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Technical Data Sheet
334-15/T2C2-6TVB
Everlight Electronics Co., Ltd. http\\:www.everlight.com Rev: 1 Page: 1 of 9
Device Number: DLE-0000346 Established date:11-19-2008 Established by: Ruby Lin
Features
․Popular T-1 3/4 round package
․High luminous power.
˙Typical chromaticity coordinates x=0.33y=0.34
according to CIE1931.
˙Bulk, available taped on reel.
˙ESD-withstand voltage: up to 4KV
․The product itself will remain within RoHS compliant version.
Descriptions
˙The series is designed for application required
high luminous intensity.
˙The phosphor filled in the reflector converts the
blue emission of InGaN chip to ideal white.
Applications
˙Message panels
˙Optical Indicators
˙Backlighting
˙Marker Lights
Device Selection Guide
Chip
PART NO. Material Emitted Color Lens Color
334-15/T2C2-6TVB InGaN White Water Clear
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334-15/T2C2-6TVB
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Device Number: DLE-0000346 Established date:11-19-2008 Established by: Ruby Lin
Package Dimensions
Notes:
1.All dimensions are in millimeters, and tolerance is 0.25mm except being specified.
2.Lead spacing is measured where the lead emerges from the package.
3.Protruded resin under flange is 1.5mm Max. LED.
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334-15/T2C2-6TVB
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Device Number: DLE-0000346 Established date:11-19-2008 Established by: Ruby Lin
Absolute Maximum Ratings (Ta=25℃)
Parameter Symbol Rating Unit
Continuous Forward Current IF30 mA
Peak Forward Current(Duty /10 @ 1KHZ) IFP 100 mA
Reverse Voltage VR5V
Operating Temperature Topr -40 ~ +85 ℃
Storage Temperature Tstg -40 ~ +100 ℃
Soldering Temperature (T=5 sec) Tsol 260 ℃
Power Dissipation Pd100 mW
Zener Reverse Current Iz 100 mA
Electrostatic Discharge ESD 4K V
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Device Number: DLE-0000346 Established date:11-19-2008 Established by: Ruby Lin
Production Designation
334-15/T2C2-□□□□
Electro-Optical Characteristics (Ta=25℃)
Parameter Symbol Condition Min. Typ. Max. Units
Forward Voltage VFIF=20mA 2.8 -- 3.6 V
Zener Reverse Voltage Vz Iz=5mA 5.2 -- -- V
Reverse Current IRVR=5V -- -- 50 uA
Luminous Intensity IVIF=20mA 7150 -- 14250 mcd
Viewing Angle 2θ1/2 IF=20mA -- 20 -- deg
x -- 0.29 -- --
Chromaticity Coordinates
yIF=20mA -- 0.28 -- --
Color
Group
Luminous Intensity Bins
Voltage Group
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Device Number: DLE-0000346 Established date:11-19-2008 Established by: Ruby Lin
Luminous Intensity Combination (mcd at 20mA)
*Measurement Uncertainty of Luminous Intensity: ±10%
Forward Voltage Combination (V at 20mA)
Rank 0123
Forward Voltage 2.8~3.0 3.0~3.2 3.2~3.4 3.4~3.6
*Measurement Uncertainty of Forward Voltage：±0.1V
Color Combination ( at 20mA)
Group Bins
6 B5+B6+C0
Rank Min Max
T 7150 9000
U 9000 11250
V 11250 14250
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Device Number: DLE-0000346 Established date:11-19-2008 Established by: Ruby Lin
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
0.0
0.2
0.4
0.6
0.8
1.0
C0
B5B6
CIE-y
CIE-x
CIE Chromaticity Diagram
Color Ranks (IF=20mA，Ta=25℃)
Color Ranks CIE
X 0.287 0.307 0.311 0.296
B5 Y 0.295 0.315 0.294 0.276
X 0.307 0.33 0.33 0.311
B6 Y 0.315 0.339 0.318 0.294
X 0.33 0.361 0.355 0.33
C0 Y 0.36 0.385 0.35 0.318
Measurement uncertainty of the color coordinates：±0.01
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Device Number: DLE-0000346 Established date:11-19-2008 Established by: Ruby Lin
0 20 40 60 80 100
0
5
10
15
20
25
30
Forward Current(mA)
Ambient Temperature Ta(OC)
Typical Electro-Optical Characteristics Curves
Relative Intensity vs. Wavelength Forward Current vs. Forward Voltage
Relative Intensity vs. Forward Current Forward Current vs. Ambient Temp.
Chromaticity Coordinate vs. Forward Current Relative Intensity vs. Angle Displacement
2.0 2.5 3.0 3.5 4.0 4.5
0
5
10
15
20
25
Forward Current(mA)
Forward Voltage(V)
350 400 450 500 550 600 650 700 750 800
0.0
0.2
0.4
0.6
0.8
1.0
Relative Intensity(a.u.)
Wavelength(nm)
0 5 10 15 20 25
0.0
0.5
1.0
1.5
Relative Intensity(a.u.)
Forward Current(mA)
010 20 30 40
50
60
70
80
90O
O
O
O
O
O
O
O
O
O
0
1.0
1.0
0.5
30O
60O
90O
0
0.5
Relative Luminusity
Radiation Angle
0 10 20 30 40 50
0.300
0.310
0.320
0.330
0.340
0.350
0.360
Relative Intensity(a.u.)
Forward Current(mA)
x
y
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Device Number: DLE-0000346 Established date:11-19-2008 Established by: Ruby Lin
Pb
EL ECTROSTATIC ELECTRONAGNETIC
MAGNETIC OR RADIOACTIVE RELDS
anti-static for 750
Label
Packing Specification
■ Anti-electrostatic bag
■ Inner Carton
■Label Form Specification
CPN: Customer’s Production Number
P/N : Production Number
QTY: Packing Quantity
CAT: Ranks of Luminous Intensity and Forward Voltage
HUE: Color Rank
■Outside Carton REF: Reference
LOT No: Lot Number
MADE IN TAIWAN: Production Place
■Packing Quantity
1. 500 PCS/1 Bag, 5 Bags/1 Inner Carton
2. 10 Inner Cartons/1 Outside Carton
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Device Number: DLE-0000346 Established date:11-19-2008 Established by: Ruby Lin
Notes
1. Lead Forming
During lead formation, the leads should be bent at a point at least 3mm from the base of the
epoxy bulb.
Lead forming should be done before soldering.
Avoid stressing the LED package during leads forming. The stress to the base may damage
the LED’s characteristics or it may break the LEDs.
Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures
may cause failure of the LEDs.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead
position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration
of the epoxy resin and this will degrade the LEDs.
2. Storage
The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from
Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or
more, they can be stored for a year in a sealed container with a nitrogen atmosphere and
moisture absorbent material.
Please avoid rapid transitions in ambient temperature, especially, in high humidity
environments where condensation can occur.
3. Soldering
Careful attention should be paid during soldering. When soldering, leave more then 3mm
from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is
recommended.
Recommended soldering conditions:
Hand Soldering DIP Soldering
Temp. at tip of
iron 300 Max.℃(30W
Max.) Preheat temp. 100 Max.℃(60 sec
Max.)
Soldering time 3 sec Max. Bath temp. & time 260 Max., 5 sec Max
Distance 3mm Min.(From
solder joint to
epoxy bulb)
Distance 3mm Min. (From
solder joint to epoxy
bulb)
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Prehead
laminar wave
Fluxing
Avoiding applying any stress to the lead frame while the LEDs are at high temperature
particularly when soldering.
Dip and hand soldering should not be done more than one time
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or
vibration until the LEDs return to room temperature.
A rapid-rate process is not recommended for cooling the LEDs down from the peak
temperature.
Although the recommended soldering conditions are specified in the above table, dip or
handsoldering at the lowest possible temperature is desirable for the LEDs.
Wave soldering parameter must be set and maintain according to recommended temperature
and dwell time in the solder wave.
4. Cleaning
When necessary, cleaning should occur only with isopropyl alcohol at room temperature for
a duration of no more than one minute. Dry at room temperature before use.
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of
ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the
assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause
damage to the LED
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Device Number: DLE-0000346 Established date:11-19-2008 Established by: Ruby Lin
5. Circuit Protection
Below the zener reference voltage Vz, all the current flows through LED and as the voltage
rises to Vz, the zener diode “breakdown." If the voltage tries to rise above Vz current flows
through the zener branch to keep the voltage at exactly Vz.
When the LED is connected using serial circuit, if either piece of LED is no light up but
current can’t flow through causing others to light down. In new design, the LED is parallel
with zener diode. if either piece of LED is no light up but current can flow through causing
others to light up.
6. Heat Management
Heat management of LEDs must be taken into consideration during the design stage of LED
application. The current should be de-rated appropriately by referring to the de-rating curve
found in each product specification.
The temperature surrounding the LED in the application should be controlled. Please refer to
the data sheet de-rating curve.
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Device Number: DLE-0000346 Established date:11-19-2008 Established by: Ruby Lin
7. ESD (Electrostatic Discharge)
Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs.
An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling
LEDs.
All devices, equipment and machinery must be properly grounded.
Use ion blower to neutralize the static charge which might have built up on surface of the
LEDs plastic lens as a result of friction between LEDs during storage and handing.
8. Other
Above specification may be changed without notice. EVERLIGHT will reserve authority on
material change for above specification.
When using this product, please observe the absolute maximum ratings and the instructions
for using outlined in these specification sheets. EVERLIGHT assumes no responsibility for
any damage resulting from use of the product which does not comply with the absolute
maximum ratings and the instructions included in these specification sheets.
These specification sheets include materials protected under copyright of EVERLIGHT
corporation. Please don’t reproduce or cause anyone to reproduce them without
EVERLIGHT’s consent.
EVERLIGHT ELECTRONICS CO., LTD. Tel: 886-2-2267-2000, 2267-9936
Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: 886-2267-6244, 2267-6189, 2267-6306
Tucheng, Taipei 236, Taiwan, R.O.C http:\\www.everlight.com
