SPECIFICATION
Supplier : Samsung electro-mechanics Samsung P/N : CL31C470JIFNFNE
Product : Multi-layer Ceramic Capacitor Description : CAP, 47㎊, 1000V, ±5%, C0G, 1206
CL 31 C470 J I F N F N E
① ②③ ④ ⑤⑥⑦⑧⑨⑩⑪
①Series Samsung Multi-layer Ceramic Capacitor
②Size 1206 (inch code) L: 3.2 ± 0.15 mm W: ± 0.15 mm
③Dielectric C0G ⑧Inner electrode
④Capacitance 47 ㎊Termination
⑤Capacitance ±5 %Plating (Pb Free)
tolerance ⑨Product Product for POWER application
⑥Rated Voltage 1000 V ⑩Special Reserved for future use
⑦Thickness 1.25 ± 0.15 mm ⑪Packaging Embossed Type, 7" reel
B. Samsung Reliablility Test and Judgement condition
Capacitance Within specified tolerance 1㎒±10% 0.5~5Vrms
Q1000 min
Insulation 10,000Mohm or 500Mohm㎌500±50 Vdc 60~120 sec.
Resistance Whichever is Smaller
Appearance No abnormal exterior appearance Microscope (10)
Withstanding No dielectric breakdown or of the rated voltage
Voltage mechanical breakdown
Temperature C0G
Characterisitcs (From -55℃ to 125℃, Capacitance change shoud be within ±30PPM/℃)
Adhesive Strength No peeling shall be occur on the 500gF, for 10±1 sec.
of Termination terminal electrode
Bending Strength Capacitance change : Bending to the limit (1mm)
within ±5% or ±0.5㎊ whichever is larger with 1.0mm/sec.
Solderability More than 75% of terminal surface SnAg3.0Cu0.5 solder
is to be soldered newly 245±5℃, 3±0.3sec.
(preheating : 80~120℃ for 10~30sec.)
Resistance to Capacitance change : Solder pot : 270±5℃, 10±1sec.
Soldering heat within ±2.5% or ±0.25㎊ whichever is larger
Tan δ, IR : initial spec.
Performance Test condition
120%
A. Samsung Part Number
Sn 100%
Cu
Ni
1.6
Vibration Test Capacitance change : Amplitude : 1.5mm
within ±2.5% or ±0.25㎊ whichever is larger From 10㎐ to 55㎐ (return : 1min.)
Tan δ, IR : initial spec. 2hours 3 direction (x, y, z)
High Temperature Capacitance change : Wit
h
of the rated voltage
Resistance within ±3% or ±0.3㎊ whichever is larger Max. operating temperature
Q : 350 min 1000+48/-0hrs
IR : 1000Mohm or 50Mohm ㎌
Temperature Capacitance change : 1 cycle condition
Cycling within ±2.5% or ±0.25㎊ whichever is larger Min. operating temperature →25℃
Tan δ, IR : initial spec. →Max. operating temperature →25℃
5 cycle test
C. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max )
* For the more detail Specification, Please refer to the Samsung MLCC catalogue.
Whichever is Smaller
Performance Test condition
100%
