XC3SD1800A-5FGG676C - Xilinx

DS706 (v1.1) February 2, 2011 www.xilinx.com

Product Specification 1

other countries. PCI, PCI Express, PCIe, and PCI-X are trademarks of PCI-SIG. All other trademarks are the property of their respective owners.

General Description

The Extended Spartan®-3A family of Field-Programmable Gate Arrays (FPGAs) solves the design challenges in many high-

volume, cost-sensitive electronic applications. With 12 devices ranging from 50,000 to 3.4 million system gates (as shown in

Ta bl e 1 ), the Extended Spartan-3A family provides a broad range of densities and package options, integrated DSP MACs,

and low total system cost while increasing functionality. The Extended Spartan-3A family includes the Spartan-3A devices

and the higher density Spartan-3A DSP devices. It also includes the nonvolatile Spartan-3AN devices, which combine

leading-edge FPGA and flash technologies to provide a new evolution in security, protection and functionality, ideal for

space-critical or secure applications.

The Extended Spartan-3A family improves system performance and reduces the cost of configuration. These

enhancements, combined with proven 90 nm process technology, deliver more functionality and bandwidth per dollar.

Because of its exceptionally low cost, the Extended Spartan-3A family is ideally suited to a wide range of consumer

electronics applications, including broadband access, home networking, display/projection, and digital television equipment.

The Extended Spartan-3A family is a superior alternative to mask-programmed ASICs. FPGAs avoid the high initial cost,

lengthy development cycles, the inherent inflexibility of conventional ASICs, and permit field design upgrades.

Summary of Extended Spartan-3A Family Features

• Very low-cost, high-performance logic solution for high-

volume, cost-conscious applications

• Low-cost QFP and BGA packaging, Pb-free options

• Flexible power management

• Leading connectivity platform

• Abundant, flexible logic resources

• Dedicated resources for high-speed digital signal

processing applications

• Precise clock management with up to eight Digital

Clock Managers (DCMs)

• Integrated flash memory in Spartan-3AN devices

• Eight low-skew global clock networks, eight additional

clocks per half device, plus abundant low-skew routing

• Hierarchical SelectRAM™ memory architecture

• Configuration interface to industry-standard PROMs

• Complete Xilinx® ISE® and free WebPACK™

development system software support

• MicroBlaze™ and PicoBlaze™ embedded processors

reduce risk

• Low-cost starter kits from Xilinx, distributors, and third

parties

• XA versions available for Automotive applications

Extended Spartan-3A Family Overview

DS706 (v1.1) February 2, 2011 Product Specification

Table 1: Summary of Extended Spartan-3A Family Attributes

Device System

Gates

Equivalent

Logic Cells CLBs Slices Distributed

RAM Bits(1)Block RAM

Bits(1)In-System

Flash Bits(2)Dedicated

Multipliers DSP48As DCMs Maximum

User I/O

XC3S50A/AN 50K 1,584 176 704 11K 54K 1M 3 - 2 144

XC3S200A/AN 200K 4,032 448 1,792 28K 288K 4M 16 - 4 248(3)

XC3S400A/AN 400K 8,064 896 3,584 56K 360K 4M 20 - 4 311

XC3S700A/AN 700K 13,248 1,472 5,888 92K 360K 8M 20 - 8 372

XC3S1400A/AN 1400K 25,344 2,816 11,264 176K 576K 16M 32 - 8 502

XC3SD1800A 1800K 37,440 4,160 16,640 260K 1,512K - - 84 8 519

XC3SD3400A 3400K 53,712 5,968 23,872 373K 2,268K - - 126 8 469

Notes:

1. By convention, one Kb is equivalent to 1,024 bits.

2. In-System flash is available in the Spartan-3AN devices only.

3. Maximum user I/O for XC3S200AN is 195.

Extended Spartan-3A Family Overview

DS706 (v1.1) February 2, 2011 www.xilinx.com

Product Specification 2

Extended Spartan-3A Family Features

This section describes the features of the Extended Spartan-3A family of FPGAs.

• Very low-cost, high-performance logic solution for high-

volume, cost-conscious applications

• Use fewer standard components

• Increase system reliability

• Flexible power management

• Low 1.2V core voltage

• Selectable I/O voltage with 3.3V, 2.5V, 1.8V, 1.5V,

and 1.2V signaling

• Full 3.3V ±10% compatibility and hot swap

compliance

• Dual-range auxiliary voltage allows 3.3V setting to

simplify 3.3V-only design

• Suspend and hibernate modes reduce system power

• Leading connectivity platform

• Multi-standard SelectIO™ interface pins support

most popular and emerging signaling standards

• Up to 519 I/O pins or 227 differential signal pairs

• LVCMOS, LVTTL, HSTL, SSTL single-ended I/O

• Selectable output drive, up to 24 mA per pin

• QUIETIO standard reduces I/O switching noise

• 640+ Mb/s data transfer rate per differential I/O

• LVDS, RSDS, mini-LVDS, HSTL/SSTL differential

I/O with integrated differential termination resistors

• Enhanced Double Data Rate (DDR) support

• Compliant to 32-/64-bit, 33/66 MHz PCI™ technology

• Abundant, flexible logic resources

• Densities up to 53,712 logic cells, including

optional shift register or distributed RAM support

• Efficient wide multiplexers and wide logic improve

performance and density

• Fast look-ahead carry logic

• IEEE 1149.1/1532 JTAG programming/debug port

• Dedicated resources for high-speed digital signal

processing applications

• 18-bit by 18-bit multiplier with optional pipeline

• 250 MHz XtremeDSP™ DSP48A block in the

largest two devices

-48-bit accumulator for multiply-accumulate

(MAC) operation

-Integrated 18-bit pre-adder for multiply or

multiply-add operation

-Optional cascaded Multiply or MAC

-Fills the DSP performance gap between DSP

processors and high-end custom solutions

• Precise clock management with up to eight Digital

Clock Managers (DCMs)

• Clock skew elimination (delay locked loop)

• Frequency synthesis, multiplication, division

• High-resolution phase shifting

• Wide frequency range (5 MHz to over 320 MHz)

• Integrated flash memory in Spartan-3AN devices

• Up to 16 Mb of internal flash for configuration and

application storage

• Up to 11 Mb of user storage available for

embedded processing, code shadowing, or

scratchpad memory

• Enables single-chip board designs for space-

conscious applications

• Enhanced design security with flash memory

protection and security register

• Eight low-skew global clock networks, eight additional

clocks per half device, plus abundant low-skew routing

• Hierarchical SelectRAM memory architecture

• Up to 2.2 Mb of fast block RAM with byte write

enables for processor applications

• Up to 373 Kb of efficient distributed RAM

• External DDR/DDR2 SDRAM support up to

400 Mb/s

• Configuration interface to industry-standard PROMs

• Low-cost, space-saving SPI serial flash PROM

• x8 or x8/x16 parallel NOR flash PROM

• Low-cost Xilinx Platform Flash with JTAG

• Load multiple bitstreams under FPGA control with

MultiBoot capability

• Complete Xilinx ISE and free WebPACK development

system software support

• Industry’s most comprehensive IP library

•MicroBlaze and PicoBlaze embedded processors

• Integrate soft processor into FPGA to reduce Bill of

Materials

• Reduce obsolescence risks with soft processors

• Low-cost QFP and BGA packaging, Pb-free options

• Common footprints support easy density migration

• Low-cost starter kits from Xilinx, distributors, and third

parties

• Complete starter kits designed for cost-sensitive,

high-volume applications with design examples

•XA versions available for Automotive applications

Extended Spartan-3A Family Overview

DS706 (v1.1) February 2, 2011 www.xilinx.com

Product Specification 3

Architectural Overview

The Extended Spartan-3A family architecture consists of

five fundamental programmable functional elements:

•Configurable Logic Blocks (CLBs) contain flexible

Look-Up Tables (LUTs) that implement logic plus

storage elements used as flip-flops or latches. CLBs

perform a wide variety of logical functions as well as

store data.

•Input/Output Blocks (IOBs) control the flow of data

between the I/O pins and the internal logic of the

device. IOBs support bidirectional data flow plus

3-state operation. Supports a variety of signal

standards, including several high-performance

differential standards. Double Data-Rate (DDR)

registers are included.

•Block RAM provides data storage in the form of

18-Kbit dual-port blocks.

•Multiplier or DSP48A Blocks accept two 18-bit binary

numbers as inputs and calculate the product. The

DSP48A blocks in the two largest members of the

Extended Spartan-3A family add an 18-bit pre-adder

and 48-bit accumulator.

•Digital Clock Manager (DCM) Blocks provide self-

calibrating, fully digital solutions for distributing,

delaying, multiplying, dividing, and phase-shifting clock

signals.

Configuration

The Extended Spartan-3A family is programmed by loading

configuration data into robust, reprogrammable, static

CMOS configuration latches (CCLs) that collectively control

all functional elements and routing resources. The FPGA

configuration data is stored externally in a PROM or some

other nonvolatile medium, either on or off the board, or

stored within the FPGA in the nonvolatile Spartan-3AN

devices. After applying power, the configuration data is

written to the FPGA using any of eight different modes:

• Master Serial from a Xilinx Platform Flash PROM

• Serial Peripheral Interface (SPI) from an industry-

standard SPI serial flash

• Internal SPI flash memory (Spartan-3AN devices)

• Byte Peripheral Interface (BPI) Up from an industry-

standard x8 or x8/x16 parallel NOR flash

• Slave Serial, typically downloaded from a processor

• Slave Parallel, typically downloaded from a processor

• Boundary Scan (JTAG), typically downloaded from a

processor or system tester

• MultiBoot configuration

MultiBoot configuration allows two or more FPGA

configuration bitstreams to be stored in a single SPI serial

flash or a parallel NOR flash. The FPGA application controls

which configuration to load next and when to load it.

Additionally, each FPGA in the Extended Spartan-3A family

contains a unique, factory-programmed Device DNA

identifier useful for tracking purposes, anti-cloning designs,

or IP protection.

I/O Capabilities

The SelectIO interface of the Extended Spartan-3A family

supports many popular single-ended and differential

standards. Ta b l e 2 shows the maximum number of user

I/Os and input-only pins for each device/package

combination.

FPGAs in the Extended Spartan-3A family support the

following single-ended standards:

• 3.3V low-voltage TTL (LVTTL)

• Low-voltage CMOS (LVCMOS) at 3.3V, 2.5V, 1.8V,

1.5V, or 1.2V

• 3.3V PCI at 33 MHz or 66 MHz

• HSTL I, II, and III at 1.5V and 1.8V, commonly used in

memory applications

• SSTL I and II at 1.8V, 2.5V, and 3.3V, commonly used

for memory applications

FPGAs in the Extended Spartan-3A family support the

following differential standards:

• LVDS, mini-LVDS, RSDS, and PPDS I/O at 2.5V or

3.3V

• Bus LVDS I/O at 2.5V

• TMDS I/O at 3.3V

• Differential HSTL and SSTL I/O

• LVPECL inputs at 2.5V or 3.3V

Extended Spartan-3A Family Overview

DS706 (v1.1) February 2, 2011 www.xilinx.com

Product Specification 4

Package Marking

Figure 1 provides a top marking example for the Extended

Spartan-3A family in the quad-flat packages. Figure 2

shows the top marking for the Extended Spartan-3A family

in BGA packages. The markings for the BGA packages are

nearly identical to those for the quad-flat packages, except

that the marking is rotated with respect to the ball A1

indicator.

The “5C” and “4I” Speed Grade/Temperature Range part

combinations might be dual marked as “5C/4I”.

Tab le 2: Available User I/Os

Device VQ100

VQG100

TQ144

TQG144

FT256

FTG256

FG320

FGG320

FG400

FGG400

CS484

CSG484

FG484

FGG484

FG676

FGG676

Body Size (mm) 14x14

(1)20x20

(1)17 x 17 19 x 19 21 x 21 19 x 19 23 x 23 27 x 27

XC3S50A/AN 68(2)108144 - - - - -

XC3S200A/AN 68(2) - 195 248(2) - - - -

XC3S400A/AN - - 195 251(2)311 - - -

XC3S700A/AN - - 161(2) - 311(2)-372 -

XC3S1400A/AN - - 161(2) - - -375502

XC3SD1800A - ----309-519

XC3SD3400A - ----309-469

Notes:

1. The footprints for the VQ/TQ packages are larger than the package body. See the package drawings

(http://www.xilinx.com/support/documentation/package_specifications.htm) for details.

2. These options are available only in the Spartan-3A devices, not the Spartan-3AN devices. See the data sheets for each device for Pb and

Pb-free package option availability.

X-Ref Target - Figure 1

Figure 1: Extended Spartan-3A Device QFP Package Marking Example

X-Ref Target - Figure 2

Figure 2: Extended Spartan-3A Device BGA Package Marking Example

Date Code

Mask Revision Code

Process Technology

XC3S50ATM

TQ144AGQ0625

D1234567A

SPARTAN

Device Type

Package

Speed Grade

Temperature Range

Fabrication Code

Pin P1

DS706_01_072508

Lot Code

Date Code

XC3S50ATM

SPARTAN

Device Type

BGA Ball A1

Package

Speed Grade

Temperature Range

DS706_02_072508

FT256 AGQ0625

D1234567A

Mask Revision Code

Process Code

Fabrication Code

Extended Spartan-3A Family Overview

DS706 (v1.1) February 2, 2011 www.xilinx.com

Product Specification 5

Ordering Information

The Extended Spartan-3A family is available in both standard and Pb-free packaging options for all options of the

Spartan-3A devices and the Spartan-3A DSP devices, and for most options of the Spartan-3AN devices (see DS557,

Spartan-3AN FPGA Family: Introduction and Ordering Information for details).The Pb-free packages include a “G” character

in the ordering code (see Figure 3).

X-Ref Target - Figure 3

Figure 3: Ordering Information

XC3S50A -4 FTG256 C

Device Type

Speed Grade

Temperature Range

Package Type/Number of Pins

Example:

DS706_03_072508

Device Speed Grade Package Type / Number of Pins Temperature Range (TJ)

XC3S50A/AN –4 Standard Performance VQ(G)100 100-pin Very Thin Quad Flat Pack (VQFP) C Commercial (0°C to 85°C)

XC3S200A/AN –5 High Performance TQ(G)144 144-pin Thin Quad Flat Pack (TQFP) I Industrial (–40°C to 100°C)

XC3S400A/AN FT(G)256 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA) LI Low Power Industrial (–40°C

to 100°C) for Spartan-3A

DSP devices (see DS610,

Spartan-3A DSP FPGA Data

Sheet)

XC3S700A/AN FG(G)320 320-ball Fine-Pitch Ball Grid Array (FBGA)

XC3S1400A/AN FG(G)400 400-ball Fine-Pitch Ball Grid Array (FBGA)

XC3SD1800A CS(G)484 484-ball Chip-Scale Ball Grid Array (FBGA)

XC3SD3400A FG(G)484 484-ball Fine-Pitch Ball Grid Array (FBGA)

FG(G)676 676-ball Fine-Pitch Ball Grid Array (FBGA)

Notes:

1. The –5 speed grade is exclusively available in the Commercial temperature range.

Extended Spartan-3A Family Overview

DS706 (v1.1) February 2, 2011 www.xilinx.com

Product Specification 6

Extended Spartan-3A Family Documentation

Complete and up-to-date documentation of the Extended Spartan-3A family of FPGAs is available on the Xilinx website. The

following files are also available for download:

DS529, Spartan-3A FPGA Data Sheet

DS610, Spartan-3A DSP FPGA Data Sheet

DS557, Spartan-3AN FPGA Data Sheet

These data sheets contain DC and Switching Characteristic

specifications and pinouts for the Extended Spartan-3A

family.

UG331, Spartan-3 Generation FPGA User Guide

This guide includes chapters on:

• Clocking Resources

• Digital Clock Managers (DCMs)

• Block RAM

• Configurable Logic Blocks (CLBs)

• I/O Resources

• Embedded Multiplier Blocks

• Programmable Interconnect

•ISE

Design Tools

•IP Cores

• Embedded Processing and Control Solutions

• Pin Types and Package Overview

• Package Drawings

• Powering FPGAs

• Power Management

UG332, Spartan-3 Generation Configuration User Guide

This guide includes chapters on:

• Configuration Overview

• Detailed Descriptions by Mode

• ISE iMPACT Programming Examples

• MultiBoot Reconfiguration

• Design Authentication using Device DNA

UG333, Spartan-3AN FPGA In-System Flash User Guide

This guide provides information for Spartan-3AN FPGA

applications that write to or read from the In-System flash

memory after configuration:

• SPI_ACCESS interface

• In-System flash memory architecture

• Read, program, and erase commands

• Status registers

• Sector Protection and Sector Lockdown features

• Security Register with Unique Identifier

UG431, XtremeDSP DSP48A for Spartan-3A DSP

FPGAs User Guide

This guide describes the DSP48A slices and the DSP48A

pre-adder.

Extended Spartan-3A Family Starter Kits

For specific hardware examples, see the Starter Kit boards

for the Extended Spartan-3A family. The following web page

has links to various boards for each family, including design

examples and the user guides:

http://www.xilinx.com/products/boards/s3_sk_promo.htm

Revision History

The following table shows the revision history for this document:

Date Version Description of Revisions

08/04/08 1.0 Initial Xilinx release.

01/29/10 1.0.1 Corrected typo in the slice count for XC3SD1800A in Ta b l e 1 .

02/02/11 1.1 Updated for new Spartan-3AN family part/package combinations: XC3S50AN and XC3S400AN in

FT(G)256 package, and XC3S1400AN in FG(G)484 package. Removed footnote for maximum user

I/O for XC3S50A/AN in Ta b l e 1 . Updated Tabl e 2 content and table notes. Updated Device

Temperature table.

Extended Spartan-3A Family Overview

DS706 (v1.1) February 2, 2011 www.xilinx.com

Product Specification 7

Notice of Disclaimer

THE XILINX HARDWARE FPGA AND CPLD DEVICES REFERRED TO HEREIN (“PRODUCTS”) ARE SUBJECT TO THE TERMS AND

CONDITIONS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED AT http://www.xilinx.com/warranty.htm. THIS LIMITED

WARRANTY DOES NOT EXTEND TO ANY USE OF PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE

SPECIFICATIONS STATED IN THE XILINX DATA SHEET. ALL SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE.

PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE OR FOR USE IN ANY APPLICATION REQUIRING FAIL-SAFE

PERFORMANCE, SUCH AS LIFE-SUPPORT OR SAFETY DEVICES OR SYSTEMS, OR ANY OTHER APPLICATION THAT INVOKES

THE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL

APPLICATIONS”). USE OF PRODUCTS IN CRITICAL APPLICATIONS IS AT THE SOLE RISK OF CUSTOMER, SUBJECT TO

APPLICABLE LAWS AND REGULATIONS.