19-6529; Rev 2; 1/15
Ordering Information appears at end of data sheet.
IEEE is a registered service mark of the Institute of Electrical
and Electronics Engineers, Inc.
WiMAX is a registered certification mark and registered service
mark of WiMAX Forum.
General Description
The MAX5991A/MAX5991B provide a complete power-
supply solution as IEEE® 802.3af-compliant Class 1/
Class 2 Powered Devices (PDs) in a Power-over-Ethernet
(PoE) system. The devices integrate the PD interface with
an efficient DC-DC converter, offering a low external part
count PD solution. The devices also include a low-drop-
out regulator, MPS, sleep, and ultra-low power modes.
The PD interface provides a detection signature and
a Class 1/Class 2 classification signature with a single
external resistor. The PD interface also provides an isola-
tion power MOSFET, a 60mA (max) inrush current limit,
and a 321mA (typ) operating current limit.
The integrated step-down DC-DC converter uses a peak
current-mode control scheme and provides an easy-to-
implement architecture with a fast transient response.
The step-down converter operates in a wide input volt-
age range from 8.7V to 60V and supports up to 6.49W of
input power at 1.3A load. The DC-DC converter operates
at a fixed 430kHz switching frequency, with an efficiency-
boosting frequency foldback that reduces the switching
frequency by half at light loads.
The devices feature an input undervoltage-lockout
(UVLO) with wide hysteresis and long deglitch time
to compensate for twisted-pair cable resistive drop
and to assure glitch-free transition during power-on/-off
conditions. The devices also feature overtemperature
shutdown, short-circuit protection, output overvolt-
age protection, and hiccup current limit for enhanced
performance and reliability.
All devices are available in a 20-pin, 4mm x 4mm, TQFN
power package and operate over the -40°C to +85°C
temperature range.
Applications
●IEEE 802.3af-Powered Devices
●IP Phones
●Wireless Access Nodes
●IP Security Cameras
●WiMAX® Base Stations
Benets and Features
●High Integration Saves Space and BOM Cost
• Efcient, Integrated DC-DC Converter (with
Integrated Switches)
• Built-In Output-Voltage Monitoring
• Protects Against Overload, Output Short Circuit,
Output Overvoltage, and Overtemperature
• Integrated TVS Diode Withstands Cable Discharge
Event (CDE)
• Internal LDO Regulator with Up to 100mA Load
●IEEE 802.3af-Compliant Features Reduce Design Time
• PoE Class 1/Class 2 Classication Set with Single
Resistor
• Intelligent Maintain Power Signature (MPS)
Complies with IEEE 802.3af Specication
• Simplied Wall Adapter Interface
• Pass 2kV, 200m CAT-6 Cable Discharge Event
●High Efficiency During Light Loads Reduces Power
Consumption
• Sleep and Ultra-Low-Power Mode
• Frequency Foldback for High-Efciency Light-
Load Operation
• Back-Bias Capability to Optimize the Efciency
●Robust Performance
• 8.7V to 60V Wide Input Voltage Range
• Hiccup-Mode Runaway Current Limit
• 49mA (typ) Inrush Current Limit
• Open-Drain RESET Output
●Easy to Design With
• 3.2V to 14V Programmable Output Voltage Range
• Internal Compensation
• Fixed 430kHz Switching Frequency
MAX5991A /MAX5991B
IEEE 02.af-Compliant High-Efciency
Class 1Class 2 Powered Devices
with Integrated DC-DC Converter
EVALUATION KIT AVAILABLE
Junction-to-Ambient Thermal Resistance (qJA) ..............35°C/W
Junction-to-Case Thermal Resistance (qJC) ..................2.7°C/W
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Package Thermal Characteristics (Note 2)
(All voltages referenced to GND, unless otherwise noted.)
VDD to GND ...........................................................-0.3V to +70V
(100V, 100ms, RTEST = 3.3kω) (Note 1)
VCC, WAD, RREF to GND ........................ -0.3V to (VDD + 0.3V)
AUX, LDO_IN, LED to GND .................................... -0.3V to 16V
LDO_OUT to GND .............................. -0.3V to (LDO_IN + 0.3V)
LDO_FB to GND ......................................................-0.3V to +6V
LX to GND ................................................ -0.3V to (VCC + 0.3V)
LDO_OUT, VDRV, FB, RESET, WK,
SL, ULP, MPS, CLASS2 to GND .........................-0.3V to +6V
VDRV to VDD ............................................ -0.3V to (VDD + 0.3V)
PGND to GND ......................................................-0.3V to +0.3V
LX Total RMS Current ...........................................................1.6A
Continuous Power Dissipation (TA = + 70NC)
TQFN (derate 28.6mW/NC above +70NC)...............2285.7mW
Operating Temperature Range .......................... -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Note 1: See Figure 1, Test Circuit.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(VDD = 48V, RSIG = 24.9kω, LED, VCC, SL, ULP, WK, RESET, LDO_OUT unconnected, WAD = LDO_EN = LDO_IN = PGND = GND,
C1 = 68nF, C2 = 10µF, C3 = 1µF (see Figure 3), VFB = VAUX = 0V, LX unconnected, CLASS2 = 0V, MPS = 0V. All voltages are refer-
enced to GND, unless otherwise noted. TA = TJ = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 3)
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MAX5991A/MAX5991B IEEE 802.3af-Compliant, High-Efciency,
Class 1/Class 2, Powered Devices
with Integrated DC-DC Converter
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER DEVICE (PD) INTERFACE
DETECTION MODE
Input Offset Current IOFFSET VVDD = 1.4V to 10.1V (Note 4) 8 FA
Effective Differential Input
Resistance dR VVDD = 1.4V to 10.1V with 1V step,
(Note 5) 23.95 25.5 kI
CLASSIFICATION MODE
Classification Enable Threshold VTH,CLS,EN VDD rising 10.2 11.42 12.5 V
Classification Disable Threshold VTH,CLS,DIS VDD rising 22 23 23.8 V
Classification Stability Time 2 ms
Classification Current ICLASS VDD = 12.6V to
20V
CLASS2 = GND 9.12 10.5 11.88 mA
CLASS2 = VDRV 16.1 18 20.9
POWER MODE
VDD Supply Voltage Range VDD 60 V
VDD Supply Current IDD VDD = 60V 4.8 6.6 mA
VDD Turn-On Voltage VON VDD rising 37.2 38.7 40 V
VDD Turn-Off Voltage VOFF VDD falling 30 31.4 V
Electrical Characteristics (continued)
(VDD = 48V, RSIG = 24.9kω, LED, VCC, SL, ULP, WK, RESET, LDO_OUT unconnected, WAD = LDO_EN = LDO_IN = PGND = GND,
C1 = 68nF, C2 = 10µF, C3 = 1µF (see Figure 3), VFB = VAUX = 0V, LX unconnected, CLASS2 = 0V, MPS = 0V. All voltages are refer-
enced to GND, unless otherwise noted. TA = TJ = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 3)
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MAX5991A/MAX5991B IEEE 802.3af-Compliant, High-Efciency,
Class 1/Class 2, Powered Devices
with Integrated DC-DC Converter
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
VDD Turn-On/Off Hysteresis VHYST_UVLO (Note 6) 7.3 V
VDD Deglitch Time tOFF_DLY VDD falling from 40V to 20V (Note 5) 150 Fs
Inrush to Operating Mode Delay tDELAY tDELAY = time after (VDD - VCC) from
1.5V to 0V 115 ms
Isolation Power MOSFET
On-Resistance RON_ISO IVCC = 100mA TJ = +25NC 1.2 I
TJ = +85NC 1.5
MAINTAIN POWER SIGNATURE (MPS = VDRV)
PoE MPS Current Rising
Threshold IMPS_RISE 18 28.7 40 mA
PoE MPS Current Falling
Threshold IMPS_FALL 14 24 35 mA
PoE MPS Current Threshold
Hysteresis IMPS_HYS 4.3 mA
PoE MPS Output Average
Current IMPS_AVE 4.8 mA
PoE MPS Peak Output Current IMPS_PEAK 10 12.6 mA
PoE MPS Time High IMPS_HIGH 95 ms
PoE MPS Time Low IMPS_LOW 190 ms
CURRENT LIMIT
Inrush Current Limit IINRUSH During initial turn-on period,
VDD - VCC = 4V, measured at VCC 39 49 60 mA
Current Limit During Normal
Operation ILIM After inrush completed,
VCC = VDD - 1.5V, measured at VCC 290 321 360 mA
LOGIC
WAD Detection Rising Threshold VWAD_RISE 8.8 V
WAD Detection Falling
Threshold VWAD_FALL 5.8 V
WAD Detection Hysteresis 0.6 V
WAD Input Current IWAD VWAD = 24V 125 FA
CLASS2, MPS Voltage Rising
Threshold 2.9 V
CLASS2, MPS Voltage Falling
Threshold 0.4 V
RESET Output Voltage Low ISINK = 1mA 0.2 V
RESET, CLASS2, MPS Leakage -1 +1 FA
Electrical Characteristics (continued)
(VDD = 48V, RSIG = 24.9kω, LED, VCC, SL, ULP, WK, RESET, LDO_OUT unconnected, WAD = LDO_EN = LDO_IN = PGND = GND,
C1 = 68nF, C2 = 10µF, C3 = 1µF (see Figure 3), VFB = VAUX = 0V, LX unconnected, CLASS2 = 0V, MPS = 0V. All voltages are refer-
enced to GND, unless otherwise noted. TA = TJ = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 3)
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MAX5991A/MAX5991B IEEE 802.3af-Compliant, High-Efciency,
Class 1/Class 2, Powered Devices
with Integrated DC-DC Converter
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
INTERNAL REGULATOR WITH BACK BIAS
VAUX Input Voltage Range VAUX Inferred from VAUX input current 4.75 14 V
VAUX Input Current VAUX from 4.75V to 14V 0.65 3.1 mA
VDRV Output Voltage 4.2 5.5 V
SLEEP MODE
WK and ULP Logic Threshold VTH VWK falling and VULP rising and falling 1.6 2.9 V
SL Logic Threshold Falling 0.55 0.8 V
SL Current V SL = 0V 62 FA
LED Current Amplitude ILED
R SL = 60.4kI, VLED = 6.5V 9.2 10.6 12
mAR SL = 30.2kI, VLED = 6.5V 19.2 21.2 23.5
R SL = 30.2kI, VLED = 3.5V 21.2
LED Current Programmable
Range IRANGE 10 20 mA
LED Current with Grounded SL V SL = 0V 20.6 26 31.4 mA
LED Current Frequency fILED Sleep and ultra-low power modes 250 Hz
LED Current Duty Cycle DILED Sleep and ultra-low power modes 25 %
VDD Current Amplitude IVDD Sleep mode, VLED = 6.5V 10 12 14.5 mA
Internal Current Duty Cycle DIVDD Sleep and ultra-low power modes 75 %
Internal Current Enable Time tMPS Ultra-low power mode 76 88 98 ms
Internal Current Disable Time tMPDO Ultra-low power mode 205 237 265 ms
THERMAL SHUTDOWN
Thermal Shutdown Threshold TSD TJ rising 151 NC
Thermal Shutdown Hysteresis TSD,HYS 16 NC
LDO
Input Voltage Range Inferred from line regulation 4.5 14 V
Output Voltage LDO_FB = VDRV 3.3 V
Max Output Voltage Setting With external divider to LDO_FB 5.5 V
LDO Quiescent Current VLDO_IN = 4.5V 4 FA
LDO FB Regulation Voltage 1.20 1.227 1.25 V
LDO FB Leakage Current -1 +1 FA
Dropout VLDO_IN = 5V, VLDO_FB = VDRV,
ILOAD = 80mA 265 mV
Load Regulation ILOAD from 1mA to 80mA 0.5 mV/mA
Line Regulation VLDO_IN from 4.5V to 14V 1.4 mV/V
Overcurrent Limit 85 mA
Electrical Characteristics (continued)
(VDD = 48V, RSIG = 24.9kω, LED, VCC, SL, ULP, WK, RESET, LDO_OUT unconnected, WAD = LDO_EN = LDO_IN = PGND = GND,
C1 = 68nF, C2 = 10µF, C3 = 1µF (see Figure 3), VFB = VAUX = 0V, LX unconnected, CLASS2 = 0V, MPS = 0V. All voltages are refer-
enced to GND, unless otherwise noted. TA = TJ = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 3)
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MAX5991A/MAX5991B IEEE 802.3af-Compliant, High-Efciency,
Class 1/Class 2, Powered Devices
with Integrated DC-DC Converter
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
LDO_FB Rising Threshold 3.3 3.7 V
LDO_FB Hysteresis 2.4 V
DC-DC CONVERTER INPUT SUPPLY
VDD Voltage Range VDD,RISING VCC = VDD = VWAD - 0.3V, rising 8 60 V
VDD,FALLING VCC = VDD = VWAD - 0.3V, falling 7.7 60
WAD Detection Rising Threshold VWAD,RISE (Note 7) 8.8 V
WAD Detection Falling
Threshold VWAD,FALL (Note 7) 5.8 V
WAD Detection Hysteresis 0.6 V
POWER MOSFETs
High-Side pMOS On-Resistance RDSON-H ILX = 0.5A (sourcing) 0.54 I
Low-Side nMOS On-Resistance RDSON-L ILX = 0.5A (sinking) 0.14 I
LX Leakage Current ILX-LKG VDD = VCC = 28V,
VLX = (VPGND + 1V) to (VCC - 1V) -5 +5 FA
SOFT-START (SS)
Soft-Start Time tSS-TH 10 ms
FEEDBACK (FB)
FB Regulation Voltage VFB-RG 1.203 1.226 1.252 V
FB Input Bias Current IFB VFB = 1.224V 10 200 nA
OUTPUT VOLTAGE
Output Voltage Range VOUT
MAX5991A 3.0 5.6 V
MAX5991B 5.4 14
Cycle by Cycle Overvoltage
Protection VOUT-OV
Rising (Note 8) 101 108 %
Falling (Note 8) 98.5 104
INTERNAL COMPENSATION NETWORK
Compensation Network Zero-
Resistance RZERO 200 kI
Compensation Network Zero-
Capacitance CZERO 150 pF
CURRENT LIMIT
Peak Current-Limit Threshold IPEAK-LIMIT
MAX5991A CLASS2 = GND 1.45 1.64
A
CLASS2 = VDRV 1.66 1.79
MAX5991B CLASS2 = GND 0.75 0.81
CLASS2 = VDRV 0.85 0.94
Note 3: All devices are 100% production tested at TA = +25°C. Limits over temperature are guaranteed by design.
Note 4: The input offset current is illustrated in Figure 2.
Note 5: Effective differential input resistance is defined as the differential resistance between VDD and GND, see Figure 2.
Note 6: A 20V glitch on input voltage, which takes VDD below VON shorter than or equal to tOFF_DLY does not cause the device to
exit power-on mode.
Note 7: The WAD detection rising and falling thresholds control the isolation power MOS transistor. To turn the DC-DC on in WAD
mode, the WAD must be detected and the VDD must be within the VDD voltage range.
Note 8: Referred to feedback regulation voltage.
Note 9: Referred to LDO feedback regulation voltage.
Electrical Characteristics (continued)
(VDD = 48V, RSIG = 24.9kω, LED, VCC, SL, ULP, WK, RESET, LDO_OUT unconnected, WAD = LDO_EN = LDO_IN = PGND = GND,
C1 = 68nF, C2 = 10µF, C3 = 1µF (see Figure 3), VFB = VAUX = 0V, LX unconnected, CLASS2 = 0V, MPS = 0V. All voltages are refer-
enced to GND, unless otherwise noted. TA = TJ = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 3)
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MAX5991A/MAX5991B IEEE 802.3af-Compliant, High-Efciency,
Class 1/Class 2, Powered Devices
with Integrated DC-DC Converter
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Runaway Current-Limit
Threshold
IRUNAWAY-
LIMIT
MAX5991A CLASS2 = GND 1.9
A
CLASS2 = VDRV 2.1
MAX5991B CLASS2 = GND 0.93
CLASS2 = VDRV 1.07
Valley Current-Limit Threshold IVALLEY-
LIMIT
MAX5991A 1.45 A
MAX5991B 0.75
ZX Threshold IZX 25 mA
TIMINGS
Switching Frequency fSW 380 430 475 kHz
Frequency Foldback fSW-FOLD 195 215 238 kHz
Consecutive ZX Events for
Entering Foldback 8 Events
Consecutive ZX Events for
Exiting Foldback 8 Events
VOUT Undervoltage Trip Level to
Cause HICCUP VOUT-HICF After soft-start completed (Note 8) 55 60 65 %
HICCUP Timeout 77 ms
Minimum On-Time tON-MIN 113 140 ns
LX Dead Time 14 ns
RESET
VFB Threshold for RESET
Assertion VFB-OKF VFB falling (Note 8) 87 90 93 %
VFB Threshold for RESET
Deassertion VFB-OKR VFB rising (Note 8) 91.5 95 98 %
VLDO_FB Threshold for RESET
Assertion VLDO_FB-OKF VLDO_FB falling, LDO_FB = VDRV
(Note 9) 90 %
VFB Threshold for RESET
Deassertion VFB rising 95 %
RESET Deassertion Delay 2.4 ms
Figure 1. MAX5991A/MAX5991B Internal TVS Test Setup Figure 2. Effective Differential Resistance and Offset Current
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MAX5991A/MAX5991B IEEE 802.3af-Compliant, High-Efciency,
Class 1/Class 2, Powered Devices
with Integrated DC-DC Converter
IIN
IINi + 1
IINi
IOFFSET
dRi
1VVINi VINi + 1
IOFFSET = IINi - VINi
dRi
dRi = (VINi + 1 - VINi) = 1V
(IINi + 1 - IINi) (IINi + 1 - IINi)
VIN
EVALUATION
BOARD*
1ms/10ms /100ms
RTEST
100V
*EVALUATION PERFORMED WITH THE MAX5988A EV KIT.
Typical Operating Characteristics
(TA = +25°C, unless otherwise noted.)
Maxim Integrated
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MAX5991A/MAX5991B IEEE 802.3af-Compliant, High-Efciency,
Class 1/Class 2, Powered Devices
with Integrated DC-DC Converter
CLASSIFICATION CURRENT
vs. INPUT VOLTAGE
MAX5991A toc05
INPUT VOLTAGE (V)
CLASSIFICATION CURRENT (mA)
222016 181412
7
9
11
13
15
17
19
21
23
25
5
10 24
CLASS 2
CLASS 1
SIGNATURE RESISTANCE
vs. SUPPLY VOLTAGE
MAX5991A toc03
SUPPLY VOLTAGE (V)
DIFFERENTIAL RESISTANCE (kI)
7.45.94.42.9
23
24
25
26
27
28
22
1.4 10.18.9
DETECTION CURRENT vs. INPUT VOLTAGE
MAX5991A toc01
INPUT VOLTAGE (V)
DETECTION CURRENT (mA)
8.97.45.94.42.9
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0
1.4 10.1
CLASSIFICATION SETTLING TIME
MAX5991A toc06
VDD
10V/div
GND
IDD
10mA/div
0mA
400µs/div
INPUT OFFSET CURRENT
vs. INPUT VOLTAGE
MAX5991A toc04
SUPPLY VOLTAGE (V)
OFFSET CURRENT (µA)
7.45.94.42.9
-2
-1
0
1
2
3
-3
1.4 10.18.9
QUIESCENT CURRENT vs. SUPPLY
VOLTAGE (ULTRA-LOW POWER MODE)
MAX5991A toc02
SUPPLY VOLTAGE (V)
QUIESCENT CURRENT (mA)
55504540
2.75
3.00
3.25
3.50
3.75
4.00
2.50
35 60
Typical Operating Characteristics (continued)
(TA = +25°C, unless otherwise noted.)
Maxim Integrated
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MAX5991A/MAX5991B IEEE 802.3af-Compliant, High-Efciency,
Class 1/Class 2, Powered Devices
with Integrated DC-DC Converter
EFFICIENCY vs. LOAD CURRENT
(MAX5991B, VOUT = 12V)
MAX5991A toc11
LOAD CURRENT (A)
EFFICIENCY (%)
0.60.50.1 0.2 0.3 0.4
65
70
75
80
85
90
95
100
60
0 0.7
VIN = 36V
VIN = 48V
VIN = 57V
LED CURRENT vs. LED VOLTAGE
MAX5991A toc09
LED VOLTAGE (V)
LED CURRENT (mA)
5.253.501.75
10
15
20
25
5
0 7.00
RSL = 30.2kI
RSL = 60.4kI
INRUSH CURRENT LIMIT vs. VCC VOLTAGE
MAX5991A toc07
VCC (V)
INRUSH CURRENT (mA)
4236302418126
44
48
52
56
60
40
04
8
LED VOLTAGE
vs. PORT CURRENT (MPS ENABLED)
MAX5991A toc12
LED VOLTAGE
(2 IN SERIES)
5V/div
IDD CURRENT
5mA/div
40ms/div
EFFICIENCY vs. LOAD CURRENT
(MAX5991A, VOUT = 5V)
MAX5991A toc10
LOAD CURRENT (A)
EFFICIENCY (%)
0.90.80.1 0.2 0.3 0.5 0.60.4 0.7
65
70
75
80
85
90
95
100
60
0 1.0
VIN = 12V
VIN = 36V
VIN = 48V
VIN = 57V
LED CURRENT vs. RSL
MAX5991A toc08
RSL (kI)
LED CURRENT (mA)
706050403020
12
18
20
24
28
8
10 80
Typical Operating Characteristics (continued)
(TA = +25°C, unless otherwise noted.)
Maxim Integrated
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10
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MAX5991A/MAX5991B IEEE 802.3af-Compliant, High-Efciency,
Class 1/Class 2, Powered Devices
with Integrated DC-DC Converter
DC-DC CONVERTER STARTUP
(IOUT = 0A)
MAX5991A toc15
VOUT
2V/div
2ms/div
5V LOAD TRANSIENT
(0% TO 50%)
MAX5991A toc13
VOUT
AC-COUPLED
50mV/div
IOUT
500mA/div
0A
100µs/div
DC-DC CONVERTER STARTUP
(IOUT = 1A)
MAX5991A toc16
VOUT
2V/div
2ms/div
5V LOAD TRANSIENT
(50% TO 100%)
MAX5991A toc14
VOUT
AC-COUPLED
50mV/div
IOUT
500mA/div
0A
100µs/div
Pin Description
Pin Congurations
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MAX5991A/MAX5991B IEEE 802.3af-Compliant, High-Efciency,
Class 1/Class 2, Powered Devices
with Integrated DC-DC Converter
PIN NAME FUNCTION
1 AUX
Auxiliary Voltage Input. Auxiliary input to the internal regulator, VDRV. Connect AUX to the output of
the buck converter if the output voltage is greater than 4.75V to back bias the internal circuitry and
increase efficiency. Connect to a clean ground when not used.
2 LX Inductor Connection. Inductor connection for the internal DC-DC converter.
3 LED LED Driver Output. In sleep mode, LED sources a periodic current (ILED) at 250Hz with 25% duty
cycle.
4 LDO_IN LDO Input Voltage. Connect LDO_IN to the output of the DC-DC converter when used; otherwise,
connect to GND. Connect a minimum 1µF bypass capacitor between LDO_IN and GND.
5 LDO_OUT LDO Output Voltage. Connect a minimum 1µF output capacitor between LDO_OUT and GND.
6 FB Feedback. Feedback input for the DC-DC buck converter. Connect FB to a resistive divider from
the output to GND to adjust the output voltage.
7 GND Ground. Reference rail for the device. It is also the “quiet” ground for all voltage reference (e.g., FB
is referenced to this GND).
8 VDRV
Internal 5V Regulator Voltage Output. The internal voltage regulator provides 5V to the MOSFET
driver and other internal circuits. VDRV is referenced to GND. Do not use VDRV to drive external
circuits. Connect a 1µF bypass capacitor between VDRV and GND.
19
20
18
17
7
6
8
LX
LDO_OUT
9
AUX
LDO_FB
MPS
CLASS2
WK
12
VCC
45
15 14 12 11
PGND
RREF
*EP
SL
VDRV
GND
FB
+
LED RESET
3
13
VDD
16 10 ULP
WAD
TQFN
4mm × 4mm
MAX5991A
MAX5991B
TOP VIEW
LDO_IN
*EP = EXPOSED PAD. CONNECT EP TO GND.
Pin Description (continued)
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MAX5991A/MAX5991B IEEE 802.3af-Compliant, High-Efciency,
Class 1/Class 2, Powered Devices
with Integrated DC-DC Converter
PIN NAME FUNCTION
9SL Sleep Mode Enable Input. A falling edge on SL brings the device into sleep mode. An external
resistor (RSL) connected between SL and GND sets the LED current (ILED).
10 ULP
Ultra-Low Power-Mode Enable Input. ULP has an internal 50kI pullup resistor to the internal 5V
bias rail. A falling edge on SL while ULP is asserted low enables ultra-low power mode. When
ultra-low power mode is enabled, the power consumption of the device is reduced even lower than
sleep mode to comply with ultra-low power sleep power requirements while still supporting MPS.
11 CLASS2 Class 2 Selection Pin. Connect to VDRV for Class 2 operation. Connect to GND for Class 1
operation.
12 MPS MPS Enable Pin. Connect to VDRV to turn the MPS function on. Connect to GND to turn the MPS
function off.
13 RESET
Open-Drain Reset Output. The RESET output is driven low if either LDO_OUT or FB drops below
90% of its set value. RESET goes high 100µs after both LDO_OUT and FB rise above 95% of their
set values. Leave unconnected when not used.
14 LDO_FB LDO Regulator Feedback Input. Connect to VDRV to get the preset LDO output voltage of 3.3V, or
connect to a resistive divider from the LDO_OUT to GND for an adjustable LDO output voltage.
15 WK
Wake Mode Enable Input. WK has an internal 50kI pullup resistor to the internal 5V bias rail.
A falling edge on WK brings the device out of sleep mode and into the normal operating mode
(wake mode).
16 WAD
Wall Power Adapter Detector Input. Wall adapter detection is enabled when the voltage from WAD
to GND is greater than 8.8V. When a wall power adapter is present, the isolation p-channel power
MOSFET turns off. Connect WAD directly to GND when the wall power adapter or other auxiliary
power source is not used.
17 VDD Positive Supply Input. Connect a 68nF (min) bypass capacitor between VDD and PGND.
18 VCC DC-DC Converter Power Input. VDD is connected to VCC by an isolation p-channel MOSFET.
Connect a 10FF capacitor in parallel with a 1µF ceramic capacitor between VCC and PGND.
19 PGND Power Ground. Power ground of the DC-DC converter power stage. Connect PGND to GND with a
star connection. Do not use PGND as reference for sensitive feedback circuit.
20 RREF Signature Resistor Connection. Connect a 24.9kI resistor (RSIG) to GND.
— EP Exposed Pad. Connect the exposed pad to ground.
Detailed Description
PD Interface
The MAX5991A/MAX5991B include complete interface
functions for a PD to comply with the IEEE 802.3af
standard as a Class 1/Class 2 PD. The devices provide
the detection and classification signatures using a single
external signature resistor. An integrated MOSFET pro-
vides isolation from the buck converter when the PSE
has not applied power. The devices guarantee a leakage
current offset of less than 8µA during the detection
phase. The devices feature power-mode undervoltage-
lockout (UVLO) with wide hysteresis and long deglitch
time to compensate for twisted-pair-cable resistive drop
and to ensure glitch-free transitions between detection,
classification, and power-on/-off modes.
Operating Modes
The devices operate in three different modes depending
on VDD. The three modes are detection mode, classifica-
tion mode, and power mode. The device is in detection
mode when VDD is between 1.4V and 10.1V, classifica-
tion mode when VDD is between 12.6V and 20V, and
power mode when the input voltage exceeds VON.
Detection Mode (1.4V < VDD < 10.1V)
In detection mode, the devices provide a signature
differential resistance to VDD. During detection, the
power-sourcing equipment (PSE) applies two voltages to
VDD, both between 1.4V and 10.1V with a minimum 1V
increment. The PSE computes the differential resistance
to ensure the presence of the 24.9kω signature resis-
tor. Connect the 24.9kω signature resistor (RSIG) from
RREF to GND for proper signature detection. The device
applies VDD to RREF when in detection mode, and the
VDD offset current due to the device is less than 8µA. The
DC offset due to protection diodes does not significantly
affect the signature resistance measurement.
Classication Mode (12.6V < VDD < 20V)
In classification mode, the devices sink a Class 1/Class
2 classification currents. The PSE applies a classifica-
tion voltage between 12.6V and 20V, and measures the
classification currents. The devices use the external
24.9kω resistor (RSIG) and the CLASS2 pin to set the
classification current at 10.5mA (Class 1, CLASS1 =
GND) or 18mA (Class 2, CLASS2 = VDRV). The PSE
uses this to determine the maximum power to deliver.
The classification current includes current drawn by the
supply current of the device so the total current drawn
by the PD is within the IEEE 802.3af standard. The
classification current is turned off when the device leaves
classification mode.
Power Mode (VDD > VON)
In power mode, the devices have the isolation MOSFET
between VDD and VCC fully on. The devices have the
buck regulator enabled and the LDO enabled. The
devices can be in either wake mode, sleep mode, or
ultra-low power mode. The buck regulator and LDO are
only enabled in wake mode.
The devices enter power mode when VDD rises above
the undervoltage lockout threshold (VON). When VDD
rises above VON, the device turns on the internal p-chan-
nel isolation MOSFET to connect VCC to VDD with inrush
current limit internally set to 49mA (typ). The isolation
MOSFET is fully turned on when VCC is near VDD and the
inrush current is below the inrush limit. Once the isola-
tion MOSFET is fully turned on, the device changes the
current limit to 321mA. The buck converter turns on
115ms after the isolation MOSFET turns on fully.
Undervoltage Lockout
The devices operate with up to a 60V supply voltage
with a turn-on UVLO threshold (VON) at 38.7V (typ), and
a turn-off UVLO threshold (VOFF) at 31.4V (typ). When
the input voltage is above VON, the device enters power
mode and the internal isolation MOSFET is turned on.
When the input voltage is below VOFF for more than
tOFF_DLY, the MOSFET and the buck converter are off.
LED Driver
The devices drive an LED, or multiple LEDs in series, with
a maximum LED voltage of 6.5V. In sleep mode and ultra-
low power mode, the LED current is pulse width modu-
lated with a duty cycle of 25% and the amplitude is set by
R SL. The LED driver current amplitude is programmable
from 10mA to 20mA using R SL according to the formula:
ILED = 646/R SL (mA)
where R SL is in kω.
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13
MAX5991A/MAX5991B IEEE 802.3af-Compliant, High-Efciency,
Class 1/Class 2, Powered Devices
with Integrated DC-DC Converter
Sleep and Ultra-Low Power Modes
The devices feature a sleep mode and an ultra-low power
mode in which the internal p-channel isolation MOSFET
is kept on and the buck regulator is off. In sleep mode,
the LED driver output (LED) pulse width modulates the
LED current with a 25% duty cycle. The peak LED current
(ILED) is set by an external resistor R SL. To enable sleep
mode, apply a falling edge to SL with ULP disconnected
or high impedance. Sleep mode can only be entered
from wake mode.
Ultra-low power mode allows the devices to reduce
power consumption lower than sleep mode, while main-
taining the power signature of the IEEE standard. The
ultra-low power-mode enable input ULP is internally held
high with a 50kω pullup resistor to the internal 5V bias of
the device. To enable ultra-low power mode, apply a fall-
ing edge to SL with ULP = LOW. Ultra-low power mode
can only be entered from wake mode.
To exit from sleep mode or ultra-low power mode and
resume normal operation, apply a falling edge on the
wake-mode enable input (WK).
Thermal-Shutdown Protection
If the devices’ die temperature reaches 151°C, an over-
temperature fault is generated and the device shuts down.
The die temperature must cool down below +127°C to
remove the overtemperature fault condition. After a ther-
mal shutdown condition clears, the device is reset.
WAD Description
For applications where an auxiliary power source such
as a wall power adapter is used to power the PD, the
devices feature wall power adapter detection.
The wall power adapter is connected from WAD to PGND.
The devices detect the wall power adapter when the volt-
age from WAD to PGND is greater than 8.8V. When a wall
power adapter is detected, the internal isolation MOSFET
is turned off, classification current is disabled.
Connect the auxiliary power source to WAD, connect a
diode from WAD to VDD, and connect a diode from WAD
to VCC. See the typical application circuit in Figures 3
and 4.
The application circuit must ensure that the auxiliary
power source can provide power to VDD and VCC by
means of external diodes. The voltage on VDD must be
within the VDD voltage range to allow the DC-DC to oper-
ate. To allow operation of the DC-DC converter, the VDD
and VCC voltage must be greater than 8V, on the rising
edge, while on the falling edge the VDD and VCC may fall
down to 7.7V keeping the DC-DC converter on.
Note: When operating solely with a wall power adapter,
the WAD voltage must be able to meet the condition VDD
> 8V, that likely results in WAD > 8.8V.
Internal Linear
Regulator and Back Bias
An internal voltage regulator provides VDRV to internal
circuitry. The VDRV output is filtered by a 1µF capaci-
tor connected from VDRV to GND. The regulator is for
internal use only and cannot be used to provide power to
external circuits. VDRV can be powered by either VDD or
VAUX, depending on VAUX. The internal regulator is used
for both PD and buck converter operations.
VOUT can be used to back bias the VDRV voltage regu-
lator if VOUT is greater than 4.75V. Back biasing VDRV
increases device efficiency by drawing current from
VOUT instead of VDD. If VOUT is used as back bias,
connect AUX directly to VOUT. In this configuration, the
VDRV source switches from VDD to VAUX after the buck
converter’s output has reached its regulation voltage.
Cable Discharge Event Protection (CDE)
A 70V voltage clamp is integrated to protect the internal
circuits from a cable discharge event.
DC-DC Buck Converter
The DC-DC buck converter uses a PWM, peak current-
mode, fixed-frequency control scheme providing an
easy-to-implement architecture without sacrificing a fast
transient response. The buck converter operates in a
wide input voltage range from 8V to 60V and supports up
to 6.49W of output power at 1.3A load. The devices pro-
vide a wide array of protection features including UVLO,
overtemperature shutdown, short-circuit protection with
hiccup runaway current limit, cycle-by-cycle peak cur-
rent protection, and cycle-by-cycle output overvoltage
protection, for enhanced performance and reliability. A
frequency foldback scheme is implemented to reduce
the switching frequency to half at light loads to increase
the efficiency.
Frequency Foldback Protection for
High-Efciency Light-Load Operation
The devices enter frequency foldback mode when eight
consecutive inductor current zero-crossings occur. The
switching frequency is 430kHz under loads large enough
that the inductor current does not cross zero. In frequen-
cy foldback mode, the switching frequency is reduced
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MAX5991A/MAX5991B IEEE 802.3af-Compliant, High-Efciency,
Class 1/Class 2, Powered Devices
with Integrated DC-DC Converter
to 215kHz to increase power conversion efficiency. The
device returns to normal mode when the inductor current
does not cross zero for eight consecutive switching peri-
ods. Frequency foldback mode is forced during startup
until 50% of the soft-start is completed.
Hiccup Mode
The devices include a hiccup protection feature. When
hiccup protection is triggered, the devices turn off the
high-side and turn on the low-side MOSFET until the
inductor current reaches the valley current limit. The
control logic waits 77ms until attempting a new soft-start
sequence. Hiccup mode is triggered if the current in
the high-side MOSFET exceeds the runaway current-
limit threshold, both during soft-start and during normal
operating mode. Hiccup mode can also be triggered in
normal operating mode in the case of an output under-
voltage event. This happens if the regulated feedback
voltage drops below 60% (typ).
RESET Output
The devices feature an open-drain RESET output that
indicates if either the LDO or the switching regulator drop
out of regulation. The RESET output goes low if either
regulator drops below 92% of its regulated feedback
value. RESET goes high impedance 100µs after both
regulators are above 95% of their value.
Maintain Power Signature (MPS)
The devices feature the MPS to comply with the IEEE
802.3af standard. It is able to maintain a minimum current
(10mA) of the port to avoid the power disconnection from
the PSE. The devices enter MPS mode when the port
current is lower than 14mA and also exit the MPS mode
when the port current is greater than 40mA. The feature is
enabled by connecting the MPS pin to VDRV, or disabled
by connecting the MPS pin to GND.
Applications Information
Operation with Wall Adapter
For applications where an auxiliary power source such
as a wall power adapter is used to power the PD, the
devices feature wall power adapter detection. The device
gives priority to the WAD supply over VDD supply, and
smoothly switches the power supply to WAD when it is
detected. The wall power adapter is connected from
WAD to PGND. The devices detect the wall power adapt-
er when the voltage from WAD to PGND is greater than
8.8V. When a wall power adapter is detected, the internal
isolation MOSFET is turned off, classification current is
disabled and the device draws power from the auxiliary
power source through VCC. Connect the auxiliary power
source to WAD, connect a diode from WAD to VCC. See
the typical application circuit in Figures 3 and 4.
Adjusting LDO Output Voltage
An uncommitted LDO regulator is available to provide
a supply voltage to external circuits. A preset voltage
of 3.3V is set by connecting LDO_FB directly to VDRV.
For different output voltages connect a resistor divider
from LDO_OUT and LDO_FB to GND. The total feedback
resistance should be in the range of 100kω. The maxi-
mum output current is 85mA and thermal considerations
must be taken to prevent triggering thermal shutdown.
The LDO regulator can be powered by VOUT, a differ-
ent power supply, or grounded when not used. The LDO
is enabled once the buck converter has reached the
regulation voltage. The LDO is disabled when the buck
converter is turned off or not regulating.
Adjusting Buck Converter Output Voltage
The buck converter output voltage is set by changing
the feedback resistor-divider ratio. The output voltage
can be set from 3.0V to 5.6V (MAX5991A) or 5.4V to
14V (MAX5991B). The FB voltage is regulated to 1.226V.
Keep the trace from the FB pin to the center of the resis-
tive divider short, and keep the total feedback resistance
around 100kω.
Inductor Selection
Choose an inductor with the following equation:
where LIR is the ratio of the inductor ripple current to
full load current at the minimum duty cycle. Choose LIR
between 20% to 40% for best performance and stability.
Use an inductor with the lowest possible DC resistance
that fits in the allotted dimensions. Powdered iron ferrite
core types are often the best choice for performance.
With any core material, the core must be large enough
not to saturate at the current limit of the devices.
VCC Input Capacitor Selection
The input capacitor reduces the current peaks drawn
from the input power supply and reduces switching noise
in the IC. The total input capacitance must be equal or
greater than the value given by the following equation
to keep the input-ripple voltage within specification and
minimize the high-frequency ripple current being fed
back to the input source:
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15
MAX5991A/MAX5991B IEEE 802.3af-Compliant, High-Efciency,
Class 1/Class 2, Powered Devices
with Integrated DC-DC Converter
where VIN-RIPPLE is the maximum allowed input ripple
voltage across the input capacitors and is recommended
to be less than 2% of the minimum input voltage. D is
the duty cycle (VOUT/VIN) and TS is the switching period
(1/fS).
The impedance of the input capacitor at the switching
frequency should be less than that of the input source so
high-frequency switching currents do not pass through
the input source, but are instead shunted through the
input capacitor. The input capacitor must meet the ripple
current requirement imposed by the switching currents.
The RMS input ripple current is given by:
where IRIPPLE is the input RMS ripple current.
Output Capacitor Selection
The key selection parameters for the output capacitor are
capacitance, ESR, ESL, and voltage-rating requirements.
These affect the overall stability, output ripple voltage,
and transient response of the DC-DC converter. The out-
put ripple occurs due to variations in the charge stored in
the output capacitor, the voltage drop due to the capaci-
tor’s ESR, and the voltage drop due to the capacitor’s
ESL. Estimate the output-voltage ripple due to the output
capacitance, ESR, and ESL:
VRIPPLE = VRIPPLE(C) + VRIPPLE(ESR) +VRIPPLE(ESL)
where the output ripple due to output capacitance, ESR,
and ESL is:
or whichever is larger. The peak-to-peak inductor current
(IP-P)
Use these equations for initial output capacitor selec-
tion. Determine final values by testing a prototype or an
evaluation circuit. A smaller ripple current results in less
output-voltage ripple. Since the inductor ripple current is
a factor of the inductor value, the output-voltage ripple
decreases with larger inductance. Use ceramic capaci-
tors for low ESR and low ESL at the switching frequency
of the converter. The ripple voltage due to ESL is negli-
gible when using ceramic capacitors.
Load-transient response depends on the selected output
capacitance. During a load transient, the output instantly
changes by ESR x ILOAD. Before the controller can
respond, the output deviates further, depending on the
inductor and output capacitor values. After a short time,
the controller responds by regulating the output voltage
back to its predetermined value. The controller response
time depends on the closed-loop bandwidth. A higher
bandwidth yields a faster response time, preventing the
output from deviating further from its regulating value.
Table 1. Design Selection Table
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MAX5991A/MAX5991B IEEE 802.3af-Compliant, High-Efciency,
Class 1/Class 2, Powered Devices
with Integrated DC-DC Converter
OUTPUT
(V)
CIN COUT L CLASS
CERAMIC ELECTROLYTIC CERAMIC
3.3 2.2FF/100V 10FF/63V 2 x 22FF/6.3V 15FH/1.7A 1
52.2FF/100V 10FF/63V 2 x 22FF/6.3V 22FH/1.7A 1 or 2
12 2.2FF/100V 10FF/63V 2 x 10FF/16V 100FH/0.8A 1 or 2
PCB Layout
Careful PCB layout is critical to achieve clean and stable
operation. It is highly recommended to duplicate the
MAX5991A EV kit layout for optimum performance. If
deviation is necessary, follow these guidelines for good
PCB layout:
1) Connect input and output capacitors to the power
ground plane; connect all other capacitors to the sig-
nal ground plane.
2) Place capacitors on VDD, VCC, AUX, VDRV as close
as possible to the IC and its corresponding pin using
direct traces. Keep power ground plane (connected
to PGND) and signal ground plane (connected to
GND) separate.
3) Keep the high-current paths as short and wide as
possible. Keep the path of switching current short
and minimize the loop area formed by LX, the output
capacitors, and the input capacitors.
4) Connect VDD, VCC, and PGND separately to a large
copper area to help cool the IC to further improve
efficiency and long-term reliability.
5) Ensure all feedback connections are short and direct.
Place the feedback resistors and compensation com-
ponents as close as possible to the IC.
6) Route high-speed switching nodes, such as LX, away
from sensitive analog areas (FB).
7) Place enough vias in the pad for the EP of the devices
so that heat generated inside can be effectively dis-
sipated by the PCB copper. The recommended spac-
ing for the vias is 1mm to 1.2mm pitch. The thermal
vias should be plated (1oz copper) and have a small
barrel diameter (0.3mm to 0.33mm).
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MAX5991A/MAX5991B IEEE 802.3af-Compliant, High-Efciency,
Class 1/Class 2, Powered Devices
with Integrated DC-DC Converter
Typical Application Circuits
Figure 3. MAX5991A/MAX5991B 5V Buck Regulator and Fixed LDO Output
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MAX5991A/MAX5991B IEEE 802.3af-Compliant, High-Efciency,
Class 1/Class 2, Powered Devices
with Integrated DC-DC Converter
C3
1µF
RJ45 AND
BRIDGE
RECTIFIER
MAX5991A
MAX5991B
VDRV
CLASS2
MPS
LDO_FB
VDD VCC WAD
WK
SL
RREF
GND PGND
ULP
AUX
LX
FB
LED
LDO_OUT
L0
22µH
C2
10µF
C1
68nF 1µF
R1
75kI
RSL
60.4kI
0I
TO µP OPEN-DRAIN OUTPUTS
OR PULLDOWN SWITCHES
RSIG
24.9kI
R2
24.9kI
5V
OUTPUT
3.3V
OUTPUT
LDO_IN
C5
1µF
C6
1µF
TO 5V OUTPUTS
C4
47µF
Typical Application Circuits (continued)
Figure 4. MAX5991A/MAX5991B 5V Buck Regulator and Adjustable LDO Output
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19
MAX5991A/MAX5991B IEEE 802.3af-Compliant, High-Efciency,
Class 1/Class 2, Powered Devices
with Integrated DC-DC Converter
MAX5991A
MAX5991B
VDRV
CLASS2
MPS
VDD VCC WAD
WK
SL
RREF
LDO_IN
GND PGND
ULP
AUX
LX
FB
LED
LDO_OUT
LDO_FB
L0
22µH
C2
10µF
C1
68nF
C3
1µF
C5
1µF
1µF
R1
75kI
RSL
60.4kI
0I
TO µP OPEN-DRAIN OUTPUTS
OR PULLDOWN SWITCHES
TO 5V OUTPUTS
RSIG
24.9kI
R2
24.9kI
R3
ADJ_LDO_OUT
R4
5V
OUTPUT
RJ45 AND
BRIDGE
RECTIFIER
C4
47µF
C6
1µF
Functional Diagram
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20
MAX5991A/MAX5991B IEEE 802.3af-Compliant, High-Efciency,
Class 1/Class 2, Powered Devices
with Integrated DC-DC Converter
CONTROL
CLK
1.5V
VREF
DRIVER
FB
PGND
LX
VDRV
AUX
WAD
VCC
5V
HOT-SWAP
CONTROLLER
PD VOLTAGE
MONITOR
5V
5V
1
0
5V
5V
REGULATOR
OPEN DRAIN RESET
5V
DETECTION
CLASSIFICATION
TVS
GND
VDD
RREF
VREF
LDO_IN
LDO_OUT
LDO_FB
LDO
LOGIC
50kI50kI
WK
SL
ULP
LED
5VVDD
VDD
MAX5991A
MAX5991B
CLASS
BANDGAP
MPS
MPS
CLASS2
Ordering Information
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns (foot-
prints), go to www.maximintegrated.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
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21
MAX5991A/MAX5991B IEEE 802.3af-Compliant, High-Efciency,
Class 1/Class 2, Powered Devices
with Integrated DC-DC Converter
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
20 TQFN-EP T2044+4 21-0139 90-0409
PART
PIN-PACKAGE
SLEEP/ULP
MODE
LDO
UVLO (V) RESET MPS/CLASS2 OUTPUTADJ
MAX5991A
ETP+ 20 TQFN-EP* Yes Yes 38.7 Yes Yes Yes
MAX5991BETP+
20 TQFN-EP* Yes Yes 38.7 Yes Yes Yes
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com.
Revision History
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. © 2015 Maxim Integrated Products, Inc.
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MAX5991A/MAX5991B IEEE 802.3af-Compliant, High-Efciency,
Class 1/Class 2, Powered Devices
with Integrated DC-DC Converter
REVISION
NUMBER
REVISION
DATE DESCRIPTION PAGES
CHANGED
0 11/12 Initial release —
1 1/13 Changed land pattern number 21
2 1/15 Updated Benefits and Features section 1
