© Semiconductor Components Industries, LLC, 2011
August, 2011 − Rev. 5
1Publication Order Number:
MMBFJ177LT1/D
MMBFJ177LT1G
JFET Chopper
P−Channel − Depletion
Features
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating Symbol Value Unit
Drain−Gate Voltage VDG 25 Vdc
Reverse Gate−Source Voltage VGS(r) −25 Vdc
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Total Device Dissipation FR−5 Board
(Note 1)
TA = 25°C
Derate above 25°C
PD225
1.8
mW
mW/°C
Thermal Resistance,
Junction−to−Ambient
RqJA 556 °C/W
Junction and Storage Temperature TJ, Tstg −55 to +150 °C
1. FR−5 = 1.0 0.75 0.062 in.
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MARKING DIAGRAM
SOT−23 (TO−236AB)
CASE 318−08
STYLE 10
2 SOURCE
3
GATE
1 DRAIN
1
2
3
Device Package Shipping†
ORDERING INFORMATION
MMBFJ177LT1G SOT−23
(Pb−Free)
3000 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1
6Y MG
G
6Y = Specific Device Code
M = Date Code*
G= Pb−Free Package
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
(Note: Microdot may be in either location)
MMBFJ177LT1G
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2
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Gate−Source Breakdown Voltage (VDS = 0, ID = 1.0 mAdc) V(BR)GSS 30 −Vdc
Gate Reverse Current (VDS = 0 Vdc, VGS = 20 Vdc) IGSS −1.0 nAdc
Gate Source Cutoff Voltage (VDS = 15 Vdc, ID = 10 nAdc) VGS(off) 0.8 2.5 Vdc
ON CHARACTERISTICS
Zero−Gate−Voltage Drain Current (VGS = 0, VDS = 15 Vdc) (Note 2) IDSS 1.5 20 mAdc
Drain Cutoff Current (VDS = 15 Vdc, VGS = 10 Vdc) ID(off) −1.0 nAdc
Drain Source On Resistance (ID = 500 mAdc) rDS(on) −300 W
Input Capacitance VDS = 0, VGS = 10 Vdc
f = 1.0 MHz
Ciss −11 pF
Reverse Transfer Capacitance Crss −5.5
2. Pulse Test: Pulse Width < 300 ms, Duty Cycle ≤ 2%.
TYPICAL CHARACTERISTICS
Figure 1. Drain Current vs. Drain−Source
Voltage
Figure 2. Reverse Transfer Capacitance
VDS, DRAIN−SOURCE VOLTAGE (V) VDS, DRAIN−SOURCE VOLTAGE (V)
121086420
0
1
2
3
4
6
7
8
−25−20−15−10−50
0
4
6
10
12
14
Figure 3. Input Capacitance
VDS, DRAIN−SOURCE VOLTAGE (V)
−25−20−15−10−50
0
8
12
20
24
32
ID, DRAIN CURRENT (mA)
Crss, REVERSE TRANSFER
CAPACITANCE (pF)
Ciss, INPUT CAPACITANCE (pF)
5
VGS = 0 V
VGS = −0.9 V
VGS = −0.7 V
VGS = −0.5 V
VGS = −0.3 V
VGS = −0.1 V
2
8
4
16
28
VGS = 0 V
f = 1 MHz
VGS = 0 V
f = 1 MHz
MMBFJ177LT1G
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3
PACKAGE DIMENSIONS
D
A1
3
12
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
VIEW C
L
0.25
L1
q
e
EE
b
A
SEE VIEW C
DIM
A
MIN NOM MAX MIN
MILLIMETERS
0.89 1.00 1.11 0.035
INCHES
A1 0.01 0.06 0.10 0.001
b0.37 0.44 0.50 0.015
c0.09 0.13 0.18 0.003
D2.80 2.90 3.04 0.110
E1.20 1.30 1.40 0.047
e1.78 1.90 2.04 0.070
L0.10 0.20 0.30 0.004
0.040 0.044
0.002 0.004
0.018 0.020
0.005 0.007
0.114 0.120
0.051 0.055
0.075 0.081
0.008 0.012
NOM MAX
L1
H
2.10 2.40 2.64 0.083 0.094 0.104
HE
0.35 0.54 0.69 0.014 0.021 0.029
c
0−−− 10 0 −−− 10
q°°°°
SOT−23 (TO−236AB)
CASE 318−08
ISSUE AP
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
ǒmm
inchesǓ
SCALE 10:1
0.8
0.031
0.9
0.035
0.95
0.037
0.95
0.037
2.0
0.079
STYLE 10:
PIN 1. DRAIN
2. SOURCE
3. GATE
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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MMBFJ177LT1/D
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