SN54LS280, SN54S280, SN74LS280, SN74S280
9-BIT ODD/EVEN PARITY GENERATORS/CHECKERS
SDLS152 – DECEMBER 1972 – REVISED MARCH 1988
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright 1988, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
SN54LS280, SN54S280, SN74LS280, SN74S280
9-BIT ODD/EVEN PARITY GENERATORS/CHECKERS
SDLS152 – DECEMBER 1972 – REVISED MARCH 1988
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
SN54LS280, SN54S280, SN74LS280, SN74S280
9-BIT ODD/EVEN PARITY GENERATORS/CHECKERS
SDLS152 – DECEMBER 1972 – REVISED MARCH 1988
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
SN54LS280, SN54S280, SN74LS280, SN74S280
9-BIT ODD/EVEN PARITY GENERATORS/CHECKERS
SDLS152 – DECEMBER 1972 – REVISED MARCH 1988
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
SN54LS280, SN54S280, SN74LS280, SN74S280
9-BIT ODD/EVEN PARITY GENERATORS/CHECKERS
SDLS152 – DECEMBER 1972 – REVISED MARCH 1988
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
JM38510/32901B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/32901BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
JM38510/32901BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
JM38510/32901BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/32901BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SN54LS280J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SN54LS280J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SN54S280J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SN54S280J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SN74LS280D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS280D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS280DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS280DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS280DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS280DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS280J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN74LS280J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN74LS280N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS280N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS280N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS280N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS280NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS280NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS280NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS280NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS280NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS280NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS280NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS280NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S280D OBSOLETE SOIC D 14 TBD Call TI Call TI
SN74S280D OBSOLETE SOIC D 14 TBD Call TI Call TI
PACKAGE OPTION ADDENDUM
www.ti.com 10-Feb-2010
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74S280N ACTIVE PDIP N 14 25 TBD Call TI Call TI
SN74S280N ACTIVE PDIP N 14 25 TBD Call TI Call TI
SN74S280N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S280N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S280NE4 ACTIVE PDIP N 14 25 TBD Call TI Call TI
SN74S280NE4 ACTIVE PDIP N 14 25 TBD Call TI Call TI
SN74S280NSR ACTIVE SO NS 14 2000 TBD Call TI Call TI
SN74S280NSR ACTIVE SO NS 14 2000 TBD Call TI Call TI
SN74S280NSRE4 ACTIVE SO NS 14 2000 TBD Call TI Call TI
SN74S280NSRE4 ACTIVE SO NS 14 2000 TBD Call TI Call TI
SN74S280NSRG4 ACTIVE SO NS 14 2000 TBD Call TI Call TI
SN74S280NSRG4 ACTIVE SO NS 14 2000 TBD Call TI Call TI
SNJ54LS280FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS280FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS280J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SNJ54LS280J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SNJ54LS280W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54LS280W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54S280FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S280FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S280J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SNJ54S280J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SNJ54S280W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54S280W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
PACKAGE OPTION ADDENDUM
www.ti.com 10-Feb-2010
Addendum-Page 2
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 10-Feb-2010
Addendum-Page 3
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LS280NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74S280NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 10-Feb-2010
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LS280NSR SO NS 14 2000 346.0 346.0 33.0
SN74S280NSR SO NS 14 2000 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 10-Feb-2010
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MINMAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
1314151618 17
11
10
8
9
7
5
432
0.020 (0,51)
0.010 (0,25)
6
12826 27
19
21
B SQ
A SQ 22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
JM38510/32901B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/32901BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
JM38510/32901BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
JM38510/32901BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/32901BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SN54LS280J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SN54LS280J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SN54S280J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SN54S280J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SN74LS280D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS280D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS280DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS280DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS280DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS280DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS280J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN74LS280J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN74LS280N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS280N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS280N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS280N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS280NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS280NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS280NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS280NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS280NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS280NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS280NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS280NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S280D OBSOLETE SOIC D 14 TBD Call TI Call TI
SN74S280D OBSOLETE SOIC D 14 TBD Call TI Call TI
PACKAGE OPTION ADDENDUM
www.ti.com 10-Feb-2010
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74S280N ACTIVE PDIP N 14 25 TBD Call TI Call TI
SN74S280N ACTIVE PDIP N 14 25 TBD Call TI Call TI
SN74S280N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S280N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S280NE4 ACTIVE PDIP N 14 25 TBD Call TI Call TI
SN74S280NE4 ACTIVE PDIP N 14 25 TBD Call TI Call TI
SN74S280NSR ACTIVE SO NS 14 2000 TBD Call TI Call TI
SN74S280NSR ACTIVE SO NS 14 2000 TBD Call TI Call TI
SN74S280NSRE4 ACTIVE SO NS 14 2000 TBD Call TI Call TI
SN74S280NSRE4 ACTIVE SO NS 14 2000 TBD Call TI Call TI
SN74S280NSRG4 ACTIVE SO NS 14 2000 TBD Call TI Call TI
SN74S280NSRG4 ACTIVE SO NS 14 2000 TBD Call TI Call TI
SNJ54LS280FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS280FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS280J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SNJ54LS280J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SNJ54LS280W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54LS280W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54S280FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S280FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S280J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SNJ54S280J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SNJ54S280W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54S280W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
PACKAGE OPTION ADDENDUM
www.ti.com 10-Feb-2010
Addendum-Page 2
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 10-Feb-2010
Addendum-Page 3
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LS280NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74S280NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 10-Feb-2010
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LS280NSR SO NS 14 2000 346.0 346.0 33.0
SN74S280NSR SO NS 14 2000 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 10-Feb-2010
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MINMAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
1314151618 17
11
10
8
9
7
5
432
0.020 (0,51)
0.010 (0,25)
6
12826 27
19
21
B SQ
A SQ 22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
IMPORTANT NOTICE
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and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
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TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
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