BAS16SL — Small Signal Diodes
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
BAS16SL Rev. A3 1
October 2010
BAS16SL
Small Signal Diodes
Features
Low Forward Voltage Drop
Fast switching
Very Sma ll and Thin SMD package
Profile height, 0.43mm max
Footprint, 1.0 x 0.6mm
Absolute Maximum Ratings * TA = 25°C unless otherwise noted
* These ratings are limiting value s ab ove which the serviceability of the diode may be impaired.
The factory should be consulted on applications involving pulsed or low duty cycl e operations.
Thermal Characteristics
* Minimum land pad.
Electrical Characteristics TA=25°C unless otherwise noted
Symbol Parameter Value Unit
VRRM Maximum Repetitive Reverse Voltage 85 V
IF(AV) Average Rectified Forward Current 150 mA
IFSM Forward Surge Current
(8.3mS Single Half Sine-Wave) 500 mA
TJ, TSTG Operating Junction & Storage Temperature Range -55 to +150 °C
Symbol Parameter Value Unit
PDPower Dissipation 227 mW
RθJA Thermal Resistance, Junction to Ambient *520 °C/W
Symbol Parameter Test Conditions Min. Max. Unit
VRBreakdown Voltage IR = 100μA85 V
VFForward Voltage IF = 1mA
IF = 10mA
IF = 50mA
IF = 150mA
715
855
1.0
1.25
mV
mV
V
V
IRReverse Leakage VR = 75V
VR = 25V@150°C
VR = 75V@150°C
1.0
30
50
μA
μA
μA
trr Reverse Recovery Time IF = IR= 10mA, irr = 0.1IR8.0 nS
CjJunction Capacitance VR = 0, f = 1.0MHz 2.0 pF
Connection Diagram
2
1
2
1
SOD-923F
Marking: AB
BAS16SL — Small Signal Diodes
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
BAS16SL Rev. A3 2
Typical Performance Characteristics
Figure 1. Forward Current Characteristics Figure 2. Reverse Leakage Current
Figure 3. Junction Capacitance Figure 4. Power Derating
1
10
100
0.20.30.40.50.60.70.80.91.0
TJ=150 oC
TJ=85 oC
TJ=25 oC
Forward Voltage Drop, VF[V]
Forward Current, IF[mA]
10 20 30 40 50 60 70 80 90 100
1
10
100
1000
10000
100000
TJ=150 oC
TJ=25 oC
Reverse Current, IR[nA]
Reverse Voltage, VR[V]
TJ=85 oC
0246810
1.0
1.3
1.5
1.8
2.0
f=1mhz
Juntion Capacitance, CJ[pF]
Reverse Voltage, VR[V]
0 25 50 75 100 125 150
0
50
100
150
200
250
300
Power Dissipation, [ mW]
Ambient Tempe rature, Ta[oC]
BAS16SL — Small Signal Diodes
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
BAS16SL Rev. A3 3
Physical Dimensions
NOTES:
A) THIS PACKAGE DOES NOT COMPLY
TO ANY CURRENT PACKAGING STANDARD.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) BODY DIMENSIONS ARE INCLUSIVE OF BURRS, AND
MOLD FLASH.
D) DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994
E) LANDPATTERN BASED ON NOMINAL PACKAGE
DIMENSIONS.
F) DRAWING FILE NAME : SOD923F1REV2
LAND PATTERN RECOMMENDATION
0.82
0.32
0.28
0.75 - 0.85
0.55 - 0.65
TOP VIEW
0.08 - 0.14 0.43 Max
0.05
0.00
SIDE VIEW END VIEW
A
B
0.08 A B
2X
0.90 - 1.10
0.39 - 0.41
0.05 - 0.15
SEATING PLANE
0.15
0.05
BOTTOM VIEW
0.26
0.10
0.27
0.17
SOD-923F
Dimensions in Millimeters
© Fairchild Semiconductor Corporation www.fairchildsemi.com
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The datasheet is for reference information only. Rev. I50