REG1117-2.85_2K5 - Burr-Brown / Texas Instruments

REG1117

REG1117A

800mA and 1A Low Dropout Positive Regulator

1.8V, 2.5V, 2.85V, 3.3V, 5V, and Adjustable

FEATURES

● FIXED AND ADJUSTABLE VERSIONS

●2.85V MODEL FOR SCSI-2 ACTIVE

TERMINATION

●OUTPUT CURRENT:

REG1117: 800mA max

REG1117A: 1A max

●OUTPUT TOLERANCE: ±1% max

●DROPOUT VOLTAGE:

REG1117: 1.2V max at IO

= 800mA

REG1117A: 1.3V max at IO = 1A

● INTERNAL CURRENT LIMIT

● THERMAL OVERLOAD PROTECTION

● SOT-223 AND DDPAK SURFACE

MOUNT PACKAGES

APPLICATIONS

● SCSI-2 ACTIVE TERMINATION

● HAND-HELD DATA COLLECTION DEVICES

● HIGH EFFICIENCY LINEAR REGULATORS

● BATTERY POWERED INSTRUMENTATION

●BATTERY MANAGEMENT CIRCUITS FOR

NOTEBOOK AND PALMTOP PCs

●CORE VOLTAGE SUPPLY:

FPGA, PLD, DSP, CPU

DESCRIPTION

The REG1117 is a family of easy-to-use three-termi-

nal voltage regulators. The family includes a variety of

fixed- and adjustable-voltage versions, two currents

(800mA and 1A) and two package types (SOT-223

and DDPAK). See the chart below for available op-

tions.

Output voltage of the adjustable versions is set with

two external resistors. The REG1117’s low dropout

voltage allows its use with as little as 1V input-output

voltage differential.

Laser trimming assures excellent output voltage accu-

racy without adjustment. An NPN output stage allows

output stage drive to contribute to the load current for

maximum efficiency.

REG1117

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800mA 1A

VOLTAGE SOT-223 DDPAK SOT-223 DDPAK

1.8V ✔✔

2.5V ✔✔

2.85V ✔

3.3V ✔✔

5V ✔✔

Adj. ✔✔✔

SBVS001

REG1117

SPECIFICATIONS

At TJ = +25°C, unless otherwise noted.

REG1117, REG1117A

PARAMETER CONDITIONS MIN TYP MAX UNITS

OUTPUT VOLTAGE

REG1117-2.85 IO = 10mA, VIN = 4.85V 2.820 2.85 2.880 V

Note 1 IO = 0 to 800mA, VIN = 4.05 to 10V 2.790 2.85 2.910 V

REG1117-3.3 IO = 10mA, VIN = 5.3V 3.270 3.30 3.330 V

Note 1 IO = 0 to 800mA, VIN = 4.8 to 10V 3.240 3.30 3.360 V

REG1117-5 IO = 10mA, VIN = 7V 4.950 5.00 5.050 V

Note 1 IO = 0 to 800mA, VIN = 6.5 to 10V 4.900 5.00 5.100 V

REG1117A-1.8 IO = 10mA, VIN = 3.8V 1.782 1.8 1.818 V

Note 1 IO = 0 to 1A, VIN = 3.8V to 10V 1.764 1.8 1.836 V

REG1117A-2.5 IO = 10mA, VIN = 4.5V 2.475 2.5 2.525 V

Note 1 IO = 0 to 1A, VIN = 4.5V to 10V 2.450 2.5 2.550 V

REG1117A-5 IO = 10mA, VIN = 7V 4.950 5.0 5.050 V

Note 1 IO = 0 to 1A, VIN = 7V to 10V 4.900 5.0 5.100 V

REFERENCE VOLTAGE

REG1117 (Adjustable) IO = 10mA, VIN – VO = 2V 1.238 1.250 1.262 V

Note 1 IO = 10 to 800mA, VIN – VO = 1.4 to 10V 1.225 1.250 1.280 V

REG1117A (Adjustable) IO = 10mA, VIN – VO = 2V 1.238 1.250 1.262 V

Note 1 IO = 10mA to 1A, VIN – VO = 1.4 to 10V 1.225 1.250 1.280 V

LINE REGULATION

REG1117-2.85 Note 1 IO = 0, VIN = 4.25 to 10V 1 7 mV

REG1117-3.3 Note 1 IO = 0, VIN = 4.8 to 10V 2 7 mV

REG1117-5 Note 1 IO = 0, VIN = 6.5 to 15V 3 10 mV

REG1117 (Adjustable) Note 1 IO = 10mA, VIN – VO = 1.5 to 13.75V 0.1 0.4 %

REG1117A (Adjustable) Note 1 IO = 10mA, VIN – VO = 1.5 to 13.75V 0.1 0.4 %

REG1117A-1.8 Note 1 IO = 0, VIN = 3.8V to 10V 1 7 mV

REG1117A-2.5 Note 1 IO = 0, VIN = 4.5V to 10V 1 7 mV

REG1117A-5.0 Note 1 IO = 0, VIN = 7V to 15V 3 10 mV

LOAD REGULATION

REG1117-2.85 Note 1 IO = 0 to 800mA, VIN = 4.25V 2 10 mV

REG1117-3.3 Note 1 IO = 0 to 800mA, VIN = 4.8V 3 12 mV

REG1117-5 Note 1 IO = 0 to 800mA, VIN = 6.5V 3 15 mV

REG1117 (Adjustable) Note 1, 2 IO = 10 to 800mA, VIN – VO = 3V 0.1 0.4 %

REG1117A (Adjustable) Note 1, 2 IO = 10mA to 1A, VIN – VO = 3V 0.1 0.4 %

REG1117A-1.8 IO = 0 to 1A, VIN = 3.8V 2 10 mV

REG1117A-2.5 IO = 0 to 1A, VIN = 4.5V 2 10 mV

REG1117A-5 IO = 0 to 1A, VIN = 7.0V 3 15 mV

DROPOUT VOLTAGE Note 3

All Models Note 1 IO = 100mA 1.00 1.10 V

Note 1 IO = 500mA 1.05 1.15 V

REG1117 Models Note 1 IO = 800mA 1.10 1.20 V

REG1117A IO = 1A 1.2 1.30 V

Note 1 IO = 1A 1.2 1.55 V

CURRENT LIMIT

REG1117 Models VIN – VO = 5V 800 950 1200 mA

REG1117A VIN – VO = 5V 1000 1250 1600 mA

MINIMUM LOAD CURRENT

Adjustable Models Note 1, 2 VIN – VO = 13.75V 1.7 5 mA

QUIESCENT CURRENT

Fixed-Voltage Models Note 1 VIN – VO = 5V 4 10 mA

Adjust Pin Current Note 1, 2 IO = 10mA, VIN – VO = 1.4 to 10V 50 120 µA

vs Load Current, REG1117 Note 1 IO = 10mA to 800mA, VIN – VO = 1.4 to 10V 0.5 5 µA

vs Load Current, REG1117A Note 1 IO = 10mA to 1A, VIN – VO = 1.4 to 10V 0.5 5 µA

THERMAL REGULATION

All Models Note 4 30ms Pulse 0.01 0.1 %/W

RIPPLE REJECTION

All Models f = 120Hz, VIN – VOUT = 3V+1VPP Ripple 62 dB

TEMPERATURE DRIFT

Fixed-Voltage Models TJ = 0°C to +125°C 0.5 %

Adjustable Models TJ = 0°C to +125°C2%

REG1117

LONG-TERM STABILITY

All Models TA = +125°C, 1000Hr 0.3 %

OUTPUT NOISE

rms Noise, All Models f = 10Hz to 10kHz 0.003 %

THERMAL RESISTANCE

Operating Junction Temperature Range 0 +125 °C

Storage Range –65 +150 °C

Thermal Resistance,

JC (Junction-to-Case at Tab)

3-Lead SOT-223 Surface-Mount 15 °C/W

3-Lead DDPAK Surface-Mount f > 50Hz 2 °C/W

dc 3 °C/W

Thermal Resistance,

JA (Junction-to-Case at Tab)

3-Lead DDPAK Surface-Mount No Heat Sink 65 °C/W

The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes

no responsibility for the use of this information, and all use of such information shall be entirely at the user's own risk. Prices and specifications are subject to change

without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant

any BURR-BROWN product for use in life support devices and/or systems.

NOTES: (1) Specification applies over the full operating Junction temperature range, 0°C to 125°C. (2) REG1117 and REG1117A adjustable versions require a

minimum load current for ±3% regulation. (3) Dropout voltage is the Input voltage minus output voltage that produces a 1% decrease in output voltage.

(4) Percentage change in unloaded output voltage before vs after a 30ms power pulse of IO = 800mA (REG1117 models), IO = 1A (REG1117A), VIN – VO = 1.4V

(Reading taken 10ms after pulse).

SPECIFICATIONS (cont.)

At TJ = +25°C, unless otherwise noted.

REG1117, REG1117A

PARAMETER CONDITIONS MIN TYP MAX UNITS

ABSOLUTE MAXIMUM RATINGS(1)

Power Dissipation ........................................................... Internally Limited

Input Voltage........................................................................................ 15V

Operating Junction Temperature Range............................. 0°C to +125°C

Storage Temperature Range .......................................... –65°C to +150°C

Lead Temperature (soldering, 10s)(2) ............................................ +300°C

NOTE: (1) Stresses above these ratings may cause permanent damage. (2) See

“Soldering Methods.”

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degrada-

tion to complete device failure. Precision integrated circuits

may be more susceptible to damage because very small

parametric changes could cause the device not to meet its

published specifications.

Plastic SOT-223 Plastic DDPAK

Tab is V

OUT

Ground

(Adj.)

(1)

Tab is

OUT

Ground

(Adj.)

(1)

NOTE: (1) Adjustable-Voltage Model.

CONNECTION DIAGRAM

Front View

REG1117

PACKAGE SPECIFIED

DRAWING TEMPERATURE PACKAGE ORDERING TRANSPORT

PRODUCT VO/IOPACKAGE NUMBER RANGE MARKING NUMBER(1) MEDIA

800mA Output

REG1117-2.85 2.85/800mA SOT-223 311 –40°C to +85°C BB11172 REG1117-2.85 Rails

""/"" " " "REG1117-2.85 / 2K5 Tape and Reel

REG1117-3.3 3.3/800mA SOT-223 311 –40°C to +85°C BB11174 REG1117-3.3 Rails

""/"" " " "REG1117-3.3 /2K5 Tape and Reel

REG1117F-3.3 3.3/800mA DDPAK-3 339 –40°C to +85°C BB1117F4 REG1117F-3.3 Rails

""/"" " " "REG1117F-3.3/500 Tape and Reel

REG1117-5 5V/800mA SOT-223 311 –40°C to +85°C BB11175 REG1117-5 Rails

""/"" " " "REG1117-5/2K5 Tape and Reel

REG1117 Adj./800mA SOT-223 311 –40°C to +85°C BB1117 REG1117 Rails

""/"" " " " REG1117/2K5 Tape and Reel

1A Output

REG1117A-1.8 1.8V/1A SOT-223 311 –40°C to +85°C R111718 REG1117A-1.8 Rails

""/"" " " "REG1117A-1.8/2K5 Tape and Reel

REG1117FA-1.8 1.8/1A DDPAK-3 339 –40°C to +85°C REG1117FA1.8 REG1117FA-1.8 Rails

""/"" " " "REG1117FA-1.8 /500 Tape and Reel

REG1117A-2.5 2.5/1A SOT-223 311 –40°C to +85°C R111725 REG1117A-2.5 Rails

""/"" " " "REG1117A-2.5/2K5 Tape and Reel

REG1117FA-2.5 2.5/1A DDPAK-3 339 –40°C to +85°C REG1117FA2.5 REG1117FA-2.5 Rails

""/"" " " "REG1117FA-2.5 /500 Tape and Reel

REG1117FA-5 5/1A DDPAK-3 339 –40°C to +85°C REG1117FA5.0 REG1117FA-5 Rails

""/"" " " "REG1117FA-5 /500 Tape and Reel

REG1117A Adj./1A SOT-223 311 –40°C to +85°C BB1117A REG1117A Rails

""/"" " " "REG1117A/2K5 Tape and Reel

REG1117FA Adj./1A DDPAK-3 339 –40°C to +85°C REG1117FA REG1117FA Rails

""/"" " " "REG1117FA/500 Tape and Reel

NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces

of “REG1117/2K5” will get a single 2500-piece Tape and Reel.

Thermal

Limit

10X V

OUT

Ground (Fixed-Voltage Models)

Adj. (Adjustable-Voltage Model)

(Substrate)

Current

Limit

SIMPLIFIED SCHEMATIC

PACKAGE/ORDERING INFORMATION

REG1117

At TJ = +25°C, all models, unless otherwise specified.

TYPICAL PERFORMANCE CUR VES

LOAD REGULATION

∆I

LOAD

= 800mA

–1

–2

–3

–4

–5

–6

–7–50 –25 0 25 50 75 100

Temperature (°C)

Output Voltage Deviation (mV)

REG1117-5

REG1117-2.85

REG1117A-1.8

LINE REGULATION vs TEMPERATURE

–1

–2–50 –25 0 25 50 75 100

Temperature (°C)

Output Voltage Change (mV)

REG1117-1.8

= 3.8V to 10V

= 6.5V to 15V

REG1117-5

RIPPLE REJECTION vs FREQUENCY

Frequency (Hz)

Ripple Rejection (dB)

100

010 100 1k 10k 100k

OUT

= 100mA

RIPPLE

= 1.0Vp-p

QUIESCENT CURRENT vs TEMPERATURE

0–50 –25 0 25 50 75 100

Temperature (°C)

Quiescent Current (mA)

Fixed-Voltage Models

SHORT-CIRCUIT CURRENT vs TEMPERATURE

1400

1300

1200

1100

1000

900

800–50 –25 0 25 50 75 100

Temperature (°C)

Short-Circuit Current (mA)

REG1117A

REG1117 Models

OUTPUT VOLTAGE vs TEMPERATURE

2.0

1.0

–1.0

–2.0–50 –25 0 25 50 75 100

Temperature (°C)

Output Voltage Change (%)

= 10mA

REG1117

LINE TRANSIENT RESPONSE

–20

–40

5.25

4.25

3.25

Input Voltage (V) Output Voltage

Deviation (mV)

0 20 40 60 80 100 120 140 160 180 200

Time (µs)

= 1µF

OUT

= 10µF Tantalum

OUT

= 0.1A

At TJ = +25°C, all models, unless otherwise specified.

TYPICAL PERFORMANCE CURVE (cont.)

FIGURE 2. Adjustable-Voltage Model—Basic Connections.

0.1

Output Voltage

Deviations (V)

060

4020

LOAD TRANSIENT RESPONSE

100

Time (µs) 80

–0.1

0.5

–0.5

Load Current (A)

CIN = 10µF

COUT = 10µF

Tantalum

VIN = 4.25V

Preload = 0.1A

APPLICATIONS INFORMATION

Figure 1 shows the basic hookup diagram for fixed-voltage

models. All models require an output capacitor for proper

operation and to improve high frequency load regulation. A

10µF tantalum capacitor is recommended. Aluminum elec-

trolytic types of 50µF or greater can also be used. A high

quality capacitor should be used to assure that the ESR

(effective series resistance) is less than 0.5Ω.

Figure 2 shows a hookup diagram for the adjustable voltage

model. Resistor values are shown for some commonly used

output voltages. Values for other voltages can be calculated

from the equation shown in Figure 2. For best load regula-

tion, connect R1 close to the output pin and R2 close to the

ground side of the load as shown. FIGURE 1. Fixed-Voltage Model—Basic Connections.

REG1117 V

10µF

Tantalum 10µF

Tantalum

VOUT (V) R1 (Ω)(2) R2 (Ω)(2)

1.25 Open Short

1.5 750 147

2.1 158 107

2.85 169 215

3 137 191

3.3 115 187

5 113 340

10 113 787

REG1117

(Adj)

10µF

3(1)

10µF

Load

NOTE: (1) C

optional. Improves high-frequency line rejection. (2) Resistors are standard 1% values.

= • (1.25V) + (50µA) (R

)

+ R

This term is negligible with

proper choice of values—see

table at right.

REG1117

THERMAL CONSIDERATIONS

The REG1117 has current limit and thermal shutdown

circuits that protect it from overload. The thermal shutdown

activates at approximately TJ = 165°C. For continuous op-

eration, however, the junction temperature should not be

allowed to exceed 125°C. Any tendency to activate the

thermal shutdown in normal use is an indication of an

inadequate heat sink or excessive power dissipation. The

power dissipation is equal to:

PD = (VIN – VOUT) IOUT

The junction temperature can be calculated by:

TJ = TA + PD (

JA)

where TA is the ambient temperature, and

JA is the junction-to-ambient thermal resistance

A simple experiment will determine whether the maximum

recommended junction temperature is exceeded in an actual

circuit board and mounting configuration: Increase the am-

bient temperature above that expected in normal operation

until the device’s thermal shutdown is activated. If this

occurs at more than 40°C above the maximum expected

ambient temperature, then the TJ will be less than 125°C

during normal operation.

The internal protection circuitry of the REG1117 was de-

signed to protect against overload conditions. It was not

intended to replace proper heat sinking. Continuously run-

ning the REG1117 into thermal shutdown will degrade

reliability.

LAYOUT CONSIDERATIONS

The DDPAK (REG1117F-3.3 and REG1117FA) is a sur-

face-mount power package that has excellent thermal char-

acteristics. For best thermal performance, its mounting tab

should be soldered directly to a circuit board copper area

(see Figure 3). Increasing the copper area improves heat

dissipation. Figure 4 shows typical thermal resistance from

junction-to-ambient as a function of the copper area.

FIGURE 3. DDPAK Thermal Resistance vs Circuit Board Copper Area.

THERMAL RESISTANCE vs

CIRCUIT BOARD COPPER AREA

Thermal Resistance, θ

(°C/W)

012345

Copper Area (inches

)

REG1117F

DDPAK Surface Mount Package

1oz copper

FIGURE 4. DDPAK Thermal Resistance vs Circuit Board Copper Area.

Circuit Board Copper Area

REG1117F

DDPAK Surface Mount Package

3-Lead DDPAK

(1)

NOTE: (1) For improved thermal performance increase

footprint area. See Figure 4, “Thermal Resistance vs

Circuit Board Copper Area”.

All measurements

in inches.

0.45

0.085

0.2

0.51

0.10

0.155 0.05

REG1117

The SOT-223 package derives heat sinking from conduction

through its copper leads, especially the large mounting tab.

These must be soldered to a circuit board with a substantial

amount of copper remaining (see Figure 5). Circuit board

traces connecting the tab and the leads should be made as

large as practical. The mounting tab of both packages is

electrically connected to VOUT.

Without back-side copper:

JA ≈ 59°C/W

With solid back-side copper:

JA ≈ 49°C/W

FIGURE 5. SOT-223 Circuit Board Layout Example.

Total Area: 50 x 50mm

35 x 17 mm

16 x 10 mm 16 x 10 mm

Other nearby circuit traces, including those on the back side

of the circuit board, help conduct heat away from the device,

even though they may not be electrically connected. Make

all nearby copper traces as wide as possible and leave only

narrow gaps between traces.

Table I shows approximate values of

JA for various circuit

board and copper areas for the SOT-223 package. Nearby

heat dissipating components, circuit board mounting condi-

tions and ventilation can dramatically affect the actual

JA.

Proper heat sinking significantly increases the maximum

power dissipation at a given ambient temperature as shown

in Figure 6.

SOLDERING METHODS

Both REG1117 packages are suitable for infrared reflow and

vapor-phase reflow soldering techniques. The high rate of

temperature change that occurs with wave soldering, or hand

soldering can damage the REG1117.

TOPSIDE(1) BACKSIDE SOT-223

TOTAL PC BOARD COPPER COPPER THERMAL RESISTANCE

AREA AREA AREA JUNCTION-TO-AMBIENT

2500mm22500mm22500mm246°C/W

2500mm21250mm22500mm247°C/W

2500mm2950mm22500mm249°C/W

2500mm22500mm2051°C/W

2500mm21800mm2053°C/W

1600mm2600mm21600mm255°C/W

2500mm21250mm2058°C/W

2500mm2915mm2059°C/W

1600mm2600mm2067°C/W

900mm2340mm2900mm272°C/W

900mm2340mm2085°C/W

NOTE: (1) Tab is attached to the topside copper.

TABLE I.

INSPEC Abstract Number: B91007604, C91012627

Kelly, E.G. “Thermal Characteristics of Surface 5WK9Ω

Packages.” The Proceedings of SMTCON. Surface Mount

Technology Conference and Exposition: Competitive Surface

Mount Technology, April 3-6, 1990, Atlantic City, NJ, USA.

Abstract Publisher: IC Manage, 1990, Chicago, IL, USA.

FIGURE 6. Maximum Power Dissipation vs Ambient

Temperature.

FIGURE 7. SCSI Active Termination Configuration.

10µF10µF

REG1117-2.85

110Ω110Ω

10µF 10µF

1N5817

5V TERMPWR

2.85V 2.85V

TERMPWR

1N5817

(Up to 27 Lines)

REG1117-2.85

Power Dissipation (Watts)

0 25 50 75 100 125

Ambient Temperature (°C)

MAXIMUM POWER DISSIPATION

vs AMBIENT TEMPERATURE

= (T

(max) – T

)

(max) = 150°C

DDPAK

SOT-223

= 85°C/W

(340mm

topside copper,

no backside copper)

= 46°C/W

(2500mm

topside and

backside copper)

= 27°C/W

(4in

one oz copper

mounting pad)

= 65°C/W

(no heat sink)

REG1117

FIGURE 8. Adjusting Output of Fixed Voltage Models. FIGURE 9. Regulator with Reference.

REG1117-5

GND

In Out

10µF 100µF

5V to 10V

10µF +

> 12V

1kΩ

REG1117-5

GND

In Out

10µF 100µF

7.5VV

> 9.0V

2.5V

OUT

REF1004-2.5

REG1117-5

GND

In Out

REG1117-5

GND

In Out

10µF

100µF

6.5V

1kΩ

50Ω

5.2V Line

5.0V Battery

FIGURE 10. Battery Backed-Up Regulated Supply.

REG1117-5

GND

In Out

10µF 100µF

OUT

= –5V

Floating Input

FIGURE 11. Low Dropout Negative Supply.

IMPORTANT NOTICE

Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue

any product or service without notice, and advise customers to obtain the latest version of relevant information

to verify, before placing orders, that information being relied on is current and complete. All products are sold

subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those

pertaining to warranty, patent infringement, and limitation of liability.

TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent

TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily

performed, except those mandated by government requirements.

Customers are responsible for their applications using TI components.

In order to minimize risks associated with the customer’s applications, adequate design and operating

safeguards must be provided by the customer to minimize inherent or procedural hazards.

TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent

that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other

intellectual property right of TI covering or relating to any combination, machine, or process in which such

semiconductor products or services might be or are used. TI’s publication of information regarding any third

party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.