LRMA Low Resistance Metal Alloy Current Sense Resistor * * * * * Robust metal strip able to withstand high temperature and high current. Low TCR and Inductance Resistance Range from 1 m to 100 m Power ratings from 1W to 3W in 0815, 1206, and 2512 chip size Designed for current sense circuits in power electronic and automotive systems * RoHS compliant and Halogen Free Electrical Data IRC Type Footprint Power rating at 70C (Watts) Standard Resistance Values (m)1 TCR Tolerance Insulation (ppm/C) (%) Resistance (M) Version - M2 (Manganese-Copper Alloy) LRMA-M 2512 1206 2 5, 10 100 20 75 1 30, 40 75 1 5, 10, 100 15, 20, 25, 30 75 1, 2, 5 100 Version - N LRMA-N 0815 1 1, 6, 8, 10, 15, 20, 25, 30 100 1, 2, 5 100 2512 3 3, 5, 10 100 1, 2, 5 100 11, 15, 20, 25, 30, 40, 50, 80, 100 75 2 1, 1.5, 2, 3, 4, 5, 6, 7, 8, 9, 10 100 1, 2, 5 100 1 11, 12, 15, 18, 20, 25, 30, 33, 40, 50 75 Version - P LRMA-P Version - T (Copper-Nickel Alloy) LRMA-T 2512 Notes: 1Non-Listed resistance values available (contact factory). 2Constructed of Manganese Copper alloy, which reduces thermal emf, and is distinguished by a green mold compound. Environmental Data Test Item Reference Test Condition Test Limits High Temperature Exposure MIL-STD-202 method 108 + 125C 1000 hrs < 0.5% Temperature Cycling JESD22 method JA-104 1000 cycles (-55C to +125C) < 0.5% Bias Humidity MIL-STD-202 method 103 1000 hrs @ 85C / 85% RH < 0.5% Operational Life MIL-STD-202 method 108 Steady State, ambient 70C @ rated power < 0.5% Mechanical Shock MIL-STD-202 method 213 100 g's < 0.5% Vibration MIL-STD-202 method 204 5 g's for 20 min, 10 - 2000 Hz, 12 cycles 3 planes < 0.5% Resistance to Solder Heat MIL-STD-202 method 210 Condition B: No pre-heat < 0.5% Solderability J-STD-002 245C 5C solder, 2 0.5 sec > 95% coverage Terminal Strength AEC Q200-006 Force of 1.8 kg for 60 seconds < 0.5% Board Flex AEC Q200-005 2 mm deflection (min) < 0.5% 5 X rated power for 5 sec < 0.5% Short Time Overload General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC's own data and is considered accurate at time of going to print. Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com A Subsidiary of TT electronics plc LRMA Series April 2010 Sheet 1 of 5 Physical Data Version - N Version - M, P, and T D L L D T W W Package T Resistance Value (m)2 L W T D 2512 5 - 40 6.4 0.2 3.2 0.2 0.6 0.2 0.9 0.2 1206 5 - 20 3.2 0.2 1.6 0.2 0.6 0.2 0.5 0.3 3 - 20 3.8 0.3 2.1 0.3 0.7 0.2 0.5 0.2 3 - 100 6.4 0.2 3.2 0.2 0.7 0.2 0.9 0.2 6.4 0.2 3.2 0.2 0.6 0.2 LRMA - M LRMA - N 0815 LRMA - P 2512 LRMA - T 2512 2 > 2 - 50 2.0 0.2 0.9 0.2 Note: 1 Dimensions are for reference only and are expressed in mm. 2 Resistance range listed is the full possible range for the product family. Consult factory for offerings within this range, but not listed on Sheet 1. Electrical Connections Package Resistance Value (m)2 a1 b1 L1 L b a LRMA - M 2512 3 - 50 4.0 2.1 4.1 1206 5 - 20 1.8 1.9 1.4 3 - 20 7.9 1.5 0.9 LRMA - N 0815 LRMA - P 2512 3 - 100 4.0 2.1 4.1 1-2 4.0 3.1 1.3 3 - 50 4.0 2.1 4.1 LRMA - T 2512 Circuit Trace Sensing Trace Note: 1 Dimensions are for reference only and are expressed in mm. 2 Resistance range listed is the full possible range for the product family. Consult factory for offerings within this range, but not listed on Sheet 1. Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com LRMA Series April 2010 Sheet 2 of 5 Construction Resistive Alloy Version - M, P, and T UL-94 V0 grade moulding compound Copper Electrode Ni / Sn Plating Version - N A low TCR resistive alloy is coated with a molding compound that enables the part to be suitable for wave and IR reflow methods by controlling the solder attachment area. Copper electrode reduces resistance measurement sensitivity that can result from connection directly to the resistive alloy. Nickel / Tin plating provide a solder compliant surface. LRMA version M is green in color and constructed of Manganese Copper alloy. Power Derating Note: % Of Rated Power 100 The power derating curve is a guidance based on a conservative design model. The LRMA is a solid metal alloy construction that can withstand significantly greater operating temperatures than the conservative model permits. The protective coating will operate up to 260C while the alloy can withstand in excess of 350C. Therefore, the system thermal design will be the most significant design parameter due to the heat limitations of the solder joint. 50 0 0 70 170 Ambient Temperature (C) Thermal Images LRMA-M 20 m at 2 Watts LRMA-N 20 m at 1 Watts LRMA-P 10 m at 3 Watts The above images are based on a standard test circuit board constructed of a four layer FR4 material with 2-ounce outer layers and 1-ounce inner layers, which is typical of many industry designs. Each of the above images is in ambient temperature conditions with no air flow. Contact IRC for more details or for other thermal image test data for specific resistance values and power levels. Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com LRMA Series April 2010 Sheet 3 of 5 IRC Solder Reflow Recommendations Sn-Pb Eutectic and Pb-Free Reflow Profiles tP TP Ramp-up Critical Zone TL to TP TL tL Temperature Tsmax Tsmin ts Preheat 25 Ramp-down t 25C to Peak Time * Based on Industry Standards and IPC recommendations Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly 3C / second max. 3C / second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100C 150C 60 -120 seconds 150C 200C 60 -180 seconds Time maintained above - Temperature (TL) - Time (tL) 183C 60 - 150 seconds 217C 60 - 150 seconds Peak Temperature (TP) See Table 1 See Table 2 Average Ramp-up rate (Tsmax to Tp) Time within 5C of actual Peak Temperature (tp)2 Ramp-down Rate Time 25C to Peak Temperature 10 - 30 seconds 20 - 40 seconds 6C / second max. 6C / second max. 6 minutes max. 8 minutes max. Note 1: All temperatures refer to topside of the package, measured on the package body surface. Note 2: Time within 5 C of actual peak temperature (tp) specified for the reflow profiles is a "supplier" minimum and a "user" maximum. Note 1: Package volume excludes external terminals (balls, bumps, lands, leads) and/or non-integral heat sinks. Tabel 1: SnPb Eutectic Process Package Peak Reflow Temperatures Package Thickness Volume mm3 < 350 Volume mm3 350 < 2.5 mm 240 +0/-5C 225 +0/-5C 2.5 mm 225 +0/-5C 225 +0/-5C Tabel 2: Pb-free Process Package Peak Reflow Temperatures Package Thickness Volume mm3 < 350 Volume mm3 350 - 2000 Volume mm3 > 2000 260C * < 1.6 mm 260C * 260C * 1.6 mm - 2.5 mm 260C * 250C * 245C * 2.5 mm 250C * 245C * 245C * Note 2: The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processess reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist. Note 3: Components intended for use in "leadfree" assembly process shall be evaluated using the "lead-free" peak temperature and profiles defined in Table 1, 2 and reflow profile whether or not lead-free. * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature at the rated MSL level. Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com LRMA Series April 2010 Sheet 4 of 5 Package Tape Specification Top Tape P0 D0 E F B W A T P1 Resistor P2 D 1 1.4Min. direction of unreeling Emboss Tape Note: 1. 2. 3. 4. 5. The cumulative tolerance of 10 sprocket hole pitch is 0.2 mm. Carrier camber shall not be more than 1 mm per 100 mm through a length of 250 mm. A & B measured 0.3 mm from the bottom of the packet. T measured at a point on the inside bottom of the packet to the top surface of the carrier. Pocket position relative to sprocket hole is measured as the true position of the pocket and not the pocket hole. Size A B W E F P0 P1 P2 D0 T 2512 3.60.2 0815 2.60.2 6.90.2 120.2 1.750.1 5.50.05 4.00.05 4.00.1 2.00.05 1.5+0.1, -0 0.850.15 4.50.2 12.00.2 1.750.1 5.50.1 4.00.1 4.00.1 2.00.2 1.550.05 1.10.1 1206 2.00.2 3.60.2 8.00.2 1.750.1 3.50.1 4.00.1 4.00.1 20.05 1.5+0.1, -0 0.840.1 Ordering Data Specify type, resistance, tolerance, ROHS compliance and packaging. Example: Metal Element Current Sense Resistor, 1-watt, 10 m resistor. Sample Part No. LRMA N 3 2512 R010 F LF SLT IRC Type Version M, N, P, and T Power Rating (refer to spec table) Package Size Resistance Value (EIA 4-digit code) Example: 0.010 = R010 Packaging Quantity Series Emboss Plastic Tape 2512 4,000 0815 4,000 1206 5,000 Tolerance (EIA format) F = 1%, G = 2%, J = 5% RoHS - Compliance LF = RoHS compliant Construction Packaging SLT = Standard Lead Tape Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com LRMA Series April 2010 Sheet 5 of 5