2SK3399 TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (-MOSV) 2SK3399 Switching Regulator Applications Unit: mm * Low drain-source ON resistance: RDS (ON) = 0.54 (typ.) * High forward transfer admittance: |Yfs| = 5.2 S (typ.) * Low leakage current: IDSS = 100 A (max) (VDS = 600 V) * Enhancement mode: Vth = 3.0 to 5.0 V (VDS = 10 V, ID = 1 mA) Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Drain-source voltage VDSS 600 V Drain-gate voltage (RGS = 20 k) VDGR 600 V Gate-source voltage VGSS 30 V DC (Note 1) ID 10 Pulse (Note 1) IDP 40 Drain power dissipation (Tc = 25C) PD 100 W Single pulse avalanche energy (Note 2) EAS 363 mJ Avalanche current IAR 10 A Repetitive avalanche energy (Note 3) EAR 10 mJ Channel temperature Tch 150 C Storage temperature range Tstg -55 to 150 C Drain current A JEDEC JEITA TOSHIBA 2-10S1B Weight: 1.5 g (typ.) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Thermal Characteristics Characteristics Symbol Max Unit Thermal resistance, channel to case Rth (ch-c) 1.25 C/W Thermal resistance, channel to ambient Rth (ch-a) 83.3 C/W Note 1: Ensure that the channel temperature does not exceed 150C. Note 2: VDD = 90 V, Tch = 25C (initial), L = 6.36 mH, RG = 25 , IAR = 10 A JEDEC JEITA TOSHIBA 2-10S1B Weight: 1.5 g (typ.) Note 3: Repetitive rating: pulse width limited by maximum channel temperature This transistor is an electrostatic-sensitive device. Please handle with caution. 1 2009-09-29 2SK3399 Electrical Characteristics (Ta = 25C) Characteristics Symbol Typ. Max Unit VGS = 25 V, VDS = 0 V 10 A V(BR) GSS IG = 10 A, VDS = 0 V 30 V IDSS VDS = 600 V, VGS = 0 V 100 A Drain cut-off current Drain-source breakdown voltage Min IGSS Gate leakage current Gate-source breakdown voltage Test Condition V (BR) DSS ID = 10 mA, VGS = 0 V 600 V Vth VDS = 10 V, ID = 1 mA 3.0 5.0 V Gate threshold voltage Drain-source ON resistance RDS (ON) VGS = 10 V, ID = 5 A 0.54 0.75 Forward transfer admittance Yfs VDS = 10 V, ID = 5 A 2.0 5.2 S Input capacitance Ciss 1750 Reverse transfer capacitance Crss 11 Output capacitance Coss 170 15 40 Rise time VDS = 25 V, VGS = 0 V, f = 1 MHz tr ton Switching time Fall time VOUT 0V RL = 40 10 Turn-on time ID = 5 A 10 V VGS tf Turn-off time VIN: tr, tf < 5 ns Duty < = 1%, tw = 10 s toff Total gate charge (Gate-source plus gate-drain) Qg Gate-source charge Qgs Gate-drain ("Miller") charge Qgd pF ns 8 35 35 15 20 VDD - 200 V VDD - 400 V, VGS = 10 V, ID = 10 A nC Source-Drain Ratings and Characteristics (Ta = 25C) Characteristics Symbol Test Condition Min Typ. Max Unit Continuous drain reverse current (Note 1) IDR 10 A Pulse drain reverse current IDRP 40 A (Note 1) Forward voltage (diode) VDSF IDR = 10 A, VGS = 0 V -1.7 V Reverse recovery time trr IDR = 10 A, VGS = 0 V, 1300 ns Reverse recovery charge Qrr dIDR/dt = 100 A/s 16 C Marking K3399 Note 4: A line under a Lot No. identifies the indication of product Labels. Not underlined: [[Pb]]/INCLUDES > MCV Underlined: [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]] Part No. (or abbreviation code) Lot No. Note 4 Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 2 2009-09-29 2SK3399 ID - VDS ID - VDS 20 Common source Tc = 25C Pulse test 15 15 10 8 7.25 Drain current ID (A) 8 7 6 6. 75 4 6. 5 5.25 6 2 Common source Tc = 25C Pulse test 10 16 Drain current ID (A) 10 8.0 7.75 12 7.5 7.25 8 7.0 6.5 4 VGS = 6.0 V VGS = 5.5V 0 0 2 4 6 Drain-source voltage 8 0 0 10 10 VDS (V) 20 Drain-source voltage VDS (V) Common source Common source VDS = 20 V VDS = 20 V Pulse test 12 8 25 4 100 0 0 2 Tc = -55C 4 6 Gate-source voltage 8 5 2 25 0.3 3 4 12 8 16 20 VGS (V) 10 30 1 Drain current ID (A) VGS = 10 V 15 V 0.1 1 100 Common source Tc = 25C Pulse test Tc = -55C 1 2.5 RDS (ON) - ID Drain-source ON resistance RDS (ON) () (S) Forward transfer admittance Yfs 4 5 100 0.3 ID = 10 A 6 Gate-source voltage 1 0.1 0.1 8 VGS (V) Yfs - ID 3 Common source Tc = 25C Pulse test 0 0 10 30 Common source VDS = 20 V 10 Pulse test 50 VDS (V) 10 Drain-source voltage Drain current ID (A) 16 40 VDS - VGS ID - VGS 20 30 10 100 Drain current ID (A) 3 2009-09-29 2SK3399 RDS (ON) - Tc IDR - VDS 100 Common source VGS = 10 V Pulse test Common source (A) Tc = 25C 2.0 1.5 Drain reverse current IDR Drain-source ON resistance RDS (ON) () 2.5 5.0 ID = 10 A 2.5 1.0 0.5 Pulse test 10 1 10 3 5 0 -80 -40 0 40 80 Case temperature Tc 120 0.1 0 160 (C) -0.4 -0.2 Capacitance - VDS 100 Vth (V) Gate threshold voltage (pF) Capacitance C 300 Coss Common source VGS = 0 V f = 1 MHz Crss Tc = 25C 0.3 1 3 10 30 Drain-source voltage -1.2 -1 VDS (V) Vth - Tc 1000 3 0.1 -0.8 6 Ciss 10 -0.6 Drain-source voltage 5000 30 VGS = 0, -1 V 1 100 5 4 3 2 1 0 -80 500 Common source VDS = 10 V ID = 1 mA Pulse test VDS (V) -40 0 40 80 Case temperature Tc 120 160 (C) Dynamic input/output characteristics PD - Tc 160 25 500 80 40 0 0 40 80 120 Case temperature Tc 160 (C) Tc = 25C 20 Pulse test 15 300 VDD = 400 V 10 200 200 VGS 100 5 100 0 0 200 ID = 10 A VDS 10 20 30 40 VGS (V) 400 Gate-source voltage VDS (V) 120 Drain-source voltage Drain power dissipation PD (W) Common source 0 50 Total gate charge Qg (nC) 4 2009-09-29 2SK3399 rth - tw 10 5 Normalized transient thermal impedance rth (t)/Rth (ch-c) 3 1 0.5 Duty = 0.5 0.3 0.2 0.1 0.1 0.05 0.05 0.02 0.03 0.01 Single pulse PDM 0.01 t 0.005 T 0.003 Duty = t/T Rth (ch-c) = 1.25C/W 0.001 10 100 1m 10 m Pulse width 100 m tw 1 (s) EAS - Tch Safe operating area 400 100 ID max (pulse) * Avalanche energy EAS (mJ) 50 30 100 s * ID max (continuous) 1 ms * (A) 10 Drain current ID 10 5 3 DC operation Tc = 25C 1 0.5 300 200 100 0.3 0 25 0.1 0.05 0.03 75 100 125 150 Channel temperature (initial) Tch (C) * Single nonrepetitive pulse Tc = 25C Curves must be derated linearly with increase in VDSS max 15 V temperature. 0.01 1 50 3 10 30 Drain-source voltage 100 300 1000 BVDSS IAR -15 V VDS (V) VDS VDD Test circuit RG = 25 VDD = 90 V, L = 6.36 mH 5 Wave form AS = 1 B VDSS L I2 B 2 - V VDSS DD 2009-09-29 2SK3399 RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. * Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact ("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. * Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. * Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. * The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. * ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. * Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 6 2009-09-29