LP3999ITLX-3.3/NOPB - Texas Instruments

LP3999

Enable Control,

Active high Load

CBYPASS

10 nF

1.0 uF

1.0 PF

VIN

VOUT

GND

VEN

LP3999

www.ti.com

SNVS207E –JUNE 2003–REVISED MAY 2013

LP3999 Low Noise 150mA Voltage Regulator for RF/Analog Applications

Check for Samples: LP3999

1FEATURES APPLICATIONS

2• 5 pin DSBGA Package • GSM Portable Phones

• Stable with Ceramic Capacitor • CDMA Cellular Handsets

• Logic Controlled Enable • Wideband CDMA Cellular Handsets

• Fast Turn-on • Bluetooth Devices

• Thermal-overload and short-circuit protection • Portable Information Appliances

•−40 to +125°C junction temperature range for • Handheld MP3 Devices

operation DESCRIPTION

KEY SPECIFICATIONS The LP3999 regulator is designed to meet the

requirements of portable wireless battery-powered

• 2.5V to 6.0V Input Range applications and will provide an accurate output

• Accurate Output Voltage; ±75mV / 2% voltage with low noise and low quiescent current.

• 60 mV Typical Dropout with 150 mA Load. Vout Ideally suited for powering RF/Analog devices this

device will also be used to meet more general circuit

> 2.5V requirements.

• Virtually Zero Quiescent Current when

Disabled For battery powered applications the low dropout and

low ground current provided by the device allows the

• 10 μVrms Output Noise Over 10Hz to 100kHz lifetime of the battery to be maximized.The inclusion

• Stable with a 1 μF Output Capacitor of an Enable(disable) control can be used by the

• Ensured 150 mA Output Current system to further extend the battery lifetime by

reducing the power consumption to virtually zero.

• Fast Turn-on Time; 140 μs (Typ.) Should the application require a device with an active

disable function please refer to device LP3995.

The LP3999 also features internal protection against

short-circuit currents and over-temperature

conditions.

Typical Application Circuit

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

A3 C3

A1 B2 C1

CBYPASS VIN

VEN GND VOUT

A3C3

A1B2C1

CBYPASS

VIN

VEN

GND

VOUT

Top View Bottom View

Fast Turn-

Vref

Over Current

Thermal Protn.

VIN

VEN

CBYPASS

VOUT

GND

LP3999

SNVS207E –JUNE 2003–REVISED MAY 2013

www.ti.com

DESCRIPTION (CONTINUED)

The LP3999 is designed to be stable with small 1.0 µF ceramic capacitors. The small outline of the LP3999

DSBGA package with the required ceramic capacitors can realize a system application within minimal board

area.

Performance is specified for a −40°C to +125°C temperature range.

The device is available in DSBGA package. For other package options contact your local TI sales office.

The device is available in fixed output voltages in the ranges of 1.5V to 3.3V. For availability, please contact your

local TI sales office.

Block Diagram

PIN DESCRIPTIONS

Pin No. Symbol Name and Function

A1 VEN Enable Input; Disables the Regulator when ≤0.4V.

Enables the regulator when ≥0.9V

B2 GND Common Ground

C1 VOUT Voltage output. Connect this output to the load circuit.

C3 VIN Voltage Supply Input

A3 CBYPASS Bypass Capacitor connection.

Connect a 0.01 µF capacitor for noise reduction.

Connection Diagram

5 Bump DSBGA Package

See Package Number YZR0005

Product Folder Links: LP3999

LP3999

www.ti.com

SNVS207E –JUNE 2003–REVISED MAY 2013

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION(1)(2)

Orderable Device Output Voltage (V)

LP399ITL-1.5/NOPB 1.5

LP399ITLX-1.5/NOPB

LP399ITL-1.8/NOPB 1.8

LP399ITLX-1.8/NOPB

LP399ITL-1.875/NOPB 1.875

LP399ITLX-1.875/NOPB

LP399ITL-2.4/NOPB 2.4

LP399ITLX-2.4/NOPB

LP399ITL-2.5/NOPB 2.5

LP399ITLX-2.5/NOPB

LP399ITL-2.8/NOPB 2.8

LP399ITLX-2.8/NOPB

LP399ITL-3.3/NOPB 3.3

LP399ITLX-3.3/NOPB

(1) For the most current package and ordering information, see the Package Option Addendum at the end

of this document, or see the TI web site at www.ti.com.

(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

Absolute Maximum Ratings (1) (2)(3)

Input Voltage (VIN)−0.3 to 6.5V

Output Voltage −0.3 to (VIN + 0.3V)

to 6.5V (max)

Enable Input Voltage −0.3 to 6.5V

Junction Temperature 150°C

Lead/Pad Temperature(4)

DSBGA 260°C

Storage Temperature −65 to +150°C

Continuous Power Dissipation(5) Internally limited

ESD (6)

Human Body Model 2 kV

Machine Model 200V

(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and

associated test conditions, see the Electrical Characteristics tables.

(2) All voltages are with respect to the potential at the GND pin.

(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for

availability and specifications.

(4) For further information on these packages please refer to application notes AN-1112 Micro SMD Package Wafer Level Chip Scale

Package SNVA009.

(5) Internal Thermal shutdown circuitry protects the device from permanent damage.

(6) The human body is 100 pF discharge through 1.5 kΩresistor into each pin. The machine model is a 200 pF capacitor discharged

directly into each pin.

Product Folder Links: LP3999

LP3999

SNVS207E –JUNE 2003–REVISED MAY 2013

www.ti.com

Operating Ratings (1)

Input Voltage (VIN) 2.5 to 6.0V

Enable Input Voltage 0 to 6.0V

Junction Temperature −40 to +125°C

Ambient Temperature Range(2) -40 to 85°C

(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and

associated test conditions, see the Electrical Characteristics tables.

(2) In applications where high power dissipation and/or poor thermal resistance is present, the maximum ambient temperature may have to

be derated. Maximum ambient temperature (TA(max)) is dependant on the maximum operating junction temperature (TJ(max-op)), the

maximum power dissipation (PD(max)), and the junction to ambient thermal resistance in the application (θJA). This relationship is given

by:

TA(max) = TJ(max-op) −(PD(max) ×θJA).

Thermal Properties(1)

Junction to Ambient Thermal Resistance

θJA (DSBGA pkg.) 255°C/W

(1) Junction to ambient thermal resistance is highly dependant on the application and board layout. In applications where high thermal

dissipation is possible, special care must be paid to thermal issues in the board design.

Electrical Characteristics

Unless otherwise noted, VEN = 1.5, VIN = VOUT(NOM) + 1.0V, CIN = 1 µF, IOUT = 1 mA, COUT = 1 µF, CBP = 0.01 µF. Typical

values and limits appearing in normal type apply for TJ= 25°C. Limits appearing in boldface type apply over the full

temperature range for operation, −40 to +125°C. (1) (2)

Limit

Symbol Parameter Conditions Typical Units

Min Max

VIN Input Voltage 2.5 6.0 V

DEVICE OUTPUT: 1.5 ≤VOUT < 1.8V

ΔVOUT Output Voltage Tolerance IOUT = 1 mA −50 50 mV

-75 75

Line Regulation Error VIN = (VOUT(NOM)+1.0V) to 6.0V, −3.5 3.5 mV/V

IOUT = 1 mA

Load Regulation Error IOUT = 1 mA to 150 mA 10 75 µV/mA

PSRR Power Supply Rejection Ratio(3) f = 1 kHz, IOUT = 1 mA 58 dB

f = 10 kHz, IOUT = 1 mA 58

DEVICE OUTPUT: 1.8 ≤VOUT < 2.5V

ΔVOUT Output Voltage Tolerance IOUT = 1 mA -50 50 mV

−75 75

Line Regulation Error VIN = (VOUT(NOM)+1.0V) to 6.0V, −2.5 2.5 mV/V

IOUT = 1 mA

Load Regulation Error IOUT = 1 mA to 150 mA 10 75 µV/mA

PSRR Power Supply Rejection Ratio(3) f = 1 kHz, IOUT = 1 mA 60 dB

f = 10 kHz, IOUT = 1 mA 60

DEVICE OUTPUT: 2.5 ≤VOUT ≤3.3V

ΔVOUT Output Voltage Tolerance IOUT = 1 mA -2 2 % of

VOUT(NOM)

−3 3

Line Regulation Error VIN = (VOUT(NOM)+1.0V) to 6.0V, −0.1 0.1 %/V

IOUT = 1 mA

Load Regulation Error IOUT = 1 mA to 150 mA 0.0004 0.002 %/mA

(1) All limits are ensured. All electrical characteristics having room-temperature limits are tested during production at TJ= 25°C or correlated

using Statistical Quality Control methods. Operation over the temperature specification is ensured by correlating the electrical

characteristics to process and temperature variations and applying statistical process control.

(2) VOUT(NOM) is the stated output voltage option for the device.

(3) This electrical specification is ensured by design.

Product Folder Links: LP3999

LP3999

www.ti.com

SNVS207E –JUNE 2003–REVISED MAY 2013

Electrical Characteristics (continued)

Unless otherwise noted, VEN = 1.5, VIN = VOUT(NOM) + 1.0V, CIN = 1 µF, IOUT = 1 mA, COUT = 1 µF, CBP = 0.01 µF. Typical

values and limits appearing in normal type apply for TJ= 25°C. Limits appearing in boldface type apply over the full

temperature range for operation, −40 to +125°C. (1) (2)

Limit

Symbol Parameter Conditions Typical Units

Min Max

VDO Dropout Voltage IOUT = 1 mA 0.4 2mV

IOUT = 150 mA 60 100

PSRR Power Supply Rejection Ratio(3) f = 1 kHz, IOUT = 1 mA 60 dB

f = 10 kHz, IOUT = 1 mA 50

FULL VOUT RANGE

ILOAD Load Current See (4) and (3) 0 µA

IQQuiescent Current VEN = 1.5V, IOUT = 0 mA 85 150

VEN = 1.5V, IOUT = 150 mA 140 200 µA

VEN = 0.4V 0.003 1.5

ISC Short Circuit Current Limit 450 mA

ENOutput Noise Voltage(3) BW = 10 Hz to 100 kHz, 10

VIN = 4.2V, No Load µVrms

BW = 10 Hz to 100 kHz, 30

VIN = 4.2V, 1mA Load

TSHUTDOWN Thermal Shutdown Temperature 160 °C

Hysteresis 20

ENABLE CONTROL CHARACTERISTICS

IEN Maximum Input Current at VEN VEN = 0.0V and VIN = 6.0V 0.001 µA

Input

VIL Low Input Threshold 0.4 V

VIH High Input Threshold 0.9 V

TIMING CHARACTERISTICS

TON Turn On Time (5) To 95% Level (6) 140 µs

(4) The device maintains the regulated output voltage without load.

(5) This electrical specification is ensured by design.

(6) Time from VEN = 0.9V to VOUT = 95% (VOUT(NOM))

Recommended Output Capacitor Limit

Symbol Parameter Conditions Typical Units

Min Max

COUT Output Capacitor Capacitance (1) 1.0 0.70 µF

ESR 5 500 mΩ

(1) The capacitor tolerance should be 30% or better over temperature. Recommended capacitor type is X7R however dependant on

application X5R,Y5V and Z5U can also be used.

Product Folder Links: LP3999

VIN = VOUT(NOM) + 1V

50 mV

VIN = VOUT(NOM) + 1V

30 us

600 mV

4.6 ms

600 us

LP3999

SNVS207E –JUNE 2003–REVISED MAY 2013

www.ti.com

INPUT TEST SIGNALS

Figure 1. Line Transient Response Input Test Signal

Figure 2. PSRR Input Test Signal

Product Folder Links: LP3999

LP3999

www.ti.com

SNVS207E –JUNE 2003–REVISED MAY 2013

TYPICAL PERFORMANCE CHARACTERISTICS

Unless otherwise specified, CIN = COUT = 1.0 µF Ceramic, VIN = VOUT + 1.0V, TA= 25°C, Enable pin is tied to VIN.

Output Voltage Change vs Temperature Ground Current vs Load Current (1.8V VOUT)

Figure 3. Figure 4.

Ground Current vs VIN @ 25°C Ground Current vs VIN @125°C

Figure 5. Figure 6.

Ground Current vs VIN @ -40°C Short Circuit Current

Figure 7. Figure 8.

Product Folder Links: LP3999

LP3999

SNVS207E –JUNE 2003–REVISED MAY 2013

www.ti.com

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

Unless otherwise specified, CIN = COUT = 1.0 µF Ceramic, VIN = VOUT + 1.0V, TA= 25°C, Enable pin is tied to VIN.

Line Transient Response (1.8V VOUT) Line Transient Response (1.5V VOUT)

Figure 9. Figure 10.

Ripple Rejection (1.8V VOUT) Ripple Rejection (1.5V VOUT)

Figure 11. Figure 12.

Enable Start-Up Time (VOUT = 1.8V) Enable Start-Up Time (VOUT = 1.8V)

Figure 13. Figure 14.

Product Folder Links: LP3999

LP3999

www.ti.com

SNVS207E –JUNE 2003–REVISED MAY 2013

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

Unless otherwise specified, CIN = COUT = 1.0 µF Ceramic, VIN = VOUT + 1.0V, TA= 25°C, Enable pin is tied to VIN.

Enable Start-Up Time (VOUT = 1.5V) Enable Start-Up Time (VOUT = 1.5V)

Figure 15. Figure 16.

Load Transient Response (VOUT = 1.8V) Load Transient Response (VOUT = 1.5V)

Figure 17. Figure 18.

Output Noise Density VIN = 4.2V VOUT = 2.5V)

Figure 19.

Product Folder Links: LP3999

LP3999

SNVS207E –JUNE 2003–REVISED MAY 2013

www.ti.com

APPLICATION HINTS

POWER DISSIPATION AND DEVICE OPERATION

The permissible power dissipation for any package is a measure of the capability of the device to pass heat from

the power source, the junctions of the IC, to the ultimate heat sink, the ambient environment. Thus the power

dissipation is dependent on the ambient temperature and the thermal resistance across the various interfaces

between the die and ambient air.

Re-stating the equation given in (1) in the electrical specification section, the allowable power dissipation for the

device in a given package can be calculated:

(1)

With a θJA = 255°C/W, the device in the DSBGA package returns a value of 392 mW with a maximum junction

temperature of 125°C.

The actual power dissipation across the device can be represented by the following equation:

PD= (VIN −VOUT) x IOUT. (2)

This establishes the relationship between the power dissipation allowed due to thermal consideration, the voltage

drop across the device, and the continuous current capability of the device. These two equations should be used

to determine the optimum operating conditions for the device in the application.

EXTERNAL CAPACITORS

In common with most regulators, the LP3999 requires external capacitors to ensure stable operation. The

LP3999 is specifically designed for portable applications requiring minimum board space and smallest

components. These capacitors must be correctly selected for good performance.

INPUT CAPACITOR

An input capacitor is required for stability. It is recommended that a 1.0 µF capacitor be connected between the

LP3999 input pin and ground (this capacitance value may be increased without limit).

This capacitor must be located a distance of not more than 1 cm from the input pin and returned to a clean

analogue ground. Any good quality ceramic, tantalum, or film capacitor may be used at the input.

Important: Tantalum capacitors can suffer catastrophic failures due to surge current when connected to a low-

impedance source of power (like a battery or a very large capacitor). If a tantalum capacitor is used at the input,

it must be ensured by the manufacturer to have a surge current rating sufficient for the application.

There are no requirements for the ESR (Equivalent Series Resistance) on the input capacitor, but tolerance and

temperature coefficient must be considered when selecting the capacitor to ensure the capacitance will remain ≅

1.0 µF over the entire operating temperature range.

OUTPUT CAPACITOR

The LP3999 is designed specifically to work with very small ceramic output capacitors. A ceramic capacitor

(dielectric types Z5U, Y5V or X7R) in the 1.0 [to 10 µF] range, and with ESR between 5 mΩto 500 mΩ, is

suitable in the LP3999 application circuit.

For this device the output capacitor should be connected between the VOUT pin and ground.

It may also be possible to use tantalum or film capacitors at the device output, VOUT, but these are not as

attractive for reasons of size and cost (see the section CAPACITOR CHARACTERISTICS).

The output capacitor must meet the requirement for the minimum value of capacitance and also have an ESR

value that is within the range 5 mΩto 500 mΩfor stability.

(1) In applications where high power dissipation and/or poor thermal resistance is present, the maximum ambient temperature may have to

be derated. Maximum ambient temperature (TA(max)) is dependant on the maximum operating junction temperature (TJ(max-op)), the

maximum power dissipation (PD(max)), and the junction to ambient thermal resistance in the application (θJA). This relationship is given

by:

TA(max) = TJ(max-op) −(PD(max) ×θJA).

Product Folder Links: LP3999

LP3999

www.ti.com

SNVS207E –JUNE 2003–REVISED MAY 2013

NO-LOAD STABILITY

The LP3999 will remain stable and in regulation with no external load. This is an important consideration in some

circuits, for example CMOS RAM keep-alive applications.

CAPACITOR CHARACTERISTICS

The LP3999 is designed to work with ceramic capacitors on the output to take advantage of the benefits they

offer. For capacitance values in the range of 1 µF to 4.7 µF, ceramic capacitors are the smallest, least expensive

and have the lowest ESR values, thus making them best for eliminating high frequency noise. The ESR of a

typical 1 µF ceramic capacitor is in the range of 20 mΩto 40 mΩ, which easily meets the ESR requirement for

stability for the LP3999.

The temperature performance of ceramic capacitors varies by type. Most large value ceramic capacitors (≥2.2

µF) are manufactured with Z5U or Y5V temperature characteristics, which results in the capacitance dropping by

more than 50% as the temperature goes from 25°C to 85°C.

A better choice for temperature coefficient in a ceramic capacitor is X7R. This type of capacitor is the most stable

and holds the capacitance within ±15% over the temperature range. Tantalum capacitors are less desirable than

ceramic for use as output capacitors because they are more expensive when comparing equivalent capacitance

and voltage ratings in the 1 µF to 4.7 µF range.

Another important consideration is that tantalum capacitors have higher ESR values than equivalent size

ceramics. This means that while it may be possible to find a tantalum capacitor with an ESR value within the

stable range, it would have to be larger in capacitance (which means bigger and more costly) than a ceramic

capacitor with the same ESR value. It should also be noted that the ESR of a typical tantalum will increase about

2:1 as the temperature goes from 25°C down to −40°C, so some guard band must be allowed.

NOISE BYPASS CAPACITOR

A bypass capacitor should be connected between the CBYPASS pin and ground to significantly reduce the noise at

the regulator output. This device pin connects directly to a high impedance node within the bandgap reference

circuitry. Any significant loading on this node will cause a change on the regulated output voltage. For this

reason, DC leakage current through this pin must be kept as low as possible for best output voltage accuracy.

The use of a 0.01µF bypass capacitor is strongly recommended to prevent overshoot on the output during start-

up.

The types of capacitors best suited for the noise bypass capacitor are ceramic and film. High quality ceramic

capacitors with NPO or COG dielectric typically have very low leakage. Polypropolene and polycarbonate film

capacitors are available in small surface-mount packages and typically have extremely low leakage current.

Unlike many other LDO’s, the addition of a noise reduction capacitor does not effect the transient response of the

device.

ENABLE OPERATION

The LP3999 may be switched ON or OFF by a logic input at the ENABLE pin, VEN. A high voltage at this pin will

turn the device on. When the enable pin is low, the regulator output is off and the device typically consumes 3

nA. If the application does not require the shutdown feature, the VEN pin should be tied to VIN to keep the

regulator output permanently on. To ensure proper operation, the signal source used to drive the VEN input must

be able to swing above and below the specified turn-on/off voltage thresholds listed in the Electrical

Characteristics section under VIL and VIH.

FAST TURN ON

Fast turn-on is ensured by control circuitry within the reference block allowing a very fast ramp of the output

voltage to reach the target voltage. There is no active turn-off on this device. Refer to LP3995 for a similar device

with active turn-off.

DSBGA MOUNTING

The DSBGA package requires specific mounting techniques which are detailed in TI's AN-1112 Application

Report (SNVA009).

Product Folder Links: LP3999

LP3999

SNVS207E –JUNE 2003–REVISED MAY 2013

www.ti.com

Referring to the section Surface Mount Assembly Considerations, it should be noted that the pad style which

must be used with the 5 pin package is NSMD (non-solder mask defined) type.

For best results during assembly, alignment ordinals on the PC board may be used to facilitate placement of the

DSBGA device.

DSBGA LIGHT SENSITIVITY

Exposing the DSBGA device to direct sunlight will cause incorrect operation of the device. Light sources such as

halogen lamps can affect electrical performance if they are situated in proximity to the device.

Light with wavelengths in the red and infra-red part of the spectrum have the most detrimental effect thus the

fluorescent lighting used inside most buildings has very little effect on performance. Tests carried out on a

DSBGA test board showed a negligible effect on the regulated output voltage when brought within 1 cm of a

fluorescent lamp. A deviation of less than 0.1% from nominal output voltage was observed.

Product Folder Links: LP3999

LP3999

www.ti.com

SNVS207E –JUNE 2003–REVISED MAY 2013

REVISION HISTORY

Changes from Revision D (May 2013) to Revision E Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 12

Product Folder Links: LP3999

PACKAGE OPTION ADDENDUM

www.ti.com 8-Oct-2015

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LP3999ITL-1.8/NOPB ACTIVE DSBGA YZR 5 250 Green (RoHS

& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 9

LP3999ITL-2.4/NOPB ACTIVE DSBGA YZR 5 250 Green (RoHS

& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 9

LP3999ITL-2.5/NOPB ACTIVE DSBGA YZR 5 250 Green (RoHS

& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 9

LP3999ITL-3.3/NOPB ACTIVE DSBGA YZR 5 250 Green (RoHS

& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 9

LP3999ITLX-1.8/NOPB ACTIVE DSBGA YZR 5 3000 Green (RoHS

& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 9

LP3999ITLX-2.5/NOPB ACTIVE DSBGA YZR 5 3000 Green (RoHS

& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 9

LP3999ITLX-2.8/NOPB ACTIVE DSBGA YZR 5 3000 Green (RoHS

& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 9

LP3999ITLX-3.3/NOPB ACTIVE DSBGA YZR 5 3000 Green (RoHS

& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 9

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

PACKAGE OPTION ADDENDUM

www.ti.com 8-Oct-2015

Addendum-Page 2

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LP3999ITL-1.8/NOPB DSBGA YZR 5 250 178.0 8.4 1.09 1.55 0.76 4.0 8.0 Q1

LP3999ITL-2.4/NOPB DSBGA YZR 5 250 178.0 8.4 1.09 1.55 0.76 4.0 8.0 Q1

LP3999ITL-2.5/NOPB DSBGA YZR 5 250 178.0 8.4 1.09 1.55 0.76 4.0 8.0 Q1

LP3999ITL-3.3/NOPB DSBGA YZR 5 250 178.0 8.4 1.09 1.55 0.76 4.0 8.0 Q1

LP3999ITLX-1.8/NOPB DSBGA YZR 5 3000 178.0 8.4 1.09 1.55 0.76 4.0 8.0 Q1

LP3999ITLX-2.5/NOPB DSBGA YZR 5 3000 178.0 8.4 1.09 1.55 0.76 4.0 8.0 Q1

LP3999ITLX-2.8/NOPB DSBGA YZR 5 3000 178.0 8.4 1.09 1.55 0.76 4.0 8.0 Q1

LP3999ITLX-3.3/NOPB DSBGA YZR 5 3000 178.0 8.4 1.09 1.55 0.76 4.0 8.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 2-Sep-2015

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LP3999ITL-1.8/NOPB DSBGA YZR 5 250 210.0 185.0 35.0

LP3999ITL-2.4/NOPB DSBGA YZR 5 250 210.0 185.0 35.0

LP3999ITL-2.5/NOPB DSBGA YZR 5 250 210.0 185.0 35.0

LP3999ITL-3.3/NOPB DSBGA YZR 5 250 210.0 185.0 35.0

LP3999ITLX-1.8/NOPB DSBGA YZR 5 3000 210.0 185.0 35.0

LP3999ITLX-2.5/NOPB DSBGA YZR 5 3000 210.0 185.0 35.0

LP3999ITLX-2.8/NOPB DSBGA YZR 5 3000 210.0 185.0 35.0

LP3999ITLX-3.3/NOPB DSBGA YZR 5 3000 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 2-Sep-2015

Pack Materials-Page 2

MECHANICAL DATA

YZR0005xxx

www.ti.com

TLA05XXX (Rev C)

0.600±0.075

NOTES:

. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.

B. This drawing is subject to change without notice.

4215043/A 12/12

D: Max =

E: Max =

1.502 mm, Min =

1.045 mm, Min =

1.441 mm

0.984 mm

IMPORTANT NOTICE

Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its

semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers

should obtain the latest relevant information before placing orders and should verify that such information is current and complete.

TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated

circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and

services.

Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is

accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced

documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements

different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the

associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers

remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have

full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products

used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with

respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous

consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and

take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will

thoroughly test such applications and the functionality of such TI products as used in such applications.

TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,

including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to

assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any

way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource

solely for this purpose and subject to the terms of this Notice.

TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI

products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,

enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically

described in the published documentation for a particular TI Resource.

Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that

include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE

TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY

RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information

regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or

endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR

REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO

ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF

MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL

PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,

INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF

PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,

DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN

CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN

ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949

and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.

Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such

products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards

and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must

ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in

life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.

Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life

support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all

medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.

TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).

Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications

and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory

requirements in connection with such selection.

Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-

compliance with the terms and provisions of this Notice.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Texas Instruments:

LP3999ITL-1.5/NOPB LP3999ITL-1.8/NOPB LP3999ITL-1875/NOPB LP3999ITL-2.4/NOPB LP3999ITL-2.5/NOPB

LP3999ITL-2.8/NOPB LP3999ITL-3.3/NOPB LP3999ITLX-1.5/NOPB LP3999ITLX-1.8/NOPB LP3999ITLX-

1875/NOPB LP3999ITLX-2.4/NOPB LP3999ITLX-2.5/NOPB LP3999ITLX-2.8/NOPB LP3999ITLX-3.3/NOPB