HCC/HCF4049UB
HCC/HCF4050B
HEX BUFFER/CONVERTERS
DESCRIPTION
.HIGH SINK CURRENT FOR DRIVING 2 TTL
LOADS
.HIGH-TO-LOWLEVELLOGIC CONVERSION
.QUIESCENT CURRENT SPECIFIED TO 20V
FOR HCC DEVICE
.HIGH ”SINK” AND ”SOURCE” CURRENT CA-
PABILITY
.5V, 10V AND 15VPARAMETRIC RATINGS
.INPUT CURRENTOF100nAAT18VAND 25°C
FOR HCC DEVICE
.100% TESTEDFOR QUIESCENT CURRENT
.MEETSALLREQUIREMENTSOFJEDECTEN-
TATIVE STANDARD No. 13A, ”STANDARD
SPECIFICATIONS FOR DESCRIPTION OF ”B”
SERIESCMOS DEVICES”
June 1989
The HCC4049UB/4050B (extended temperature
range) and the HCF4049UB/4050B (intermediate
temperature range) are monolithic integrated cir-
cuits available in 16-lead dual in-line plastic or ce-
ramic package and plastic micro package.
The HCC/HCF4049UB/4050B are inverting and
non-inverting hex buffers, respectively, and feature
logic-level conversion usingonlyonesupply voltage
(VDD). The input-signal high level (VIH) can exceed
theVDD supplyvoltage whenthesedevicesareused
for logic level conversions. These devices are in-
tendedfor use asCOS/MOStoDTL/TTLconverters
and candrivedirectly twoDTL/TTLloads (VDD =5V,
VOL ≤0.4V, andIOL ≥ 3.2mA).
EY
(Plastic Package) F
(Ceramic Frit SealPackage)
M1
(Micro Package)
ORDERCODES :
HCC40XXBF HCF40XXBM1
HCF40XXBEY HCF40XXBC1
PIN CONNECTIONS
4049UB INVERTING TYPE
4050B NON-INVERTING TYPE
4049UB
4050B
C1
(Plastic Chip Carrier)
1/12