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TechnischeInformation/TechnicalInformation
DF1000R17IE4
IGBT-Module
IGBT-modules
preparedby:RH
approvedby:MS
dateofpublication:2013-11-05
revision:2.2
VorläufigeDaten
PreliminaryData
IGBT,Brems-Chopper/IGBT,Brake-Chopper
HöchstzulässigeWerte/MaximumRatedValues
Kollektor-Emitter-Sperrspannung
Collector-emittervoltage Tvj = 25°C VCES 1700 V
Kollektor-Dauergleichstrom
ContinuousDCcollectorcurrent TC = 100°C, Tvj max = 175°C
TC = 25°C, Tvj max = 175°C
IC nom
IC1000
1390 A
A
PeriodischerKollektor-Spitzenstrom
Repetitivepeakcollectorcurrent tP = 1 ms ICRM 2000 A
Gesamt-Verlustleistung
Totalpowerdissipation TC = 25°C, Tvj max = 175°C Ptot 6,25 kW
Gate-Emitter-Spitzenspannung
Gate-emitterpeakvoltage VGES +/-20 V
CharakteristischeWerte/CharacteristicValues min. typ. max.
Kollektor-Emitter-Sättigungsspannung
Collector-emittersaturationvoltage IC = 1000 A, VGE = 15 V
IC = 1000 A, VGE = 15 V
IC = 1000 A, VGE = 15 V
VCE sat
2,00
2,35
2,45
2,45
2,80
V
V
V
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Gate-Schwellenspannung
Gatethresholdvoltage IC = 36,0 mA, VCE = VGE, Tvj = 25°C VGEth 5,2 5,8 6,4 V
Gateladung
Gatecharge VGE = -15 V ... +15 V QG10,0 µC
InternerGatewiderstand
Internalgateresistor Tvj = 25°C RGint 1,5 Ω
Eingangskapazität
Inputcapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cies 81,0 nF
Rückwirkungskapazität
Reversetransfercapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cres 2,60 nF
Kollektor-Emitter-Reststrom
Collector-emittercut-offcurrent VCE = 1700 V, VGE = 0 V, Tvj = 25°C ICES 5,0 mA
Gate-Emitter-Reststrom
Gate-emitterleakagecurrent VCE = 0 V, VGE = 20 V, Tvj = 25°C IGES 400 nA
Einschaltverzögerungszeit,induktiveLast
Turn-ondelaytime,inductiveload IC = 1000 A, VCE = 900 V
VGE = ±15 V
RGon = 1,2 Ω
td on
0,55
0,60
0,60
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Anstiegszeit,induktiveLast
Risetime,inductiveload IC = 1000 A, VCE = 900 V
VGE = ±15 V
RGon = 1,2 Ω
tr
0,10
0,12
0,12
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Abschaltverzögerungszeit,induktiveLast
Turn-offdelaytime,inductiveload IC = 1000 A, VCE = 900 V
VGE = ±15 V
RGoff = 1,8 Ω
td off
1,00
1,25
1,30
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Fallzeit,induktiveLast
Falltime,inductiveload IC = 1000 A, VCE = 900 V
VGE = ±15 V
RGoff = 1,8 Ω
tf
0,29
0,50
0,59
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
EinschaltverlustenergieproPuls
Turn-onenergylossperpulse IC = 1000 A, VCE = 900 V, LS = 30 nH
VGE = ±15 V, di/dt = 8000 A/µs (Tvj = 150°C)
RGon = 1,2 ΩEon 265
390
415
mJ
mJ
mJ
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
AbschaltverlustenergieproPuls
Turn-offenergylossperpulse IC = 1000 A, VCE = 900 V, LS = 30 nH
VGE = ±15 V, du/dt = 3000 V/µs (Tvj = 150°C)
RGoff = 1,8 ΩEoff 200
295
330
mJ
mJ
mJ
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Kurzschlußverhalten
SCdata VGE ≤ 15 V, VCC = 1000 V
VCEmax = VCES -LsCE ·di/dt ISC
4000
A
Tvj = 150°C
tP ≤ 10 µs,
Wärmewiderstand,ChipbisGehäuse
Thermalresistance,junctiontocase proIGBT/perIGBT RthJC 24,0 K/kW
Wärmewiderstand,GehäusebisKühlkörper
Thermalresistance,casetoheatsink proIGBT/perIGBT
λPaste=1W/(m·K)/λgrease=1W/(m·K) RthCH 9,00 K/kW
TemperaturimSchaltbetrieb
Temperatureunderswitchingconditions Tvj op -40 150 °C