FEATURES
DTrenchFETr Power MOSFET
DAdvanced High Cell Density
Process
APPLICATIONS
DLoad Switches
Notebook PCs
Desktop PCs
Pb-free
Available
Si4425BDY
Vishay Siliconix
Document Number: 72000
S-50366—Rev. D, 28-Feb-05
www.vishay.com
1
P-Channel 30-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V) rDS(on) (W) ID (A)
30
0.012 @ VGS = 10 V 11.4
30
0.019 @ VGS = 4.5 V 9.1
SD
SD
SD
GD
SO-8
5
6
7
8
Top View
2
3
4
1
S
G
D
P-Channel MOSFET
Ordering Information: Si4425BDY
Si4425BDY—T1 (with Tape and Reel)
Si4425BDY—E3 (Lead (Pb)-Free)
Si4425BDY-T1—E3 (Lead (Pb)-Free with Tape and Reel)
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter Symbol 10 secs Steady State Unit
Drain-Source Voltage VDS 30
V
Gate-Source Voltage VGS "20
V
Continuous Drain Current (TJ
=
150
_
C)
a
TA = 25_C
ID
11.4 8.8
C
on
ti
nuous
D
ra
i
n
C
urren
t (T
J
=
150_C)a
TA = 70_C
I
D
9.1 7.0
A
Pulsed Drain Current IDM 50
A
continuous Source Current (Diode Conduction)aIS2.1 1.3
Maximum Power Dissipationa
TA = 25_C
PD
2.5 1.5
W
Maximum Power Dissipationa
TA = 70_CPD1.6 0.9 W
Operating Junction and Storage Temperature Range TJ, Tstg 55 to 150 _C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Mi J ti tAbit
a
t v 10 sec
R
40 50
Maximum Junction-to-Ambienta
Steady State RthJA 70 85 _C/W
Maximum Junction-to-Foot (Drain) Steady State RthJF 15 18
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Si4425BDY
Vishay Siliconix
www.vishay.com
2 Document Number: 72000
S-50366—Rev. D, 28-Feb-05
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Symbol Test Condition Min Typ Max Unit
Static
Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250 mA1.0 3.0 V
Gate-Body Leakage IGSS VDS = 0 V, VGS = "20 V"100 nA
Zero Gate Voltage Drain Current
IDSS
VDS = 30 V, VGS = 0 V 1
Zero Gate Voltage Drain Current IDSS VDS = 30 V, VGS = 0 V, TJ = 55_C5mA
On-State Drain CurrentaID(on) VDS v 5 V, VGS = 10 V 50 A
Drain Source On State Resistancea
rDS( )
VGS = 10 V, ID = 11.4 A 0.010 0.012
Drain-Source On-State ResistancearDS(on) VGS = 4.5 V, ID = 9.1 A 0.015 0.019 W
Forward Transconductanceagfs VDS = 15 V, I D = 11.4 A 29 S
Diode Forward VoltageaVSD IS = 2.5 A, VGS = 0 V 0.8 1.2 V
Dynamicb
Total Gate Charge Qg64 100
Gate-Source Charge Qgs VDS = 15 V, VGS = 10 V, ID = 11.4 A 11 nC
Gate-Drain Charge Qgd
DS ,GS ,D
17
Turn-On Delay Time td(on) 15 25
Rise Time trVDD = 15 V, RL = 15 W13 20
Turn-Off Delay Time td(off)
VDD = 15 V
,
RL = 15 W
ID ^ 1 A, VGEN = 10 V, RG = 6 W100 150 ns
Fall Time tf53 80
Source-Drain Reverse Recovery Time trr IF = 2.5 A, di/dt = 100 A/ms 41 80
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
0
10
20
30
40
50
012345
0
10
20
30
40
50
012345
VGS = 10 thru 5 V
TC = 125_C
55_C
25_C
Output Characteristics Transfer Characteristics
VDS Drain-to-Source Voltage (V)
Drain Current (A)ID
VGS Gate-to-Source Voltage (V)
Drain Current (A)ID
4 V
3 V
Si4425BDY
Vishay Siliconix
Document Number: 72000
S-50366—Rev. D, 28-Feb-05
www.vishay.com
3
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
rDS(on) On-Resiistance
(Normalized)
On-Resistance (rDS(on) W)
0
1000
2000
3000
4000
5000
0 6 12 18 24 30
0.6
0.8
1.0
1.2
1.4
1.6
50 25 0 25 50 75 100 125 150
0
2
4
6
8
10
0 1020304050607080
0.000
0.005
0.010
0.015
0.020
0.025
0 1020304050
VDS Drain-to-Source Voltage (V)
Crss
Coss
Ciss
VDS = 15 V
ID = 12 A
ID Drain Current (A)
VGS = 10 V
ID = 12 A
VGS = 10 V
Gate Charge
On-Resistance vs. Drain Current
Gate-to-Source Voltage (V)
Qg Total Gate Charge (nC)
C Capacitance (pF)
VGS
Capacitance
On-Resistance vs. Junction Temperature
TJ Junction Temperature (_C)
0.0 0.2 0.4 0.6 0.8 1.0 1.2
0.00
0.01
0.02
0.03
0.04
0.05
0246810
TJ = 25_C
ID = 12 A
50
10
1
Source-Drain Diode Forward Voltage On-Resistance vs. Gate-to-Source Voltage
On-Resistance (rDS(on) W)
VSD Source-to-Drain Voltage (V) VGS Gate-to-Source Voltage (V)
Source Current (A)IS
VGS = 4.5 V
TJ = 150_C
Si4425BDY
Vishay Siliconix
www.vishay.com
4 Document Number: 72000
S-50366—Rev. D, 28-Feb-05
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
VDS Drain-to-Source Voltage (V)
*VGS u minimum VGS at which rDS(on) is specified
0
30
10
20
Power (W)
Single Pulse Power, Junction-to-Ambient
Time (sec)
1031021 10 600101
104100
0.4
0.2
0.0
0.2
0.4
0.6
0.8
50 25 0 25 50 75 100 125 150
ID = 250 mA
2
1
0.1
0.01
0.2
0.1
0.05
0.02
Single Pulse
Duty Cycle = 0.5
Threshold Voltage
Variance (V)VGS(th)
TJ Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient
Square Wave Pulse Duration (sec)
Normalized Effective Transient
Thermal Impedance
1. Duty Cycle, D =
2. Per Unit Base = RthJA = 70_C/W
3. TJM TA = PDMZthJA(t)
t1
t2
t1
t2
Notes:
4. Surface Mounted
PDM
1600
100101
10210
5
25
15
Safe Operating Area
100
1
0.1 1 10 100
0.01
10
TA = 25_C
Single Pulse
Drain Current (A)ID
P(t) = 10
dc
0.1
IDM Limited
ID(on)
Limited
*rDS(on) Limited
BVDSS Limited
P(t) = 1
P(t) = 0.1
P(t) = 0.01
P(t) = 0.001
P(t) = 0.0001
Si4425BDY
Vishay Siliconix
Document Number: 72000
S-50366—Rev. D, 28-Feb-05
www.vishay.com
5
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
103102110101
104
2
1
0.1
0.01
0.2
0.1
0.05
0.02
Single Pulse
Duty Cycle = 0.5
Normalized Thermal Transient Impedance, Junction-to-Foot
Square Wave Pulse Duration (sec)
Normalized Effective Transient
Thermal Impedance
Vishay Siliconix maintains worldwide m anufactur ing capability. Produc ts m ay be manufac tured at one of several qualified locations. R e liabilit y d at a for Silicon Technology an d
Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see
http://www.vishay.com/ppg?72000.
Document Number: 91000 www.vishay.com
Revision: 18-Jul-08 1
Disclaimer
Legal Disclaimer Notice
Vishay
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.