Si4425BDY
Vishay Siliconix
www.vishay.com
2 Document Number: 72000
S-50366—Rev. D, 28-Feb-05
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Symbol Test Condition Min Typ Max Unit
Static
Gate Threshold Voltage VGS(th) VDS = VGS, ID = −250 mA−1.0 −3.0 V
Gate-Body Leakage IGSS VDS = 0 V, VGS = "20 V"100 nA
Zero Gate Voltage Drain Current
VDS = −30 V, VGS = 0 V −1
Zero Gate Voltage Drain Current IDSS VDS = −30 V, VGS = 0 V, TJ = 55_C−5mA
On-State Drain CurrentaID(on) VDS v −5 V, VGS = −10 V −50 A
Drain Source On State Resistancea
VGS = −10 V, ID = −11.4 A 0.010 0.012
Drain-Source On-State ResistancearDS(on) VGS = −4.5 V, ID = −9.1 A 0.015 0.019 W
Forward Transconductanceagfs VDS = −15 V, I D = −11.4 A 29 S
Diode Forward VoltageaVSD IS = −2.5 A, VGS = 0 V −0.8 −1.2 V
Dynamicb
Total Gate Charge Qg64 100
Gate-Source Charge Qgs VDS = −15 V, VGS = −10 V, ID = −11.4 A 11 nC
Gate-Drain Charge Qgd
17
Turn-On Delay Time td(on) 15 25
Rise Time trVDD = −15 V, RL = 15 W13 20
Turn-Off Delay Time td(off)
,
ID ^ −1 A, VGEN = −10 V, RG = 6 W100 150 ns
Fall Time tf53 80
Source-Drain Reverse Recovery Time trr IF = −2.5 A, di/dt = 100 A/ms 41 80
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
0
10
20
30
40
50
012345
0
10
20
30
40
50
012345
VGS = 10 thru 5 V
TC = 125_C
−55_C
25_C
Output Characteristics Transfer Characteristics
VDS − Drain-to-Source Voltage (V)
− Drain Current (A)ID
VGS − Gate-to-Source Voltage (V)
− Drain Current (A)ID
4 V
3 V