ERJ1GEJ1R2C - Panasonic

Thick Film Chip Resistors

Design and speciﬁ cations are each subject to change without notice. Ask factory for the current technical speciﬁ cations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Thick Film

Chip Resistors

Product Code Size, Power Rating

XGE : 01005

1GE : 0201

2GE : 0402

3GE : 0603

6GE : 0805

8GE : 1206

14 : 1210

12 : 1812

12Z : 2010

1T : 2512

0.031 W

0.05 W

0.1 W

0.125 W

0.25 W

0.5 W

0.75 W

Power R.

Marking

Code

✽Nil

Marking

Value Marking on

black side

No marking

Resistance Tolerance

Code

Tolerance

±5%

Jumper

The first two digits are significant figures of resistance and

the third one denotes number of zeros following.

Decimal Point is expressed by R as 4.7 = 4R7.

Jumper is expressed by R00.

Resistance Value

Packaging Methods

Code

Packaging Type

Pressed Carrier Taping

2mmpitch, 20000 pcs.

Pressed Carrier Taping

2mmpitch, 15000 pcs.

Punched Carrier Taping

2mmpitch, 10000 pcs.

Punched Carrier Taping

4mmpitch

Embossed CarrierTaping

4mmpitch

ERJXGE

ERJ1GE

ERJ2GE

ERJ3GE

ERJ6GE

ERJ8GE

ERJ14

ERJ12

ERJ12Z

ERJ1T

Type : inches

Thick Film Chip Resistors

01005, 0201, 0402, 0603, 0805,

1206, 1210, 1812, 2010, 2512

Type: ERJ XG, 1G, 2G, 3G, 6G, 8G,

14, 12, 12Z, 1T

■Features

● Small size and lightweight

● High reliability

Metal glaze thick ﬁ lm resistive element and three layers of electrodes

● Compatible with placement machines

Taping packaging available

● Suitable for both reﬂ ow and ﬂ ow sol der ing

● Reference Standards

IEC 60115-8, JIS C 5201-8, EIAJ RC-2134B

■Explanation of Part Numbers

● ERJXGE, 1GE, 2GE, 3GE, 6GE, 8GE, 14, 12, 12Z, 1T Series, ±5 % type

✽ When omitted, the rest of the P/N factors shall be moved up respectively.

(Only XGE, 1GE, 2GE type)

Mar. 2008

Design and speciﬁ cations are each subject to change without notice. Ask factory for the current technical speciﬁ cations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Thick Film Chip Resistors

Protective coating

Alumina substrate Electrode (Inner)

Electrode

(Between)

Thick film

resistive element Electrode (Outer)

–40 –20 0 20 40 60 80 100 120 140 160

180–60

155 °C

70 °C

Ambient Temperature (°C)

100

Rated Load (%)

–55 °C

2G, 3G, 6G, 8G,

14, 12, 12Z, 1T

XG, 1G

125 °C

■Construction ■Dimensions in mm (not to scale)

Type

(inches)

Dimensions (mm)

Mass (Weight)

(g/1000 pcs.)

LWa b t

ERJXG

(01005) 0.40±0.02 0.20±0.02 0.10±0.03 0.10±0.03 0.13±0.02 0.04

ERJ1G

(0201) 0.60±0.03 0.30±0.03 0.10±0.05 0.15±0.05 0.23±0.03 0.15

ERJ2G

(0402) 1.00±0.05 0.50±0.05 0.20±0.10 0.25±0.05 0.35±0.05 0.8

ERJ3G

(0603) 1.60±0.15 0.80+0.15 0.30±0.20 0.30±0.15 0.45±0.10 2

ERJ6G

(0805) 2.00±0.20 1.25±0.10 0.40±0.20 0.40±0.20 0.60±0.10 4

ERJ8G

(1206) 3.20+0.05 1.60+0.05 0.50±0.20 0.50±0.20 0.60±0.10 10

ERJ14

(1210) 3.20±0.20 2.50±0.20 0.50±0.20 0.50±0.20 0.60±0.10 16

ERJ12

(1812) 4.50±0.20 3.20±0.20 0.50±0.20 0.50±0.20 0.60±0.10 27

ERJ12Z

(2010) 5.00±0.20 2.50±0.20 0.60±0.20 0.60±0.20 0.60±0.10 27

ERJ1T

(2512) 6.40±0.20 3.20±0.20 0.65±0.20 0.60±0.20 0.60±0.10 45

–0.05

–0.15

–0.20

Type

(inches)

Power Rating

at 70 °C (W)

Limiting Element

Voltage (Maximum

RCWV)(1) (V)

Maximum Overload

Voltage(2)

(V)

Resistance

Tolerance

(%)

Resistance

Range

()

T.C.R.

[10–6/°C

(ppm/°C)]

Category Temperature

Range (Operating

Temperature Range)

(°C)

ERJXG

(01005) 0.031 15 30 ±5 10 to 1 M (E24) <100 :±300

100 <:±200 –55 to +125

ERJ1G

(0201) 0.05 25 50 ±5 1 to 10 M (E24)

<10 :

–100 to +600

10  to 1 M:

±200

1 M<:

–400 to +150

–55 to +125

ERJ2G

(0402) 0.1 50 100 ±5 1 to 10 M (E24) –55 to +155

ERJ3G

(0603) 0.1 75 150 ±5 1 to 10 M (E24) –55 to +155

ERJ6G

(0805) 0.125 150 200 ±5 1 to 10 M (E24) –55 to +155

ERJ8G

(1206) 0.25 200 400 ±5 1 to 10 M (E24) –55 to +155

ERJ14

(1210) 0.5 200 400 ±5 1 to 10 M (E24) –55 to +155

ERJ12

(1812) 0.5 200 400 ±5 1 to 10 M (E24) –55 to +155

ERJ12Z

(2010) 0.75 200 500 ±5 1 to 10 M (E24) –55 to +155

ERJ1T

(2512) 1200500±51 to 1 M (E24) –55 to +155

Type

(inches) Rated Current

(A)

Maximum Over load Current

(A)

ERJ1G (0201) 0.5 1

ERJ2G (0402) 12

ERJ3G (0603)

ERJ6G (0805)

ERJ8G (1206)

ERJ14 (1210)

ERJ12 (1812)

ERJ12Z (2010)

ERJ1T (2512)

Power Derating Curve

For resistors operated in ambient temperatures above

70 °C, power rating shall be derated in accordance

with the ﬁ gure below.

(1) Rated Continuous Working Voltage (RCWV) shall be de ter mined from RCWV=Power Rating  Re sis tance Values, or Limiting Element Voltage

(max. RCWV) list ed above, whichever less.

(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be de ter mined from SOTV=2.5Power Rating or max. Over load Volt age list ed above

which ev er less.

■Ratings

Mar. 2008

Thick Film Chip Resistors

Design and speciﬁ cations are each subject to change without notice. Ask factory for the current technical speciﬁ cations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

φB

φA

φC

TT TA

φD0

φD1(Only Emboss)

(2 mm pitch)

● Taping Reel

■Packaging Methods (Taping)

● Standard Quantity

● Carrier Tape

Type Kind of Taping Pitch (P1)Quantity

ERJXG Pressed Carrier Taping 2 mm

20000 pcs./reel

ERJ1G 15000 pcs./reel

ERJ2G

Punched Carrier Taping

10000 pcs./reel

ERJ3G

4 mm 5000 pcs./reel

ERJ6G

ERJ8G

ERJ14

Embossed Carrier Taping

ERJ12

ERJ12Z

ERJ1T 4000 pcs./reel

(Unit : mm)

Type φAφBφCWT

ERJXG

180.0+0 60 min. 13.0±1.0

9.0±1.0 11.4 ±1.0

ERJ1G

ERJ2G

ERJ3G

ERJ6G

ERJ8G

ERJ14

ERJ12

13.0±1.0 15.4±2.0

ERJ12Z

ERJ1T

(Unit : mm)

–3.0

Type A B W F E P1P2P0φD0TφD1

ERJXG 0.24±0.03 0.45±0.03

8.00±0.20

3.50±0.05

1.75±0.10

2.00±0.10

2.00±0.05 4.00±0.10 1.50+0.10

0.31±0.05 –

ERJ1G 0.38±0.05 0.68±0.05 0.42±0.05 –

ERJ2G 0.67±0.05 1.17±0.05 0.52±0.05 –

ERJ3G 1.10±0.10 1.90±0.10

4.00±0.10

0.70±0.05 –

ERJ6G 1.65±0.15 2.50±0.20

0.84±0.05 –

ERJ8G 2.00±0.15 3.60±0.20 –

ERJ14 2.80±0.20 3.50±0.20 8.00±0.30

1.00±0.10

1.0+0.10

ERJ12 3.50±0.20 4.80±0.20

12.00±0.30

5.50±0.20 1.5 min.

ERJ12Z 2.80±0.20 5.30±0.20

ERJ1T 3.60±0.20 6.90±0.20

−0

Pressed Carrier Punched Carrier Embossed Carrier

Feb. 2006

Design and speciﬁ cations are each subject to change without notice. Ask factory for the current technical speciﬁ cations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Thick Film Chip Resistors

Chip Resistor

Preheating

Peak

Heating

Temperature

Time

Type

(inches)

Dimensions (mm)

abc

ERJXG(01005) 0.15 to 0.20 0.5 to 0.7 0.20 to 0.25

ERJ1G (0201) 0.3 to 0.4 0.8 to 0.9 0.25 to 0.35

ERJ2G(0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6

ERJ3G (0603) 0.7 to 0.9 2 to 2.2 0.8 to 1

ERJ6G (0805) 1 to 1.4 3.2 to 3.8 0.9 to 1.4

ERJ8G (1206) 2 to 2.4 4.4 to 5 1.2 to 1.8

ERJ14(1210) 2 to 2.4 4.4 to 5 1.8 to 2.8

ERJ12(1812) 3.3 to 3.7 5.7 to 6.5 2.3 to 3.5

ERJ12Z(2010) 3.6 to 4 6.2 to 7 1.8 to 2.8

ERJ1T(2512) 5 to 5.4 7.6 to 8.6 2.3 to 3.5

Temperature Time

Preheating 140 °C to 160 °C 60 s to 120 s

Main heating Above 200 °C 30 s to 40 s

Peak 235 ± 5 °C max. 10 s

Temperature Time

Preheating 150 °C to 180 °C 60 s to 120 s

Main heating Above 230 °C 30 s to 40 s

Peak max. 260 °C max. 10 s

For soldering For lead-free soldering

Temperature Time Temperature Time

Preheating 140 °C to 180 °C 60 s to 120 s 150 °C to 180 °C 60 s to 120 s

Soldering 245 ± 5 °C 20 s to 30 s max. 260 °C max. 10 s

■Recommended Land Pattern

In case of ﬂ ow soldering, the land width must be smaller than the Chip Resistor width to control the sol der amount properly.

Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of reﬂ ow soldering, solder

amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).

■Recommended Soldering Conditions

Recommendations and precautions are described below.

●Recommended soldering conditions for reﬂ ow

For soldering (Example : Sn/Pb)

For lead-free soldering (Example : Sn/Ag/Cu)

●Recommended soldering conditions for ﬂ ow

· Reﬂ ow soldering shall be performed a maximum of

two times.

· Please contact us for additional information when

used in conditions other than those speciﬁ ed.

· Please measure the temperature of the terminals

and study every kind of solder and printed circuit

board for solderability be fore ac tu al use.

Safety Precautions

The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors

shown on page ER3 of this catalog.

1. Take measures against mechanical stress during and after mounting of Thick Film Chip Resistors (here af ter called the

resistors) so as not to damage their electrodes and protective coatings.

2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations

of the resistors when installed in your products before use.

Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.

3. Do not use halogen-based or other high-activity ﬂ ux. Otherwise, the residue may impair the resistors' per for mance

and/or reliability.

4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a

soldering iron with a high temperature tip, ﬁ nish soldering as quickly as possible (within three seconds at 350 °C max.).

5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing

problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.

6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Oth er wise, the re sis tors'

protective coatings and bodies may be chipped, affecting their performance.

7. Avo id exces si ve b en ding of printed circuit boards in order to protect the resistors from abnormal stress.

Feb. 2006

– ER3 –

Safety Precautions

(Common precautions for Fixed Resistors)

• When using our products, no matter what sort of equipment they might be used for, be sure to make a written

agreement on the speciﬁ cations with us in advance. The design and speciﬁ cations in this catalog are subject

to change without prior notice.

• Do not use the products beyond the speciﬁ cations described in this catalog.

• This catalog explains the quality and performance of the products as individual components. Be fore use, check

and evaluate their operations when installed in your products.

• Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment

where a defect in these products may cause the loss of human life or other signiﬁ cant damage, such as damage to

vehicles (au to mo bile, train, vessel), trafﬁ c lights, medical equipment, aerospace equipment, elec tric heating

ap pli anc es, com bus tion/gas equipment, rotating equipment, and disaster/crime prevention equip ment.

✽ Systems equipped with a protection circuit and a protection device

✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault

(1) Precautions for use

• These products are designed and manufactured for general and stan dard use in general elec tron ic

equipment (e.g. AV equipment, home electric ap pli anc es, ofﬁ ce equipment, information and com mu ni ca tion

equipment)

• These products are not intended for use in the following special conditions. Be fore using the products, care ful ly

check the effects on their quality and performance, and determine whether or not they can be used.

1. In liquid, such as water, oil, chemicals, or organic solvent

2. In direct sunlight, outdoors, or in dust

3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2

4. Electric Static Discharge (ESD) Environment

These components are sensitive to static electricity and can be damaged under static shock (ESD).

Please take measures to avoid any of these environments.

Smaller components are more sensitive to ESD environment.

5. Electromagnetic Environment

Avoid any environment where strong electromagnetic waves exist.

6. In an environment where these products cause dew condensation

7. S ea li ng o r co ating of these products or a printed circuit board on which these products are mounted, with resin

or other materials

• These products generate Joule heat when energized. Carefully position these products so that their heat will not

affect the other components.

• Carefully position these products so that their temperatures will not exceed the category temperature range due

to the effects of neighboring heat-generating com po nents. Do not mount or place heat-generating com po nents or

inﬂ ammables, such as vinyl-coated wires, near these products .

• Note that non-cleaning solder, halogen-based highly active ﬂ ux, or water-soluble ﬂ ux may deteriorate the

performance or reliability of the products.

• Carefully select a ﬂ ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the

performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave

water res i dues. Otherwise, the insulation performance may be deteriorated.

(2) Precautions for storage

The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your

company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °

C and a relative humidity of 45 % to 85 %.

Even within the above guarantee periods, do not store these products in the fol low ing conditions. Otherwise, their

elec tri cal performance and/or solderability may be deteriorated, and the packaging materials (e.g. tap ing ma te ri als)

may be de formed or deteriorated, resulting in mounting failures.

1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2

2. In direct sunlight

Package markings include the product number, quantity, and country of origin.

In principle, the country of origin should be indicated in English.

Oct. 2007