GMM 3x100-01X1 Three phase full Bridge VDSS = 100 V = 90 A ID25 RDSon typ. = 7.5 mW with Trench MOSFETs in DCB isolated high current package L1+ L2+ G1 G3 G5 S1 S3 S5 L1 L2 G4 G6 G2 S2 L3+ L3 S4 S6 L1- L2- L3- Applications MOSFETs Conditions Maximum Ratings VDSS TVJ = 25C to 150C 100 20 V V u VGS ID25 ID90 TC = 25C TC = 90C IF25 IF90 TC = 25C (diode) TC = 90C (diode) Symbol Conditions A A -o 90 68 A A iv 90 68 e Characteristic Values (TVJ = 25C, unless otherwise specified) VGS(th) VDS = 20 V; ID = 1 mA IDSS VDS = VDSS; VGS = 0 V IGSS VGS = 20 V; VDS = 0 V Qg Qgs Qgd VGS = 10 V; VDS = 65 V; ID = 90 A RthJC RthJH 8.5 a mW mW 4.5 V 1 A mA 0.2 A 0.1 h 90 30 30 nC nC nC 130 95 290 55 ns ns ns ns 0.4 0.4 0.007 mJ mJ mJ t p 7.5 14 with heat transfer paste (IXYS test setup) 1.3 1.0 1.6 Features * MOSFETs in trench technology: - low RDSon - optimized intrinsic reverse diode * package: - high level of integration - high current capability - aux. terminals for MOSFET control - terminals for soldering or welding connections - isolated DCB ceramic base plate with optimized heat transfer * Space and weight savings K/W K/W VDS = ID*(RDS(on) + 2RPin to Chip) t 1) inductive load VGS = 10 V; VDS = 48 V ID = 70 A; RG = 33 ; TJ = 125C n Eon Eoff Erecoff max. 2.5 TVJ = 25C TVJ = 125C e td(on) tr td(off) tf typ. t TVJ = 25C TVJ = 125C a on chip level at VGS = 10 V s min. RDSon 1) AC drives * in automobiles - electric power steering - starter generator * in industrial vehicles - propulsion drives - fork lift drives * in battery supplied equipment et Symbol Recommended replacement: MTI 85WX100GD IXYS reserves the right to change limits, test conditions and dimensions. (c) 2011 IXYS All rights reserved 20110307 1-3 GMM 3x100-01X1 Source-Drain Diode Symbol Conditions Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. VSD (diode) IF = 70 A; VGS = 0 V trr QRM IRM IF = 70 A; -diF/dt = 800 A/s; VR = 48 V 0.9 1.2 V 55 0.95 33 ns C A Component Conditions Maximum Ratings IRMS per pin in main current paths (P+, N-, L1, L2, L3) may be additionally limited by external connections 2 pins for output L1, L2, L3 TJ Tstg VISOL IISOL < 1 mA, 50/60 Hz, f = 1 minute FC mounting force with clip Symbol Conditions C C 1000 V~ N typ. max. tbd 1) u Characteristic Values pF 25 g a t e n t p h a t s e VDS = ID*(RDS(on) + 2RPin to Chip) mW 160 iv coupling capacity between shorted pins and back side metallization Weight 1) -55...+175 -55...+125 -o CP A 50 - 250 min. Rpin to chip 75 et Symbol IXYS reserves the right to change limits, test conditions and dimensions. (c) 2011 IXYS All rights reserved 20110307 2-3 a e n t p h a t s e iv -o u et GMM 3x100-01X1 Ordering Part Name & Packing Unit Marking Part Marking Delivering Mode Base Qty. Ordering Code Standard GMM 3x100-01X1 - SMD GMM 3x100-01X1 Blister 28 509 035 t Leads SMD IXYS reserves the right to change limits, test conditions and dimensions. (c) 2011 IXYS All rights reserved 20110307 3-3