2007-04-19
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BAS116...
Silicon Low Leakage Diode
• Low-leakage applications
• Medium speed switching times
• Pb-free (RoHS compliant) package1)
• Qualified according AEC Q101
BAS116
!
Type Package Configuration Marking
BAS116 SOT23 single JVs
Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter Symbol Value Unit
Diode reverse voltage VR80 V
Peak reverse voltage VRM 85
Forward current IF250 mA
Non-repetitive peak surge forward current
t = 1 µs
t = 1 s
IFSM
4.5
0.5
A
Total power dissipation
TS ≤ 54°C Ptot 370 mW
Junction temperature Tj150 °C
Storage temperature Tstg -65 ... 150
Thermal Resistance
Parameter Symbol Value Unit
Junction - soldering point2)
BAS116 RthJS ≤ 260 K/W
1Pb-containing package may be available upon special request
2For calculation of RthJA please refer to Application Note Thermal Resistance
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BAS116...
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Breakdown voltage
I(BR) = 100 µA V(BR) 85 - - V
Reverse current
VR = 75 V
VR = 75 V, TA = 150 °C
IR
-
-
-
-
5
80
nA
Forward voltage
IF = 1 mA
IF = 10 mA
IF = 50 mA
IF = 150 mA
VF
-
-
-
-
-
-
-
-
900
1000
1100
1250
mV
AC Characteristics
Diode capacitance
VR = 0 V, f = 1 MHz CT- 2 - pF
Reverse recovery time
IF = 10 mA, IR = 10 mA, measured at IR = 1mA ,
RL = 100 Ω
trr - 0.6 1.5 µs
Test circuit for reverse recovery time
EHN00022
Oscillograph
Ι
F
D.U.T.
Puls generator: tp = 10µs, D = 0.05,
tr = 0.6ns, Ri = 50Ω
Oscillograph: R = 50Ω , tr = 0.35ns, C ≤ 1pF
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BAS116...
Reverse current IR = ƒ (TA)
VR = Parameter
0 50 100 150
BAS 116 EHB00053
nA
˚C
max
typ
10
1
2
10
2
10
-1
10
-2
10
-3
10
Ι
R
A
T
Forward Voltage VF = ƒ (TA)
IF = Parameter
0
0.5
1.0
1.5
0 50 100 150
BAS 116 EHB00056
V
TA
V
F
˚C
150 mA
50 mA
10 mA
1 mA
0.1 mA
Ι
F=
Forward current IF = ƒ (VF)
TA = 25°C
0
0
EHB00054BAS 116
Ι
0.5 1.0 V 1.5
50
100
mA
150
F
F
V
maxtyp
Forward current IF = ƒ (TS)
BAS116
0 15 30 45 60 75 90 105 120 °C 150
TS
0
25
50
75
100
125
150
175
200
225
250
mA
300
IF
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BAS116...
Permissible Puls Load RthJS = ƒ (tp)
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
TP
-1
10
0
10
1
10
2
10
3
10
RthJS
D = 0,5
0,2
0,1
0,05
0,02
0,01
0,005
0
Permissible Pulse Load
IFmax/ IFDC = ƒ (tp)
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
sTP
0
10
1
10
2
10
-
IFmax/IFDC
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
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BAS116...
Package SOT23
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
EH
s
BCW66
Type code
Pin 1
0.8
0.9 0.91.3
0.8 1.2
0.25 MBC
1.9
-0.05
+0.1
0.4
±0.1
2.9
0.95
C
B
0...8˚
0.2 A
0.1 MAX.
10˚ MAX.
0.08...0.15
1.3
±0.1
10˚ MAX.
M
2.4
±0.15
±0.1
1
A
0.15 MIN.
1)
1) Lead width can be 0.6 max. in dambar area
12
3
3.15
4
2.65
2.13
0.9
8
0.2
1.15
Pin 1
Manufacturer
2005, June
Date code (YM)
2007-04-19
6
BAS116...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
