BD6381EFV-E2 - Rohm Semiconductor

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www.rohm.com 2012.02 - Rev.

Stepping Motor Drivers

Low Voltage

Stepping Motor Drivers

BD6380EFV, BD6381EFV

●Description

This series can drive the bipolar stepping motor used for paper feed carriages. It is a low power consumption bipolar PWM

constant current-drive driver. It is suitable for the mobile devices of a battery drive by power save function. It contributes

also to reduction of mounting area by ultra-thin and high heat-radiation (exposed metal type) HTSSOP package.

●Feature

1) Low ON resistance DMOS output

2) PWM constant current control (self oscillation)

3) Built-in spike noise cancel function (external noise filter is unnecessary)

4) Power save function

5) Built-in logic input pull-down resistor

6) Power-on reset function

7) Thermal shutdown circuit (TSD)

8) Over current protection circuit (OCP)

9) Under voltage lock out circuit (UVLO)

10) Malfunction prevention at the time of no applied power supply (Ghost Supply Prevention)

11) Electrostatic discharge: 4kV (HBM specification)

12) Adjacent pins short protection

13) Microminiature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP package

●Application

Mini printer, Handy printer, Monitoring camera, WEB camera, Scanner, Toy, and Robot etc.

●Absolute maximum ratings(Ta=25℃)

Item Symbol BD6380EFV BD6381EFV Unit

Supply voltage VCC VCC -0.2～+7.0 -0.2～+7.0 V

Supply voltage VM VM -0.2～+15.0 -0.2～+15.0 V

Power dissipation Pd 1.1※1 1.1※1 W

4.0※2 4.0※2 W

Input voltage for control pin VIN -0.2～(VCC +0.3) -0.2～(VCC +0.3) V

RNF maximum voltage VRNF 0.5 0.5 V

Maximum output current IOUT 0.8※3 1.2※3 A/ch

Operating temperature range Topr -25～+75 -25～+75 ℃

Storage temperature range Tstg -55～+150 -55～+150 ℃

Junction temperature Tjmax 150 150 ℃

※1 70mm×70mm×1.6mm glass epoxy board. Derating in done at 8.8mW/℃ for operating above Ta=25℃.

※2 4-layer recommended board. Derating in done at 32.0mW/℃ for operating above Ta=25℃.

※3 Do not exceed Pd, ASO and Tjmax=150℃.

No.12009EAT01

Technical Note

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BD6380EFV/BD6381EFV

www.rohm.com 2012.02 - Rev.

●Operating conditions (Ta=-25～+75℃)

Item Symbol BD6380EFV BD6381EFV Unit

Supply voltage VCC VCC 2.5～5.5 2.5～5.5 V

Supply voltage VM VM 4.0～13.5 6.0～13.5 V

Input voltage for control pin VIN 0～VCC 0～VCC V

Output current (DC) IOUT 0.5※4 0.8※4 A/ch

※4 Do not exceed Pd, ASO

●Electrical characteristics

Applicable to BD6380EFV,BD6381EFV(Unless otherwise specified Ta=25℃, VCC=3.3V, VM=6.0V)

Item Symbol

Limit Unit Conditions

Min. Typ. Max.

Whole

VCC current at standby ICCST - 0 10 μA PS=L

VCC current ICC - 1.6 3.0 mA PS=H, VLIMX=0.5V

VM current at standby IVMST - 0 10 μA PS=L

VM current IVM - 0.08 0.50 mA PS=H, VLIMX=0.5V

Control input (PS, IN1A, IN1B, IN2A, IN2B)

H level input voltage VINH 2.0 - 3.3 V

L level input voltage VINL 0 - 0.8 V

H level input current IINH 15 30 60 μAV

IN =3V

L level input current IINL -10 0 - μAV

IN =0V

Output (OUT1A, OUT1B, OUT2A, OUT2B)

Output ON resistance

(BD6380EFV) RON - 1.2 1.5 Ω IOUT =±0.3A, VM=6V

Sum of upper and lower

Output ON resistance

(BD6381EFV) RON - 1.0 1.25 Ω IOUT =±0.6A, VM=7.2V

Sum of upper and lower

Output leak current ILEAK - - 10 μA

Current control

RNFX input current IRNF -40 -20 - μA RNFX=0V

SENSEX input current ISENSE -2.0 -0.1 - μA SENSEX=0V

VLIMX input current IVLIM -2.0 -0.1 - μAVLIMX=0V

VLIMX input voltage range VVLIM 0 - 0.5 V

Comparator offset voltage VOFS -10 - 10 mV

Noise cancel time tn 0.3 0.7 1.2 μs R=39kΩ, C=1000pF

VREF voltage VVREF 0.97 1.00 1.03 V IVREF=0~1mA

Technical Note

3/8

BD6380EFV/BD6381EFV

www.rohm.com 2012.02 - Rev.

●Terminal function･Block diagram･Application circuit diagram

1) BD6380EFV / BD6381EFV

No. Pin name Function Pin

No. Pin name Function

1 GND Ground terminal

13 RNF2

Connection terminal of resistor for

output current detection

2 PS Power save terminal

3 VLIM1 Output current limit setting terminal 14 OUT2B H bridge output terminal

4 SENSE1 Input terminal of current limit comp. 15 OUT2A H bridge output terminal

5 CR1

Connection terminal of CR for setting

PWM frequency

16 VM2 Power supply terminal for motor

17 NC Non connection

6 IN1A Logic input terminal 18 IN2B Logic input terminal

7 IN1B Logic input terminal 19 IN2A Logic input terminal

8 NC Non connection

20 CR2

Connection terminal of CR for setting

PWM frequency

9 VM1 Power supply terminal for motor

10 OUT1A H bridge output terminal 21 SENSE2 Input terminal of current limit comp.

11 OUT1B H bridge output terminal 22 VLIM2 Output current limit setting terminal

12 RNF1

Connection terminal of resistor for

output current detection 23 VREF Reference voltage output terminal

Fig.1 Block diagram & Application circuit diagram of BD6380EFV / BD6381EFV

Resistor for current. detecting.

Setting range is

0.1Ω～1.0Ω

Bypass capacitor.

Setting range is

10uF～470uF(electrolytic)

0.01uF～0.1uF

(multilayer ceramic etc.)

Set the PWM

frequency.

Setting range is

C:470pF～4700pF

R:10kΩ～100kΩ

VM1

VLIM2

CR2

VCC

IN1

IN1B

CR1

IN2

IN2B

VLIM1

OUT1B

SENSE1

RNF1

VM2

SENSE2

OUT2B

RNF2

39kΩ 1000pF

0.3Ω

Predriver

Current Limit Comp.

Timer

Current Limit Comp.

Timer Predriver

TSD

UVLO

GND

47uF 0.1uF

Resistor for current. detecting.

Setting range is

0.1Ω～1.0Ω

4.7uF 0.1uF

Bypass capacitor.

Setting range is

4.7uF～47uF(electrolytic)

0.01uF～0.1uF(multilayer ceramic etc.)

VREF 23

PS 2

Logic

VREF

Set the PWM frequency.

Setting range is

C:470pF～4700pF

R:10kΩ～100kΩ

You can devide the

reference voltage by

external resistor, and use

it for output current limit

setting.

OCP

OUT2A

OUT1A

Technical Note

4/8

BD6380EFV/BD6381EFV

www.rohm.com 2012.02 - Rev.

●Points to notice for terminal description

○PS／Power save terminal

PS can make circuit standby state and make motor output OPEN. Please be careful because there is a delay of 40μ

s(max.) before it is returned from standby state to normal state and the motor output becomes ACTIVE at PS=L→H.

If you don't use power save mode, you may short PS terminal to VCC.

PS State

L Standby state (RESET)

H ACTIVE

○IN1A,IN1B,IN2A,IN2B／Logic input terminal

These pins decide output state.

Input Output

PS IN1A

IN2A

IN1B

IN2B

OUT1A

OUT2A

OUT1B

OUT2B

L X X OPEN OPEN Standby state (RESET)

H L L OPEN OPEN Standby

H H L H L Forward

H L H L H Reverse

H H H L L Brake

X: H or L

●Protection Circuits

○Thermal Shutdown (TSD)

This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises above

175℃ (typ.), the motor output becomes OPEN. Also, when the temperature returns to under 150℃ (typ.), it

automatically returns to normal operation. However, even when TSD is in operation, if heat is continued to be added

externally, heat overdrive can lead to destruction.

○Over current Protection (OCP)

This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are

shorted each other or VCC-output or motor output-GND is shorted. This circuit latches the motor output to OPEN

condition when the regulated threshold current flows for 4μs (typ.). It returns with VCC power reactivation or a reset of

the PS terminal. The over current protection circuit’s only aim is to prevent the destruction of the IC from irregular

situations such as motor output shorts, and is not meant to be used as protection or security for the set. Therefore, sets

should not be designed to take into account this circuit’s functions. After OCP operating, if irregular situations continues

and the return by power reactivation or a reset of the PS terminal is carried out repeatly, then OCP operates repeatly

and the IC may generate heat or otherwise deteriorate. When the L value of the wiring is great due to the wiring being

long, after the over current has flowed and the output terminal voltage jumps up and the absolute maximum values

may be exceeded and as a result, there is a possibility of destruction. Also, when current which is over the output

current rating and under the OCP detection current flows, the IC can heat up to over Tjmax=150℃ and can deteriorate,

so current which exceeds the output rating should not be applied.

○Under voltage lock out (UVLO)

This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply

under voltage. When the applied voltage to the VCC terminal goes under 1.95V (typ.), the motor output is set to OPEN.

This switching voltage has a 0.25V (typ.) hysteresis to prevent false operation by noise etc. Please be aware that this

circuit does not operate during power save mode.

○False operation prevention function in no power supply (Ghost Supply Prevention)

If a logic control signal is input when there is no power supplied to this IC, there is a function which prevents the false

operation by voltage supplied via the electrostatic destruction prevention diode from the logic control input terminal to

the VCC, to this IC or to another IC’s power supply. Therefore, there is no chance of malfunction of the circuit even

when voltage is supplied to the logic control input terminal while there is no power supply.

Technical Note

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BD6380EFV/BD6381EFV

www.rohm.com 2012.02 - Rev.

●Power dissipation

○HTSSOP-B24 Package

HTSSOP-B24 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. Also,

the back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing

power dissipation. The back metal is shorted with the back side of the IC chip, being a GND potential, therefore there is

a possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. Also, it is

recommended that the back metal is soldered onto the GND to short. Please note that it has been assumed that this

product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat

dissipation efficiency.

3.0

2.0

1.0

100 125

4.0W

Ambient Temperature : Ta[℃]

Power Dissipation : Pd[W]

4.0

Measurement machine：TH156（Kuwano Electric）

Measurement condition：ROHM board

Board size：70*70*1.6mm3

(With through holes on the board)

The exposed metal of the backside is connected to the board with

solder.

Board①：1-layer board(Copper foil on the back 0mm2)

Board②：2-layer board(Copper foil on the back 15*15mm2)

Board③：2-layer board(Copper foil on the back 70*70mm2)

Board④：4-layer board(Copper foil on the back 70*70mm2)

Board①：θja=113.6℃/W

Board②：θja =73.5℃/W

Board③：θja =44.6℃/W

Board④：θja =31.3℃/W

Fig.2 HTSSOP-B24 Derating curve

2.8W

1.7W

1.1W

Technical Note

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BD6380EFV/BD6381EFV

www.rohm.com 2012.02 - Rev.

●Usage Notes

(1) Absolute maximum ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can

break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If

any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,

such as fuses.

(2) Connecting the power supply connector backward

Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply

lines. An external direction diode can be added.

(3) Power supply Lines

Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,

separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals

to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the

circuit, not that capacitance characteristic values are reduced at low temperatures.

(4) GND Potential

The potential of GND pin must be minimum potential in all operating conditions.

(5) Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

Users should be aware that BD6380EFV and BD6381EFV have been designed to expose their frames at the back of the

package, and should be used with suitable heat dissipation treatment in this area to improve dissipation. As large a

dissipation pattern should be taken as possible, not only on the front of the baseboard but also on the back surface.

(6) Inter-pin shorts and mounting errors

When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper

attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be

caused by foreign matter entering between outputs or an output and the power supply or GND.

(7) Operation in a strong electric field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to

malfunction.

(8) ASO

When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.

(9) Thermal shutdown circuit

The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃, and higher,

coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal

operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect

peripheral equipment.

TSD ON Temperature [℃] (typ.) Hysteresis Temperature [℃] (typ.)

175 25

(10) Inspection of the application board

During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility

that it could cause stress to the IC, therefore an electrical discharge should be performed after each process. Also, as a

measure again electrostatic discharge, it should be earthed during the assembly process and special care should be

taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power

supply should first be turned off and then removed before the inspection.

Technical Note

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BD6380EFV/BD6381EFV

www.rohm.com 2012.02 - Rev.

(11) Input terminal of IC

This IC is a monolithic IC, and between each element there is a P+ isolation for element partition and a P substrate.

This P layer and each element’s N layer make up the P-N junction, and various parasitic elements are made up.

For example, when the resistance and transistor are connected to the terminal as shown in figure 3,

○When GND＞(Terminal A) at the resistance and GND＞(Terminal B) at the transistor (NPN),

the P-N junction operates as a parasitic diode.

○Also, when GND＞(Terminal B) at the transistor (NPN)

The parasitic NPN transistor operates with the N layers of other elements close to the aforementioned parasitic

diode.

Because of the IC’s structure, the creation of parasitic elements is inevitable from the electrical potential relationship. The

operation of parasitic elements causes interference in circuit operation, and can lead to malfunction and destruction.

Therefore, be careful not to use it in a way which causes the parasitic elements to operate, such as by applying voltage

that is lower than the GND (P substrate) to the input terminal.

Fig.3 Pattern Diagram of Parasitic Element

(12) Ground Wiring Patterns

When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,

placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage

variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change

the GND wiring pattern potential of any external components, either.

Resistor Transistor (NPN)

N N N P+ P

P substrate

GND

Parasitic element

Pin A

N P+ P

P substrate

GND

Parasitic element

Pin B

C B

GND

Pin A

aras

iti

element

Pin B

Other adjacent elements

GND

aras

iti

element

Technical Note

8/8

BD6380EFV/BD6381EFV

www.rohm.com 2012.02 - Rev.

●Ordering part number

B D 6 3 8 0 EF V -E 2

形名パッケージ

EFV=HTSSOP-B24

包装、フォーミング仕様

E2: リール状エンボステーピング

(Unit : mm)

HTSSOP-B24

0.65

1.0MAX

0.85±0.05

0.08±0.05

0.24 +0.05

0.04 0.08

0.08

1.0±0.2

0.53±0.15

0.17 +0.05

0.03

4°

6°

−

4°

24 13

112

0.325

(3.4)

(5.0)

7.8±0.1

7.6±0.2

5.6±0.1

(MAX 8.15 include BURR)

1PIN MARK

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tape (with dry pack)Tape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2000pcs

()

Direction of feed

Reel 1pin

R1120

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