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LM10
SNOSBH4E MAY 1998REVISED OCTOBER 2015
LM10 Operational Amplifier and Voltage Reference
The circuit is recommended for portable equipment
1 Features and is completely specified for operation from a
1 Input Offset Voltage: 2 mV (Maximum) single power cell. In contrast, high output-drive
Input Offset Current: 0.7 nA (Maximum) capability, both voltage and current, along with
thermal overload protection, suggest it in demanding
Input Bias Current: 20 nA (Maximum) general-purpose applications.
Reference Regulation: 0.1% (Maximum) The device is capable of operating in a floating mode,
Offset Voltage Drift: 2 μV/°C independent of fixed supplies. It can function as a
Reference Drift: 0.002%/°C remote comparator, signal conditioner, SCR controller
or transmitter for analog signals, delivering the
2 Applications processed signal on the same line used to supply
power. It is also suited for operation in a wide range
Remote Amplifiers of voltage and current regulator applications, from low
Battery-Level Indicators voltages to several hundred volts, providing greater
Thermocouple Transmitters precision than existing ICs.
Voltage and Current regulators This series is available in the three standard
temperature ranges, with the commercial part having
3 Description relaxed limits. In addition, a low-voltage specification
The LM10 series are monolithic linear ICs consisting (suffix L) is available in the limited temperature
of a precision reference, an adjustable reference ranges at a cost savings.
buffer and an independent, high-quality operational
amplifier. Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
The unit can operate from a total supply voltage as
low as 1.1 V or as high as 40 V, drawing only 270 μA. SOIC (14) 8.992 mm × 7.498 mm
A complementary output stage swings within 15 mV LM10 SDIP (8) 8.255 mm × 8.255 mm
of the supply terminals or will deliver ±20-mA output PDIP (8) 9.81 mm × 6.35 mm
current with ±0.4-V saturation. Reference output can (1) For all available packages, see the orderable addendum at
be as low as 200 mV. the end of the data sheet.
Operational Amplifier Schematic
(Pin numbers are for 8-pin packages)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM10
SNOSBH4E MAY 1998REVISED OCTOBER 2015
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Table of Contents
7.4 Device Functional Modes........................................ 17
1 Features.................................................................. 18 Application and Implementation ........................ 18
2 Applications ........................................................... 18.1 Application Information............................................ 18
3 Description............................................................. 18.2 Typical Application ................................................. 18
4 Revision History..................................................... 28.3 System Examples ................................................... 19
5 Pin Configuration and Functions......................... 39 Power Supply Recommendations...................... 27
6 Specifications......................................................... 410 Layout................................................................... 27
6.1 Absolute Maximum Ratings ...................................... 410.1 Layout Guidelines ................................................. 27
6.2 Recommended Operating Conditions....................... 410.2 Layout Example .................................................... 27
6.3 Thermal Information.................................................. 411 Device and Documentation Support................. 28
6.4 Electrical Characteristics LM10/LM10B .................... 511.1 Device Support .................................................... 28
6.5 Electrical Characteristics, LM10C............................. 611.2 Documentation Support ........................................ 28
6.6 Electrical Characteristics, LM10BL ........................... 811.3 Community Resources.......................................... 28
6.7 Electrical Characteristics, LM10CL........................... 911.4 Trademarks........................................................... 29
6.8 Typical Characteristics............................................ 11 11.5 Electrostatic Discharge Caution............................ 29
7 Detailed Description............................................ 17 11.6 Glossary................................................................ 29
7.1 Overview................................................................. 17 12 Mechanical, Packaging, and Orderable
7.2 Functional Block Diagram....................................... 17 Information ........................................................... 29
7.3 Feature Description................................................. 17
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (March 2013) to Revision E Page
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes,Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Revision C (March 2013) to Revision D Page
Changed layout of National Data Sheet to TI format ........................................................................................................... 26
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5 Pin Configuration and Functions
NEV Package P Package
8-Pin SDIP 8-Pin PDIP
Top View Top View
Pin Functions 8-Pin SDIP or PDIP
PIN I/O DESCRIPTION
NAME NO.
Balance 5 I Used for offset nulling
Op Amp Input (+) 3 I Noninverting input of operational amplifier
Op Amp Input (–) 2 I Inverting input of operational amplifier
Op Amp Output 6 O Output terminal of operational amplifier
Reference Feedback 8 I Feedback terminal of reference
Reference Output 1 O Output terminal of reference
V+ 7 I Positive supply voltage
V– 4 I Negative supply voltage
NPA Package
14-Pin SOIC
Top View
Pin Functions 14-Pin SOIC
PIN I/O DESCRIPTION
NAME NO.
Balance 9 I Used for offset nulling
NC 1, 2, 7, 8, 14, 13 No connection
Op Amp Input (–) 4 I Inverting input of operational amplifier
Op Amp Input (+) 5 I Noninverting input of operational amplifier
Op Amp Output 10 O Output terminal of operational amplifier
Reference Feedback 12 I Feedback terminal of reference
Reference Output 3 O Output terminal of reference
V+ 11 I Positive supply voltage
V– 6 I Negative supply voltage
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6 Specifications
6.1 Absolute Maximum Ratings
See (1)(2)(3)
MIN MAX UNIT
LM10/LM10B/LM10C 45 V
Total supply voltage LM10BL/LM10CL 7 V
LM10/LM10B/LM10C ±40 V
Differential input voltage(4) LM10BL/LM10CL ±7 V
Power dissipation(5) Internally limited
Output short-circuit duration(6) Continuous
TO Soldering (10 seconds) 300 °C
Soldering (10 seconds) 260 °C
Lead temperature DIP Vapor phase (60 seconds) 215 °C
Infrared (15 seconds) 220 °C
LM10 150 °C
Maximum junction LM10B 100 °C
temperature LM10C 85 °C
Storage temperature, Tstg 55 150 °C
(1) Refer to RETS10X for LM10H military specifications.
(2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) The Input voltage can exceed the supply voltages provided that the voltage from the input to any other terminal does not exceed the
maximum differential input voltage and excess dissipation is accounted for when VIN < V.
(5) The maximum, operating-junction temperature is 150°C for the LM10, 100°C for the LM10B(L) and 85°C for the LM10C(L). At elevated
temperatures, devices must be derated based on package thermal resistance.
(6) Internal thermal limiting prevents excessive heating that could result in sudden failure, but the IC can be subjected to accelerated stress
with a shorted output and worst-case conditions.
6.2 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT
VSSupply input voltage range (V–) (V+) 1.2 40 V
VCM Common-mode voltage (V–) (V+) 0.85 V
VREF Reference voltage 0.2 V
IREF Reference current 0 1 mA
6.3 Thermal Information LM10
THERMAL METRIC(1) NEV (SDIP) NPA (SOIC) P (PDIP) UNIT
8 PINS 14 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 150 90 87 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 45 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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6.4 Electrical Characteristics LM10/LM10B
TJ=25°C unless otherwise specified(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TJ=25°C 0.3 2 mV
Input offset voltage TMIN TJTMAX (see (1)) 3 mV
TJ=25°C 0.25 0.7 nA
Input offset current(2) TMIN TJTMAX (see (1)) 1.5 nA
TJ=25°C 10 20 nA
Input bias current TMIN TJTMAX (see (1)) 30 nA
TJ=25°C 250 500 kΩ
Input resistance TMIN TJTMAX (see (1)) 150 kΩ
VS= ±20 V, IOUT = 0 120 400 V/mV
VOUT = ±19.95 V, TMIN TJTMAX (see (1)) 80 V/mV
VS= ±20 V, VOUT = ±19.4 V 50 130 V/mV
IOUT = ±20 mA, TMIN TJTMAX (see (1)) 20 V/mV
Large signal voltage IOUT = ±15 mA, TMIN TJTMAX (see (1)) 20 V/mV
gain VS= ±0.6 V, IOUT = ±2 mA 1.5 3 V/mV
VS= ±0.65 V, IOUT = ±2 mA, TMIN TJTMAX (see (1)) 1.5 3 V/mV
VOUT = ±0.4 V, TMIN TJTMAX (see (1)) 0.5 V/mV
VOUT = ±0.3 V, VCM =0.4 V, TMIN TJTMAX (see (1)) 0.5 V/mV
1.2 V VOUT 40 V, RL= 1.1 kΩ14 33 V/mV
1.3 V VOUT 40 V, RL= 1.1 kΩ, TMIN TJTMAX (see (1)) 14 33 V/mV
Shunt gain(3) 0.1 mA IOUT 5 mA, TMIN TJTMAX (see (1)) 6 V/mV
1.5 V V+40 V, RL= 250 Ω8 25 V/mV
0.1 mA IOUT 20 mA, TMIN TJTMAX (see (1)) 4 V/mV
20 V VCM 19.15 V 93 102 dB
Common-mode 20 V VCM 19 V, TMIN TJTMAX (see (1)) 93 102 dB
rejection VS= ±20 V, TMIN TJTMAX (see (1)) 87 dB
0.2 V V 39 V 90 96 dB
V+= 1 V, TMIN TJTMAX (see (1)) 84 dB
V+= 1.1 V, TMIN TJTMAX (see (1)) 84 dB
Supply-voltage
rejection 1 V V+39.8 V 96 106 dB
1.1 V V+39.8 V, TMIN TJTMAX (see (1)) 96 106 dB
V=0.2 V, TMIN TJTMAX (see (1)) 90 dB
Offset voltage drift 2 μV/°C
Offset current drift 2 pA/°C
Bias current drift TC< 100°C 60 pA/°C
1.2 V VS40 V 0.001 0.003 %/V
Line regulation 1.3 V VS40 V, TMIN TJTMAX (see (1)) 0.001 0.003 %/V
0IREF 1 mA, VREF = 200 mV, TMIN TJTMAX (see (1)) 0.006 %/V
0IREF 1 mA 0.01% 0.1%
Load regulation V+VREF 1 V, TMIN TJTMAX (see (1)) 0.15%
V+VREF 1.1 V, TMIN TJTMAX (see (1)) 0.15%
(1) These specifications apply for VVCM V+0.85 V, 1 V (TMIN TJTMAX), 1.2 V, 1.3 V (TMIN TJTMAX) < VSVMAX, VREF = 0.2 V
and 0 IREF 1 mA, unless otherwise specified: VMAX = 40 V for the standard part and 6.5 V for the low voltage part. The full-
temperature-range operation is 55°C to 125°C for the LM10, 25°C to 85°C for the LM10B(L) and 0°C to 70°C for the LM10C(L). The
specifications do not include the effects of thermal gradients (τ120 ms), die heating (τ20.2 s) or package heating. Gradient effects
are small and tend to offset the electrical error (see curves).
(2) For TJ> 90°C, IOS may exceed 1.5 nA for VCM = V. With TJ= 125°C and VVCM V+ 0.1 V, IOS 5 nA.
(3) This defines operation in floating applications such as the bootstrapped regulator or two-wire transmitter. Output is connected to the V+
terminal of the IC and input common mode is referred to V(see System Examples). Effect of larger output-voltage swings with higher
load resistance can be accounted for by adding the positive-supply rejection error.
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Electrical Characteristics LM10/LM10B (continued)
TJ=25°C unless otherwise specified(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TJ=25°C 50 75 V/mV
Amplifier gain 0.2 V VREF 35 V TMIN TJTMAX (see (1)) 23 V/mV
TJ=25°C 195 200 205 mV
Feedback sense
voltage TMIN TJTMAX (see (1)) 194 206 mV
TJ=25°C 20 50 nA
Feedback current TMIN TJTMAX (see (1)) 65 nA
Reference drift 0.002 %/°C
TJ=25°C 270 400 μA
Supply current TMIN TJTMAX (see (1)) 500 μA
TJ=25°C 15
1.2 V VS40 V μA
TMIN TJTMAX (see (1)) 75
Supply current change TJ=25°C 15
1.3 V VS40 V μA
TMIN TJTMAX (see (1)) 75
6.5 Electrical Characteristics, LM10C
TJ=25°C unless otherwise specified(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TJ=25°C 0.5 4 mV
Input offset voltage TMIN TJTMAX (see (1)) 5 mV
TJ=25°C 0.4 2 nA
Input offset current(2) TMIN TJTMAX (see (1)) 3 nA
TJ=25°C 12 30 nA
Input bias current TMIN TJTMAX (see (1)) 40 nA
TJ=25°C 150 400 kΩ
Input resistance TMIN TJTMAX (see (1)) 115 kΩ
VS= ±20 V, IOUT = 0 80 400 V/mV
VOUT = ±19.95 V, TMIN TJTMAX (see (1)) 50 V/mV
VS= ±20 V, VOUT = ±19.4 V 25 130 V/mV
IOUT = ±20 mA, TMIN TJTMAX (see (1)) 15 V/mV
Large signal voltage gain IOUT = ±15 mA, TMIN TJTMAX (see (1)) 15 V/mV
VS= ±0.6 V, IOUT = ±2 mA 1 3 V/mV
VS= 0.65 V, IOUT = ±2 mA, TMIN TJTMAX (see (1)) 1 3 V/mV
VOUT = ±0.4 V, TMIN TJTMAX (see (1)) 0.75 V/mV
VOUT = ±0.3 V, VCM =0.4 V, TMIN TJTMAX (see (1)) 0.75 V/mV
1.2 V VOUT 40 V, RL= 1.1 kΩ10 33 V/mV
1.3 V VOUT 40 V, RL= 1.1 kΩ, TMIN TJTMAX (see (1)) 10 33 V/mV
Shunt gain(3) 0.1 mA IOUT 5 mA, TMIN TJTMAX (see (1)) 6 V/mV
1.5 V V+40 V, RL= 250 Ω6 25 V/mV
0.1 mA IOUT 20 mA, TMIN TJTMAX (see (1)) 4 V/mV
(1) These specifications apply for VVCM V+0.85 V, 1 V (TMIN TJTMAX), 1.2 V, 1.3 V (TMIN TJTMAX) < VSVMAX, VREF = 0.2 V
and 0 IREF 1 mA, unless otherwise specified: VMAX = 40 V for the standard part and 6.5 V for the low voltage part. The full-
temperature-range operation is 55°C to 125°C for the LM10, 25°C to 85°C for the LM10B(L) and 0°C to 70°C for the LM10C(L). The
specifications do not include the effects of thermal gradients (τ120 ms), die heating (τ20.2 s) or package heating. Gradient effects
are small and tend to offset the electrical error (see curves).
(2) For TJ> 90°C, IOS may exceed 1.5 nA for VCM = V. With TJ= 125°C and VVCM V+ 0.1 V, IOS 5 nA.
(3) This defines operation in floating applications such as the bootstrapped regulator or two-wire transmitter. Output is connected to the V+
terminal of the IC and input common mode is referred to V(see System Examples). Effect of larger output-voltage swings with higher
load resistance can be accounted for by adding the positive-supply rejection error.
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Electrical Characteristics, LM10C (continued)
TJ=25°C unless otherwise specified(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
20 V VCM 19.15 V 90 102 dB
Common-mode rejection 20 V VCM 19 V 90 102 dB
VS= ±20 V, TMIN TJTMAX (see (1)) 87 dB
0.2 V V 39 V 87 96 dB
V+= 1 V, TMIN TJTMAX (see (1)) 84 dB
V+= 1.1 V, TMIN TJTMAX (see (1)) 84 dB
Supply-voltage rejection 1 V V+39.8 V 93 106 dB
1.1 V V+39.8 V, TMIN TJTMAX (see (1)) 93 106 dB
V=0.2 V, TMIN TJTMAX (see (1)) 90 dB
Offset voltage drift 5 μV/°C
Offset current drift 5 pA/°C
Bias current drift TC< 100°C 90 pA/°C
1.2 V VS40 V 0.001 0.008 %/V
Line regulation 1.3 V VS40 V, TMIN TJTMAX (see (1)) 0.001 0.008 %/V
0IREF 1 mA, VREF = 200 mV, TMIN TJTMAX (see (1)) 0.01 %/V
0IREF 1 mA 0.01% 0.15%
Load regulation V+VREF 1 V, TMIN TJTMAX (see (1)) 0.2%
V+VREF1.1 V, TMIN TJTMAX (see (1)) 0.2%
TJ=25°C 25 70 V/mV
Amplifier gain 0.2 V VREF 35 V TMIN TJTMAX (see (1)) 15 V/mV
TJ=25°C 190 200 210 mV
Feedback sense voltage TMIN TJTMAX (see (1)) 189 211 mV
TJ=25°C 22 75 nA
Feedback current TMIN TJTMAX (see (1)) 90 nA
Reference drift 0.003 %/°C
TJ=25°C 300 500 μA
Supply current TMIN TJTMAX (see (1)) 570 μA
TJ=25°C 15
1.2 V VS40 V μA
TMIN TJTMAX (see (1)) 75
Supply current change TJ=25°C 15
1.3 V VS40 V μA
TMIN TJTMAX (see (1)) 75
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6.6 Electrical Characteristics, LM10BL
TJ=25°C unless otherwise specified.(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TJ=25°C 0.3 2 mV
Input offset voltage TMIN TJTMAX (see (1)) 3 mV
TJ=25°C 0.1 0.7 nA
Input offset current(2) TMIN TJTMAX (see (1)) 1.5 nA
TJ=25°C 10 20 nA
Input bias current TMIN TJTMAX (see (1)) 30 nA
TJ=25°C 250 500 kΩ
Input resistance TMIN TJTMAX (see (1)) 150 kΩ
VS= ±3.25 V, IOUT = 0 60 300 V/mV
VOUT = ±3.2 V, TMIN TJTMAX (see (1)) 40 V/mV
VS= ±3.25 V, IOUT = 10 mA 10 25 V/mV
VOUT = ±2.75 V, TMIN TJTMAX (see (1)) 4 V/mV
Large signal voltage gain VS= ±0.6 V, IOUT = ±2 mA 1.5 3 V/mV
VS= 0.65 V, IOUT = ±2 mA, TMIN TJTMAX (see (1)) 1.5 3 V/mV
VOUT = ±0.4 V, VCM =0.4 V, TMIN TJTMAX (see (1)) 0.5 V/mV
VOUT = ±0.3 V, VCM =0.4 V, TMIN TJTMAX (see (1)) 0.5 V/mV
1.5 V V+6.5 V, RL= 500 Ω8 30 V/mV
Shunt gain(3) 0.1 mA IOUT 10 mA, TMIN TJTMAX (see (1)) 4 V/mV
3.25 V VCM 2.4 V 89 102 dB
Common-mode rejection 3.25 V VCM 2.25 V, TMIN TJTMAX (see (1))
VS= ±3.25 V, TMIN TJTMAX (see (1)) 83 dB
0.2 V V 5.4 V 86 96 dB
V+= 1 V, TMIN TJTMAX (see (1)) 80 dB
V+= 1.2 V, TMIN TJTMAX (see (1)) 80 dB
Supply-voltage rejection 1 V V+6.3 V 94 106 dB
1.1 V V+6.3 V, TMIN TJTMAX (see (1)) 94 106 dB
V=0.2 V, TMIN TJTMAX (see (1)) 88 dB
Offset voltage drift 2 μV/°C
Offset current drift 2 pA/°C
Bias current drift 60 pA/°C
1.2 V VS6.5 V 0.001 0.01 %/V
Line regulation 1.3 V VS6.5 V, TMIN TJTMAX (see (1)) 0.001 0.01 %/V
0IREF 0.5 mA, VREF = 200 mV, TMIN TJTMAX (see (1)) 0.02 %/V
0IREF 0.5 mA 0.01% 0.1%
Load regulation V+VREF 1 V, TMIN TJTMAX (see (1)) 0.15%
V+VREF 1.1 V, TMIN TJTMAX (see (1)) 0.15%
TJ=25°C 30 70 V/mV
Amplifier gain 0.2 V VREF 5.5 V TMIN TJTMAX (see (1)) 20 V/mV
TJ=25°C 195 200 205 mV
Feedback sense voltage TMIN TJTMAX (see (1)) 194 206 mV
(1) These specifications apply for VVCM V+0.85 V, 1 V (TMIN TJTMAX), 1.2 V, 1.3 V (TMIN TJTMAX) < VSVMAX, VREF = 0.2 V
and 0 IREF 1 mA, unless otherwise specified: VMAX = 40 V for the standard part and 6.5 V for the low voltage part. The full-
temperature-range operation is 55°C to 125°C for the LM10, 25°C to 85°C for the LM10B(L) and 0°C to 70°C for the LM10C(L). The
specifications do not include the effects of thermal gradients (τ120 ms), die heating (τ20.2 s) or package heating. Gradient effects
are small and tend to offset the electrical error (see curves).
(2) For TJ> 90°C, IOS may exceed 1.5 nA for VCM = V. With TJ=125°C and VVCM V+ 0.1 V, IOS 5 nA.
(3) This defines operation in floating applications such as the bootstrapped regulator or two-wire transmitter. Output is connected to the V+
terminal of the IC and input common mode is referred to V(see System Examples). Effect of larger output-voltage swings with higher
load resistance can be accounted for by adding the positive-supply rejection error.
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Electrical Characteristics, LM10BL (continued)
TJ=25°C unless otherwise specified.(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TJ=25°C 20 50 nA
Feedback current TMIN TJTMAX (see (1)) 65 nA
Reference drift 0.002 %/°C
TJ=25°C 260 400 μA
Supply current TMIN TJTMAX (see (1)) 500 μA
6.7 Electrical Characteristics, LM10CL
TJ=25°C unless otherwise specified.(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TJ=25°C 0.5 4 mV
Input offset voltage TMIN TJTMAX (see (1)) 5 mV
TJ=25°C 0.2 2 nA
Input offset current(2) TMIN TJTMAX (see (1)) 3 nA
TJ=25°C 12 30 nA
Input bias current TMIN TJTMAX (see (1)) 40 nA
TJ=25°C 150 400 kΩ
Input resistance TMIN TJTMAX (see (1)) 115 kΩ
VS= ±3.25 V, IOUT = 0 40 300 V/mV
VOUT = ±3.2 V, TMIN TJTMAX (see (1)) 25 V/mV
VS= ±3.25 V, IOUT = 10 mA 5 25 V/mV
VOUT = ±2.75 V, TMIN TJTMAX (see (1)) 3 V/mV
Large signal voltage gain VS= ±0.6 V, IOUT = ±2 mA 1 3 V/mV
VS= 0.65 V, IOUT = ±2 mA, TMIN TJTMAX (see (1)) 1 3 V/mV
VOUT = ±0.4 V, VCM =0.4 V, TMIN TJTMAX (see (1)) 0.75 V/mV
VOUT = ±0.3 V, VCM =0.4 V, TMIN TJTMAX (see (1)) 0.75 V/mV
1.5 V V+6.5 V, RL= 500 Ω6 30 V/mV
Shunt gain(3) 0.1 mA IOUT 10 mA, TMIN TJTMAX (see (1)) 4 V/mV
3.25 V VCM 2.4 V 80 102 dB
Common-mode rejection 3.25 V VCM 2.25 V, TMIN TJTMAX (see (1)) 80 102 dB
VS= ±3.25 V, TMIN TJTMAX (see (1)) 74 dB
0.2 V V 5.4 V 80 96 dB
V+= 1 V, TMIN TJTMAX (see (1)) 74 dB
V+= 1.2 V, TMIN TJTMAX (see (1)) 74 dB
Supply-voltage rejection 1VV+6.3 V 80 106 dB
1.1 V V+6.3 V, TMIN TJTMAX (see (1)) 80 106 dB
V= 0.2 V, TMIN TJTMAX (see (1)) 74 dB
Offset voltage drift 5 μV/°C
Offset current drift 5 pA/°C
Bias current drift 90 pA/°C
(1) These specifications apply for VVCM V+0.85 V, 1 V (TMIN TJTMAX), 1.2 V, 1.3 V (TMIN TJTMAX) < VSVMAX, VREF = 0.2 V
and 0 IREF 1 mA, unless otherwise specified: VMAX = 40 V for the standard part and 6.5 V for the low voltage part. The full-
temperature-range operation is 55°C to 125°C for the LM10, 25°C to 85°C for the LM10B(L) and 0°C to 70°C for the LM10C(L). The
specifications do not include the effects of thermal gradients (τ120 ms), die heating (τ20.2 s) or package heating. Gradient effects
are small and tend to offset the electrical error (see curves).
(2) For TJ> 90°C, IOS may exceed 1.5 nA for VCM = V. With TJ= 125°C and VVCM V+ 0.1 V, IOS 5 nA.
(3) This defines operation in floating applications such as the bootstrapped regulator or two-wire transmitter. Output is connected to the V+
terminal of the IC and input common mode is referred to V(see System Examples). Effect of larger output-voltage swings with higher
load resistance can be accounted for by adding the positive-supply rejection error.
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Electrical Characteristics, LM10CL (continued)
TJ=25°C unless otherwise specified.(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
1.2 V VS6.5 V 0.001 0.02 %/V
Line regulation 1.3 V VS6.5 V, TMIN TJTMAX (see (1)) 0.001 0.02 %/V
0IREF 0.5 mA, VREF = 200 mV, TMIN TJTMAX (see (1)) 0.03 %/V
0IREF 0.5 mA 0.01% 0.15%
Load regulation V+VREF 1 V, TMIN TJTMAX (see (1)) 0.2%
V+VREF 1.1 V, TMIN TJTMAX (see (1)) 0.2%
TJ=25°C 20 70 V/mV
Amplifier gain 0.2 V VREF 5.5 V TMIN TJTMAX (see (1)) 15 V/mV
TJ=25°C 190 200 210 mV
Feedback sense voltage TMIN TJTMAX (see (1)) 189 211 mV
TJ=25°C 22 75 nA
Feedback current TMIN TJTMAX (see (1)) 90 nA
Reference drift 0.003 %/°C
TJ=25°C 280 500 μA
Supply current TMIN TJTMAX (see (1)) 570 μA
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6.8 Typical Characteristics
6.8.1 Typical Characteristics (Op Amp)
Figure 2. Common-Mode Limits
Figure 1. Input Current
Figure 3. Output Voltage Drift Figure 4. Input Noise Voltage
Figure 6. Transconductance
Figure 5. DC Voltage Gain
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Typical Characteristics (Op Amp) (continued)
Figure 8. Output Saturation Characteristics
Figure 7. Output Saturation Characteristics
Figure 10. Minimum Supply Voltage
Figure 9. Output Saturation Characteristics
Figure 11. Minimum Supply Voltage Figure 12. Minimum Supply Voltage
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Typical Characteristics (Op Amp) (continued)
Figure 14. Typical Stability Range
Figure 13. Output Impedance
Figure 15. Large Signal Response Figure 16. Comparator Response Time For Various Input
Overdrives
Figure 18. Follower Pulse Response
Figure 17. Comparator Response Time For Various Input
Overdrives
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Typical Characteristics (Op Amp) (continued)
Figure 20. Rejection Slew Limiting
Figure 19. Noise Rejection
Figure 22. Thermal Gradient Feedback
Figure 21. Supply Current
Figure 24. Shunt Gain
Figure 23. Thermal Gradient Cross-Coupling
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Typical Characteristics (Op Amp) (continued)
Figure 25. Shunt Gain Figure 26. Shunt Gain
Figure 28. Shunt Gain
Figure 27. Shunt Gain
Figure 29. Shunt Gain
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6.8.2 Typical Characteristics (Reference)
Figure 30. Line Regulation Figure 31. Load Regulation
Figure 33. Minimum Supply Voltage
Figure 32. Reference Noise Voltage
Figure 35. Typical Stability Range
Figure 34. Output Saturation
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7 Detailed Description
7.1 Overview
The LM10 is a dual-operational amplifier combined with a voltage reference capable of a single-supply operation
down to 1.1 V. It provides high overall performance, making it ideal for many general-purpose applications. The
circuit can also operate in a floating mode, powered by residual voltage, independent of fixed supplies and it is
well-protected from temperature drift.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Operating Characteristics
The LM10 is specified for operation from 1.2 V to 40 V. Many of the specifications apply from –55C to 125C.
Parameters that can exhibit significant variance with regard to operating voltage or temperature are presented in
electrical characteristics tables under Specifications and in the Typical Characteristics section.
7.3.2 Common-Mode Voltage Range
The input common-mode voltage range of the LM10 extends from the negative rail to 0.85 V less than the
positive rail.
7.3.3 Operational Amplifier
The minimum operating voltage is reduced to nearly one volt and the current gain is less affected by
temperature, resulting in a fairly flat bias current over temperature.
7.3.4 Voltage Reference
Second-order nonlinearities are compensated for which eliminates the bowed characteristics of conventional
designs, resulting in better temperature stability.
7.4 Device Functional Modes
7.4.1 Floating Mode
To use the device in a floating mode, the operational amplifier output is shorted to V+ which disables the PNP
portion of the output stage. Thus, with a positive input signal, neither halves of the output conducts and the
current between the supply terminals is equal to the quiescent supply current. With negative input signals, the
NPN portion of the output begins to turn on, reaching the short circuit current for a few hundred microvolts
overdrive.
7.4.2 Linear Operation
This device can also operate linearly while in the floating mode. An example of this is shown in the Typical
Application section.
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O U T R E F
1
R
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R
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
With heavy amplifier loading to V, resistance drops in the Vlead can adversely affect reference regulation.
Lead resistance can approach 1 Ω. Therefore, the common to the reference circuitry should be connected as
close as possible to the package.
8.2 Typical Application
* required for capacitive loading
Figure 36. Shunt Voltage Regulator
8.2.1 Design Requirements
Table 1 lists the design parameters for this example.
Table 1. Design Parameters
DESIGN PARAMETERS EXAMPLE VALUE
Ambient Temperature Range –55C to 125C
Supply Voltage Range 1.2 V to 40 V
Common-Mode Input Range (V–) to (V+) 0.85 V
8.2.2 Detailed Design Procedure
Given that the transfer function of this circuit is:
(1)
the output can be set between 0.2 V and the breakdown voltage of the IC by selecting an appropriate value for
R2. The circuit regulates for input voltages within a saturation drop of the output (typically 0.4 V at 20 mA and
0.15 V at 5 mA). The regulator is protected from shorts or overloads by current limiting and thermal shutdown.
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Typical regulation is about 0.05% load and 0.003%/V line. A substantial improvement in regulation can be
effected by connecting the operational amplifier as a follower and setting the reference to the desired output
voltage. This has the disadvantage that the minimum input-output differential is increased to a little more than a
diode drop. If the operational amplifier were connected for a gain of 2, the output could again saturate. But this
requires an additional pair of precision resistors.
The regulator in Figure 36 could be made adjustable to zero by connecting the operational amplifier to a
potentiometer on the reference output. This has the disadvantage that the regulation at the lower voltage settings
is not as good as it might otherwise be.
8.2.3 Application Curve
Figure 37. Frequency Response
8.3 System Examples
Circuit descriptions available in application note AN-211 (SNOA638).
8.3.1 Operational Amplifier Offset Adjustment
(Pin numbers are for 8-pin packages)
Figure 38. Standard Figure 39. Limited Range
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System Examples (continued)
(Pin numbers are for 8-pin packages)
Figure 40. Limited Range With Boosted Reference
8.3.2 Positive Regulators
(Pin numbers are for 8-pin packages)
Figure 41. Low Voltage Figure 42. Best Regulation
Use only electrolytic output capacitors.
Figure 43. Zero Output Figure 44. Current Regulator
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System Examples (continued)
(Pin numbers are for 8-pin packages)
Required For Capacitive Loading
*Electrolytic
Figure 45. Shunt Regulator Figure 46. Negative Regulator
*VOUT=104R3
Figure 47. Precision Regulator Figure 48. Laboratory Power Supply
Figure 49. HV Regulator Figure 50. Protected HV Regulator
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System Examples (continued)
(Pin numbers are for 8-pin packages)
*800°C Threshold Is Established By Connecting Balance To VREF.
*Provides Hysteresis
Figure 51. Flame Detector Figure 52. Light Level Sensor
Figure 53. Remote Amplifier Figure 54. Remote Thermocouple Amplifier
10 mAIOUT50 mA
500°CTP1500°C
*Gain Trim
Figure 55. Transmitter for Bridge Sensor Figure 56. Precision Thermocouple Transmitter
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System Examples (continued)
(Pin numbers are for 8-pin packages)
††Level-shift Trim
*Scale Factor Trim
†Copper Wire Wound
Figure 57. Resistance Thermometer Transmitter Figure 58. Optical Pyrometer
1 mAIOUT5 mA
‡50 μAID500 μA
††Center Scale Trim
†Scale Factor Trim
*Copper Wire Wound
200°CTp700°C
1 mAIOUT5 mA
†Gain Trim Figure 59. Thermocouple Figure 60. Logarithmic Light Sensor
Transmitter
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System Examples (continued)
(Pin numbers are for 8-pin packages)
Figure 61. Battery-level Indicator Figure 62. Battery-threshold Indicator
Flashes Above 1.2V Flash Rate Increases
Rate Increases With Above 6V and Below 15V
Voltage Figure 63. Single-cell Voltage Monitor Figure 64. Double-ended Voltage Monitor
*Trim For Span
INPUT †Trim For Zero
10 mV, 100nA
FULL-SCALE Figure 65. Meter Amplifier Figure 66. Thermometer
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System Examples (continued)
(Pin numbers are for 8-pin packages)
ZOUT680Ω@ 5 kHz
AV1k
1≤λ/λ0105f1100 Hz
f25 kHz
RL500
*Max Gain Trim
Figure 67. Light Meter Figure 68. Microphone Amplifier
†Controls “Loop Gain”
*Optional Frequency Shaping
Figure 69. Isolated Voltage Sensor Figure 70. Light-Level Controller
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System Examples (continued)
(Pin numbers are for 8-pin packages)
8.3.3 Reference and Internal Regulator
Figure 71. Reference and Internal Regulator
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1
AMP_IN+
2
AMP_IN+
3
AMP_IN+
4
V– BAL
6
VOUT
8
AMP_IN+
7
VOUT
AMP_IN–
AMP_IN+
V–
AMP_IN+
VOUT
AMP_IN+
AMP_1–
AMP_IN+
1
VOUT
2
VOUT
2
AMP-IN–
1
AMP_INT–
2
AMP-IN–
1
V+
VOUT
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9 Power Supply Recommendations
The LM10 is specified for operation from 1.2 V to 40 V unless otherwise stated. Many specifications apply from
–55C to 125C. Parameters that can exhibit significant variance with regard to operating voltage or temperature
are presented in the Specifications section.
CAUTION
Supply voltages larger than 40 V can permanently damage the device; see the
Absolute Maximum Ratings table.
10 Layout
10.1 Layout Guidelines
For best operational performance of the device, good printed-circuit board (PCB) layout practices are
recommended. Low-loss, 0.1-uF bypass capacitors should be connected between each supply pin and ground,
placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable to single-
supply applications.
10.2 Layout Example
Figure 72. Layout Example
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11 Device and Documentation Support
11.1 Device Support
11.1.1 Device Nomenclature
11.1.1.1 Definition of Terms
Input offset voltage:That voltage which must be applied between the input terminals to bias the unloaded
output in the linear region.
Input offset current:The difference in the currents at the input terminals when the unloaded output is in the
linear region.
Input bias current:The absolute value of the average of the two input currents.
Input resistance:The ratio of the change in input voltage to the change in input current on either input with the
other grounded.
Large signal voltage gain:The ratio of the specified output voltage swing to the change in differential input
voltage required to produce it.
Shunt gain: The ratio of the specified output voltage swing to the change in differential input voltage required to
produce it with the output tied to the V+terminal of the IC. The load and power source are
connected between the V+and Vterminals, and input common-mode is referred to the Vterminal.
Common-mode rejection:The ratio of the input voltage range to the change in offset voltage between the
extremes.
Supply-voltage rejection:The ratio of the specified supply-voltage change to the change in offset voltage
between the extremes.
Line regulation:The average change in reference output voltage over the specified supply voltage range.
Load regulation:The change in reference output voltage from no load to that load specified.
Feedback sense voltage: The voltage, referred to V, on the reference feedback terminal while operating in
regulation.
Reference amplifier gain:The ratio of the specified reference output change to the change in feedback sense
voltage required to produce it.
Feedback current: The absolute value of the current at the feedback terminal when operating in regulation.
Supply current:The current required from the power source to operate the amplifier and reference with their
outputs unloaded and operating in the linear range.
11.2 Documentation Support
11.2.1 Related Documentation
For related documentation, see the following:
AN-211 New Op Amp Ideas,SNOA638
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
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11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM10BH ACTIVE TO-99 LMC 8 500 TBD Call TI Call TI -40 to 85 ( LM10BH ~ LM10BH)
LM10BH/NOPB ACTIVE TO-99 LMC 8 500 Green (RoHS
& no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 85 ( LM10BH ~ LM10BH)
LM10CH ACTIVE TO-99 LMC 8 500 TBD Call TI Call TI 0 to 70 ( LM10CH ~ LM10CH)
LM10CH/NOPB ACTIVE TO-99 LMC 8 500 Green (RoHS
& no Sb/Br) Call TI Level-1-NA-UNLIM 0 to 70 ( LM10CH ~ LM10CH)
LM10CLN/NOPB ACTIVE PDIP P 8 40 Green (RoHS
& no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LM10CLN
LM10CN/NOPB ACTIVE PDIP P 8 40 Green (RoHS
& no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LM
10CN
LM10CWM NRND SOIC NPA 14 50 TBD Call TI Call TI 0 to 70 LM10CWM
LM10CWM/NOPB ACTIVE SOIC NPA 14 50 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR 0 to 70 LM10CWM
LM10CWMX/NOPB ACTIVE SOIC NPA 14 1000 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR 0 to 70 LM10CWM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 19-Jul-2016
Addendum-Page 2
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM10CWMX/NOPB SOIC NPA 14 1000 330.0 16.4 10.9 9.5 3.2 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 10-Aug-2015
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM10CWMX/NOPB SOIC NPA 14 1000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 2
MECHANICAL DATA
NPA0014B
www.ti.com
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