* High case dielectric strength of 2000 V
* High surge current capability
* Low forward voltage drop
* Fast switching for high efficiency
* Ideal for printed circuit board
* Case : Reliable low cost construction
utilizing molded plastic technique
* Epoxy : UL94V-O rate flame retardant
* Lead : Axial lead solderable per
MIL - STD 202 , Method 208 guaranteed
* Polarity : Polarity symbols marked on case
* Mounting position : Any
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
C ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
SYMBOL FKBP
FKBP
FKBP
FKBP
FKBP
FKBP
FKBP
UNIT
Maximum Recurrent Peak Reverse Voltage VRRM 50 100 200 400 600 800 1000 Volts
Maximum RMS Voltage VRMS 35 70 140 280 420 560 700 Volts
Maximum DC Blocking Voltage VDC 50 100 200 400 600 800 1000 Volts
Maximum Average Forward Current Tc = 50 °CIF(AV) 2.0 Amps.
Peak Forward Surge Current Single half sine wave
Superimposed on rated load (JEDEC Method) IFSM 35 Amps.
Current Squared Time at t < 8.3 ms. I2t10 A2S
Maximum Forward Voltage drop per Diode at IF
VF1.3 Volts
Maximum DC Reverse Current Ta = 25 °CIR10 µA
at Rated DC Blocking Voltage Ta = 100 °CIR(H) 500 µA
Maximum Reverse Recovery Time (Note 1) Trr 150 250 500 ns
Typical Thermal Resistance (Note 2)
θ
30 °C/W
Operating Junction Temperature Range TJ - 50 to + 150 °C
Storage Temperature Range TSTG - 50 to + 150 °C
F
R
= 1 Amp., Irr = 0.25 Amp.
2 ) Thermal resistance from Junction to Ambient on P.C. Board with, 0.47" X 0.47" ( 12 mm. x 12 mm. ) Cu. pads.
RATING
Dimensions in inches and ( millimeter )
0.276 (7.01 )
0.236 (5.99)
0.105 (2.66)
0.085 (2.16)
0.16 (4.00)
0.14 (3.55)
0.035 (0.89)
0.028 (0.71)
0.500
KBP
0.71 (18.0)
AC AC
0.825 (20.95)