CREAT BY ART
- Patented Trench Schottky technology
- Excellent high temperature stability
- Low forward voltage
- Low power loss/ high efficiency
- High forward surge capability
- Ideal for automated placement
TO-277A (SMPC)
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Packing code with suffix "G" means green compound (halogen-free)
V
RRM
V
V
RMS
V
I
F(AV)
A
TYP MAX TYP MAX
I
F
= 5A 0.44 - 0.45 -
I
F
= 10A 0.48 0.57 0.52 0.64
I
F
= 5A 0.34 - 0.36 -
I
F
= 10A 0.41 0.5 0.46 0.63
T
J
= 25°C μA
T
J
= 125°C mA
R
θJL
°C/W
T
J
°C
T
STG
°C
Document Number: DS_D1411065 Version: D15
UNIT
Maximum repetitive peak reverse voltage
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25°C unless otherwise noted)
PARAMETER
45 60
Maximum RMS voltage 32
TSP10H45S - TSP10H60S
10A, 45V - 60V Trench Schottk
y
Rectifiers
TSP10H45S TSP10H60S
V
F
Taiwan Semiconductor
SYMBOL
T
J
= 25°C
A
Storage temperature range - 55 to +150
I
R
Maximum instantaneous reverse current at rated
reverse voltage
Note 1: Pulse test with pulse width=300μs, 1% duty cycle
- 55 to +150
10Typical thermal resistance
10
Operating junction temperature range
V
Case: TO-277A (SMPC)
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
42
150
25
I
FSM
180
Instantaneous forward voltage (Note 1)
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
T
J
= 125°C
TYPIC AL APPLICATIONS
Trench Schottky barrier rectifier is designed for high frequency
miniature switched mode power supplies such as adapters,
lighting and on-board DC/DC converters.
FEATURES
Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
MECHANICAL DATA
Maximum average forward rectified current
Weight: 95mg (approximately)
Polarity: Indicated by cathode band
Note 1: "XX" defines voltage from 45V (TSP10H45S) to 60V (TSP10H60S)
Note 2: Whole series with green compound (halogen-free)
RATINGS AND CHARACTERISTICS CURVES
(T
A
=25°C unless otherwise noted)
Document Number: DS_D1411065 Version: D15
TSP10H45STSP10H45S S1G S1
PACKING CODE
PREFERRED
PART NO.
PACKING
PART NO. PACKING CODE
SUFFIX
G
SMPC
TSP10H45S - TSP10H60S
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
EXAMPLE
TSP10HXXS
(Note 1, 2)
PACKING CODE
S2
S1
SMPC
PACKAGE
Green compound
DESCRIPTION
G
PACKING CODE
SUFFIX
6,000/ 13" Plastic reel
1,500/ 7" Plastic reel
0.001
0.01
0.1
1
10
100
10 20 30 40 50 60 70 80 90 100
TSP10H45S
INSTANTANEOUS REVERSE CURRENT (mA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG.4 TYPICAL REVERSE CHARACTERISTICS
TJ=125oC
TJ=100oC
TJ=25oC
TJ=150oC
0.01
0.1
1
10
100
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
TJ=125oC
TJ=100oC
TSP10H45S
INSTANTANEOUS FORWARD CURRENT (A)
FORWARD VOLTAGE (V)
FIG.2 TYPICAL FORWARD CHARACTERISTICS
TJ=25oC
TJ=150oC
0
2
4
6
8
10
12
50 75 100 125 150
FIG.1 FORWARD CURRENT DERATING CURVE
WITH
HEATSINK
30mm x 30mm
4 oz. pad PCB
AVERAGE FORWARD CURRENT (A)
LEAD TEMPERATURE (oC)
0.01
0.1
1
10
100
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
TSP10H60S
INSTANTANEOUS FORWARD CURRENT (A)
FORWARD VOLTAGE (V)
FIG.3 TYPICAL FORWARD CHARACTERISTICS
TJ=125oC
TJ=100oC
TJ=25oC
TJ=150oC
Document Number: DS_D1411065 Version: D15
TSP10H45S - TSP10H60S
Taiwan Semiconductor
100
1000
10000
0.1 1 10 100
f=1.0MHz
Vslg=50mVp-p
CAPACITANCE (pF)
REVERSE VOLTAGE (V)
FIG.6 TYPICAL JUNCTION CAPACITANCE
0.001
0.01
0.1
1
10
100
10 20 30 40 50 60 70 80 90 100
TSP10H60S
INSTANTANEOUS REVERSE CURRENT (mA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
TJ=125oC
TJ=100oC
TJ=25oC
TJ=150oC
FIG.5 TYPICAL REVERSE CHARACTERISTICS
0
30
60
90
120
150
180
210
110100
PEAK FORWARD SURGE CURRENT (A)
NUMBER OF CYCLES AT 60 Hz
FIG. 7- MAXIMUM NON-REPETITIVE PEAK FORWARD
SURGE CURRENT
8.3ms Single Half Sine Wave
Min Max Min Max
A 5.650 5.750 0.222 0.226
B 6.350 6.650 0.250 0.262
C 4.550 4.650 0.179 0.183
D 3.540 3.840 0.139 0.151
E 4.235 4.535 0.167 0.179
F 1.850 2.150 0.073 0.085
G 3.170 3.470 0.125 0.137
H 1.043 1.343 0.041 0.053
I 1.000 1.300 0.039 0.051
J 1.930 2.230 0.076 0.088
K 0.175 0.325 0.007 0.013
L 1.000 1.200 0.039 0.047
Symbol
A
B
C
D
E
F
P/N = Marking Code
YW = Date Code
F = Factory Code
Document Number: DS_D1411065 Version: D15
TSP10H45S - TSP10H60S
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
TO-277A (SMPC) DIM. Unit (mm) Unit (inch)
0.050
SUGG ESTED PAD LAYOUT
Unit (mm) Unit (inch)
4.80 0.189
6.80 0.268
1.04 0.041
MARKING DIAGRAM
4.72 0.186
1.40 0.055
1.27
CREAT BY ART
Document Number: DS_D1411065 Version: D15
TSP10H45S - TSP10H60S
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to any
intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for
such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale
and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability,
or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers
using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for
any damages resulting from such improper use or sale.
