For more information visit us at www.irf.com October 2013 KS11547A
Specifications
Motor Current
Part Number Size
(mm) Voltage IO
(DC at
25ºC) w/ o H S W HS
Motor
Power VO =
150/75VRMS Topology
IRSM836-024MA 12x12 250V 2A 47mA 550mA 60W/72W 3P Open Source
IRSM836-044MA 12x12 250V 4A 750mA 850mA 95W/110W 3P Open Source
IRSM836-025MA 12x12 500V 2A 360mA 440mA 93W/114W 3P Open Source
IRSM836-035MB 12x12 500V 3A 420mA 510mA 108W/135W 3P Common Source
IRSM836-035MA 12x12 500V 3A 420mA 510mA 110W/130W 3P Open Source
IRSM836-045MA 12x12 500V 4A 550mA 750mA 145W/195W 3P Open Source
IRSM808-105MH 8x9 500V 10A 1.1A 1.3A 285W/390W Half-Bridge
IRSM807-105MH 8x9 500V 10A 1.1A 1.3A 285W/390W Half-Bridge
**RMS, Fc=16kHz, 2-phase PWM, ΔTCA = 70ºC, TA=25ºC
Qualifying Questions
• Is the customer interested in?
- A compact solution
- Ease-of-use
- Improved thermal performance
- Reduction in overall system cost
Key Points
• The µIPMTM family offers a new benchmark in size versus any equivalent competitor solutions; up to 60%
smaller than the existing smallest 3-phase motor control Power ICs.
• House in QFN-like packages, the µIPMTM family is comprised of a series of fully integrated 3-phase or single-
phase (half-bridge) motor control circuit solutions. By adopting the most rugged and efficient high voltage
FREDFET MOSFET switches, specifically optimized for variable frequency drives, and IR’s most advanced HV
driver ICs, the µIPMTM product family has ratings ranging from 0.4A to 10A.
• With the µIPMTM family, designers can implement smaller and more efficient motor drives solutions for
embedded applications where high volume and higher density is required. By using QFN packaging
technology, assembly is simplified by eliminating through-hole second pass assembly and improving thermal
performances versus the traditional dual in-line module solution from the competition.
• The µIPMTM product family offers a scalable solution for applications that require different current ratings by
delivering a wide spectrum of parts with common pin-out and package size, optimized to address specific load
power levels.
• The IRSM808-105MH and IRSM807-105MH half-bridge µIPM™ power modules provide designers with even
greater scalability, in addition to offering up to a 60% smaller footprint compared to existing leading solutions
and delivering advantages in output current capability and system efficiency cost-effectively.