1. General description
The 74HC157; 74HCT157 is a high-speed Si-gate CMOS device and is pin compatible
with Low-power Schottky TTL. It is specified in compliance with JEDEC standard no. 7A.
The 74HC/HCT157 are quad 2-input multiplexers which select 4 bits of data from two
sources under the control of a common data select input (S). The en able input (E) is
active LOW. When E is HIGH, all of the outputs (1Y to 4Y) are forced LOW regardless of
all other input conditions.
Moving the data from two groups of registers to four common output buses is a common
use of the 74HC/HCT157. The state of the common data select input (S) determines the
particular register from which the data come s. It can also be used as function generator.
The device is useful for implementing highly irregular logic by generating any four of the
16 different functions of two var iab les with on e va ria ble comm on . Th e 74HC /HC T1 5 7 is
logic implementa tion of a 4-pole, 2-position switch, where the position of the switch is
determined by the logic levels applied to S.
The logic equations are:
1Y = E (1I1 S+1I0 S)
2Y = E (2I1 S+2I0 S)
3Y = E (3I1 S+3I0 S)
4Y = E (4I1 S+4I0 S)
The 74HC/HCT 15 7 is ide nt ical to the 74 HC 15 8 bu t ha s no n-i nv er tin g (tr ue ) outpu ts.
2. Features and benefits
Low-power dissipation
Complies with JEDEC standard no. 7A
Input levels:
For 74HC157: CMOS level
For 74HCT157: TTL level
Non-inverting data path
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Specified from 40 Cto+85C and from 40 Cto+125C
74HC157; 74HCT157
Quad 2-input multiplexer
Rev. 8 — 28 December 2015 Product data sheet
74HC_HCT157 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 8 — 28 December 2015 2 of 18
NXP Semiconductors 74HC157; 74HCT157
Quad 2-input multiplexer
3. Ordering information
4. Functional diagram
Table 1. Ordering information
Type number Package
Temperatur e range Name Description Version
74HC157D 40 C to +125 C SO16 plastic small outline package; 16 leads; body width
3.9 mm SOT109-1
74HCT157D
74HC157DB 40 C to +125 C SSOP16 plastic shrink small outline package; 16 leads;
body width 5.3 mm SOT338-1
74HCT157DB
74HC157PW 40 C to +125 C TSSOP16 plastic thin shrink small outline package; 16 leads;
body width 4.4 mm SOT403-1
74HCT157PW
74HC157BQ 40 C to +125 C DHVQFN16 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 16 terminals;
body 2.5 3.5 0.85 mm
SOT763-1
74HCT157BQ
Fig 1. Logic diag ra m Fig 2. logic symbo l
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74HC_HCT157 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 8 — 28 December 2015 3 of 18
NXP Semiconductors 74HC157; 74HCT157
Quad 2-input multiplexer
5. Pinning information
5.1 Pinning
Fig 3. Logic symbol Fig 4. IEC logic symbol
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74HC_HCT157 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 8 — 28 December 2015 4 of 18
NXP Semiconductors 74HC157; 74HCT157
Quad 2-input multiplexer
5.2 Pin description
6. Functional description
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care.
7. Limiting values
[1] Ptot derates linearly with 8 mW/K above 70 C.
[2] Ptot derates linearly with 5.5 mW/K above 60 C.
[3] Ptot derates linearly with 4.5 mW/K above 60 C.
Table 2. Pin description
Symbol Pin Description
S 1 common data select input
1I0 to 4I0 2, 5, 11, 14 data inputs from source 0
1I1 to 4I1 3, 6, 10, 13 data inputs from source 1
1Y to 4Y 4, 7, 9, 12 multiplexer outputs
GND 8 ground (0 V)
E15 enable input (active LOW)
VCC 16 supply voltage
Table 3. Function table[1]
Input Output
ESnI0 nI1 nY
HXXXL
LLLXL
LLHXH
LHXLL
LHXHH
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage 0.5 +7 V
IIK input clamping current VI < 0.5 V or VI>V
CC +0.5 V - 20 mA
IOK output clamping current VO<0.5 V or VO>V
CC +0.5V - 20 mA
IOoutput current VO = 0.5 V to (VCC +0.5V) - 25 mA
ICC supply current - +50 mA
IGND ground current 50 - mA
Tstg storage temperature 65 +150 C
Ptot total power dissipation Tamb = 40 C to +125 C
SO16 package [1] - 500 mW
(T)SSOP16 package [2] - 500 mW
DHVQFN16 package [3] - 500 mW
74HC_HCT157 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 8 — 28 December 2015 5 of 18
NXP Semiconductors 74HC157; 74HCT157
Quad 2-input multiplexer
8. Recommended operating conditions
9. Static characteristics
Table 5. Recommended operating con ditions
Voltages are referenced to GND (ground = 0 V)
Symbol Parameter Conditions 74HC157 74HCT157 Unit
Min Typ Max Min Typ Max
VCC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V
VIinput voltage 0 - VCC 0-V
CC V
VOoutput voltage 0 - VCC 0-V
CC V
Tamb ambient temperature 40 +25 +125 40 +25 +125 C
t/V input transition rise and fall rate VCC = 2.0 V - - 625 - - - ns/V
VCC = 4.5 V - 1.67 139 - 1.67 139 ns/V
VCC = 6.0 V - - 83 - - - ns/V
Table 6. Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Tamb = 25 C Tamb = 40 C
to +85 CTamb = 40 C to
+125 CUnit
Min Typ Max Min Max Min Max
74HC157
VIH HIGH-level
input voltage VCC = 2.0 V 1.5 1.2 - 1.5 - 1.5 - V
VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V
VCC = 6.0 V 4.2 3.2 - 4.2 - 4.2 - V
VIL LOW-level
input voltage VCC = 2.0 V - 0.8 0.5 - 0.5 - 0.5 V
VCC = 4.5 V - 2.1 1.35 - 1.35 - 1.35 V
VCC = 6.0 V - 2.8 1.8 - 1.8 - 1.8 V
VOH HIGH-level
output voltage VI=V
IH or VIL
IO=20 A; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V
IO=20 A; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V
IO=20 A; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V
IO=4.0 mA; VCC = 4.5 V 3.98 4.32 - 3.84 - 3.7 - V
IO=5.2 mA; VCC = 6.0 V 5.48 5.81 - 5.34 - 5.2 - V
VOL LOW-level
output voltage VI=V
IH or VIL
IO=20A; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V
IO=20A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V
IO=20A; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V
IO= 4.0 mA; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V
IO= 5.2 mA; VCC = 6.0 V - 0.16 0.26 - 0.33 - 0.4 V
IIinput leakage
current VI=V
CC or GND; VCC =6.0V - - 0.1 - 1.0 - 1.0 A
ICC supply current VI=V
CC or GND; IO=0A;
VCC =6.0V - - 8.0 - 80 - 160 A
74HC_HCT157 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 8 — 28 December 2015 6 of 18
NXP Semiconductors 74HC157; 74HCT157
Quad 2-input multiplexer
CIinput
capacitance -3.5- - - - -pF
74HCT157
VIH HIGH-level
input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - 2.0 - V
VIL LOW-level
input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 - 0.8 V
VOH HIGH-level
output voltage VI=V
IH or VIL; VCC =4.5V
IO=20 A 4.4 4.5 - 4.4 - 4.4 - V
IO=4 mA 3.98 4.32 - 3.84 - 3.7 - V
VOL LOW-level
output voltage VI=V
IH or VIL; VCC =4.5V
IO=20A - 0 0.1 - 0.1 - 0.1 V
IO= 4.0 mA - 0.15 0.26 - 0.33 - 0.4 V
IIinput leakage
current VI=V
CC or GND; VCC =5.5V - - 0.1 - 1.0 - 1.0 A
ICC supply current VI=V
CC or GND; IO=0A;
VCC =5.5V - - 8.0 - 80 - 160 A
ICC additional
supply current VI=V
CC 2.1 V;
other inputs at VCC or GND;
VCC = 4.5 V to 5.5 V; IO=0A
per input pin; nI0, nI1 inputs - 100 360 - 450 - 490 A
per input pin; E input - 60 216 - 270 - 294 A
per input pin; S input - 100 360 - 450 - 490 A
CIinput
capacitance -3.5- - - - -pF
Table 6. Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Tamb = 25 C Tamb = 40 C
to +85 CTamb = 40 C to
+125 CUnit
Min Typ Max Min Max Min Max
74HC_HCT157 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 8 — 28 December 2015 7 of 18
NXP Semiconductors 74HC157; 74HCT157
Quad 2-input multiplexer
10. Dynamic characteristics
Table 7. Dynamic characteristics
Vo ltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 9.
Symbol Parameter Conditions Tamb = 25 C Tamb = 40 C
to +85 CTamb = 40 C
to +125 CUnit
Min Typ Max Min Max Min Max
74HC157
tpd propagation
delay nI0, nI1 to nY; see Figure 7 [1]
VCC = 2.0 V - 36 125 - 155 - 190 ns
VCC = 4.5 V - 13 25 - 31 - 38 ns
VCC =5V; C
L=15pF - 11 - - - - - ns
VCC = 6.0 V - 10 21 - 26 - 32 ns
S to nY; see Figure 7 [1]
VCC = 2.0 V - 41 125 - 155 - 190 ns
VCC = 4.5 V - 15 25 - 31 - 38 ns
VCC =5V; C
L=15pF - 12 - - - - - ns
VCC = 6.0 V - 12 21 - 26 - 32 ns
Eto nY; see Figure 8 [1]
VCC = 2.0 V - 39 115 - 145 - 175 ns
VCC = 4.5 V - 14 23 - 29 - 35 ns
VCC =5V; C
L=15pF - 11 - - - - - ns
VCC = 6.0 V - 11 20 - 25 - 30 ns
tttransition
time nY; see Figure 7 [2]
VCC = 2.0 V - 19 75 - 95 - 110 ns
VCC = 4.5 V - 7 15 - 19 - 22 ns
VCC = 6.0 V - 6 13 - 16 - 19 ns
CPD power
dissipation
capacitance
CL=50pF;f=1 MHz;
VI=GNDtoV
CC
[3] -70- - - - -pF
74HCT157
tpd propagation
delay nI0, nI1 to nY; see Figure 7 [1]
VCC = 4.5 V - 16 27 - 34 - 41 ns
VCC =5V; C
L=15pF - 13 - - - - - ns
S to nY; see Figure 7 [1]
VCC = 4.5 V - 22 37 - 46 - 56 ns
VCC =5V; C
L=15pF - 19 - - - - - ns
Eto nY; see Figure 8 [1]
VCC = 4.5 V - 15 26 - 33 - 39 ns
VCC =5V; C
L=15pF - 12 - - - - - ns
74HC_HCT157 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 8 — 28 December 2015 8 of 18
NXP Semiconductors 74HC157; 74HCT157
Quad 2-input multiplexer
[1] tpd is the same as tPLH and tPHL.
[2] tt is the same as tTHL and tTLH.
[3] CPD is used to determine the dynamic power dissipation (PD in W).
PD=C
PD VCC2fiN+(CLVCC2fo) where:
fi = input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CLVCC2fo) = sum of outputs.
11. Waveforms
tttransition
time nY; see Figure 7 [2]
VCC = 4.5 V - 7 15 - 19 - 22 ns
CPD power
dissipation
capacitance
CL=50pF;f=1 MHz;
VI= GND to VCC 1.5 V [3] -70- - - - -pF
Table 7. Dynamic characteristics …continued
Vo ltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 9.
Symbol Parameter Conditions Tamb = 25 C Tamb = 40 C
to +85 CTamb = 40 C
to +125 CUnit
Min Typ Max Min Max Min Max
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 7. Propagation delay input (nI0, nI1, S) to output (nYn)
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74HC_HCT157 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 8 — 28 December 2015 9 of 18
NXP Semiconductors 74HC157; 74HCT157
Quad 2-input multiplexer
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 8. Prop a ga t io n de la y input (E) to output (nY)
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Table 8. Measurement points
Type Input Output
VMVM
74HC157 0.5VCC 0.5VCC
74HCT157 1.3 V 1.3 V
74HC_HCT157 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 8 — 28 December 2015 10 of 18
NXP Semiconductors 74HC157; 74HCT157
Quad 2-input multiplexer
Test data is given in Table 9.
Definitions test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
CL = Load capacitance including jig and probe capacitance.
RL = Load resistance.
S1 = Test selection switch.
Fig 9. Test circuit for measuring switching times
Table 9. Test data
Type Input Load Test
VItr, tfCL
74HC157 VCC 6.0 ns 15 pF, 50 pF tPLH, tPHL
74HCT157 3.0 V 6.0 ns 15 pF, 50 pF tPLH, tPHL
74HC_HCT157 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 8 — 28 December 2015 11 of 18
NXP Semiconductors 74HC157; 74HCT157
Quad 2-input multiplexer
12. Package outline
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74HC_HCT157 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 8 — 28 December 2015 12 of 18
NXP Semiconductors 74HC157; 74HCT157
Quad 2-input multiplexer
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74HC_HCT157 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 8 — 28 December 2015 13 of 18
NXP Semiconductors 74HC157; 74HCT157
Quad 2-input multiplexer
Fig 12. Package outline SOT403-1 (TSSOP16)
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74HC_HCT157 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 8 — 28 December 2015 14 of 18
NXP Semiconductors 74HC157; 74HCT157
Quad 2-input multiplexer
Fig 13. Package outline SOT763-1 (DHVQFN16)
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74HC_HCT157 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 8 — 28 December 2015 15 of 18
NXP Semiconductors 74HC157; 74HCT157
Quad 2-input multiplexer
13. Abbreviations
14. Revision history
Table 10. Abbreviations
Acronym Description
CMOS Complementary Metal Oxide Semiconductor
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
MM Machine Model
TTL Transistor-Transistor Logic
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
74HC_HCT157 v.8 20151228 Product data sheet - 74HC_HCT157 v.7
Modifications: Type numbers 74HC157 N and 74HCT157N (SOT38-4) removed.
74HC_HCT157 v.7 20150121 Product data sheet - 74HC_HCT157 v.6
Modifications: Table 7: Power dissipation capacitance condition for 74HCT 157 is corrected.
74HC_HCT157 v.6 20120827 Product data sheet - 74HC_HCT157 v.5
Modifications: Package outline drawing DIP16 add ed.
74HC_HCT157 v.5 20120425 Product data sheet - 74HC_HCT157 v.4
Modifications: Figure 7 updated with transition times.
74HC_HCT157 v.4 20111219 Product data sheet - 74HC_HCT157 v.3
74HC_HCT157 v.3 20101231 Product data sheet - 74HC_HCT157_CNV v.2
74HC_HCT157_CNV v.2 19970827 Product specification - -
74HC_HCT157 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 8 — 28 December 2015 16 of 18
NXP Semiconductors 74HC157; 74HCT157
Quad 2-input multiplexer
15. Legal information
15.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not b e relied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semicond uctors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre va il.
Product specificatio n The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warrant ies, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect , incidental ,
punitive, special or consequ ential damages (including - wit hout limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconduct ors’ aggregate and cumulati ve liability toward s
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descripti ons, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use NXP Semiconductors product s are not designed,
authorized or warranted to be suitable for use in life support , life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expect ed
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications and ther efore such inclu sion and/or use is at the cu stomer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for t he customer’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Custo mers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liabil i ty related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party custo mer(s). Customer is responsible for doing all necessa ry
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or the gr ant,
conveyance or implication of any license under any copyrights, patents or
other industrial or inte llectual property right s.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Develop ment This document contain s data from the objective specification for product develop ment.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specificat ion.
Product [short] data sheet Production This document contains the product specification.
74HC_HCT157 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 8 — 28 December 2015 17 of 18
NXP Semiconductors 74HC157; 74HCT157
Quad 2-input multiplexer
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors prod uct is automotive qualified,
the product is not suitable for automotive use. It i s neit her qua lif ied nor test ed
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or app lications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standards, custome r
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such au tomotive applications, use and specifica tions, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y
liability, damages or failed product claims resulting from custome r design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
15.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respective ow ners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors 74HC157; 74HCT157
Quad 2-input multiplexer
© NXP Semiconductors N.V. 2015. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 28 December 2015
Document identifier: 74HC_HCT157
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
17. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Functional description . . . . . . . . . . . . . . . . . . . 4
7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Recommended operating conditions. . . . . . . . 5
9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
13 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 15
14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15
15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
15.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
16 Contact information. . . . . . . . . . . . . . . . . . . . . 17
17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18