IRFP460A 20A, 500V, 0.22 Ohm, N-Channel SMPS Power MOSFET Applications Features * Switch Mode Power Supplies (SMPS) * Low Gate Charge Requirement * Uninterruptable Power Supply * Improved Gate, Ruggedness * High Speed Power Switching Qg results Avalanche in and Simple Drive Dynamic dv/dt * Improved rDS(ON) * Reduced Miller Capacitance Package Symbol JEDEC TO-247 SOURCE DRAIN D GATE G DRAIN (FLANGE) S Absolute Maximum Ratings TA = 25oC unless otherwise noted Symbol VDSS VGS ID PD TJ, TSTG Parameter Drain to Source Voltage Gate to Source Voltage Drain Current Continuous (TC = 25oC, VGS = 10V) Continuous (TC = 100oC, VGS = 10V) Pulsed1 Power dissipation Derate above 25oC Operating and Storage Temperature Soldering Temperature for 10 seconds Mounting Torque, 8-32 or M3 Screw Ratings 500 30 Units V V 20 A 13 80 280 2.2 -55 to 150 300 (1.6mm from case) 10ibf*in (1.1N*m) A A W W/oC oC oC Thermal Characteristics RJC Thermal Resistance Junction to Case RCS Thermal Resistance Case to Sink, Flat, Greased Surface RJA Thermal Resistance Junction to Ambient (c)2002 Fairchild Semiconductor Corporation 0.45 oC/W 0.24 TYP oC/W 40 oC/W IRFP460A Rev. B January 2002 IRFP460A January 2002 Device Marking IRFP460A Device IRFP460A Package TO-247 Reel Size - Tape Width - Quantity - Electrical Characteristics TJ = 25C (unless otherwise noted) Symbol Parameter Test Conditions Min Typ Max Units ID = 250A, VGS = 0V V/C Reference to 25oC, ID = 1mA VGS = 10V, ID = 12A VDS = VGS, ID = 250A VDS = 25V TC =25oC VGS = 0V TC = 150oC VGS = 20V 500 - - V - 0.61 - 2.0 - 0.17 3.3 - 0.22 4.0 25 250 100 Statics BVDSS Drain to Source Breakdown Voltage BVDSS/TJ Breakdown Voltage Temp. Coefficient rDS(ON) VGS(th) Drin to Source On-Resistance Gate Threshold Voltage IDSS Zero Gate Voltage Drain Current IGSS Gate to Source Leakage Current V A nA Dynamics gfs Qg(TOT) Qgs Qgd td(ON) tr td(OFF) tf CISS COSS CRSS Forward Transconductance Total Gate Charge Gate to Source Gate Charge Gate to Drain "Miller" Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = 50V, ID = 12A VGS = 10V, VDS = 400V, ID = 20A VDD = 250V, ID = 20A RG = 4.3, RD = 13 VDS = 25V, VGS = 0V, f = 1MHz 11 - - S - 56 13 17 13 8 41 6 70 18 22 - nC nC nC ns ns ns ns - 3520 410 21 - pF pF pF 960 28 - 20 - mJ A mJ - - 20 A - - 80 A - 0.86 560 8.0 1.8 710 11 V ns C Avalanche Characteristics EAS IAR EAR Single Pulse Avalanche Energy2 Avalanche Current Repetitive Avalanche Energy1 Drain-Source Diode Characteristics IS ISM VSD trr QRR Continuous Source Current (Body Diode) Pulsed Source Current1 (Body Diode) Source to Drain Diode Voltage Reverse Recovery Time Reverse Recovered Charge MOSFET symbol showing the integral reverse p-n junction diode. D G S ISD = 20A ISD = 20A, dISD/dt = 100A/s ISD = 20A, dISD/dt = 100A/s Notes: 1: 2: 3: 4: Repetitive rating; pulse width limited by maximum junction temperature VDD = 50V, Starting TJ = 25C, L = 7.0mH, RG = 25, IAS = 14A ISD