PMEG4010ETP,115 - NXP Semiconductors

1. Product profile

1.1 General description

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an

integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead

Surface-Mounted Device (SMD) plastic package.

1.2 Features and benefits

Average forward current: IF(AV) ≤ 1 A

Reverse voltage: VR ≤ 40 V

Low forward voltage

High power capability due to

clip-bonding technology

Small and flat lead SMD plastic

package

AEC-Q101 qualified

High temperature Tj ≤ 175 °C

1.3 Applications

Low voltage rectification

High efficiency DC-to-DC conve rs i on

Switch mode power supply

Reverse polarity protection

Low power consumption applications

High temperature applications

1.4 Quick reference data

[1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.

PMEG4010ETP

40 V, 1 A low VF MEGA Schottky barrier rectifier

Rev. 1 — 5 October 2011 Product data sheet

SOD128

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

IF(AV) average forward

current square wave; δ= 0.5; f = 20 kHz;

Tamb ≤145 °C [1] --1A

square wave; δ= 0.5; f = 20 kHz;

Tsp ≤165 °C --1A

VRreverse voltage Tj=25°C --40V

VFforward voltage IF=1A; T

j= 25 °C - 430 490 mV

IRreverse current VR=40V; T

j= 25 °C - 10 50 µA

Product data sheet Rev. 1 — 5 October 2011 2 of 14

NXP Semiconductors PMEG4010ETP

40 V, 1 A low VF MEGA Schottky barrier rectifier

2. Pinning information

[1] The marking bar indicates the cathode.

3. Ordering information

4. Marking

Table 2. Pinning information

Pin Symbol Description Simplified outline Graphi c sy mbol

1 K cathode[1]

SOD128

2 A anode

sym001

Table 3. Ordering information

Type number Package

Name Description Version

PMEG4010ETP - plastic surface-mounted package; 2 leads SOD128

Table 4. Marking codes

Type number Marking code

PMEG4010ETP C1

Product data sheet Rev. 1 — 5 October 2011 3 of 14

NXP Semiconductors PMEG4010ETP

40 V, 1 A low VF MEGA Schottky barrier rectifier

5. Limiting values

[1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[3] Reflow soldering is the only recommended soldering method.

[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

6. Thermal characteristics

[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a

significant part of the total power losses.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[3] Reflow soldering is the only recommended soldering method.

[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

[5] Device mounted on a ceramic PCB, Al2O3, standard footprint.

[6] Soldering point of cathode tab.

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VRreverse voltage Tj=25°C - 40 V

IF(AV) average forward cur rent square w ave; δ= 0.5; f = 20 kHz;

Tamb ≤145 °C [1] -1A

square wave; δ= 0.5; f = 20 kHz;

Tsp ≤165 °C -1A

IFSM non-repetitive peak forward

current square wave; tp=8ms; T

j(init) =25°C - 50 A

Ptot total power dissipation Tamb ≤25 °C [2][3] - 750 mW

[4][3] - 1250 mW

[1][3] - 2500 mW

Tjjunction temperature - 175 °C

Tamb ambient temperature -55 175 °C

Tstg storage temperature -65 175 °C

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistance

from junction to

ambient

in free air [1][2][3] - - 200 K/W

[1][4][3] - - 120 K/W

[1][5][3] --60K/W

Rth(j-sp) thermal resistance

from junction to solder

point

[6] --12K/W

Product data sheet Rev. 1 — 5 October 2011 4 of 14

NXP Semiconductors PMEG4010ETP

40 V, 1 A low VF MEGA Schottky barrier rectifier

FR4 PCB, standard footprint

Fig 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

FR4 PCB, mounting pad for cathode 1 cm2

Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

006aab374

th(j-a)

(K/W)

−1

(s)

−3

10110

−2

−1

duty cycle =

10.75

0.5 0.33

0.25 0.2

0.1 0.05

0.02 0.01

006aab375

th(j-a)

(K/W)

−1

(s)

−3

10110

−2

−1

duty cycle =

10.75

0.5 0.33

0.25 0.2

0.1 0.05

0.02 0.01

Product data sheet Rev. 1 — 5 October 2011 5 of 14

NXP Semiconductors PMEG4010ETP

40 V, 1 A low VF MEGA Schottky barrier rectifier

7. Characteristics

Ceramic PCB, Al2O3, standard footprint

Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

006aab376

th(j-a)

(K/W)

−1

(s)

−3

10110

−2

−1

duty cycle =

10.75

0.5 0.33

0.25 0.2

0.1 0.05

0.02 0.01

Table 7. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

VFforward voltage IF= 0.1 A; Tj= 25 °C - 310 360 mV

IF=1A; T

j= 25 °C - 430 490 mV

IF=1A; T

j= 125 °C - 330 380 mV

IRreverse current VR=10V; T

j=25°C - 3 13 µA

VR=40V; T

j= 25 °C - 10 50 µA

VR=10V; T

j=125°C -2-mA

VR=40V; T

j=125°C -6-mA

Cddiode capacitance VR= 1 V; f = 1 MHz; Tj= 25 °C - 130 - pF

VR=10V; f=1MHz; T

j=25°C - 50 - pF

Product data sheet Rev. 1 — 5 October 2011 6 of 14

NXP Semiconductors PMEG4010ETP

40 V, 1 A low VF MEGA Schottky barrier rectifier

(1) Tj = 175 °C

(2) Tj = 150 °C

(3) Tj = 125 °C

(4) Tj = 85 °C

(5) Tj = 25 °C

(6) Tj = −40 °C

(1) Tj = 150 °C

(2) Tj = 125 °C

(3) Tj = 85 °C

(4) Tj = 25 °C

(5) Tj = −40 °C

Fig 4. Forward current as a function of forward

voltage; typical values Fig 5. Reverse current as a fu nction of reverse

voltage; typical values

f = 1 MHz; Tamb = 25 °C Tj = 175 °C

(1) δ = 0.1

(2) δ = 0.2

(3) δ = 0.5

(4) δ = 1.0

Fig 6. Diod e capacitance as a function of reverse

voltage; typical values Fig 7. Average forward power dissipation as a

function of average forward current; typical

values

006aac717

10–2

10–3

10–1

(A)

10–4

VF (V)

0.0 1.00.80.4 0.60.2

(1)

(2)

(3)

(4) (6)(5)

006aac718

10–7

10–5

10–3

10–1

10–8

10–6

10–4

10–2

(A)

10–9

VR (V)

0403010 20

(1)

(2)

(3)

(4)

(5)

VR (V)

0403010 20

006aab379

100

150

200

250

(pF)

006aac719

IF(AV) (A)

0.0 1.51.00.5

0.2

0.3

0.1

0.4

0.5

PF(AV)

(W)

0.0

(1)

(2)

(3) (4)

Product data sheet Rev. 1 — 5 October 2011 7 of 14

NXP Semiconductors PMEG4010ETP

40 V, 1 A low VF MEGA Schottky barrier rectifier

Tj = 150 °C

(1) δ = 1.0

(2) δ = 0.9

(3) δ = 0.8

(4) δ = 0.5

FR4 PCB, standard footprint

Tj = 175 °C

(1) δ = 1.0 (DC)

(2) δ = 0.5; f = 20 kHz

(3) δ = 0.2; f = 20 kHz

(4) δ = 0.1; f = 20 kHz

Fig 8. Average reverse power dissipation as a

function of reverse voltage; typical values Fig 9. Average forward current as a fun ction of

ambient temperature; typical values

FR4 PCB, mounting pad for cathode 1 cm2

Tj = 175 °C

(1) δ = 1.0

(2) δ = 0.9

(3) δ = 0.8

(4) δ = 0.5

Ceramic PCB, Al2O3, standard footprint

Tj = 175 °C

(1) δ = 1.0 (DC)

(2) δ = 0.5; f = 20 kHz

(3) δ = 0.2; f = 20 kHz

(4) δ = 0.1; f = 20 kHz

Fig 10. Average forward current as a function of

ambient temperature; typical values Fig 11. Average forward current as a function of

ambient temperature; typical values

VR (V)

0403010 20

006aac720

0.50

0.75

0.25

1.00

1.25

PR(AV)

(W)

0.00

(1)

(2)

(3)

(4)

Tamb (°C)

0 20015050 100

006aac721

0.8

0.4

1.2

1.6

IF(AV)

(A)

0.0

(1)

(2)

(3)

(4)

Tamb (°C)

0 20015050 100

006aac722

0.8

0.4

1.2

1.6

IF(AV)

(A)

0.0

(1)

(2)

(3)

(4)

Tamb (°C)

0 20015050 100

006aac723

0.8

0.4

1.2

1.6

IF(AV)

(A)

0.0

(1)

(2)

(3)

(4)

Product data sheet Rev. 1 — 5 October 2011 8 of 14

NXP Semiconductors PMEG4010ETP

40 V, 1 A low VF MEGA Schottky barrier rectifier

Tj = 175 °C

(1) δ = 1.0

(2) δ = 0.9

(3) δ = 0.8

(4) δ = 0.5

Fig 12. Average forward current as a function of solder point temperature; typical values

Tsp (°C)

0 20015050 100

006aac724

0.8

0.4

1.2

1.6

IF(AV)

(A)

0.0

(1)

(2)

(3)

(4)

Product data sheet Rev. 1 — 5 October 2011 9 of 14

NXP Semiconductors PMEG4010ETP

40 V, 1 A low VF MEGA Schottky barrier rectifier

8. Test information

The current ratings for the typical waveform s as show n in figu r es 9, 10, 11 and 12 are

calculated acco rd in g to the eq u atio n s: I F(AV) = IM × δ with IM defined as peak current,

IRMS = IF(AV) at DC, and IRMS = IM × √δ with IRMS defined as RMS current.

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q101 - Stress test qualif ication for discrete semiconductors, and is

suitable for use in automotive applications.

9. Package outline

Fig 13. Duty cycle definition

tcy

006aac658

duty cycle δ =

tcy

Fig 14. Package outline SOD128

07-09-12Dimensions in mm

1.1

0.9

0.22

0.10

0.6

0.3

5.0

4.4 4.0

3.6

1.9

1.6

2.7

2.3

Product data sheet Rev. 1 — 5 October 2011 10 of 14

NXP Semiconductors PMEG4010ETP

40 V, 1 A low VF MEGA Schottky barrier rectifier

10. Packing information

[1] For further information and the availability of packing methods, see 14 “Contact information”.

11. Soldering

Table 8. Ordering information

The indicated -xxx are the last three digits of the 12NC ordering code. [1]

Type number Package Description Packing quantity

3000

PMEG4010ETP SOD128 4 mm pitch, 12 mm tape and reel -115

Reflow soldering is the onl y recommended soldering method.

Fig 15. Reflow soldering footprint for SOD128

solder lands

solder resist

occupied area

solder paste

2.53.4 2.1

(2×)

1.9

(2×)

4.4

4.2

6.2

1.2

(2×)

1.4

(2×)sod128_fr

Dimensions in mm

Product data sheet Rev. 1 — 5 October 2011 11 of 14

NXP Semiconductors PMEG4010ETP

40 V, 1 A low VF MEGA Schottky barrier rectifier

12. Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PMEG4010ETP v.1 20111005 Product data sheet - -

Product data sheet Rev. 1 — 5 October 2011 12 of 14

NXP Semiconductors PMEG4010ETP

40 V, 1 A low VF MEGA Schottky barrier rectifier

13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The p r oduct status of device(s) described in this do cument may have changed since this document was published and may differ in case of multiple devices. The latest product

status information is available on the Internet at URL http://www.nxp.com.

13.2 Definitions

Preview — The document is a preview version only. The document is still

subject to formal approval, which may result in modificati ons or additions.

NXP Semiconductors does not give any representations or warranties as to

the accuracy or completeness of informati on included herein and shall have

no liability for the consequences of use of such info rmation.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full da ta sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

13.3 Disclaimers

Limited warranty and liability — Information in this d ocument is be lieved to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulat ive liability t owards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersed es an d r eplaces all inf ormation supplied pri or

to the publication hereof.

Suitability for use — NXP Semiconductors product s are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reaso nably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Char acteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the applicatio n or use by custo mer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Document status [1] [2] Product status [3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [shor t] data sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 1 — 5 October 2011 13 of 14

NXP Semiconductors PMEG4010ETP

40 V, 1 A low VF MEGA Schottky barrier rectifier

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document ma y be interpret ed or

construed as an of fer to sell product s that is op en for accept ance or the grant ,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) d escribed herein may

be subject to export control regulat i ons. Export might require a prior

authorization fro m national authorities.

13.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,

FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,

ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,

QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,

TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.

HD Radio and HD Radio logo — are trademarks of iBiquity Digital

Corporation.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors PMEG4010ETP

40 V, 1 A low VF MEGA Schottky barrier rectifier

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 5 October 2011

Document identifier: PMEG4010ETP

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

15. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.1 General description . . . . . . . . . . . . . . . . . . . . . .1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . .3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .5

8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . .9

8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . .9

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9

10 Packing information . . . . . . . . . . . . . . . . . . . . .10

11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .11

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . .12

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12

13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .12

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13

14 Contact information. . . . . . . . . . . . . . . . . . . . . .13

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

NXP:

PMEG4010ETP,115