LM2930
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SNVS745D –APRIL 1998–REVISED APRIL 2013
LM2930 3-Terminal Positive Regulator
Check for Samples: LM2930
1FEATURES DESCRIPTION
The LM2930 3-terminal positive regulator features an
2• Input-Output Differential Less Than 0.6V ability to source 150 mA of output current with an
• Output Current in Excess of 150 mA input-output differential of 0.6V or less. Efficient use
• Reverse Battery Protection of low input voltages obtained, for example, from an
automotive battery during cold crank conditions,
• 40V Load Dump Protection allows 5V circuitry to be properly powered with supply
• Internal Short Circuit Current Limit voltages as low as 5.6V. Familiar regulator features
• Internal Thermal Overload Protection such as current limit and thermal overload protection
are also provided.
• Mirror-Image Insertion Protection
• P+Product Enhancement Tested Designed originally for automotive applications, the
LM2930 and all regulated circuitry are protected from
reverse battery installations or 2 battery jumps.
VOLTAGE RANGE During line transients, such as a load dump (40V)
• LM2930T-5.0: 5V when the input voltage to the regulator can
• LM2930T-8.0: 8V momentarily exceed the specified maximum
operating voltage, the regulator will automatically shut
• LM2930S-5.0: 5V down to protect both internal circuits and the load.
• LM2930S-8.0: 8V The LM2930 cannot be harmed by temporary mirror-
image insertion.
Fixed outputs of 5V and 8V are available in the
plastic TO-220 and SFM power packages.
Connection Diagrams
TO-220 Plastic Package
Figure 1. Front View
See Package Number NDE
SFM Plastic Surface-Mount Package
Figure 2. Top View Figure 3. Side View
See Package Number KTT See Package Number KTT
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1998–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM2930
SNVS745D –APRIL 1998–REVISED APRIL 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Input Voltage Operating Range 26V
Overvoltage Protection 40V
Reverse Voltage (100 ms) −12V
Reverse Voltage (DC) −6V
Internal Power Dissipation (3) Internally Limited
Operating Temperature Range −40°C to +85°C
Maximum Junction Temperature 125°C
Storage Temperature Range −65°C to +150°C
Lead Temp. (Soldering, 10 seconds) 230°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Thermal resistance without a heat sink for junction to case temperature is 3°C/W and for case to ambient temperature is 50°C/W for the
TO-220, 73°C/W for the SFM. If the SFM package is used, the thermal resistance can be reduced by increasing the P.C. board copper
area thermally connected to the package. Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA
is 37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W.
Electrical Characteristics(1)
LM2930-5.0 VIN=14V, IO=150 mA, Tj=25°C (2), C2=10 μF, unless otherwise specified
Parameter Conditions Typ Tested Design Unit
Limit(3) Limit(4)
Output Voltage 5 5.3 VMAX
4.7 VMIN
6V≤VIN≤26V, 5 mA≤IO≤150 mA 5.5 VMAX
−40°C≤TJ≤125°C 4.5 VMIN
Line Regulation 9V≤VIN≤16V, IO=5 mA 7 25 mVMAX
6V≤VIN≤26V, IO=5 mA 30 80 mVMAX
Load Regulation 5 mA≤IO≤150 mA 14 50 mVMAX
Output Impedance 100 mADC & 10 mArms, 100 Hz−10 kHz 200 mΩ
Quiescent Current IO=10 mA 4 7 mAMAX
IO=150 mA 18 40 mAMAX
Output Noise Voltage 10 Hz−100 kHz 140 μVrms
Long Term Stability 20 mV/1000 hr
Ripple Rejection fO=120 Hz 56 dB
Current Limit 400 700 mAMAX
150 mAMIN
Dropout Voltage IO=150 mA 0.32 0.6 VMAX
Output Voltage Under −12V≤VIN≤40V, RL=100Ω5.5 VMAX
Transient Conditions −0.3 VMIN
(1) All characteristics are measured with a capacitor across the input of 0.1 μF and a capacitor across the output of 10 μF. All
characteristics except noise voltage and ripple rejection ratio are measured using pulse techniques (tW≤10 ms, duty cycle≤5%). Output
voltage changes due to changes in internal temperature must be taken into account separately.
(2) To ensure constant junction temperature, low duty cycle pulse testing is used.
(3) Ensured and 100% production tested.
(4) Ensured (but not 100% production tested) over the operating temperature and input current ranges. These limits are not used to
calculate outgoing quality levels.
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SNVS745D –APRIL 1998–REVISED APRIL 2013
Electrical Characteristics(1)
LM2930-8.0 (VIN=14V, IO=150 mA, Tj=25°C (2), C2=10 μF, unless otherwise specified)
Parameter Conditions Typ Tested Design Unit
Limit(3) Limit(4)
Output Voltage 8 8.5 VMAX
7.5 VMIN
9.4V≤VIN≤26V, 5 mA≤IO≤150 mA, 8.8 VMAX
−40°C≤TJ≤125°C 7.2 VMIN
Line Regulation 9.4V≤VIN≤16V, IO=5 mA 12 50 mVMAX
9.4V≤VIN≤26V, IO=5 mA 50 100 mVMAX
Load Regulation 5 mA≤IO≤150 mA 25 50 mVMAX
Output Impedance 100 mADC & 10 mArms, 100 Hz−10 kHz 300 mΩ
Quiescent Current IO=10 mA 4 7 mAMAX
IO=150 mA 18 40 mAMAX
Output Noise Voltage 10 Hz−100 kHz 170 μVrms
Long Term Stability 30 mV/1000 hr
Ripple Rejection fO=120 Hz 52 dB
Current Limit 400 700 mAMAX
150 mAMIN
Dropout Voltage IO=150 mA 0.32 0.6 VMAX
Output Voltage Under −12V≤VIN≤40V, RL=100Ω8.8 VMAX
Transient Conditions −0.3 VMIN
(1) All characteristics are measured with a capacitor across the input of 0.1 μF and a capacitor across the output of 10 μF. All
characteristics except noise voltage and ripple rejection ratio are measured using pulse techniques (tW≤10 ms, duty cycle≤5%). Output
voltage changes due to changes in internal temperature must be taken into account separately.
(2) To ensure constant junction temperature, low duty cycle pulse testing is used.
(3) Ensured and 100% production tested.
(4) Ensured (but not 100% production tested) over the operating temperature and input current ranges. These limits are not used to
calculate outgoing quality levels.
Typical Application
*Required if regulator is located far from power supply filter.
**COUT must be at least 10 μF to maintain stability. May be increased without bound to maintain regulation during
transients. Locate as close as possible to the regulator. This capacitor must be rated over the same operating
temperature range as the regulator. The equivalent series resistance (ESR) of this capacitor should be less than 1Ω
over the expected operating temperature range.
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Typical Performance Characteristics
Output Impedance Overvoltage Supply Current
Figure 4. Figure 5.
Output at Reverse
Reverse Supply Current Supply
Figure 6. Figure 7.
Output at Overvoltage Output Voltage (Normalized to 1V at Tj=25°C)
Figure 8. Figure 9.
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SNVS745D –APRIL 1998–REVISED APRIL 2013
Typical Performance Characteristics (continued)
Dropout Voltage Dropout Voltage
Figure 10. Figure 11.
Low Voltage Behavior High Voltage Behavior
Figure 12. Figure 13.
Line Transient Response Load Transient Response
Figure 14. Figure 15.
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Typical Performance Characteristics (continued)
Peak Output Current Quiescent Current
Figure 16. Figure 17.
Quiescent Current Quiescent Current
Figure 18. Figure 19.
Ripple Rejection Ripple Rejection
Figure 20. Figure 21.
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SNVS745D –APRIL 1998–REVISED APRIL 2013
Definition of Terms
Dropout Voltage: The input-output voltage differential at which the circuit ceases to regulate against further
reduction in input voltage. Measured when the output voltage has dropped 100 mV from the nominal value
obtained at 14V input, dropout voltage is dependent upon load current and junction temperature.
Input Voltage: The DC voltage applied to the input terminals with respect to ground.
Input-Output Differential: The voltage difference between the unregulated input voltage and the regulated
output voltage for which the regulator will operate.
Line Regulation: The change in output voltage for a change in the input voltage. The measurement is made
under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not
significantly affected.
Load Regulation: The change in output voltage for a change in load current at constant chip temperature.
Long Term Stability: Output voltage stability under accelerated life-test conditions after 1000 hours with
maximum rated voltage and junction temperature.
Output Noise Voltage: The rms AC voltage at the output, with constant load and no input ripple, measured over
a specified frequency range.
Quiescent Current: That part of the positive input current that does not contribute to the positive load current.
The regulator ground lead current.
Ripple Rejection: The ratio of the peak-to-peak input ripple voltage to the peak-to-peak output ripple voltage.
Temperature Stability of VO:The percentage change in output voltage for a thermal variation from room
temperature to either temperature extreme.
Maximum Power Dissipation (TO-220) Maximum Power Dissipation (SFM) (1)
(1) Thermal resistance without a heat sink for junction to case temperature is 3°C/W and for case to ambient temperature is 50°C/W for the
TO-220, 73°C/W for the SFM. If the SFM package is used, the thermal resistance can be reduced by increasing the P.C. board copper
area thermally connected to the package. Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA
is 37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W.
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SNVS745D –APRIL 1998–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision C (April 2013) to Revision D Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 8
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PACKAGE OPTION ADDENDUM
www.ti.com 27-Oct-2016
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM2930T-5.0/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS
& no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 85 LM2930T
-5.0 P+
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
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provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 27-Oct-2016
Addendum-Page 2
MECHANICAL DATA
NDE0003B
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