AP2166/AP2176
1A DUAL CHANNEL CURRENT-LIMITED POWER SWITCH
AP2166/AP 2176
Document number: DS31814 Rev. 2 - 2 11 of 15
www.diodes.com June 2012
© Diodes Incorporated
Application Information
Power Supply Considerations
A 0.01-F to 0.1-F X7R or X5R ceramic bypass
capacitor between IN and GND, close to the device, is
recommended. Placing a high-val ue electrolytic capacitor
on the input (10-F minimum) and output pin(s) is
recommended when the output load is heavy. This
precaution reduces power-supply transients that may
cause ringing on the input. Additionally, bypassing the
output with a 0.01-F to 0.1-F ceramic capacitor
improves the immunity of the device to short-circuit
transients.
Over-current and Short Circuit Protection
An internal sensing FET is employed to check for over-
current conditions. Unlike current-sense resistors, sense
FETs do not increase the series resistance of the current
path. When an overcurrent condition is detected, the
device maintains a constant output current and reduces
the output voltage accordingly. Complete shutdown
occurs only if the fault stays long enough to activate
thermal limiting.
Three possible overlo ad conditions can occur. In the first
condition, the output has been shorted to GND before the
device is enabled or before VIN has been applied. The
AP2166/AP2176 senses the short circuit and
immediately clamps output current to a certain safe level
namely ILIMIT.
In the second condition, an output short or an overload
occurs while the device is enabled. At the instance the
overload occurs, higher curre nt may flow for a very short
period of time before the current limit function can react.
After the current limit function has tripped (reached the
over-current trip threshold), the device switches into
current limiting mode and the current is clamped at ILIMIT.
In the third condition, the load has been gradually
increased beyond the recommended operating current.
The current is permitted to rise until the current-limit
threshold (ITRIG) is reached or until the thermal limit of
the device is exceeded. The AP2166/AP2176 is capable
of delivering current up to the current-limit threshold
without damaging the device. Once the threshold has
been reached, the devic e switches into its current limiting
mode and is set at ILIMIT.
Note that when the output has been shorted to GND at
extremely low temperature (< -30oC), a minimum 120-F
electrolytic capacitor on the output pin is recommended.
A correct capacitor type with capacitor voltage ratin g and
temperature characteristics must be properly chosen so
that capacitance value does not drop too low at the
extremely low temperature operation. A recommended
capacitor should have temp erature characteristics of less
than 10% variation of capacitance change when
operated at extremely low temp. Our recommended
aluminum electrolytic capacitor type is Panasonic FC
series.
FLG Response
When an over-current or over-temperature shutdown
condition is encountered, the FLG open-drain output
goes active low after a nominal 7-ms deglitch timeout.
The FLG output remains low until both over-current and
over-temperature conditions are removed. Connecting a
heavy capacitive load to the output of the device can
cause a momentary over-current condition, which does
not trigger the FLG due to the 7-ms deglitch timeout. The
AP2166/AP2176 is designed to eliminate false over-
current reporting without the need of external
components to remove unwanted pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allo ws the
small surface-mount packages to pass large current.
Using the maximum operating ambient temperature (TA)
and RDS(ON), the power dissipation can be calculated by:
PD = RDS(ON)× I2
Finally, calculate the junction temperature:
TJ = PD x RθJA + TA
Where:
TA= Ambient temperature °C
RθJA = Thermal resistance
PD = Total power dissipation
Thermal Protection
Thermal protection prevents the IC from damage when
heavy-overload or short-circuit faults are present for
extended periods of time. The AP2166/AP2176
implements a thermal sensing to monitor the operating
junction temperature of the power distribution switch.
Once the die temperature rises to approximately 140°C
due to excessive power dissipation in an over-current or
short-circuit condition the internal thermal sense circuitry
turns the power switch off, thus preventing the power
switch from damage. Hysteresis is built into the thermal
sense circuit allowing the device to cool down
approximately 25°C before the switch turns back on. The
switch continues to cycle in this manner until the load
fault or input power is removed. The FLG open-drain
output is asserted when an over-temperature shutdown
or over-current occurs with 7-ms deglitch.
Under-voltage Lockout (UVLO )
Under-voltage lockout function (UVLO) keeps the interna l
power switch from being turned on until the power supply
has reached at least 1.9V, even if the switch is enabled.
Whenever the input voltage falls below approximately
1.9V, the power switch is quickly turned off. This
facilitates the design of hot-insertion systems where it is
not possible to turn off the power switch before input
power is removed.