BAS70 thru BAS70-06
Vishay Semiconductors
for mer ly General Semiconductor
Document Number 88130 www.vishay.com
10-May-02 1
Schottky Diodes
Maximum Ratings and Thermal Characteristics (TA= 25°C unless otherwise noted)
Parameter Symbol Value Unit
Repetitive Peak Reverse Voltage VRRM 70 V
Forward Continuous Current at Tamb = 25°CI
F200(1) mA
Surge Forward Current at tp < 1 s, Tamb = 25°CI
FSM 600(1) mA
Power Dissipation(1) at Tamb = 25°CP
tot 200(1) mW
Thermal Resistance Junction to Ambiant Air RθJA 430(1) °C/W
Junction Temper ature Tj150 °C
Storage Temperature Range TS–55 to +150 °C
Note:
(1) Device on fiberglass substrate, see layout on next page.
.016 (0.4)
.056 (1.43)
.037(0.95).037(0.95)
max. .004 (0.1)
.122 (3.1)
.016 (0.4) .016 (0.4)
12
3Top View
.102 (2.6)
.007 (0.175)
.045 (1.15)
.110 (2.8)
.052 (1.33)
.005 (0.125)
.094 (2.4)
.037 (0.95)
Features
• These diodes feature very low tur n-on voltage and
fast switching.
• These devices are protected by a PN junction
guard ring against excessive voltage, such as
electrostatic discharges.
TO-236AB (SOT-23)
Mechanical Data
Case: SOT-23 Plastic Package
Weight: approx. 0.008g
Packaging Codes/Options:
E8/10K per 13”reel (8mm tape), 30K/box
E9/3K per 7”reel (8mm tape), 30K/box
Dimensions in inches and (millimeters) Mounting Pad Layout
0.079 (2.0)
0.037 (0.95)
0.035 (0.9)
0.031 (0.8)
0.037 (0.95)
Top View
Top View
BAS70
Marking: 73
BAS70-05
Marking: 75
BAS70-04
Marking: 74
BAS70-06
Marking: 76
BAS70 thru BAS70-06
Vishay Semiconductors
for mer ly General Semiconductor
www.vishay.com Document Number 88130
210-May-02
Electrical Characteristics(TJ= 25°C unless otherwise noted)
Parameter Symbol Test Condition Min Typ Max Unit
Reverse Breakdown Voltage V(BR)R IR = 10µA (pulsed) 70 ——V
Leakage Current IRVR = 50V —20 100 nA
F orward Voltage VFIF = 1mA ——410 mV
IF= 15mA(1) ——1000 mV
Capacitance Ctot VR= 0V —1.5 2 pF
f = 1MHz
Reverse Recover y Time trr IF= 10mA, IR = 10mA —— 5ns
Irr = 1mA, RL= 100Ω
Note:
(1) Pulse test; tp≤300µs
0.59 (15)
0.2 (5)
0.03 (0.8)
0.30 (7.5)
0.12 (3)
.04 (1)
0.06 (1.5)
0.20 (5.1)
.08 (2)
.08 (2)
.04 (1)
0.47 (12)
Dimensions in inches (millimeters)
Layout for RθJA test
Thickness: Fiberglass 0.059 in. (1.5 mm)
Copper leads 0.012 in. (0.3 mm)
