Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 1 of 4 April 2007
EC1019B
InGaP HBT Gain Block
Product Features
• DC – 4 GHz
• +19.5 dBm P1dB at 2 GHz
• +31 dBm OIP3 at 2 GHz
• 18.5 dB Gain at 2 GHz
• 2.8 dB Noise Figure
• Available in Lead-free / green
SOT-89 Package Style
• Internally matched to 50 Ω
Applications
• Mobile Infrastructure
• CATV / FTTX
• W-LAN / ISM
• RFID
• WiMAX / WiBro
Product Description
The EC1019B is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 2000 MHz, the EC1019B typically provides
18.5 dB of gain, +31 dBm Output IP3, and +19.5 dBm P1dB.
The EC1019B consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT process technology
and only requires DC-blocking capacitors, a bias resistor,
and an inductive RF choke for operation. The device is
ideal for wireless applications and is available in low-cost,
surface-mountable plastic lead-free/green/RoHS-compliant
SOT-89 packages. A SOT-86 version is also available as
the EC1019C. All devices are 100% RF and DC tested.
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the EC1019B will work for other various applications
within the DC to 4 GHz frequency range such as CATV
and mobile wireless.
Functional Diagram
RF IN GND RF OUT
GND
1
2
3
4
Function
Pin No.
Input
1
Output/Bias
3
Ground
2, 4
Specifications (1)
Units
Min
Typ
Max
Operational Bandwidth
MHz
DC
4000
Test Frequency
MHz
2000
Gain
dB
16.5
18.4
20.5
Input Return Loss
dB
16.5
Output Return Loss
dB
10.5
Output P1dB
dBm
+14.5
+19.5
Output IP3 (2)
dBm
+31
Noise Figure
dB
2.9
Device Voltage
V
4.2
4.7
5.2
Device Current
mA
70
1. Test conditions unless otherwise noted: 25 ºC, Supply Voltage = +6V, Rbias = 16.5Ω, 50Ω syystem.
2. 3OIP measured with two tones at an output power of +4 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Parameter
Rating
Operating Case Temperature
-40 to +85 °C
Storage Temperature
-55 to +150 °C
Device Current
130 mA
RF Input Power (continuous)
+12 dBm
Junction Temperature
+250 °C
Operation of this device above any of these parameters may cause permanent damage.
Typical Performance (1)
Parameter
Units
Typical
Frequency
MHz
500
900
1900
2140
S21
dB
20.9
20.4
18.5
18.2
S11
dB
-21.5
-19.2
-16.6
-16.9
S22
dB
-17.3
-15.1
-10.6
-10.2
Output P1dB
dBm
+19
+19
+19.5
+19
Output IP3 (2)
dBm
+34
+34
+31
+31
Noise Figure
dB
2.5
2.6
2.8
2.9
Ordering Information
Part No.
Description
EC1019B-G
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 package)
EC1019B-PCB
700 – 2400 MHz Fully Assembled Eval. Board
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 2 of 4 April 2007
EC1019B
InGaP HBT Gain Block
Typical Device RF Performance
Supply Bias = +6 V, Rbias = 15 ΩΩ, Icc = 70 mA
Frequency
MHz
100
500
900
1900
2140
2400
3500
5800
S21
dB
21.2
20.9
20.4
18.5
18.2
17.6
15.6
11.3
S11
dB
-23.7
-21.5
-19.2
-16.6
-16.9
-18.2
-11.2
-9.5
S22
dB
-19.0
-17.3
-15.1
-10.6
-10.2
-10.2
-8.1
-6.2
Output P1dB
dBm
+19.4
+19.4
+19.4
+19.5
+19.0
+18.8
+16.2
Output IP3
dBm
+33
+33.2
+33.6
+31
+31
+30.7
Noise Figure
dB
2.9
2.5
2.6
2.8
2.9
1. Test conditions: T = 25º C, Supply Voltage = +6 V, Device Voltage = 4.7 V, Rbias = 16.5 Ω, Icc = 70 mA typical, 50 Ω System.
2. 3OIP measured with two tones at an output power of +4 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
S21 vs. Frequency
0
5
10
15
20
25
0
1
2
3
4
Frequency (GHz)
S21 (dB)
+25 °C
S11, S22 vs. Frequency
-25
-20
-15
-10
-5
0
0
1
2
3
4
Frequency (GHz)
S11,S22 (dB)
S22
S11
Icc vs. Vde
0
40
80
120
160
4.0
4.2
4.4
4.6
4.8
5.0
5.2
5.4
5.6
5.8
6.0
Vde (V)
Icc (mA)
25°C
OIP3 vs. Frequency
20
25
30
35
40
500
1000
1500
2000
2500
3000
Frequency (MHz)
OIP3 (dBm)
25°C
85°C
-40°C
Noise Figure vs. Frequency
0
1
2
3
4
5
0
500
1000
1500
2000
2500
Frequency (MHz)
NF (dB)
NF
P1dB vs. Frequency
12
16
20
24
500
1000
1500
2000
2500
3000
Frequency (MHz)
P1dB (dBm)
25°C
85°C
-40°C
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 3 of 4 April 2007
EC1019B
InGaP HBT Gain Block
Recommended Application Circuit
Recommended Component Values
Reference
Frequency (MHz)
Designator
50
500
900
1900
2200
2500
3500
L1
820 nH
220 nH
68 nH
27 nH
22 nH
18 nH
15 nH
C1, C2, C4
.018 µF
1000 pF
100 pF
68 pF
68 pF
56 pF
39 pF
1. The proper values for the components are dependent upon the intended frequency of operation.
2. The following values are contained on the evaluation board to achieve optimal broadband performance:
Ref. Desig.
Value / Type
Size
L1
39 nH wirewound inductor
0603
C1, C2
56 pF chip capacitor
0603
C3
0.018 µF chip capacitor
0603
C4
Do Not Place
R4
15 Ω 1% tolerance
0805
Recommended Bias Resistor Values
Supply
Voltage
R1 value
Size
6 V
16.4 ohms
0805
7 V
30.7 ohms
1210
8 V
45 ohms
1210
9 V
59 ohms
2010
10 V
74 ohms
2010
12 V
102 ohms
2512
The proper value for R1 is dependent upon the supply
voltage and allows for bias stability over temperature.
WJ recommends a minimum supply bias of +6 V. A
1% tolerance resistor is recommended.
Typical Device S-Parameters
S-Parameters (Vdevice = +4.7 V, ICC = 70 mA, T = 25 °C, calibrated to device leads)
Freq (MHz)
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
50
-23.95
-10.27
21.26
177.77
-23.34
1.00
-19.31
-6.11
500
-21.49
-53.11
20.93
159.51
-23.02
8.39
-17.25
-58.78
1000
-18.50
-96.14
20.23
141.23
-22.37
14.81
-14.71
-100.42
1500
-16.41
-136.32
19.32
124.62
-21.62
19.01
-12.45
-132.99
2000
-16.74
-169.66
18.38
110.93
-20.72
22.20
-10.32
-161.53
2500
-18.80
170.71
17.40
95.50
-19.86
22.10
-10.16
167.27
3000
-18.23
-170.30
16.26
86.90
-19.10
22.75
-10.15
154.27
3500
-11.23
156.68
15.62
73.24
-18.20
21.01
-8.08
139.29
4000
-10.23
101.48
14.56
67.04
-17.79
19.02
-6.62
107.37
4500
-15.66
57.53
14.06
52.87
-17.02
14.17
-7.84
82.18
5000
-15.34
96.95
12.53
44.96
-16.79
10.83
-8.00
69.95
5500
-10.30
75.00
12.25
30.08
-16.32
6.34
-6.73
57.27
6000
-8.84
47.92
11.61
22.08
-15.68
4.21
-5.91
36.46
Device S-parameters are available for download off of the website at: http://www.wj.com
C1
Blocking
Capacitor
RF OUT
L1
RF Choke
C3
0.018 µF
R4
Bias
Resistor
RF IN
C4
Bypass
Capacitor
C2
Blocking
Capacitor
Vcc
Icc = 70 mA
EC1019B
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 4 of 4 April 2007
EC1019B
InGaP HBT Gain Block
EC1019B-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu.It is compatible with both lead-free
(maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85 °C
Thermal Resistance, Rth
128 °C/W
Product Marking
The component will be marked with an
“1019G” designator with an alphanumeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“1019” designator followed by an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value: Passes between 250 and 500V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 °C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.