MIC5501/2/3/4
Features
Applications
General Description
Package Types
MIC5501/2/3/4
MIC5501/4
VIN EN
VOUT GND
43
12
EP
EN GND
NC VOUT
VIN
31
5
2
4
300 mA Single Output LDO in Small Packages
MIC5501/2/3/4
Typical Application Circuit
MIC5501/2/3/4
MIC550X-xYMT
VIN
EN
VOUT
GND
VBAT
1μF 1μF
MIC5501/2/3/4
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Operating Ratings ‡
†Notice:
‡ Notice:
Note 1:
2:
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: bold
Parameter Symbol Min. Typ. Max. Units Conditions
–3.0 3.0
0.3
190
380
55
65
Enable Input
0.2
1.2
MIC5501/2/3/4
125
Note 1:
2:
3:
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: bold
Parameter Symbol Min. Typ. Max. Units Conditions
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters Symbol Min. Typ. Max. Units Conditions
Temperature Ranges
Package Thermal Resistances
Note 1:
MIC5501/2/3/4
MIC5501/2/3/4
2.0 TYPICAL PERFORMANCE CURVES
Note:
FIGURE 2-1: Power Supply Rejection
Ratio.
FIGURE 2-2: Dropout Voltage vs. Output
Current.
FIGURE 2-3: Dropout Voltage vs.
Temperature.
FIGURE 2-4: Ground Current vs. Supply
Voltage.
FIGURE 2-5: Ground Current vs. Load
Current.
FIGURE 2-6: Ground Current vs.
Temperature.
MIC5501/2/3/4
FIGURE 2-7: Output Voltage vs. Output
Current.
FIGURE 2-8: Output Voltage vs. Supply
Voltage.
FIGURE 2-9: Output Voltage vs.
Temperature.
FIGURE 2-10: Current Limit vs. Supply
Voltage.
V
IN
= 3V
V
OUT
= 1.8V
C
IN
= C
OUT
= 1μF
Time (10μs/div)
V
OUT
(500mV/div)
V
EN
(500mV/div)
FIGURE 2-11: Enable Turn-On.
V
IN
= 4.3V
V
OUT
= 3.3V
C
IN
= C
OUT
= 1μF
Time (20μs/div)
V
OUT
(1V/div)
V
EN
(1V/div)
FIGURE 2-12: Enable Turn-On.
V
IN
= 3.8V
V
OUT
= 2.8V
C
IN
= C
OUT
= 1μF
Time (100μs/div)
V
OUT
(AC-COUPLED)
(100mV/div)
I
OUT
(100mA/div)
MIC5501/2/3/4
FIGURE 2-13: Load Transient.
VIN = 4.3V
VOUT = 3.3V
CIN = COUT = 1μF
Time (100μs/div)
VOUT
(AC-COUPLED)
(100mV/div)
IOUT
(100mA/div)
FIGURE 2-14: Load Transient.
VOUT = 2.8V
CIN = COUT =1μF
IOUT = 300mA
Time (100μs/div)
VOUT
(AC-COUPLED
(50mV/div)
VIN
(2mV/div)
3.8V
5.5V
FIGURE 2-15: Line Transient.
V
OUT
= 3.3V
C
IN
= C
OUT
= 1μF
Time (20μs/div)
V
OUT
(1V/div)
V
EN
(1V/div)
FIGURE 2-16: Auto-Discharge (No Load).
MIC5501/2/3/4
3.0 PIN DESCRIPTIONS
TABLE 3-1: PIN FUNCTION TABLE
4-Lead TDFN
Pin Number
SOT23-5
Pin Number Pin Name Description
MIC5501/2/3/4
4.0 APPLICATION INFORMATION
4.1 Input Capacitor
4.2 Output Capacitor
4.3 No-Load Stability
4.4 Enable/Shutdown
4.5 Thermal Considerations
EQUATION 4-1:
PDVIN VOUT 1
–IOUT
VIN
+IGND
=
EQUATION 4-2:
PD3.6V2.8V–300mA 0.240W==
EQUATION 4-3:
PDMAX
TJMAX
TA
–
JA
-----------------------------------=
MIC5501/2/3/4
EQUATION 4-4:
0.240W125CT
A
–250C/W=
TA65C=
MIC5501/2/3/4
5.0 TYPICAL APPLICATION SCHEMATICS
FIGURE 5-1: MIC550x.xYMT Typical Application Schematic.
TABLE 5-1: BILL OF MATERIALS
Item Part Number Manufacturer Description Qty.
U1
MIC5501-x.xYMT
Microchip 300 mA Single Output LDO in Small
Packages 1
MIC5501-x.xYMT
MIC5501-x.xYMT
MIC5501-x.xYMT
MIC5501/2/3/4
6.0 PCB LAYOUT RECOMMENDATIONS
FIGURE 6-1: Top Layer.
FIGURE 6-2: Bottom Layer.
MIC5501/2/3/4
7.0 PACKAGING INFORMATION
7.1 Package Marking Information
5-Lead SOT23*
4-Lead TDFN*
XX
XX
Example
Example
ZX
VX
TABLE 7-1: ABBREVIATED TOP MARK
Device Package Feature
Output Voltage
1.0V 1.2V 1.8V 2.2V 2.5V 2.8V 3.0V 3.1V 3.3V
Legend:
*
Note
3
e
3
e
MIC5501/2/3/4
4-Lead TDFN 1 mm x 1 mm Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
MIC5501/2/3/4
5-Lead SOT23 Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
MIC5501/2/3/4
APPENDIX A: REVISION HISTORY
Revision A (April 2018)
Revision B (October 2019)
Section 4.0 “Application Information”
Section 5.0 “Typical Application
Schematics”Section 6.0 “PCB Layout
Recommendations”
MIC5501/2/3/4
NOTES:
MIC5501/2/3/4
PRODUCT IDENTIFICATION SYSTEM
Examples:
Device:
Output Voltage:
Junction
Temperature
Range:
Package:
Media Type:
Note 1:
Device -X.X X XX -XX
Note:
MIC5501/2/3/4
NOTES:
.
Trademarks
Note the following details of the code protection feature on Microchip devices:
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
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