1
®
FN2867.9
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 |Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2002, 2004, 2005, 2006. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ICM7555, ICM7556
General Purpose Timers
The ICM7555 and ICM7556 are CMOS RC timers providing
significantly improved performance over the standard
SE/NE 555/6 and 355 timers, whil e at th e same time be ing
direct replacement s for tho se devices in most applicatio ns.
Improved parameters include low supply current, wide
operating supply voltage range, low THRESHOLD,
TRIGGER and RESET currents, no crowbarring of the
supply current during output transitions, higher frequency
performance and no requirement to decoup le CONTROL
VOLTAGE for stable operation.
Specifically, the ICM7555 and ICM7556 are stable
controllers capable of producing accurate time delays or
frequencies. The ICM7556 is a dual ICM7555, with the two
timers operating independently of each other, sharing only
V+ and GND. In the one shot mode, the pulse width of each
circuit is precisely controlled by one external resistor and
capacitor . For astable operation as an oscillator, the free
running frequency and the duty cycle are both a ccurately
controlled by two external resistors and one cap acitor. Unlike
the regular bipolar SE/NE 555/6 devices, the CONTROL
VOLTAGE terminal need not be decoupled with a cap acitor.
The circuits are trigge red and rese t o n fa lling (negative)
waveforms, and the output inverter can source or sink
currents large enough to drive TTL loads, or provide minimal
offsets to drive CMOS loads.
Features
Exact Equivalent in Most Cases for SE/NE555/556 or
TLC555/556
Low Supply Curre nt
- ICM7555. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60μA
- ICM7556. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120μA
Extremely Low Input Currents . . . . . . . . . . . . . . . . . 20pA
High Sp eed Operation . . . . . . . . . . . . . . . . . . . . . . . 1MHz
Guaranteed Supply Voltage Range . . . . . . . . . 2V to 18V
Temperature Stability . . . . . . . . . . . . 0.005%/°C at +25°C
Normal Reset Function - No Crowbarring of Supply During
Output T ransition
Can be Used with Higher Impedance Timing Elements
than Regular 555/6 for Lo nger RC Time Constants
Timing from Microseconds through Hours
Operates in Both Astable and Monostable Modes
Adjustable Duty Cycle
High Output Source/Sink Driver can Drive TTL/CMOS
Outputs have Very Low Offsets, HI and LO
Pb-Free Plus Anneal Available (RoHS Compliant)
Applications
Precision Timing
Pulse Generation
Sequential Timing
Time Delay Generation
Pulse Width Modulation
Pulse Position Modulation
Missing Pulse Detector
Pinouts
ICM7555 (8 LD PDIP, SOIC)
TOP VIEW ICM7556 (14 LD PDIP, CERDIP)
TOP VIEW
GND
TRIGGER
OUTPUT
RESET
1
2
3
4
8
7
6
5
VDD
DISCHARGE
THRESHOLD
CONTROL
VOLTAGE
DISCHARGE
THRESH-
CONTROL
RESET
OUTPUT
TRIGGER
GND
VDD
DISCHARGE
THRESHOLD
CONTROL
RESET
OUTPUT
TRIGGER
1
2
3
4
5
6
7
14
13
12
11
10
9
8
VOLTAGE
VOLTAGE
OLD
Data Sheet August 24, 2006
2FN2867.9
August 24, 2006
Ordering Information
PART NUMBER PART MARKING TEMP. RANGE
(°C) PACKAGE PKG. DWG. #
ICM7555CBA 7555 CBA 0 to +70 8 Ld SOIC M8.15
ICM7555CBA-T 7555 CBA 0 to +70 8 Ld SOIC Tape and Reel M8.15
ICM7555CBAZ (Note) 7555 CBAZ 0 to +70 8 Ld SOIC (Pb-free) M8.15
ICM7555CBAZ-T (Note) 7555 CBAZ 0 to +70 8 Ld SOIC (Pb-free)
Tape and Reel M8.15
ICM7555IBA 7555 IBA -25 to +85 8 Ld SOIC M8.15
ICM7555IBAT 7555 IBA -25 to +85 8 Ld SOIC Tape and Reel M8.15
ICM7555IBAZ (Note) 7555 IBAZ -25 to +85 8 Ld SOIC (Pb-free) M8.15
ICM7555IBAZ-T (Note) 7555 IBAZ -25 to +85 8 Ld SOIC (Pb-free)
Tape and Reel M8.15
ICM7555IPA 7555 IPA -25 to +85 8 Ld PDIP E8.3
ICM7555IPAZ (Note) 7555 IPAZ -25 to +85 8 Ld PDIP** (Pb-free) E8.3
ICM7556IPD ICM7556IPD -25 to +85 14 Ld PDIP E14.3
ICM7556IPDZ (Note) ICM7556IPDZ -25 to +85 14 Ld PDIP** (Pb-fr ee) E14.3
ICM7556MJD ICM7556MJD -55 to +125 14 Ld Cerdip F14.3
**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing
applications.
NOTE: Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are
MSL classified at Pb -f re e pe ak ref low te mp er at ur es t ha t mee t or exceed th e Pb-f re e re q uirem en ts of IPC/JEDEC J STD- 02 0.
ICM7555, ICM7556
3FN2867.9
August 24, 2006
Absolute Maximum Ratings Thermal Information
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+18V
Input Voltage
Trigger, Control Voltage, Threshold,
Reset (Note 1) . . . . . . . . . . . . . . . . . . . . . V+ +0.3V to GND -0.3V
Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100mA
Operating Conditions
Temperature Range
ICM7555C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
ICM7555I, ICM7556I . . . . . . . . . . . . . . . . . . . . . . -25°C to +85°C
ICM7556M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Thermal Resistance (Typical, Note 2) θJA (°C/W) θJC (°C/W)
14 Lead CERDIP Package. . . . . . . . . . 80 24
14 Lead PDIP Package* . . . . . . . . . . . 115 N/A
8 Lead PDIP Package* . . . . . . . . . . . . 130 N/A
8 Lead SOIC Package . . . . . . . . . . . . . 170 N/A
Maximum Junction Temperature (Hermetic Package) . . . . . . . +175°C
Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . -65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . +300°C
(SOIC - Lead Tips Only)
* Pb-free PDIPs can be used for through hole wave solder
processing only. They are not intended for use in Reflow solder
processing applications.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. Due to the SCR structure inherent in the CMOS process used to fabricate these devices, connecting any terminal to a voltage greater than
V+ +0.3V or less than V- -0.3V may cause destructive latchup. For this reason it is recommended that no inputs from external sources not
operating from the same power supply be applied to the device before its power supply is established. In multiple supply systems, the supply
of the ICM7555 and ICM7556 must be turned on first.
2. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief 379 for details.
Electrical Specifications Applies to ICM7555 and ICM7556, unless otherwise specified
PARAMETER SYMBOL TEST CONDITIONS
TA = +25°C (NOTE 4)
-55°C TO +125°C
UNITSMIN TYP MAX MIN TYP MAX
Static Supply Current IDD ICM7555 VDD = 5V 40 200 300 μA
VDD = 15V 60 300 300 μA
ICM7556 VDD = 5V 80 400 600 μA
VDD = 15V 120 600 600 μA
Monostable Timing Accuracy RA = 10K, C = 0.1μF, VDD = 5V 2 %
858 1161 μs
Drift with Temperature
(Note 3)
VDD = 5V 150 ppm/°C
VDD = 10V 200 ppm/°C
VDD = 15V 250 ppm/°C
Drift with Supply (Note 3) VDD = 5V to 15V 0.5 0.5 %/V
Astable Timing Accuracy RA = RB = 10K, C = 0.1μF, VDD = 5V 2 %
1717 2323 μs
Drift with Temperature
(Note 3) VDD = 5V 150 ppm/°C
VDD = 10V 200 ppm/°C
VDD = 15V 250 ppm/°C
Drift with Supply (Note 3) VDD = 5V to 15V 0.5 0.5 %/V
Threshold Voltage VTH VDD = 15V 62677161 72% V
DD
Trigger Voltage VTRIG VDD = 15V 28323627 37% V
DD
Trigger Current ITRIG VDD = 15V 10 50 nA
Threshold Current ITH VDD = 15V 10 50 nA
Control Voltage VCV VDD = 15V 62677161 72% V
DD
ICM7555, ICM7556
4FN2867.9
August 24, 2006
Functional Diagram
Reset Voltage VRST VDD = 2V to 15V 0.4 1.0 0.2 1.2 V
Reset Current IRST VDD = 15V 10 50 nA
Discharge Leakage IDIS VDD = 15V 10 50 nA
Output Voltage VOL VDD = 15V, ISINK = 20mA 0.4 1.0 1.25 V
VDD = 5V, ISINK = 3.2mA 0.2 0.4 0.5 V
VOH VDD = 15V, ISOURCE = 0.8mA 14.3 14.6 14.2 V
VDD = 5V, ISOURCE = 0.8mA 4.0 4.3 3.8 V
Discharge Output Voltage VDIS VDD = 5V, ISINK = 15mA 0.2 0.4 0.6 V
VDD = 15V, ISINK = 15mA 0.4 V
Supply Voltage (Note 3) VDD Functional Operation 2.0 18.0 3.0 16.0 V
Output Rise Time (Note 3) tRRL = 10M, CL = 10pF, VDD = 5V 75 ns
Output Fall Time (Note 3) tFRL = 10M, CL = 10pF, VDD = 5V 75 ns
Oscillator Frequency
(Note 3) fMAX VDD = 5V, RA = 470Ω, RB = 270Ω,
C = 200pF 1MHz
NOTES:
3. These parameters are based upon characterization data and are not tested.
4. Applies only to military temperature range product (M suffix).
Electrical Specifications Applies to ICM7555 and ICM7556, unless otherwise specified (Continued)
PARAMETER SYMBOL TEST CONDITIONS
TA = +25°C (NOTE 4)
-55°C TO +125°C
UNITSMIN TYP MAX MIN TYP MAX
+
-
THRESHOLD
CONTROL
VOLTAGE
6
53
1
+
-
TRIGGER
2
COMPARATOR
R
GND
B
COMPARATOR
A
R
VDD
8
OUTPUT
7
1
n
DISCHARGE
OUTPUT
DRIVERS
FLIP-FLOP
RESET
4
R
NOTE: This functional diagram reduces the circuitry down to its simplest equivalent components. Tie down unused inputs.
TRUTH TABLE
THRESHOLD VOLTAGE TRIGGER VOLTAGE RESET OUTPUT DISCHARGE SWITCH
Don’t Care Don’t Care Low Low On
>2/3(V+) >1/3(V+) High Low On
<2/3(V+) >1/3(V+) High Stable Stable
Don’t Care <1/3(V+) High High Off
NOTE: RESET will dominate all other inputs: TRIGGER will dominate over THRESHOLD.
ICM7555, ICM7556
5FN2867.9
August 24, 2006
Schematic Diagram
Application Information
General
The ICM7555 and ICM7556 devices are, in most instances,
direct replacements for the NE/SE 555/6 devices. However,
it is possible to effect economies in the external component
count using the ICM7555 and ICM7556. Because the bipolar
NE/SE 555/6 devices produce large crowbar currents in the
output driver, it is necessary to decouple the power supply
lines with a good capacitor close to the device. The ICM7555
and ICM7556 devices produce no such transients. See
Figure 1.
The ICM7555 and ICM7556 produce supply current spikes
of only 2mA - 3mA instead of 300mA - 400mA and supply
decoupling is normally not necessary. Also, in most
instances, the CONTROL VOLTAGE decoupling capacitors
are not required since the input impedance of the CMOS
comparators on chip are very high. Thus, for many
applications, two capacitors can be saved using an ICM7555
and three capacitors with an ICM7556.
POWER SUPPLY CONSIDERATIONS
Although the supply current consumed by the ICM7555 and
ICM7556 devices is very low , the total system supply current
can be high unless the timing components are high
impedance. Therefore, use high values for R and low values
for C in Figures 2A, 2B, and 3.
RESET DISCHARGE
TRIGGER
THRESHOLD
GND
OUTPUT
CONTROL
VOLTAGE
R
NN
NPN
P
R
R
VDD
NNNNN
PP
NN
PP P
R = 100kΩ ±20% (TYP)
TIME (ns)
400 8006002000
0
100
200
300
400
500
SUPPLY CURRENT (mA)
SE/NE555
TA = 25°C
ICM7555/56
FIGURE 1. SUPPLY CURRENT TRANSIENT COMPARED WITH
A STANDARD BIPOLAR 555 DURING AN OUTPUT
TRANSITION
GND
TRIGGER
OUTPUT
RESET
1
2
3
4
8
7
6
5
VDD
DISCHARGE
THRESHOLD
CONTROL
VOLTAGE
VDD
10K
ALTERNATE OUTPUT
OPTIONAL
CAPACITOR
C
VDD
R
FIGURE 2A. ASTABLE OPERATION
ICM7555, ICM7556
6FN2867.9
August 24, 2006
OUTPUT DRIVE CAPABILITY
The output driver consists of a CMOS inverter capable of
driving most logic families including CMOS and TTL. As
such, if driving CMOS, the output swing at all supply
voltages will equal the supply voltage. At a supply voltage of
4.5V or more, the ICM7555 and ICM75 56 will drive at least
two standard TTL loads.
AST ABLE OPERATION
The circuit can be connected to trigger itself and free run as
a multivibrator , see Figure 2A. The output swings from rail to
rail, and is a true 50% duty cycle square wave. (Trip points
and output swings are symmetrical.) Less than a 1%
frequency variation is observed over a voltage range of +5V
to +15V.
The timer can also be connected as shown in Figure 2B. In this
circuit, the frequency is:
The duty cycle is controlled by the values of RA and RB, by the
equation:
MONOST ABLE OPERATION
In this mode of operation, the timer functions as a one-shot.
See Figure 3. Initially the external capacitor (C) is held
discharged by a transistor inside the timer . Upon application of
a negative TRIGGER pulse to pin 2, the internal flip-flop is set
which releases the short circuit across the external capacitor
and drives the OUTPUT high. The voltage across the capacitor
now increases exponentially with a time constant t = RAC.
When the voltage across the capacitor equals 2/3 V+, the
comparator resets the flip-flop, which in turn discharges the
capacitor rapidly and also drives the OUTPUT to its low state.
TRIGGER must return to a high st ate before the OUTPUT can
return to a low state.
CONTROL VOLTAGE
The CONTROL VOLTAGE terminal permits the two trip
voltages for the THRESHOLD and TRIGGER internal
comparators to be controlled. This provides the possibility of
oscillation frequency modulation in the astable mode or even
inhibition of oscillation, depending on the applied voltage. In
the monostable mode, delay times can be changed by
varying the applied voltage to the CONTROL VOLTAGE pin.
RESET
The RESET terminal is designed to have essentially the
same trip voltage as the standard bipolar 555/6, i.e., 0.6V to
0.7V. At all supply voltages it represents an extremely high
input impedance. The mode of operation of the RESET
function is, however, much improved over the standard
bipolar NE/SE 555/6 in that it controls only the internal flip-
flop, which in turn controls simultaneously the state of the
OUTPUT and DISCHARGE pi ns. This avoids the multiple
threshold problems sometimes encountered with slow falling
edges in the bipolar devices.
OUTPUT
1
2
3
4
8
7
6
5
VDD
OPTIONAL
CAPACITOR
C
VDD
RA
RB
FIGURE 2B. ALTERNATE ASTABLE CONFIGURATION
f1
1.4 RC
------------------
=(EQ. 1)
f1.44R
A2RB
+()C=(EQ. 2)
DR
ARB
+()RA2RB
+()=(EQ. 3)
TRIGGER
OUTPUT
RESET
1
2
3
4
8
7
6
5
VDD
DISCHARGE
THRESHOLD
CONTROL
VOLTAGE
OPTIONAL
CAPACITOR C
VDD 18V
RA
ICM7555
tOUTPUT = -ln (1/3) RAC = 1.1RAC
FIGURE 3. MONOSTABLE OPERATION
ICM7555, ICM7556
7FN2867.9
August 24, 2006
Typical Performance Curves
FIGURE 4. MINIMUM PULSE WIDTH REQUIRED FOR
TRIGGERING FIGURE 5. SUPPLY CURRENT vs SUPPLY VOLTAGE
FIGURE 6. OUTPUT SOURCE CURRENT vs OUTPUT VOLTAGE FIGURE 7. OUTPUT SINK CURRENT vs OUTPUT VOLTAGE
FIGURE 8. OUTPUT SINK CURRENT vs OUTPUT VOLTAGE FIGURE 9. OUTPUT SINK CURRENT vs OUTPUT VOLTAGE
TA = 25°C
VDD = 2V
VDD = 18V
LOWEST VOLTAG E LE VE L OF TRIGGER PULSE (%VDD)
VDD = 5V
MINIMUM PULSE WIDTH (ns)
010203040
0
1200
1100
1000
900
800
700
600
500
400
300
200
100
SUPPLY VO LTAGE (V)
TA = 25°C
SUPPLY CURRENT (ICM7555) (μA)
SUPPLY CURRENT (ICM7556) (μA)
TA = -20°C
TA = 70°C
0 2 4 6 8 1012141618 20
0
200
180
160
140
120
100
80
60
40
20
400
360
320
280
240
200
160
120
80
40
0
TA = 25°C
VDD = 2V
VDD = 5V
VDD = 18V
OUTPUT SOURCE CURRENT (mA)
-100
-10.0
-1.0
-0.1
-0.01-0.1-1.0-10 OUTPUT VOLTAGE REFERENCED TO VDD (V)
TA = -20°C
OUTPUT LOW VOLTAGE (V)
VDD = 2V
VDD = 5V
VDD = 18V
OUTPUT SINK CURRENT (mA)
0.01 0.1 1.0 10.0
0.1
100
10.0
1.0
TA = 25°C
OUTPUT LOW VOLTAGE (V)
VDD = 2V
VDD = 5V
VDD = 18V
OUTPUT SINK CURRENT (mA)
0.01 0.1 1.0 10.0
0.1
100
10.0
1.0
TA = 70°C
OUTPUT LOW VOLT AGE (V)
VDD = 2V
VDD = 5V
VDD = 18V
OUTPUT SINK CURRENT (mA)
0.01 0.1 1.0 10.0
0.1
100
10.0
1.0
ICM7555, ICM7556
8FN2867.9
August 24, 2006
FIGURE 10. NORMALIZED FREQUENCY ST ABILITY IN THE
ASTABLE MODE vs SUPPLY VOLTAGE FIGURE 1 1. DISCHARGE OUTPUT CURRENT vs DISCHARGE
OUTPUT VOLTAGE
FIGURE 12. PROPAGATION DELAY vs VOLTAGE LEVEL OF
TRIGGER PULSE FIGURE 13. NORMALIZED FREQUENCY STABILITY IN THE
ASTABLE MODE vs TEMPERATURE
FIGURE 14. FREE RUNNING FREQUENCY vs RA, RB AND C FIGURE 15. TIME DELAY IN THE MONOSTABLE MODE vs
RA AND C
Typical Performance Curves (Continued)
SUPPLY VOLTAGE (V)
TA = 25°C
NORMALIZED FREQUENCY DEVIATION (%)
RA = RB = 10MΩ
0.1 1.0 10.0 100.0
8
8
6
4
2
0
2
4
6
C = 100pF
RA = RB = 10kΩ
C = 0.1μF
TA = 25°C
DISCHARGE LOW VOLTAGE (V)
VDD = 2V
VDD = 5V
VDD = 18V
DISCHARGE SINK CURRENT (mA)
0.01 0.1 1.0 10.0
0.1
100
10.0
1.0
TA = 25°C
LOWEST VOLTAGE LEVEL OF TRIGGER PULSE (%VDD)
VDD = 5V
PROPAGATION DELAY (ns)
010203040
0
600
500
400
300
200
100
TA = 70°C
TA = -20°C
TEMPERATURE (°C)
NORMALIZED FREQUENCY DEVIATION (%)
06080
-0.1
+0.1
0
RA = RB = 10kΩ
C = 0.1μF
4020-20
+0.2
+0.3
+0.4
+0.5
+0.6
+0.7
+0.8
+0.9
+1.0
VDD = 2V
VDD = 5V
VDD = 18V
VDD = 2V
TA = 25°C
FREQUENCY (Hz)
(RA + 2RB)1kΩ
10kΩ
100kΩ
1MΩ
10MΩ
100MΩ
100.1 1 100 1k 10k 100k 1M 10M
CAPACITANCE (F)
1.0
100m
10m
1m
100μ
10μ
1μ
100n
10n
1n
100p
10p
1p
TIME DELAY (s)
1kΩ
10kΩ
100kΩ
1MΩ
10MΩ
100MΩ
10μ100n 1μ100μ1m 10m 100m 1 10
CAPACITANCE (F)
1.0
100m
10m
1m
100μ
10μ
1μ
100n
10n
1n
100p
10p
1p
RA
TA = 25°C
ICM7555, ICM7556
9FN2867.9
August 24, 2006
ICM7555, ICM7556
Small Outline Plastic Packages (SOIC)
INDEX
AREA E
D
N
123
-B-
0.25(0.010) C AMBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H0.25(0.010) BM M
α
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M8.15 (JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.0532 0.0688 1.35 1.75 -
A1 0.0040 0.0098 0.10 0.25 -
B 0.013 0.020 0.33 0.51 9
C 0.0075 0.0098 0.19 0.25 -
D 0.1890 0.1968 4.80 5.00 3
E 0.1497 0.1574 3.80 4.00 4
e 0.050 BSC 1.27 BSC -
H 0.2284 0.2440 5.80 6.20 -
h 0.0099 0.0196 0.25 0.50 5
L 0.016 0.050 0.40 1.27 6
N8 87
α -
Rev. 1 6/05
10 FN2867.9
August 24, 2006
ICM7555, ICM7556
Dual-In-Line Plastic Packages (PDIP)
C
L
E
eA
C
eB
eC
-B-
E1
INDEX 12 3 N/2
N
AREA
SEATING
BASE
PLANE
PLANE
-C-
D1
B1 Be
D
D1
A
A2
L
A1
-A-
0.010 (0.25) C AMBS
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between
English and Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protru-
sions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
6. E and are measured with the leads constrained to be per-
pendicular to datum .
7. eB and eC are measured at the lead tips with the leads uncon-
strained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
eA
-C-
E8.3 (JEDEC MS-001-BA ISSUE D)
8 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A-0.210 -5.33 4
A1 0.015 -0.39 -4
A2 0.115 0.195 2.93 4.95 -
B0.014 0.022 0.356 0.558 -
B1 0.045 0.070 1.15 1.77 8, 10
C0.008 0.014 0.204 0.355 -
D0.355 0.400 9.01 10.16 5
D1 0.005 -0.13 -5
E0.300 0.325 7.62 8.25 6
E1 0.240 0.280 6.10 7.11 5
e 0.100 BSC 2.54 BSC -
eA0.300 BSC 7.62 BSC 6
eB-0.430 -10.92 7
L0.115 0.150 2.93 3.81 4
N8 89
Rev. 0 12/93
11 FN2867.9
August 24, 2006
ICM7555, ICM7556
Dual-In-Line Plastic Packages (PDIP)
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English
and Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and are measured with the leads constrained to be perpen-
dicular to datum .
7. eB and eC are measured at the lead tips with the leads uncon-
strained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 -
1.14mm).
eA
-C-
C
L
E
eA
C
eB
eC
-B-
E1
INDEX 12 3 N/2
N
AREA
SEATING
BASE
PLANE
PLANE
-C-
D1
B1 Be
D
D1
A
A2
L
A1
-A-
0.010 (0.25) C AMBS
E14.3 (JEDEC MS-001-AA ISSUE D)
14 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A-0.210 -5.33 4
A1 0.015 -0.39 -4
A2 0.115 0.195 2.93 4.95 -
B0.014 0.022 0.356 0.558 -
B1 0.045 0.070 1.15 1.77 8
C0.008 0.014 0.204 0.355 -
D0.735 0.775 18.66 19.68 5
D1 0.005 -0.13 -5
E0.300 0.325 7.62 8.25 6
E1 0.240 0.280 6.10 7.11 5
e 0.100 BSC 2.54 BSC -
eA0.300 BSC 7.62 BSC 6
eB-0.430 -10.92 7
L0.115 0.150 2.93 3.81 4
N14 149
Rev. 0 12/93
12
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No lice nse is gran t ed by i mpli catio n or other wise u nder an y p a tent or patent right s of Int ersi l or it s sub sidi aries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN2867.9
August 24, 2006
ICM7555, ICM7556
Ceramic Dual-In-Line Frit Seal Packages (CERDIP)
NOTES:
1. Index area: A notch or a pin one identification mark shall be locat-
ed adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark.
2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.
3. Dimensions b1 and c1 apply to lead base metal only . Dimension
M applies to lead plating and finish thickness.
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.
5. This dimension allows for off-center lid, meniscus, and glass
overrun.
6. Dimension Q shall be measured from the seating plane to the
base plane.
7. Measure dimension S1 at all four corners.
8. N is the maximum number of terminal positions.
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
10. Controlling dimension: INCH.
bbb C A - B
S
c
Q
L
A
SEATING
BASE
D
PLANE
PLANE
-D-
-A-
-C-
-B-
α
D
E
S1
b2 b
A
e
M
c1
b1
(c)
(b)
SECTION A-A
BASE
LEAD FINISH
METAL
eA/2
A
M
SS
ccc C A - B
MD
SSaaa CA - B
MD
SS
eA
F14.3 MIL-STD-1835 GDIP1-T14 (D-1, CONFIGURATION A)
14 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A-0.200 -5.08 -
b0.014 0.026 0.36 0.66 2
b1 0.014 0.023 0.36 0.58 3
b2 0.045 0.065 1.14 1.65 -
b3 0.023 0.045 0.58 1.14 4
c0.008 0.018 0.20 0.46 2
c1 0.008 0.015 0.20 0.38 3
D-0.785 -19.94 5
E0.220 0.310 5.59 7.87 5
e 0.100 BSC 2.54 BSC -
eA 0.300 BSC 7.62 BSC -
eA/2 0.150 BSC 3.81 BSC -
L0.125 0.200 3.18 5.08 -
Q0.015 0.060 0.38 1.52 6
S1 0.005 -0.13 -7
α90° 105° 90° 105° -
aaa - 0.015 -0.38 -
bbb - 0.030 -0.76 -
ccc - 0.010 -0.25 -
M-0.0015 -0.038 2, 3
N14 148
Rev. 0 4/94