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Chip Resistor PRODUCT SPECIFICATION FOR INFORMATION 151-SRJ-E4330B
Part No.
ERJ8BW 9 - 1
Panasonic Electronic Devices Co., Ltd.
1. Dimension
2. Power Derating Curve
100
80
60
40
20
0
120
Ambient Tem per ature (oC)
Rated Power (%)
-60 -40 -20 020 40 60 80 100 120 140 160
70
155
-55
3. Ratings ItemRated value (Explanation)
Power rating 0.50 W
Rated voltage The rated voltage of each resistance should be calculated from the
equation below. valuecetanRasisratingPowervoltageRated ×=
Resistance tolerance ± 1% (F), ± 2% (G), ± 5% (J)
Resistance range 0.010 Ω to 0.100 Ω (E-24)
Category temperature range:
-55 oC to +155 oC
(1) Substrate: Alumina
(2) Protective Coating: Resin
(3) Resistive Element: Metal glaze
(4) Inner Termination: Thick film material
(5) Middle Termination 1: Cu Plating
(6) Middle Termination 2: Ni Plating
(7) Outer Termination: Sn Plating
L
W t
b b
a
a
(1) (2) (3) (4) (5) (6) (7)
When used at ambient temperatur e above 70 oC, power
rating shall be determined in accordance wit h Figure 1.
Figure 1
L W t
Dimension (mm) 3.20±0.201.60±0.200.65±0.10
a b
Dimension (mm) 1.00±0.20 1.00±0.20
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Chip Resistor PRODUCT SPECIFICATION FOR INFORMATION 151-SRJ-E4330B
Part No.
ERJ8BW 9 - 2
Panasonic Electronic Devices Co., Ltd.
4. Explanation of Part Number
E R J 8 B W J R 0 1 6 V
(1) (2) (3) (4) (5) (6)
(1) Product code : Thick Film Chip Resistor
(2) Size and power rating : 3.2 mm x 1.6 mm, 0.50W
(3) Resistance range
Code Resistance range
W 0.010 Ω to 0.100 Ω
(4) Resistance Tolerance
Code Resistance tolerance
F ± 1%
G ± 2%
J ± 5%
(5) Resistance value
" R " means decimal point, and the other three digit s are significant figures of resistanc e value.
ex) R016 → 0.016Ω
(6) Packaging configurat ion
Code Packaging configuration
V Taping (5,000 pcs/reel)
5. Appearance & Construction
ItemExplanation
Appearance &
Construction
1. The resistive element should be covered with protective coating that does not fade
easily. The surface of coating should avoid uneven ness, f law, pinhole and
discoloration.
2. The electrode should be printed uniformly, as shown in the dimensio ns. The plating
should not fade easily , and should avoid unevenness, flaw, pinhole, projection and
discoloration.
3. The electrode should be connected electrically, mechanically to resistive ele ment.
4. Dimensions of the substrate should be as in the list and it should not h ave chipping,
flaw, flash and crack. Details of appearance criteria shall be as desc ribed in
attached sheet.
As far as there shall not designation especially, the following tests and measurement shall be operated
under the following conditions.
Normal temperature: 5 oC to 35
oC
Normal humidity: 45 %RH to 85 %RH
Normal atmospheric pressure: 86 k Pa to 106 k Pa
<Measuring method>
In measuring resistance val ue, 4 wires must be put on the top terminals as below .
wires
wires
terminals
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Chip Resistor PRODUCT SPECIFICATION FOR INFORMATION 151-SRJ-E4330B
Part No.
ERJ8BW 9 - 3
Panasonic Electronic Devices Co., Ltd.
6. P erformance Spec ificatio n
ItemSpecification Test method (JIS-C5201-1)
DC resistance DC resistance value shall be
within the sp ecified t oleranc e. At 20 oC, 65%RH
Temperature
coefficient
of resistance
(TCR)
± 200 x 10–6/ oC
(0.01Ω to 0.043Ω)
± 100 x 10–6/ oC
(0.047Ω to 0.100Ω)
Natural resistance chan ge per temperature degree
centigrade.
TCR=(R2-R1)x106/R1(t2-t1) (x10–6/ oC)
R1: Re sistanc e value at reference te mperatu re
(t1)
R2: Resistance value at test temperature (t2)
t1: 25 oC , t2: 125 oC
Short time
overload∆R: ± (2% +0.005 Ω) Resistors shall be applied 2.5 times the rated voltage
for 5 s.
Intermittent
overload∆R: ± (5% +0.005 Ω) Resistors shall be subjected to 10,000 cycles of 2.0
times the rated voltage applied for 1 s with pause of
25 s between applying.
Dielectric
withstanding
No evidence of flashover,
mechanical damage, arc ing
or insulation break down
Insulation
resistanceMi n. 1,000 M Ω
AC 200V b etween s ubstrate a nd termi nation f or 1 min.
AC powersupply
or
Insulation
resistance meter
After applying DC 200V to the res istor, insulation
resistance shall be measured.
7. Mechanical Characteristics
Item Specifications Test method (JIS-C5201-1)
Bending
strength ∆R: ± (1% +0.005 Ω)
and no mechanical dam age.
Substrate: Glass epoxy (t=1.6 mm)
Span: 90mm
Bending distance: 3mm (10 s)
<Test pattern>
Solderability Termination should be
covered uniformly with
solder (Min. 95% coverage)
Resistors shall be dipped in the melted s olde r bath at
235 oC ± 5 oC for 2 s ± 0.5 s. Flux shall be removed
from the surface of terminatio n with clean organic
solvent.
Resistance to
soldering heat ∆R: ± (1% +0.005 Ω) Resistors shall be dipped in the melted s olde r bath at
270 oC ± 3 oC for 10 s ± 1 s.
(Unit: mm)
100
40
1.4 2.2 1.4
2.
0
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Chip Resistor PRODUCT SPECIFICATION FOR INFORMATION 151-SRJ-E4330B
Part No.
ERJ8BW 9 - 4
Panasonic Electronic Devices Co., Ltd.
Item Specification Test method (JIS-C5201-1)
Vibration∆R: ± (1% +0.005 Ω)
Resistors shall be subjected to a single vibration
having as double amplitude of 1.5 mm in 3 direct ions
perpendicular one another for 2 h each (6 h in total).
The vibration f requency shall be varied uniformly
from 10 Hz to 55 Hz, and return to 10 Hz traversing
for 1 min.
Resistance to
solvent
∆R: ± (0.5% +0.005 Ω)
and without distinct
deformation in appearance
Solvent solution: Isopropyl alcohol
(1) Dipping 10 h ± 1 h, dry in room condition for 30
min ± 10 min.
(2) Ultrasonic wave washing 5 min ± 1 min
(0.3W/cm, 28kHz), dry in room condition for 30
min ± 10 min.
8. Environmental Test
Item Specification Test method (JIS-C5201-1)
Low temperature
exposure ∆R: ± (1% +0.005 Ω)Resi stors shal l be exposed at -55 oC ± 3 oC with no
load for 1000 h +48/-0 h.
High temperature
exposure ∆R: ± (1% +0.005 Ω)Resi stors shal l be exposed at 125 oC ± 3 oC with no
load for 1000 h +48/-0 h.
Resistors shall be tested for 5 cy cles continuously in
accordance with the following duty cycle.
Step Temperature (oC) Time (min.)
1 -55 ± 330
2 Room temperature Max. 3
3 +125 ± 330
4 Room temperature Max.3
Temperature
cycling ∆R: ± (1% +0.005 Ω)
Humidity
(Steady state) ∆R: ± (1% +0.005 Ω) Resistors shall be exposed at 60 oC ± 2 oC and 90%
to 95% relative hummidity in a humidity test chamber
for 1000 h +48/-0 h.
Load Life∆R: ± (3% +0.005 Ω)Resistors shall be operated at DC rated voltag e (1.5
h "ON " , 0. 5 h "O F F " ) f o r 100 0 h +48/- 0 h i n a te s t
chamber controlled at 70 oC ± 2 oC.
Load life in
Hhumidity∆R: ± (3% +0.005 Ω)
Resistors shall be operated at DC rated voltag e (1.5
h “ON”, 0.5 h “OFF”) for 1000 h +48/-0 h in a t est
chamber controlled at 60 oC ± 2 oC and at 90 % to
95% in relative hummidity.
9. Resistance value marking
No marking
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Chip Resistor PRODUCT SPECIFICATION FOR INFORMATION 151-SRJ-E4330B
Part No.
ERJ8BW 9 - 5
Panasonic Electronic Devices Co., Ltd.
10. Common Precautions in Handling Resistors
Notice for use
(1) This specification shows the quality and performance of a unit component. Before adoption, be sure
to evaluate and verify the product mounting it in your product.
(2) We take no responsibility f or t roubles caused by the product usage that is not specif ied in this
specification.
(3) Use fail-safe design and ensure safety by carrying out the following items in cases where it is
forecast that the failure of the product gives serious damage to something important like human life,
for instant in traffic transportation equipment (trains, cars, traffic signal equipment, etc.), medic al
equipment, aerospace equipment, electric heating appliances, combustion and gas equipment,
rotating equipment, disaster and crime preventive equipment.
* Ensure safety as the system by setting protect ive circuits and protective equipment.
* Ensure safety as the system by s etting such redundant circuits as do not cause danger by a single
failure.
(4) When a dogma sh all be occurred about safety for this product, be sure to inform us rapidly, operate
your technical examination.
(5) The product is design ed t o use in general standard applications of general elec tric equipment (AV
products, household electric appliances, office equipment, information and communication
equipment, etc.); hence, it do not take the use under the following special environments into
consideration. Acc ordingl y, the use in the following special env ironments, and such envir onmental
conditions may affect the performance of the product; prior to use, verify the performance, reliability,
etc. thoroughly.
1) Use in liquids such as water, oil, chemic al, and organic solvent.
2) Use under direct s unlig ht , in outdoor or in dusty atmospheres.
3) Use in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX.
4) Use in environment with large s tatic electricity or strong electroma gnetic waves.
5) Where the product is c lose to a heating component, and where an inflammable such as a
polyvinyl chloride wire is arranged close to the product.
6) Where the resistor is sea led or coated with resin, etc.
7) Where water or a water-soluble detergent is used in cleaning free soldering and in flux cleaning
af ter soldering (Pay particular attention to soluble flux.)
8) Use in such a place where the pr oduct is wetted due to dew condensation.
(6) If transient load (heavy load in a short time) like pulse is expected to be applied, carry out
evaluation and confirmation test wit h resistors actually mounted on your own board. When the load
of more than rated power is applied under the load conditio n at s t eady state, it may impair
performance and/or reliability of resistor. Never exceed the rated power. When the product shall be
used under special conditi on, be sure to ask us in advance.
(7) Halogen type (Chlorine type, Bromine type, etc.) or other high-activity flux is not recommended as
the residue may affec t performance or reliability of resistors.
(8) When soldering with solde rin g iron, never touch the body of the chip resistor with a tip of the
soldering iron. When usin g a soldering iron with a tip at high temperatu re, solder for a time as short
as possible. (3 s or less up to 350 oC)
(9) Avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pli ers or
tweezers) as it may damage protective film or the body of resistor and may affect resistor’s
performance.
(10) Avoid immersion of chip resistor in solvent for long time. Use solvent after the effect of im
mersion is confirmed.
(11) When using the mounting machine with the pushing up pin, be sure to confirm whether to
damage protective coating on the bottom side.
(12) Please confirm whether the chip standing is occurred and please confirm the selfalignment,
when you do silk-plinting on the mounted place.
!
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Chip Resistor PRODUCT SPECIFICATION FOR INFORMATION 151-SRJ-E4330B
Part No.
ERJ8BW 9 - 6
Panasonic Electronic Devices Co., Ltd.
11. Storage Method
If the product is stored in the following environments and conditions, the performance and solderability
may be badly aff ect ed, avoid the storage in the following environments.
(1) Storage in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX.
(2) Storage in places exposed to direct sunlight.
(3) Storage in places outside the temperature range of 5 oC to 35 oC and humidity range of 45 %RH to
85 %RH.
(4) Storage over a year after our delivery (This item also applies to the case where the storage
method specified in item (1) to (3) has been foll owed.).
12. Laws and Regulations
(1) This product has not been man ufactured with any ozone-depleting chemical controlled unde r the
Montreal Protocol.
(2) This product complies with the RoHS Directive (Restriction of the use of certain Hazardous
Substances in electrical and e lectronic equipment (DIRECTIVE 2002/95/E C)).
(3) All materials used in this part are registered material under the Law Concerni ng the Examination and
Regulation of Manufacturs, etc. of Chemical substances.
(4) All the materials used in this part contain no brominated materials of PBBOS or PBBS as the
flame-retardant.
(5) If you need the notice by letter of “A preliminary judgement on the laws of Japan foreign exchan ge an d
foreign trade control”, be sure to let us know.
13. P ro d uc t i o n S i t e
Country: Japan
Plant: Panasonic Electronic Devices Fukui Co., Ltd.
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Chip Resistor PRODUCT SPECIFICATION FOR INFORMATION 151-SRJ-E4330B
Part No.
ERJ8BW 9 - 7
Panasonic Electronic Devices Co., Ltd.
14. Taped and Reel Package
14-1. Physical Dimensions
Structure and dimensio ns of reel shall be as shown in the figure below.
Inaccordance with EIAJ ET-7200.
14-2 Carrier Tape Dimension
A B W F E
Dimension (mm) 2.00±0.15 3.60±0.20 8.00±0.20 3.50±0.05 1.75±0.10
P1 P
2 P
0 φD0 T
+0.10
Dimension (mm) 4.00±0.10 2.00±0.05 4.00±0.10 1.50 −0 0.84±0.05
14-3 Spec i f icati o ns
14-3-1 Taping
(1) Minimum Bending Radius
When carrier tape shall be bent by minimum b ending radius (15mm), no defection of chip and n o
break of carrier tape. However minimum bending radius shall be tested for 1 time.
(2) Resistance to climate of top tape
When it shall be exposed at 60 oC, 90 %RH to 95 %RH for 120 h, no exf oliation of top tape.
(3) When the test shall be operated with the below conditions, peel s t rength sho uld be 0.049 N to 0.49 N,
should not have flash and tear after peeling.
(Test M ethod)
Peeling directionCarrier tape
Top tape
10 o
unit: mm
11.4mm ± 1.0mm
9.0mm
±
1.0mm
180.0mm +0/−3.0mm
13.0mm ± 1.0mm
60.0mm Min.
Carrier tape
Top tape
Adhesive tape
W
F E
P1P2P0
A
B
φD0 Sprocket hole
Chip hole Chip resistor
T
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Chip Resistor PRODUCT SPECIFICATION FOR INFORMATION 151-SRJ-E4330B
Part No.
ERJ8BW 9 - 8
Panasonic Electronic Devices Co., Ltd.
14-3-2 Quantity in Taping: 5,000 pcs./reel
14-3-3 Tape packaging
(1) Resistance side shall be facing upward.
(2) Chip resistor shall not be sticking to top tape and bottom tape.
(3) Chip resistor shall be easy to take out from carrier tape and chip hole or sprocket hole shall not have
flash and break.
14-4 Outer Packaging Quantity: 20 reels (Max. 100,000 pcs.)
* When taping shall not reach Max. or quantity, the remaining empty space shall be buried with buffer
material.
* When the quantity shall be few, alternative packaging methods may be used. No problem must occur
during the exportation of the product.
14-5 Marking
At least production country is displayed in English.
(1) Side of reel (Marking shall be on one side)
1)Part name, 2)Part num ber, 3)Quantity, 4)Lot number, 5)Maker name, 6) Poduct ion country
(2)Packaging box
1)Customer name, 2)Part name, 3)Part number, 4)Cust omer part number, 5)Quantity.
6)Maker name, 7)Poduction country
Tape
Marking
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Chip Resistor PRODUCT SPECIFICATION FOR INFORMATION 151-SRJ-E4330B
Part No.
ERJ8BW 9 - 9
Panasonic Electronic Devices Co., Ltd.
15. Appearance Quality Criteria
ItemFigureAppearance quality criteriaRemark
Protective coating
chipping
A ≤ W/4
B ≤ C/2
Chipping on both
sides shall be
considered defective
Terminal chipping
A ≤ W/4
B ≤ Terminal width
Pin ho l e
1 pin hole / chip resistor
φP ≤ 0. 2 m m
Pin hole penetrates
the resistive material.
Flash
A ≤ 0.15 mm
Top terminal lacking
A ≤ W/4
Side terminal
lacking
A ≤ W/4
A
A
W
A
A
W
B
W
B
A
C
φ
P
W
A
