet at URL http://www.nxp.com.

10.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conf lict with the short data sheet, the

full data sheet shall pre vail.

Product specifica t io n — The information and data provided in a Product

data sheet shall define the specification of the product as agr eed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyon d those described in the

Product data sheet.

10.3 Disclaimers

Limited warranty and liability — Information in this d ocument is be lieved to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulati ve liability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semicondu ctors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descripti ons, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Quick reference data — The Quick reference dat a is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associate d with t heir

applications and products.

NXP Semiconductors does not accept any liabil ity related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and pro ducts using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress rating s only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

Document status [1] [2] Product status [3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [shor t] data sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 02 — 17 March 2011 14 of 15

NXP Semiconductors Z0103MN0

4Q Triac

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document ma y be interpret ed or

construed as an of fer to sell product s that is op en for accept ance or the grant ,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) d escribed herein may

be subject to export control regulat i ons. Export might require a prior

authorization fro m national authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors prod uct is automotive qualified,

the product is not suitable for automotive use. It i s neit her qualif ied nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

10.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,

FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,

ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,

QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,

TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.

HD Radio and HD Radio logo — are trademarks of iBiquity Digital

Corporation.

11. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors Z0103MN0

4Q Triac

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 17 March 2011

Document iden tifier: Z0103MN0

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

12. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.1 General description . . . . . . . . . . . . . . . . . . . . . .1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . .6

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .8

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .11

9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .12

10 Legal information. . . . . . . . . . . . . . . . . . . . . . . .13

10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .13

10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

10.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .1 3

10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .14

11 Contact information. . . . . . . . . . . . . . . . . . . . . .14